DE60035605D1 - Bauteilbestuckungsverfahren und -einrichtung - Google Patents

Bauteilbestuckungsverfahren und -einrichtung

Info

Publication number
DE60035605D1
DE60035605D1 DE60035605T DE60035605T DE60035605D1 DE 60035605 D1 DE60035605 D1 DE 60035605D1 DE 60035605 T DE60035605 T DE 60035605T DE 60035605 T DE60035605 T DE 60035605T DE 60035605 D1 DE60035605 D1 DE 60035605D1
Authority
DE
Germany
Prior art keywords
component processing
component
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60035605T
Other languages
English (en)
Other versions
DE60035605T2 (de
DE60035605T8 (de
Inventor
Yasuhiro Maenishi
Takahiro Inoue
Ikuo Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60035605D1 publication Critical patent/DE60035605D1/de
Publication of DE60035605T2 publication Critical patent/DE60035605T2/de
Publication of DE60035605T8 publication Critical patent/DE60035605T8/de
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE60035605T 1999-09-27 2000-09-26 Bauteilbestuckungsverfahren und -einrichtung Active DE60035605T8 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP27311199 1999-09-27
JP27311199 1999-09-27
JP2000288806 2000-09-22
JP2000288806 2000-09-22
PCT/JP2000/006598 WO2001024598A1 (fr) 1999-09-27 2000-09-26 Procede et dispositif de montage de composants

Publications (3)

Publication Number Publication Date
DE60035605D1 true DE60035605D1 (de) 2007-08-30
DE60035605T2 DE60035605T2 (de) 2008-02-21
DE60035605T8 DE60035605T8 (de) 2008-06-05

Family

ID=26550519

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60039547T Expired - Lifetime DE60039547D1 (de) 1999-09-27 2000-09-26 Bestückungsverfahren und Bestückungsvorrichtung
DE60035605T Active DE60035605T8 (de) 1999-09-27 2000-09-26 Bauteilbestuckungsverfahren und -einrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60039547T Expired - Lifetime DE60039547D1 (de) 1999-09-27 2000-09-26 Bestückungsverfahren und Bestückungsvorrichtung

Country Status (5)

Country Link
US (1) US6842974B1 (de)
EP (2) EP1227711B9 (de)
JP (1) JP3996768B2 (de)
DE (2) DE60039547D1 (de)
WO (1) WO2001024598A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017895A (ja) * 2001-07-04 2003-01-17 Sanyo Electric Co Ltd 電子部品装着装置
JP2003017900A (ja) * 2001-07-04 2003-01-17 Sanyo Electric Co Ltd 電子部品装着装置におけるパターンプログラム最適化方法及び最適化装置
US7043820B2 (en) * 2001-07-27 2006-05-16 Fuji Machine Mfg. Co., Ltd. Electric-component mounting system
JP4116851B2 (ja) * 2002-09-19 2008-07-09 富士通株式会社 電子部品の処理方法及び電子部品用治具
JP2007501516A (ja) * 2003-08-04 2007-01-25 アッセンブレオン エヌ ヴィ コンポーネント配置装置及び方法
WO2005022433A2 (en) * 2003-09-01 2005-03-10 Matsushita Electric Industrial Co., Ltd. Method for optimization of an order for component mounting and apparatus for optimization of an order for component mounting
US8156642B2 (en) * 2007-04-03 2012-04-17 Panasonic Corporation Component mounting method
JP4518113B2 (ja) * 2007-07-25 2010-08-04 Ｔｄｋ株式会社 電子部品内蔵基板及びその製造方法
JP4518114B2 (ja) * 2007-07-25 2010-08-04 Ｔｄｋ株式会社 電子部品内蔵基板及びその製造方法
WO2010024679A1 (en) * 2008-09-01 2010-03-04 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Pick/place head assembly
KR101639667B1 (ko) * 2010-08-10 2016-07-14 한화테크윈 주식회사 부품 실장기
CN102686037A (zh) * 2011-03-18 2012-09-19 北京博瑞精电科技有限公司 一种双头led灯条贴片机
TW201320254A (zh) * 2011-11-15 2013-05-16 Walsin Lihwa Corp 固晶裝置及固晶方法
EP3021652B1 (de) * 2013-07-09 2018-04-18 Fuji Machine Mfg. Co., Ltd. Verfahren für die zuweisung elektronischer komponenten und system zur montage elektronischer komponenten
WO2015162751A1 (ja) * 2014-04-24 2015-10-29 富士機械製造株式会社 最適化プログラム、および装着作業システム
JP6314319B2 (ja) * 2014-11-05 2018-04-25 パナソニックＩｐマネジメント株式会社 電子部品実装システム
US11140801B2 (en) * 2014-11-11 2021-10-05 Fuji Corporation Data input and control devices of an electronic component mounting machine
WO2016194030A1 (ja) * 2015-05-29 2016-12-08 富士機械製造株式会社 最適化プログラム、および装着作業機
WO2017081809A1 (ja) * 2015-11-13 2017-05-18 ヤマハ発動機株式会社 部品実装装置、部品実装方法、及び、表面実装機
US11272649B2 (en) 2018-10-12 2022-03-08 Panasonic Corporation Of North America Electronic component mounting system with cross line communication
WO2021157077A1 (ja) * 2020-02-07 2021-08-12 株式会社Ｆｕｊｉ 吸着位置調整装置
CN116095980B (zh) * 2022-11-08 2023-08-22 哈尔滨工业大学 一种基于最大二分配的贴片机吸嘴分配方法

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Publication number Priority date Publication date Assignee Title
US3337941A (en) * 1965-05-27 1967-08-29 Ibm Recycle control circuit for a chip positioning machine
NL8103574A (nl) * 1981-07-29 1983-02-16 Philips Nv Werkwijze en inrichting voor het plaatsen van elektrische en/of elektronische onderdelen op een substraat.
EP0144717B1 (de) * 1983-11-05 1988-10-19 Zevatech AG Verfahren und Vorrichtung zur Positionierung von Bauteilen auf einem Werkstück
JPS60171799A (ja) * 1984-02-17 1985-09-05 松下電器産業株式会社 電子部品自動装着装置
DE3532500C2 (de) * 1984-09-17 1996-03-14 Tdk Corp Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette
JPS62169423A (ja) 1986-01-22 1987-07-25 Hitachi Ltd 部品移載装置
JPS645100A (en) * 1987-06-29 1989-01-10 Hitachi Ltd Shortest route search system
JP2604167B2 (ja) * 1987-08-18 1997-04-30 三洋電機株式会社 部品実装方法及び部品実装装置
JPH0774969B2 (ja) * 1987-10-16 1995-08-09 三洋電機株式会社 電子部品の装着装置
JP2628392B2 (ja) * 1990-01-16 1997-07-09 新明和工業株式会社 Ｉｃパッケージのハンドリング方法
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
DE69300850T2 (de) * 1992-07-01 1996-03-28 Yamaha Motor Co Ltd Verfahren zum Montieren von Komponenten und Vorrichtung dafür.
JP3094188B2 (ja) * 1992-10-27 2000-10-03 ヤマハ発動機株式会社 電子部品実装装置
JPH07193397A (ja) * 1993-12-27 1995-07-28 Yamaha Motor Co Ltd 実装機の吸着ポイント補正装置
KR970007078Y1 (en) 1994-06-03 1997-07-15 Lg Semicon Co Ltd Devices feeding apparatus
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
US6044169A (en) * 1995-07-12 2000-03-28 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic component
US6789310B1 (en) * 1995-11-06 2004-09-14 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
JP3196626B2 (ja) * 1995-12-26 2001-08-06 ソニー株式会社 部品実装方法
US5839769A (en) 1996-10-03 1998-11-24 Kinetrix, Inc. Expanding gripper with elastically variable pitch screw
WO1999031948A1 (en) * 1997-12-18 1999-06-24 Pentus Research Limited A component placement system

Also Published As

Publication number Publication date
EP1816906A1 (de) 2007-08-08
WO2001024598A1 (fr) 2001-04-05
EP1227711A1 (de) 2002-07-31
DE60039547D1 (de) 2008-08-28
EP1227711B9 (de) 2008-08-13
US6842974B1 (en) 2005-01-18
EP1227711B1 (de) 2007-07-18
EP1227711A4 (de) 2004-09-01
DE60035605T2 (de) 2008-02-21
JP3996768B2 (ja) 2007-10-24
DE60035605T8 (de) 2008-06-05
EP1816906B1 (de) 2008-07-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)