DE60041916D1 - Elektonikbauteil-träger und seine herstellung - Google Patents
Elektonikbauteil-träger und seine herstellungInfo
- Publication number
- DE60041916D1 DE60041916D1 DE60041916T DE60041916T DE60041916D1 DE 60041916 D1 DE60041916 D1 DE 60041916D1 DE 60041916 T DE60041916 T DE 60041916T DE 60041916 T DE60041916 T DE 60041916T DE 60041916 D1 DE60041916 D1 DE 60041916D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacture
- component carrier
- electonic
- electonic component
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
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- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/14—Integrated circuits
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H01L2924/15165—Monolayer substrate
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Details Of Resistors (AREA)
- Wire Bonding (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9901831A SE515856C2 (sv) | 1999-05-19 | 1999-05-19 | Bärare för elektronikkomponenter |
PCT/SE2000/001008 WO2000070679A1 (en) | 1999-05-19 | 2000-05-18 | Carrier for electronic components and a method for manufacturing a carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60041916D1 true DE60041916D1 (de) | 2009-05-14 |
Family
ID=20415669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60041916T Expired - Lifetime DE60041916D1 (de) | 1999-05-19 | 2000-05-18 | Elektonikbauteil-träger und seine herstellung |
Country Status (8)
Country | Link |
---|---|
US (1) | US6690583B1 (de) |
EP (1) | EP1186033B1 (de) |
JP (1) | JP4758006B2 (de) |
AU (1) | AU4968500A (de) |
BR (1) | BR0010572A (de) |
DE (1) | DE60041916D1 (de) |
SE (1) | SE515856C2 (de) |
WO (1) | WO2000070679A1 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6862189B2 (en) * | 2000-09-26 | 2005-03-01 | Kabushiki Kaisha Toshiba | Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device |
SE0004078L (sv) * | 2000-11-06 | 2002-05-07 | Imego Ab | Metod och anordning för att förse ett substrat med kaviteter |
FI119583B (fi) * | 2003-02-26 | 2008-12-31 | Imbera Electronics Oy | Menetelmä elektroniikkamoduulin valmistamiseksi |
US7429596B2 (en) * | 2003-06-20 | 2008-09-30 | The Regents Of The University Of California | 1H-pyrrolo [2,3-D] pyrimidine derivatives and methods of use thereof |
US7321098B2 (en) * | 2004-04-21 | 2008-01-22 | Delphi Technologies, Inc. | Laminate ceramic circuit board and process therefor |
FI20041680A (fi) * | 2004-04-27 | 2005-10-28 | Imbera Electronics Oy | Elektroniikkamoduuli ja menetelmä sen valmistamiseksi |
WO2006068760A2 (en) | 2004-11-19 | 2006-06-29 | The Regents Of The University Of California | Anti-inflammatory pyrazolopyrimidines |
US7365273B2 (en) * | 2004-12-03 | 2008-04-29 | Delphi Technologies, Inc. | Thermal management of surface-mount circuit devices |
FR2879819B1 (fr) * | 2004-12-21 | 2007-02-23 | Ulis Soc Par Actions Simplifie | Composant de detection de rayonnements electromagnetiques notamment infrarouges |
US7335986B1 (en) | 2005-09-14 | 2008-02-26 | Amkor Technology, Inc. | Wafer level chip scale package |
MX2008012928A (es) | 2006-04-04 | 2009-03-06 | Univ California | Antagonistas de pi3-cinasa. |
KR100825766B1 (ko) * | 2007-04-26 | 2008-04-29 | 한국전자통신연구원 | Ltcc 패키지 및 그 제조방법 |
DE102007037538A1 (de) | 2007-08-09 | 2009-02-12 | Robert Bosch Gmbh | Baugruppe sowie Herstellung einer Baugruppe |
WO2009046448A1 (en) | 2007-10-04 | 2009-04-09 | Intellikine, Inc. | Chemical entities and therapeutic uses thereof |
US8193182B2 (en) | 2008-01-04 | 2012-06-05 | Intellikine, Inc. | Substituted isoquinolin-1(2H)-ones, and methods of use thereof |
CN104926815B (zh) | 2008-01-04 | 2017-11-03 | 英特利凯恩有限责任公司 | 某些化学实体、组合物和方法 |
JP5547099B2 (ja) | 2008-03-14 | 2014-07-09 | インテリカイン, エルエルシー | キナーゼ阻害剤および使用方法 |
US8993580B2 (en) | 2008-03-14 | 2015-03-31 | Intellikine Llc | Benzothiazole kinase inhibitors and methods of use |
KR100962369B1 (ko) * | 2008-06-26 | 2010-06-10 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
US20110224223A1 (en) * | 2008-07-08 | 2011-09-15 | The Regents Of The University Of California, A California Corporation | MTOR Modulators and Uses Thereof |
BRPI0915231A2 (pt) | 2008-07-08 | 2018-06-12 | Intellikine Inc | compostos inibidores de quinase e métodos de uso |
WO2010036380A1 (en) | 2008-09-26 | 2010-04-01 | Intellikine, Inc. | Heterocyclic kinase inhibitors |
WO2010040398A1 (en) * | 2008-10-08 | 2010-04-15 | Telefonaktiebolaget L M Ericsson (Publ) | Chip interconnection |
US8697709B2 (en) | 2008-10-16 | 2014-04-15 | The Regents Of The University Of California | Fused ring heteroaryl kinase inhibitors |
US8476282B2 (en) * | 2008-11-03 | 2013-07-02 | Intellikine Llc | Benzoxazole kinase inhibitors and methods of use |
EP2427195B1 (de) | 2009-05-07 | 2019-05-01 | Intellikine, LLC | Heterocyclische verbindungen und ihre verwendung |
US8980899B2 (en) | 2009-10-16 | 2015-03-17 | The Regents Of The University Of California | Methods of inhibiting Ire1 |
CN103002738A (zh) | 2010-05-21 | 2013-03-27 | 英特利凯恩有限责任公司 | 用于激酶调节的化学化合物、组合物和方法 |
US8847376B2 (en) | 2010-07-23 | 2014-09-30 | Tessera, Inc. | Microelectronic elements with post-assembly planarization |
AU2011326427B2 (en) | 2010-11-10 | 2016-01-07 | Infinity Pharmaceuticals Inc. | Heterocyclic compounds and uses thereof |
BR112013017670B1 (pt) | 2011-01-10 | 2022-07-19 | Infinity Pharmaceuticals, Inc | Processos de preparação de isoquinolinonas e formas sólidas de isoquinolinonas |
WO2012148540A1 (en) | 2011-02-23 | 2012-11-01 | Intellikine, Llc | Combination of kanase inhibitors and uses threof |
AR088218A1 (es) | 2011-07-19 | 2014-05-21 | Infinity Pharmaceuticals Inc | Compuestos heterociclicos utiles como inhibidores de pi3k |
WO2013012915A1 (en) | 2011-07-19 | 2013-01-24 | Infinity Pharmaceuticals Inc. | Heterocyclic compounds and uses thereof |
CA2846431A1 (en) | 2011-08-29 | 2013-03-07 | Infinity Pharmaceuticals Inc. | Heterocyclic compounds and uses thereof |
WO2013077921A2 (en) | 2011-09-02 | 2013-05-30 | The Regents Of The University Of California | Substituted pyrazolo[3,4-d]pyrimidines and uses thereof |
US8940742B2 (en) | 2012-04-10 | 2015-01-27 | Infinity Pharmaceuticals, Inc. | Heterocyclic compounds and uses thereof |
US8828998B2 (en) | 2012-06-25 | 2014-09-09 | Infinity Pharmaceuticals, Inc. | Treatment of lupus, fibrotic conditions, and inflammatory myopathies and other disorders using PI3 kinase inhibitors |
RU2015115631A (ru) | 2012-09-26 | 2016-11-20 | Дзе Риджентс Оф Дзе Юниверсити Оф Калифорния | Модулирование ire1 |
US9385075B2 (en) * | 2012-10-26 | 2016-07-05 | Infineon Technologies Ag | Glass carrier with embedded semiconductor device and metal layers on the top surface |
US9481667B2 (en) | 2013-03-15 | 2016-11-01 | Infinity Pharmaceuticals, Inc. | Salts and solid forms of isoquinolinones and composition comprising and methods of using the same |
MY175778A (en) | 2013-10-04 | 2020-07-08 | Infinity Pharmaceuticals Inc | Heterocyclic compounds and uses thereof |
US9751888B2 (en) | 2013-10-04 | 2017-09-05 | Infinity Pharmaceuticals, Inc. | Heterocyclic compounds and uses thereof |
CN106456628A (zh) | 2014-03-19 | 2017-02-22 | 无限药品股份有限公司 | 用于治疗PI3K‑γ介导的障碍的杂环化合物 |
WO2015160975A2 (en) | 2014-04-16 | 2015-10-22 | Infinity Pharmaceuticals, Inc. | Combination therapies |
WO2016054491A1 (en) | 2014-10-03 | 2016-04-07 | Infinity Pharmaceuticals, Inc. | Heterocyclic compounds and uses thereof |
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US10759806B2 (en) | 2016-03-17 | 2020-09-01 | Infinity Pharmaceuticals, Inc. | Isotopologues of isoquinolinone and quinazolinone compounds and uses thereof as PI3K kinase inhibitors |
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MX2018016227A (es) | 2016-06-24 | 2019-07-08 | Infinity Pharmaceuticals Inc | Terapias de combinacion. |
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JPS6265991A (ja) * | 1985-09-13 | 1987-03-25 | 株式会社東芝 | 高熱伝導性セラミツクス基板 |
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-
1999
- 1999-05-19 SE SE9901831A patent/SE515856C2/sv not_active IP Right Cessation
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2000
- 2000-05-18 WO PCT/SE2000/001008 patent/WO2000070679A1/en active Application Filing
- 2000-05-18 JP JP2000619030A patent/JP4758006B2/ja not_active Expired - Lifetime
- 2000-05-18 AU AU49685/00A patent/AU4968500A/en not_active Abandoned
- 2000-05-18 BR BR0010572-4A patent/BR0010572A/pt not_active Application Discontinuation
- 2000-05-18 DE DE60041916T patent/DE60041916D1/de not_active Expired - Lifetime
- 2000-05-18 EP EP00931872A patent/EP1186033B1/de not_active Expired - Lifetime
- 2000-05-19 US US09/574,243 patent/US6690583B1/en not_active Expired - Lifetime
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US6690583B1 (en) | 2004-02-10 |
SE9901831L (sv) | 2000-11-20 |
JP4758006B2 (ja) | 2011-08-24 |
EP1186033A1 (de) | 2002-03-13 |
EP1186033B1 (de) | 2009-04-01 |
SE515856C2 (sv) | 2001-10-22 |
WO2000070679A1 (en) | 2000-11-23 |
WO2000070679B1 (en) | 2001-02-08 |
AU4968500A (en) | 2000-12-05 |
SE9901831D0 (sv) | 1999-05-19 |
JP2003500834A (ja) | 2003-01-07 |
BR0010572A (pt) | 2002-06-04 |
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