DE60043938D1 - Halbleiterscheibepolierverfahren und vorrichtung - Google Patents
Halbleiterscheibepolierverfahren und vorrichtungInfo
- Publication number
- DE60043938D1 DE60043938D1 DE60043938T DE60043938T DE60043938D1 DE 60043938 D1 DE60043938 D1 DE 60043938D1 DE 60043938 T DE60043938 T DE 60043938T DE 60043938 T DE60043938 T DE 60043938T DE 60043938 D1 DE60043938 D1 DE 60043938D1
- Authority
- DE
- Germany
- Prior art keywords
- disc processing
- semiconductor disc
- semiconductor
- processing
- disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP37405399A JP3342686B2 (ja) | 1999-12-28 | 1999-12-28 | ウェーハ研磨方法及びウェーハ研磨装置 |
PCT/JP2000/008917 WO2001047664A1 (fr) | 1999-12-28 | 2000-12-15 | Procede et dispositif de polissage de tranche |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60043938D1 true DE60043938D1 (de) | 2010-04-15 |
Family
ID=18503184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60043938T Expired - Lifetime DE60043938D1 (de) | 1999-12-28 | 2000-12-15 | Halbleiterscheibepolierverfahren und vorrichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6764392B2 (de) |
EP (1) | EP1205280B1 (de) |
JP (1) | JP3342686B2 (de) |
KR (1) | KR100730501B1 (de) |
DE (1) | DE60043938D1 (de) |
TW (1) | TW520317B (de) |
WO (1) | WO2001047664A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7085494B2 (en) * | 2000-10-12 | 2006-08-01 | At & T Corp. | High-capacity packet-switched ring network |
DE10140133A1 (de) * | 2001-08-16 | 2003-03-13 | Wacker Siltronic Halbleitermat | Verfahren und Vorrichtung zum Herstellen einer klebenden Verbindung zwischen einer Halbleiterscheibe und einer Trägerplatte |
JP4614626B2 (ja) * | 2003-02-05 | 2011-01-19 | 東京エレクトロン株式会社 | 薄肉半導体チップの製造方法 |
KR100842660B1 (ko) * | 2004-05-13 | 2008-06-30 | 동부일렉트로닉스 주식회사 | 화학적 기계적 연마 장치 |
JP4808453B2 (ja) * | 2005-08-26 | 2011-11-02 | 株式会社荏原製作所 | 研磨方法及び研磨装置 |
US8524190B2 (en) | 2008-05-30 | 2013-09-03 | Skyworks Solutions, Inc. | Enhanced hexagonal ferrite material and methods of preparation and use thereof |
KR101515680B1 (ko) | 2008-10-20 | 2015-04-27 | 스카이워크스 솔루션즈, 인코포레이티드 | 자성-유전 조립체 및 그 제조방법 |
US8695990B2 (en) | 2010-04-01 | 2014-04-15 | Nidec-Read Corporation | Wafer flattening apparatus and method |
US20130303060A1 (en) * | 2010-11-26 | 2013-11-14 | Schneider Gmbh & Co. Kg | Block piece |
JP5886602B2 (ja) | 2011-03-25 | 2016-03-16 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
JP5908696B2 (ja) * | 2011-10-12 | 2016-04-26 | 株式会社ディスコ | 硬質基板の研削方法 |
JP2014200888A (ja) * | 2013-04-05 | 2014-10-27 | ローム株式会社 | 吸引保持装置およびウエハ研磨装置 |
TWI583605B (zh) * | 2013-04-16 | 2017-05-21 | xi-cong Lin | A glass panel capture device and a method of capturing a glass panel thereof |
USD769200S1 (en) * | 2013-05-15 | 2016-10-18 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing apparatus |
US20140357161A1 (en) * | 2013-05-31 | 2014-12-04 | Sunedison Semiconductor Limited | Center flex single side polishing head |
USD731448S1 (en) * | 2013-10-29 | 2015-06-09 | Ebara Corporation | Polishing pad for substrate polishing apparatus |
KR101587461B1 (ko) * | 2014-03-28 | 2016-01-21 | (주)대성하이텍 | 유리판 가공용 지그 |
CN105437011A (zh) * | 2015-12-24 | 2016-03-30 | 福建省金牛机械发展有限公司 | 一种用于石板磨边装置中的多板斜置架 |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
CN106695521A (zh) * | 2016-12-16 | 2017-05-24 | 苏州诚镓精密制造有限公司 | 一种不规则曲面打磨设备及其使用方法 |
CN109940498B (zh) * | 2019-03-30 | 2024-03-15 | 浙江联宜电机有限公司 | 齿轮抛光装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6410643A (en) * | 1987-07-02 | 1989-01-13 | Sony Corp | Bonding method for semiconductor substrate |
JPH01101386A (ja) * | 1987-10-13 | 1989-04-19 | Mitsubishi Metal Corp | ウェーハの接着方法 |
JP2971714B2 (ja) * | 1993-10-01 | 1999-11-08 | 住友金属工業株式会社 | 半導体基板の鏡面研磨方法 |
JPH0812470A (ja) * | 1994-07-01 | 1996-01-16 | Shin Etsu Chem Co Ltd | セラミックス基板 |
WO1996024467A1 (en) * | 1995-02-10 | 1996-08-15 | Advanced Micro Devices, Inc. | Chemical-mechanical polishing using curved carriers |
JPH10156705A (ja) * | 1996-11-29 | 1998-06-16 | Sumitomo Metal Ind Ltd | 研磨装置および研磨方法 |
US5975998A (en) * | 1997-09-26 | 1999-11-02 | Memc Electronic Materials , Inc. | Wafer processing apparatus |
JP2879038B1 (ja) * | 1998-02-12 | 1999-04-05 | 直江津電子工業株式会社 | シリコン半導体ウエハ外周部の仕上げ加工方法 |
JP4022306B2 (ja) * | 1998-03-03 | 2007-12-19 | 不二越機械工業株式会社 | ウェーハの接着方法及び接着装置 |
JPH11265928A (ja) * | 1998-03-18 | 1999-09-28 | Sumitomo Electric Ind Ltd | ウェハ貼付けプレートとそれを用いた半導体ウェハの研磨方法 |
JP3618220B2 (ja) * | 1998-03-30 | 2005-02-09 | 信越半導体株式会社 | 薄板の研磨方法および薄板保持プレート |
US6402594B1 (en) * | 1999-01-18 | 2002-06-11 | Shin-Etsu Handotai Co., Ltd. | Polishing method for wafer and holding plate |
US6271676B1 (en) * | 1999-03-02 | 2001-08-07 | Tsk America, Inc. | Spiral chuck |
US6368969B1 (en) * | 2000-06-30 | 2002-04-09 | International Business Machines Corporation | Chemical-mechanical polishing methods |
-
1999
- 1999-12-28 JP JP37405399A patent/JP3342686B2/ja not_active Expired - Fee Related
-
2000
- 2000-12-15 DE DE60043938T patent/DE60043938D1/de not_active Expired - Lifetime
- 2000-12-15 EP EP00981769A patent/EP1205280B1/de not_active Expired - Lifetime
- 2000-12-15 WO PCT/JP2000/008917 patent/WO2001047664A1/ja active IP Right Grant
- 2000-12-15 KR KR1020017010662A patent/KR100730501B1/ko active IP Right Grant
- 2000-12-15 US US09/913,790 patent/US6764392B2/en not_active Expired - Lifetime
- 2000-12-18 TW TW089127118A patent/TW520317B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2001047664A1 (fr) | 2001-07-05 |
EP1205280A1 (de) | 2002-05-15 |
EP1205280A4 (de) | 2006-11-15 |
TW520317B (en) | 2003-02-11 |
JP3342686B2 (ja) | 2002-11-11 |
US6764392B2 (en) | 2004-07-20 |
JP2001179578A (ja) | 2001-07-03 |
KR20020018186A (ko) | 2002-03-07 |
EP1205280B1 (de) | 2010-03-03 |
US20020160693A1 (en) | 2002-10-31 |
KR100730501B1 (ko) | 2007-06-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |