DE3855854D1 - Keramik-Metall-Verbund und Verfahren zu seiner Herstellung - Google Patents

Keramik-Metall-Verbund und Verfahren zu seiner Herstellung

Info

Publication number
DE3855854D1
DE3855854D1 DE3855854T DE3855854T DE3855854D1 DE 3855854 D1 DE3855854 D1 DE 3855854D1 DE 3855854 T DE3855854 T DE 3855854T DE 3855854 T DE3855854 T DE 3855854T DE 3855854 D1 DE3855854 D1 DE 3855854D1
Authority
DE
Germany
Prior art keywords
ceramic
manufacture
metal composite
composite
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3855854T
Other languages
English (en)
Other versions
DE3855854T2 (de
Inventor
Nobuyuki Mizunoya
Hiroshi Komorita
Tadashi Tanaka
Kazuo Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3855854D1 publication Critical patent/DE3855854D1/de
Publication of DE3855854T2 publication Critical patent/DE3855854T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6567—Treatment time
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/785—Submicron sized grains, i.e. from 0,1 to 1 micron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/56—Using constraining layers before or during sintering
    • C04B2237/568—Using constraining layers before or during sintering made of non-oxide ceramics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777—Edge feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE3855854T 1987-12-18 1988-12-15 Keramik-Metall-Verbund und Verfahren zu seiner Herstellung Expired - Fee Related DE3855854T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62320741A JPH01161892A (ja) 1987-12-18 1987-12-18 セラミックス回路基板およびその製造方法

Publications (2)

Publication Number Publication Date
DE3855854D1 true DE3855854D1 (de) 1997-05-07
DE3855854T2 DE3855854T2 (de) 1997-07-17

Family

ID=18124777

Family Applications (2)

Application Number Title Priority Date Filing Date
DE3855854T Expired - Fee Related DE3855854T2 (de) 1987-12-18 1988-12-15 Keramik-Metall-Verbund und Verfahren zu seiner Herstellung
DE88311882T Expired - Fee Related DE3884772T2 (de) 1987-12-18 1988-12-15 Keramik-Metall-Verbund und Verfahren zu seiner Herstellung.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE88311882T Expired - Fee Related DE3884772T2 (de) 1987-12-18 1988-12-15 Keramik-Metall-Verbund und Verfahren zu seiner Herstellung.

Country Status (5)

Country Link
US (1) US4954386A (de)
EP (2) EP0525820B1 (de)
JP (1) JPH01161892A (de)
KR (1) KR910005960B1 (de)
DE (2) DE3855854T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07502B2 (ja) * 1989-03-01 1995-01-11 同和鉱業株式会社 非酸化物系セラミックスのメタライズ方法
JPH0812947B2 (ja) * 1989-10-12 1996-02-07 株式会社東芝 回路基板
US5328751A (en) * 1991-07-12 1994-07-12 Kabushiki Kaisha Toshiba Ceramic circuit board with a curved lead terminal
US5490627A (en) * 1994-06-30 1996-02-13 Hughes Aircraft Company Direct bonding of copper composites to ceramics
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US5945130A (en) 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
US5900097A (en) * 1996-10-30 1999-05-04 Brown; Dennis P. Method of fabricating a laminated composite material
US6106923A (en) * 1997-05-20 2000-08-22 Fujitsu Limited Venting hole designs for multilayer conductor-dielectric structures
US5986391A (en) * 1998-03-09 1999-11-16 Feldman Technology Corporation Transparent electrodes
KR100277204B1 (ko) * 1998-07-24 2001-01-15 김충섭 질화규소와 탄소강의 접합방법
US7754976B2 (en) 2002-04-15 2010-07-13 Hamilton Sundstrand Corporation Compact circuit carrier package
KR20040023150A (ko) * 2002-09-10 2004-03-18 손호익 고순도가스를 이용한 동판 부착방법
DE102004033933B4 (de) 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
CN102656684B (zh) * 2009-11-27 2015-02-04 丰田自动车株式会社 半导体装置及其制造方法
CN101814439B (zh) * 2010-04-06 2011-07-20 淄博市临淄银河高技术开发有限公司 Igbt模块用低热阻陶瓷覆铜板的制作工艺
DE102010023637B4 (de) 2010-06-14 2012-01-12 Ixys Semiconductor Gmbh Verfahren zum Herstellen von doppelseitig metallisierten Metall-Keramik-Substraten
CN104557099B (zh) * 2013-10-25 2017-03-01 深圳光启创新技术有限公司 用于将导电几何结构贴压到陶瓷基板上的方法及制得组件和超材料
CN103824824B (zh) * 2014-03-03 2017-01-04 中国科学院微电子研究所 一种集成散热结构及其制造方法
JP6939596B2 (ja) * 2018-01-24 2021-09-22 三菱マテリアル株式会社 パワーモジュール用基板の製造方法及びセラミックス‐銅接合体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US171451A (en) * 1875-12-21 Improvement in trucks
US3826629A (en) * 1970-10-07 1974-07-30 Olin Corp Products formed of glass or ceramicmetal composites
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
GB2099742B (en) * 1981-06-05 1985-07-31 Philips Electronic Associated Bonding metals to non-metals
US4608321A (en) * 1984-02-20 1986-08-26 Ngk Spark Plug Co., Ltd. Ceramic and metal composite body
JPS6272576A (ja) * 1985-09-26 1987-04-03 株式会社東芝 セラミツクス−金属接合体
US4739443A (en) * 1985-12-30 1988-04-19 Olin Corporation Thermally conductive module
JPS62224995A (ja) * 1986-03-27 1987-10-02 同和鉱業株式会社 パワ−モジュ−ル基盤の製造方法
JPS62288177A (ja) * 1986-06-04 1987-12-15 株式会社東芝 セラミツクス−金属接合体用部材
JPS63165068A (ja) * 1986-12-26 1988-07-08 Japan Steel Works Ltd:The 金属板と基体との接合体

Also Published As

Publication number Publication date
EP0525820A3 (en) 1993-06-02
DE3884772D1 (de) 1993-11-11
DE3855854T2 (de) 1997-07-17
EP0321246A1 (de) 1989-06-21
EP0321246B1 (de) 1993-10-06
JPH01161892A (ja) 1989-06-26
DE3884772T2 (de) 1994-01-27
KR910005960B1 (ko) 1991-08-09
EP0525820A2 (de) 1993-02-03
EP0525820B1 (de) 1997-04-02
US4954386A (en) 1990-09-04
KR890011501A (ko) 1989-08-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee