DE60041916D1 - Elektonikbauteil-träger und seine herstellung - Google Patents

Elektonikbauteil-träger und seine herstellung

Info

Publication number
DE60041916D1
DE60041916D1 DE60041916T DE60041916T DE60041916D1 DE 60041916 D1 DE60041916 D1 DE 60041916D1 DE 60041916 T DE60041916 T DE 60041916T DE 60041916 T DE60041916 T DE 60041916T DE 60041916 D1 DE60041916 D1 DE 60041916D1
Authority
DE
Germany
Prior art keywords
manufacture
component carrier
electonic
electonic component
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60041916T
Other languages
English (en)
Inventor
Leif Bergstedt
Per Ligander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Application granted granted Critical
Publication of DE60041916D1 publication Critical patent/DE60041916D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
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    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
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    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92244—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
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    • H01L2924/01027—Cobalt [Co]
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    • H01L2924/01082—Lead [Pb]
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Wire Bonding (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
DE60041916T 1999-05-19 2000-05-18 Elektonikbauteil-träger und seine herstellung Expired - Lifetime DE60041916D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9901831A SE515856C2 (sv) 1999-05-19 1999-05-19 Bärare för elektronikkomponenter
PCT/SE2000/001008 WO2000070679A1 (en) 1999-05-19 2000-05-18 Carrier for electronic components and a method for manufacturing a carrier

Publications (1)

Publication Number Publication Date
DE60041916D1 true DE60041916D1 (de) 2009-05-14

Family

ID=20415669

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60041916T Expired - Lifetime DE60041916D1 (de) 1999-05-19 2000-05-18 Elektonikbauteil-träger und seine herstellung

Country Status (8)

Country Link
US (1) US6690583B1 (de)
EP (1) EP1186033B1 (de)
JP (1) JP4758006B2 (de)
AU (1) AU4968500A (de)
BR (1) BR0010572A (de)
DE (1) DE60041916D1 (de)
SE (1) SE515856C2 (de)
WO (1) WO2000070679A1 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6862189B2 (en) * 2000-09-26 2005-03-01 Kabushiki Kaisha Toshiba Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device
SE0004078L (sv) * 2000-11-06 2002-05-07 Imego Ab Metod och anordning för att förse ett substrat med kaviteter
FI119583B (fi) * 2003-02-26 2008-12-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
US7429596B2 (en) * 2003-06-20 2008-09-30 The Regents Of The University Of California 1H-pyrrolo [2,3-D] pyrimidine derivatives and methods of use thereof
US7321098B2 (en) * 2004-04-21 2008-01-22 Delphi Technologies, Inc. Laminate ceramic circuit board and process therefor
FI20041680A (fi) * 2004-04-27 2005-10-28 Imbera Electronics Oy Elektroniikkamoduuli ja menetelmä sen valmistamiseksi
WO2006068760A2 (en) 2004-11-19 2006-06-29 The Regents Of The University Of California Anti-inflammatory pyrazolopyrimidines
US7365273B2 (en) * 2004-12-03 2008-04-29 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices
FR2879819B1 (fr) * 2004-12-21 2007-02-23 Ulis Soc Par Actions Simplifie Composant de detection de rayonnements electromagnetiques notamment infrarouges
US7335986B1 (en) 2005-09-14 2008-02-26 Amkor Technology, Inc. Wafer level chip scale package
MX2008012928A (es) 2006-04-04 2009-03-06 Univ California Antagonistas de pi3-cinasa.
KR100825766B1 (ko) * 2007-04-26 2008-04-29 한국전자통신연구원 Ｌｔｃｃ 패키지 및 그 제조방법
DE102007037538A1 (de) 2007-08-09 2009-02-12 Robert Bosch Gmbh Baugruppe sowie Herstellung einer Baugruppe
WO2009046448A1 (en) 2007-10-04 2009-04-09 Intellikine, Inc. Chemical entities and therapeutic uses thereof
US8193182B2 (en) 2008-01-04 2012-06-05 Intellikine, Inc. Substituted isoquinolin-1(2H)-ones, and methods of use thereof
CN104926815B (zh) 2008-01-04 2017-11-03 英特利凯恩有限责任公司 某些化学实体、组合物和方法
JP5547099B2 (ja) 2008-03-14 2014-07-09 インテリカイン， エルエルシー キナーゼ阻害剤および使用方法
US8993580B2 (en) 2008-03-14 2015-03-31 Intellikine Llc Benzothiazole kinase inhibitors and methods of use
KR100962369B1 (ko) * 2008-06-26 2010-06-10 삼성전기주식회사 인쇄회로기판 및 그 제조방법
US20110224223A1 (en) * 2008-07-08 2011-09-15 The Regents Of The University Of California, A California Corporation MTOR Modulators and Uses Thereof
BRPI0915231A2 (pt) 2008-07-08 2018-06-12 Intellikine Inc compostos inibidores de quinase e métodos de uso
WO2010036380A1 (en) 2008-09-26 2010-04-01 Intellikine, Inc. Heterocyclic kinase inhibitors
WO2010040398A1 (en) * 2008-10-08 2010-04-15 Telefonaktiebolaget L M Ericsson (Publ) Chip interconnection
US8697709B2 (en) 2008-10-16 2014-04-15 The Regents Of The University Of California Fused ring heteroaryl kinase inhibitors
US8476282B2 (en) * 2008-11-03 2013-07-02 Intellikine Llc Benzoxazole kinase inhibitors and methods of use
EP2427195B1 (de) 2009-05-07 2019-05-01 Intellikine, LLC Heterocyclische verbindungen und ihre verwendung
US8980899B2 (en) 2009-10-16 2015-03-17 The Regents Of The University Of California Methods of inhibiting Ire1
CN103002738A (zh) 2010-05-21 2013-03-27 英特利凯恩有限责任公司 用于激酶调节的化学化合物、组合物和方法
US8847376B2 (en) 2010-07-23 2014-09-30 Tessera, Inc. Microelectronic elements with post-assembly planarization
AU2011326427B2 (en) 2010-11-10 2016-01-07 Infinity Pharmaceuticals Inc. Heterocyclic compounds and uses thereof
BR112013017670B1 (pt) 2011-01-10 2022-07-19 Infinity Pharmaceuticals, Inc Processos de preparação de isoquinolinonas e formas sólidas de isoquinolinonas
WO2012148540A1 (en) 2011-02-23 2012-11-01 Intellikine, Llc Combination of kanase inhibitors and uses threof
AR088218A1 (es) 2011-07-19 2014-05-21 Infinity Pharmaceuticals Inc Compuestos heterociclicos utiles como inhibidores de pi3k
WO2013012915A1 (en) 2011-07-19 2013-01-24 Infinity Pharmaceuticals Inc. Heterocyclic compounds and uses thereof
CA2846431A1 (en) 2011-08-29 2013-03-07 Infinity Pharmaceuticals Inc. Heterocyclic compounds and uses thereof
WO2013077921A2 (en) 2011-09-02 2013-05-30 The Regents Of The University Of California Substituted pyrazolo[3,4-d]pyrimidines and uses thereof
US8940742B2 (en) 2012-04-10 2015-01-27 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
US8828998B2 (en) 2012-06-25 2014-09-09 Infinity Pharmaceuticals, Inc. Treatment of lupus, fibrotic conditions, and inflammatory myopathies and other disorders using PI3 kinase inhibitors
RU2015115631A (ru) 2012-09-26 2016-11-20 Дзе Риджентс Оф Дзе Юниверсити Оф Калифорния Модулирование ire1
US9385075B2 (en) * 2012-10-26 2016-07-05 Infineon Technologies Ag Glass carrier with embedded semiconductor device and metal layers on the top surface
US9481667B2 (en) 2013-03-15 2016-11-01 Infinity Pharmaceuticals, Inc. Salts and solid forms of isoquinolinones and composition comprising and methods of using the same
MY175778A (en) 2013-10-04 2020-07-08 Infinity Pharmaceuticals Inc Heterocyclic compounds and uses thereof
US9751888B2 (en) 2013-10-04 2017-09-05 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
CN106456628A (zh) 2014-03-19 2017-02-22 无限药品股份有限公司 用于治疗PI3K‑γ介导的障碍的杂环化合物
WO2015160975A2 (en) 2014-04-16 2015-10-22 Infinity Pharmaceuticals, Inc. Combination therapies
WO2016054491A1 (en) 2014-10-03 2016-04-07 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
WO2017048702A1 (en) 2015-09-14 2017-03-23 Infinity Pharmaceuticals, Inc. Solid forms of isoquinolinone derivatives, process of making, compositions comprising, and methods of using the same
US10759806B2 (en) 2016-03-17 2020-09-01 Infinity Pharmaceuticals, Inc. Isotopologues of isoquinolinone and quinazolinone compounds and uses thereof as PI3K kinase inhibitors
US10919914B2 (en) 2016-06-08 2021-02-16 Infinity Pharmaceuticals, Inc. Heterocyclic compounds and uses thereof
MX2018016227A (es) 2016-06-24 2019-07-08 Infinity Pharmaceuticals Inc Terapias de combinacion.
US10636690B2 (en) 2016-07-20 2020-04-28 Applied Materials, Inc. Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6265991A (ja) * 1985-09-13 1987-03-25 株式会社東芝 高熱伝導性セラミツクス基板
JPS62224646A (ja) * 1986-03-12 1987-10-02 オリン　コ−ポレ−シヨン 複合材料とその製造方法
JPH02500907A (ja) * 1986-10-30 1990-03-29 オリン コーポレーション セラミック・ガラス・金属複合体
US4899118A (en) * 1988-12-27 1990-02-06 Hughes Aircraft Company Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
JPH0541471A (ja) * 1991-08-07 1993-02-19 Hitachi Ltd 半導体集積回路装置
US5343363A (en) * 1992-12-21 1994-08-30 Delco Electronics Corporation Split backed pressure sensitive die carrier tape
US5831828A (en) * 1993-06-03 1998-11-03 International Business Machines Corporation Flexible circuit board and common heat spreader assembly
US5386339A (en) * 1993-07-29 1995-01-31 Hughes Aircraft Company Monolithic microelectronic circuit package including low-temperature-cofired-ceramic (LTCC) tape dielectric structure and in-situ heat sink
US5532513A (en) * 1994-07-08 1996-07-02 Johnson Matthey Electronics, Inc. Metal-ceramic composite lid
US5798909A (en) * 1995-02-15 1998-08-25 International Business Machines Corporation Single-tiered organic chip carriers for wire bond-type chips
US5661647A (en) * 1995-06-07 1997-08-26 Hughes Electronics Low temperature co-fired ceramic UHF/VHF power converters
US5708570A (en) * 1995-10-11 1998-01-13 Hughes Aircraft Company Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures
JPH09266265A (ja) * 1996-03-28 1997-10-07 Toshiba Corp 半導体パッケージ
US6541271B1 (en) * 1996-10-09 2003-04-01 Symyx Technologies, Inc. Infrared spectroscopic imaging of libraries
US5855803A (en) * 1996-11-20 1999-01-05 Northrop Grumman Corporation Template type cavity-formation device for low temperature cofired ceramic (LTCC) sheets
ES2175655T3 (es) * 1997-02-11 2002-11-16 Fucellco Inc Pila de celulas de combustible con electrolitos solidos y su disposicion.
JPH10256429A (ja) * 1997-03-07 1998-09-25 Toshiba Corp 半導体パッケージ
JPH1154665A (ja) * 1997-07-31 1999-02-26 Toshiba Corp 複合パッケージ
SE514529C2 (sv) 1998-09-21 2001-03-05 Ericsson Telefon Ab L M Metod och anordning för begravda elektronik-komponenter
US6288905B1 (en) * 1999-04-15 2001-09-11 Amerasia International Technology Inc. Contact module, as for a smart card, and method for making same

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SE9901831L (sv) 2000-11-20
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EP1186033A1 (de) 2002-03-13
EP1186033B1 (de) 2009-04-01
SE515856C2 (sv) 2001-10-22
WO2000070679A1 (en) 2000-11-23
WO2000070679B1 (en) 2001-02-08
AU4968500A (en) 2000-12-05
SE9901831D0 (sv) 1999-05-19
JP2003500834A (ja) 2003-01-07
BR0010572A (pt) 2002-06-04

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