KR890011501A - 세라믹-금속 접합 조성물 기판 및 그 제조방법 - Google Patents
세라믹-금속 접합 조성물 기판 및 그 제조방법 Download PDFInfo
- Publication number
- KR890011501A KR890011501A KR1019880016895A KR880016895A KR890011501A KR 890011501 A KR890011501 A KR 890011501A KR 1019880016895 A KR1019880016895 A KR 1019880016895A KR 880016895 A KR880016895 A KR 880016895A KR 890011501 A KR890011501 A KR 890011501A
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- KR
- South Korea
- Prior art keywords
- ceramic
- composition substrate
- substrate
- groove
- metal
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
- C04B2235/785—Submicron sized grains, i.e. from 0,1 to 1 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/407—Copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/56—Using constraining layers before or during sintering
- C04B2237/568—Using constraining layers before or during sintering made of non-oxide ceramics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24777—Edge feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 홈을 성형하는 롤러의 사시도.
제4a도는 본 발명의 한 구체적 실시예로서 금속-세라믹 조성물 기판의 한 면을 도시한 평면도.
제4b도는 제4a도에서 금속-세라믹 조성물 기판의 반대쪽 면을 도시한 평면도.
* 도면의 주요부분에 대한 부호의 설명
10 : 동 회로판 11 : V홈
12 : 관통구멍 13 : 세라믹 기판
Claims (11)
- 반대되는 면들을 갖는 세라믹 기판 및 세라믹 기판의 한면에 직접 접합되는 면을 가진 동 시이트로 이루어진 세라믹-금속 접합 조성물 기판에 있어서, 동시이트에 적어도 하나의 관통구멍이 나 있으며, 동시이트의 면상에 적어도 하나의 홈이 있으며. 홈들이 없는 면들로 둘러싸인 영역을 포함하는 면을 가지는 것을 특징으로 하는 세라믹-금속접합 조성물 기판.
- 제1항에 있어서, 관통구멍이 원통형으로, 그 직경이 0.2mm-1mm의 범위내에 있는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
- 제1항에 있어서, 홈은 면 둘레로부터 적어도 1mm에서 끝나는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
- 제1항에 있어서, 홈의 폭이 0.01mm-3mm의 범위내에 있는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
- 제4항에 있어서, 홈의 폭이 0.5mm-1mm의 범위내에 있는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
- 제1항에 있어서, 홈의 최대 깊이는 0.1mm보다 작은 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
- 제6항에 있어서, 홈의 깊이는 0.02mm-0.08mm인 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
- 제1항에 있어서, 조성물 기판은 다수의 평행한 홈들을 포함하는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
- 제8항에 있어서, 인접 홈들의 중심선들 간의 거리가 1mm-2.5mm 범위내에 있는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
- 제1항에 있어서, 조성물 기판은 구멍으로부터 방사상으로 뻗은 다수의 홈들을 포함하는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
- 면을 둘러싸는 홈이 없는 가장자리를 가지는 소정 형상의 동 회로 기판의 한면상에 적어도 하나의 홈을 형성하고, 홈내로 동 회로 기판을 관통하는 적어도 하나의 구멍을 형성하고 : 및 세라믹 기판에 동 회로 기판의 면을 가열 접합하는 단계들로 이루어진 것을 특징으로 하는 세라믹 회로 기판의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62320741A JPH01161892A (ja) | 1987-12-18 | 1987-12-18 | セラミックス回路基板およびその製造方法 |
JP?62-320741 | 1987-12-18 | ||
JP87-320741 | 1987-12-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890011501A true KR890011501A (ko) | 1989-08-14 |
KR910005960B1 KR910005960B1 (ko) | 1991-08-09 |
Family
ID=18124777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019880016895A KR910005960B1 (ko) | 1987-12-18 | 1988-12-16 | 세라믹-금속 접합 조성물 기판 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4954386A (ko) |
EP (2) | EP0525820B1 (ko) |
JP (1) | JPH01161892A (ko) |
KR (1) | KR910005960B1 (ko) |
DE (2) | DE3855854T2 (ko) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07502B2 (ja) * | 1989-03-01 | 1995-01-11 | 同和鉱業株式会社 | 非酸化物系セラミックスのメタライズ方法 |
JPH0812947B2 (ja) * | 1989-10-12 | 1996-02-07 | 株式会社東芝 | 回路基板 |
US5328751A (en) * | 1991-07-12 | 1994-07-12 | Kabushiki Kaisha Toshiba | Ceramic circuit board with a curved lead terminal |
US5490627A (en) * | 1994-06-30 | 1996-02-13 | Hughes Aircraft Company | Direct bonding of copper composites to ceramics |
US5876859A (en) * | 1994-11-10 | 1999-03-02 | Vlt Corporation | Direct metal bonding |
US5906310A (en) * | 1994-11-10 | 1999-05-25 | Vlt Corporation | Packaging electrical circuits |
US5945130A (en) | 1994-11-15 | 1999-08-31 | Vlt Corporation | Apparatus for circuit encapsulation |
JP2732823B2 (ja) * | 1995-02-02 | 1998-03-30 | ヴィエルティー コーポレーション | はんだ付け方法 |
US5900097A (en) * | 1996-10-30 | 1999-05-04 | Brown; Dennis P. | Method of fabricating a laminated composite material |
US6106923A (en) * | 1997-05-20 | 2000-08-22 | Fujitsu Limited | Venting hole designs for multilayer conductor-dielectric structures |
US5986391A (en) * | 1998-03-09 | 1999-11-16 | Feldman Technology Corporation | Transparent electrodes |
KR100277204B1 (ko) * | 1998-07-24 | 2001-01-15 | 김충섭 | 질화규소와 탄소강의 접합방법 |
US7754976B2 (en) | 2002-04-15 | 2010-07-13 | Hamilton Sundstrand Corporation | Compact circuit carrier package |
KR20040023150A (ko) * | 2002-09-10 | 2004-03-18 | 손호익 | 고순도가스를 이용한 동판 부착방법 |
DE102004033933B4 (de) | 2004-07-08 | 2009-11-05 | Electrovac Ag | Verfahren zum Herstellen eines Metall-Keramik-Substrates |
CN102656684B (zh) * | 2009-11-27 | 2015-02-04 | 丰田自动车株式会社 | 半导体装置及其制造方法 |
CN101814439B (zh) * | 2010-04-06 | 2011-07-20 | 淄博市临淄银河高技术开发有限公司 | Igbt模块用低热阻陶瓷覆铜板的制作工艺 |
DE102010023637B4 (de) | 2010-06-14 | 2012-01-12 | Ixys Semiconductor Gmbh | Verfahren zum Herstellen von doppelseitig metallisierten Metall-Keramik-Substraten |
CN104557099B (zh) * | 2013-10-25 | 2017-03-01 | 深圳光启创新技术有限公司 | 用于将导电几何结构贴压到陶瓷基板上的方法及制得组件和超材料 |
CN103824824B (zh) * | 2014-03-03 | 2017-01-04 | 中国科学院微电子研究所 | 一种集成散热结构及其制造方法 |
JP6939596B2 (ja) * | 2018-01-24 | 2021-09-22 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法及びセラミックス‐銅接合体 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US171451A (en) * | 1875-12-21 | Improvement in trucks | ||
US3826629A (en) * | 1970-10-07 | 1974-07-30 | Olin Corp | Products formed of glass or ceramicmetal composites |
US4409278A (en) * | 1981-04-16 | 1983-10-11 | General Electric Company | Blister-free direct bonding of metals to ceramics and metals |
GB2099742B (en) * | 1981-06-05 | 1985-07-31 | Philips Electronic Associated | Bonding metals to non-metals |
US4608321A (en) * | 1984-02-20 | 1986-08-26 | Ngk Spark Plug Co., Ltd. | Ceramic and metal composite body |
JPS6272576A (ja) * | 1985-09-26 | 1987-04-03 | 株式会社東芝 | セラミツクス−金属接合体 |
US4739443A (en) * | 1985-12-30 | 1988-04-19 | Olin Corporation | Thermally conductive module |
JPS62224995A (ja) * | 1986-03-27 | 1987-10-02 | 同和鉱業株式会社 | パワ−モジュ−ル基盤の製造方法 |
JPS62288177A (ja) * | 1986-06-04 | 1987-12-15 | 株式会社東芝 | セラミツクス−金属接合体用部材 |
JPS63165068A (ja) * | 1986-12-26 | 1988-07-08 | Japan Steel Works Ltd:The | 金属板と基体との接合体 |
-
1987
- 1987-12-18 JP JP62320741A patent/JPH01161892A/ja active Pending
-
1988
- 1988-12-08 US US07/281,365 patent/US4954386A/en not_active Expired - Fee Related
- 1988-12-15 DE DE3855854T patent/DE3855854T2/de not_active Expired - Fee Related
- 1988-12-15 EP EP19920114579 patent/EP0525820B1/en not_active Expired - Lifetime
- 1988-12-15 DE DE88311882T patent/DE3884772T2/de not_active Expired - Fee Related
- 1988-12-15 EP EP19880311882 patent/EP0321246B1/en not_active Expired - Lifetime
- 1988-12-16 KR KR1019880016895A patent/KR910005960B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0525820A3 (en) | 1993-06-02 |
DE3884772D1 (de) | 1993-11-11 |
DE3855854T2 (de) | 1997-07-17 |
EP0321246A1 (en) | 1989-06-21 |
EP0321246B1 (en) | 1993-10-06 |
JPH01161892A (ja) | 1989-06-26 |
DE3884772T2 (de) | 1994-01-27 |
KR910005960B1 (ko) | 1991-08-09 |
EP0525820A2 (en) | 1993-02-03 |
EP0525820B1 (en) | 1997-04-02 |
DE3855854D1 (de) | 1997-05-07 |
US4954386A (en) | 1990-09-04 |
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