DE60132397D1 - Verfahren zur Herstellung eines thermisch leitenden Substrats mit Leiterrahmen und Wärmestrahlungsplatte - Google Patents
Verfahren zur Herstellung eines thermisch leitenden Substrats mit Leiterrahmen und WärmestrahlungsplatteInfo
- Publication number
- DE60132397D1 DE60132397D1 DE60132397T DE60132397T DE60132397D1 DE 60132397 D1 DE60132397 D1 DE 60132397D1 DE 60132397 T DE60132397 T DE 60132397T DE 60132397 T DE60132397 T DE 60132397T DE 60132397 D1 DE60132397 D1 DE 60132397D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- lead frame
- heat radiation
- thermally conductive
- conductive substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000164225 | 2000-06-01 | ||
JP2000164225 | 2000-06-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60132397D1 true DE60132397D1 (de) | 2008-03-06 |
DE60132397T2 DE60132397T2 (de) | 2009-01-22 |
Family
ID=18667872
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60143722T Expired - Lifetime DE60143722D1 (de) | 2000-06-01 | 2001-05-30 | Verfahren zur Herstellung eines wärmeleitenden Substrats mit Leiterrahmen und thermisch leitender Platte |
DE60132397T Expired - Lifetime DE60132397T2 (de) | 2000-06-01 | 2001-05-30 | Verfahren zur Herstellung eines thermisch leitenden Substrats mit Leiterrahmen und Wärmestrahlungsplatte |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60143722T Expired - Lifetime DE60143722D1 (de) | 2000-06-01 | 2001-05-30 | Verfahren zur Herstellung eines wärmeleitenden Substrats mit Leiterrahmen und thermisch leitender Platte |
Country Status (4)
Country | Link |
---|---|
US (2) | US6700182B2 (de) |
EP (2) | EP1895584B1 (de) |
KR (1) | KR100771060B1 (de) |
DE (2) | DE60143722D1 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10139287A1 (de) * | 2001-08-09 | 2003-03-13 | Bombardier Transp Gmbh | Halbleitermodul |
US6921975B2 (en) * | 2003-04-18 | 2005-07-26 | Freescale Semiconductor, Inc. | Circuit device with at least partial packaging, exposed active surface and a voltage reference plane |
US6838776B2 (en) | 2003-04-18 | 2005-01-04 | Freescale Semiconductor, Inc. | Circuit device with at least partial packaging and method for forming |
JP4644008B2 (ja) * | 2005-03-09 | 2011-03-02 | 三菱電機株式会社 | 半導体モジュール |
WO2006127208A2 (en) | 2005-05-26 | 2006-11-30 | Nanocomp Technologies, Inc. | Systems and methods for thermal management of electronic components |
JP4864093B2 (ja) | 2005-07-28 | 2012-01-25 | ナノコンプ テクノロジーズ インコーポレイテッド | ナノ繊維質材料の形成および収穫に関するシステムおよび方法 |
US9061913B2 (en) | 2007-06-15 | 2015-06-23 | Nanocomp Technologies, Inc. | Injector apparatus and methods for production of nanostructures |
AU2008293884A1 (en) | 2007-07-09 | 2009-03-05 | Nanocomp Technologies, Inc. | Chemically-assisted alignment of nanotubes within extensible structures |
EP2173473A2 (de) | 2007-07-25 | 2010-04-14 | Nanocomp Technologies, Inc. | Systeme und verfahren zur steuerung der chiralität von nanoröhrchen |
EP2176927A4 (de) | 2007-08-07 | 2011-05-04 | Nanocomp Technologies Inc | Elektrisch und thermisch leitende nichtmetallische adapter auf nanostrukturbasis |
CA2723599A1 (en) | 2008-05-07 | 2009-11-12 | Nanocomp Technologies, Inc. | Carbon nanotube-based coaxial electrical cables and wiring harness |
US9198232B2 (en) | 2008-05-07 | 2015-11-24 | Nanocomp Technologies, Inc. | Nanostructure-based heating devices and methods of use |
US8354593B2 (en) | 2009-07-10 | 2013-01-15 | Nanocomp Technologies, Inc. | Hybrid conductors and method of making same |
WO2012094398A1 (en) | 2011-01-04 | 2012-07-12 | Nanocomp Technologies, Inc. | Nanotube-based insulators |
KR102099814B1 (ko) * | 2013-01-25 | 2020-04-13 | 루미리즈 홀딩 비.브이. | 조명 조립체 및 조명 조립체를 제조하기 위한 방법 |
US20140208689A1 (en) | 2013-01-25 | 2014-07-31 | Renee Joyal | Hypodermic syringe assist apparatus and method |
US9824958B2 (en) * | 2013-03-05 | 2017-11-21 | Infineon Technologies Austria Ag | Chip carrier structure, chip package and method of manufacturing the same |
ES2943257T3 (es) | 2013-06-17 | 2023-06-12 | Nanocomp Technologies Inc | Agentes exfoliantes-dispersantes para nanotubos, haces y fibras |
DE102014114520B4 (de) * | 2014-10-07 | 2020-03-05 | Infineon Technologies Austria Ag | Ein elektronisches Modul mit mehreren Einkapselungsschichten und ein Verfahren zu dessen Herstellung |
US11434581B2 (en) | 2015-02-03 | 2022-09-06 | Nanocomp Technologies, Inc. | Carbon nanotube structures and methods for production thereof |
CN205105500U (zh) * | 2015-08-06 | 2016-03-23 | 台达电子企业管理(上海)有限公司 | 散热器与电源模块 |
CN106571354B (zh) * | 2015-10-09 | 2018-11-16 | 台达电子工业股份有限公司 | 电源变换器及其制造方法 |
US10581082B2 (en) | 2016-11-15 | 2020-03-03 | Nanocomp Technologies, Inc. | Systems and methods for making structures defined by CNT pulp networks |
US11279836B2 (en) | 2017-01-09 | 2022-03-22 | Nanocomp Technologies, Inc. | Intumescent nanostructured materials and methods of manufacturing same |
JP6879834B2 (ja) * | 2017-06-21 | 2021-06-02 | 日本発條株式会社 | 回路基板およびその製造方法 |
JP2019062021A (ja) * | 2017-09-25 | 2019-04-18 | 株式会社東芝 | 半導体モジュールおよびその製造方法 |
US20210175155A1 (en) * | 2019-12-06 | 2021-06-10 | Alpha And Omega Semiconductor (Cayman) Ltd. | Power module having interconnected base plate with molded metal and method of making the same |
EP4036966A1 (de) * | 2021-02-02 | 2022-08-03 | Hitachi Energy Switzerland AG | Metallsubstratstruktur und verfahren zur herstellung einer metallsubstratstruktur für ein halbleiterleistungsmodul sowie halbleiterleistungsmodul |
EP4068348B1 (de) * | 2021-03-31 | 2023-11-29 | Hitachi Energy Ltd | Metallsubstratstruktur und verfahren zur herstellung einer metallsubstratstruktur für ein halbleiterleistungsmodul sowie halbleitermodul |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6151947A (ja) * | 1984-08-22 | 1986-03-14 | Mitsubishi Electric Corp | 半導体装置 |
US5122439A (en) * | 1989-08-28 | 1992-06-16 | International Business Machines Corp. | Forming a pattern on a substrate |
DE9114268U1 (de) | 1991-11-15 | 1992-01-09 | Siemens Ag, 8000 Muenchen, De | |
JPH0863119A (ja) | 1994-08-01 | 1996-03-08 | Motorola Inc | 単色ledを用いた全色画像表示装置 |
JPH09102667A (ja) * | 1995-10-03 | 1997-04-15 | Japan Aviation Electron Ind Ltd | 配線基板の製造方法及び配線基板 |
JP3516789B2 (ja) * | 1995-11-15 | 2004-04-05 | 三菱電機株式会社 | 半導体パワーモジュール |
TW398163B (en) * | 1996-10-09 | 2000-07-11 | Matsushita Electric Ind Co Ltd | The plate for heat transfer substrate and manufacturing method thereof, the heat-transfer substrate using such plate and manufacturing method thereof |
CA2255441C (en) * | 1997-12-08 | 2003-08-05 | Hiroki Sekiya | Package for semiconductor power device and method for assembling the same |
US6366443B1 (en) * | 1997-12-09 | 2002-04-02 | Daniel Devoe | Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely-spaced interior conductive planes reliably connecting to positionally-tolerant exterior pads through multiple redundant vias |
JPH11233712A (ja) * | 1998-02-12 | 1999-08-27 | Hitachi Ltd | 半導体装置及びその製法とそれを使った電気機器 |
JP4126751B2 (ja) | 1998-05-26 | 2008-07-30 | ソニー株式会社 | 表示装置および照明装置 |
-
2001
- 2001-05-30 EP EP07021191A patent/EP1895584B1/de not_active Expired - Lifetime
- 2001-05-30 DE DE60143722T patent/DE60143722D1/de not_active Expired - Lifetime
- 2001-05-30 EP EP01113188A patent/EP1160861B1/de not_active Expired - Lifetime
- 2001-05-30 DE DE60132397T patent/DE60132397T2/de not_active Expired - Lifetime
- 2001-06-01 US US09/870,684 patent/US6700182B2/en not_active Expired - Fee Related
- 2001-06-01 KR KR1020010030690A patent/KR100771060B1/ko not_active IP Right Cessation
-
2003
- 2003-08-26 US US10/647,263 patent/US7033865B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1895584A1 (de) | 2008-03-05 |
EP1895584B1 (de) | 2010-12-22 |
US20020020897A1 (en) | 2002-02-21 |
EP1160861A2 (de) | 2001-12-05 |
EP1160861B1 (de) | 2008-01-16 |
KR100771060B1 (ko) | 2007-10-30 |
US6700182B2 (en) | 2004-03-02 |
EP1160861A3 (de) | 2004-03-03 |
KR20010109496A (ko) | 2001-12-10 |
DE60143722D1 (de) | 2011-02-03 |
US7033865B2 (en) | 2006-04-25 |
US20040207053A1 (en) | 2004-10-21 |
DE60132397T2 (de) | 2009-01-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |