KR890011501A - 세라믹-금속 접합 조성물 기판 및 그 제조방법 - Google Patents

세라믹-금속 접합 조성물 기판 및 그 제조방법 Download PDF

Info

Publication number
KR890011501A
KR890011501A KR1019880016895A KR880016895A KR890011501A KR 890011501 A KR890011501 A KR 890011501A KR 1019880016895 A KR1019880016895 A KR 1019880016895A KR 880016895 A KR880016895 A KR 880016895A KR 890011501 A KR890011501 A KR 890011501A
Authority
KR
South Korea
Prior art keywords
ceramic
composition substrate
substrate
groove
metal
Prior art date
Application number
KR1019880016895A
Other languages
English (en)
Other versions
KR910005960B1 (ko
Inventor
노부유끼 미즈노야
히로시 고모리따
다다시 다나까
가즈오 마쯔무라
Original Assignee
아오이 죠이찌
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이찌, 가부시끼가이샤 도시바 filed Critical 아오이 죠이찌
Publication of KR890011501A publication Critical patent/KR890011501A/ko
Application granted granted Critical
Publication of KR910005960B1 publication Critical patent/KR910005960B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6567—Treatment time
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
    • C04B2235/785—Submicron sized grains, i.e. from 0,1 to 1 micron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/56—Using constraining layers before or during sintering
    • C04B2237/568—Using constraining layers before or during sintering made of non-oxide ceramics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777—Edge feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Laminated Bodies (AREA)
  • Ceramic Products (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

내용 없음

Description

세라믹-금속 접합 조성물 기판 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도는 홈을 성형하는 롤러의 사시도.
제4a도는 본 발명의 한 구체적 실시예로서 금속-세라믹 조성물 기판의 한 면을 도시한 평면도.
제4b도는 제4a도에서 금속-세라믹 조성물 기판의 반대쪽 면을 도시한 평면도.
* 도면의 주요부분에 대한 부호의 설명
10 : 동 회로판 11 : V홈
12 : 관통구멍 13 : 세라믹 기판

Claims (11)

  1. 반대되는 면들을 갖는 세라믹 기판 및 세라믹 기판의 한면에 직접 접합되는 면을 가진 동 시이트로 이루어진 세라믹-금속 접합 조성물 기판에 있어서, 동시이트에 적어도 하나의 관통구멍이 나 있으며, 동시이트의 면상에 적어도 하나의 홈이 있으며. 홈들이 없는 면들로 둘러싸인 영역을 포함하는 면을 가지는 것을 특징으로 하는 세라믹-금속접합 조성물 기판.
  2. 제1항에 있어서, 관통구멍이 원통형으로, 그 직경이 0.2mm-1mm의 범위내에 있는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
  3. 제1항에 있어서, 홈은 면 둘레로부터 적어도 1mm에서 끝나는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
  4. 제1항에 있어서, 홈의 폭이 0.01mm-3mm의 범위내에 있는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
  5. 제4항에 있어서, 홈의 폭이 0.5mm-1mm의 범위내에 있는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
  6. 제1항에 있어서, 홈의 최대 깊이는 0.1mm보다 작은 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
  7. 제6항에 있어서, 홈의 깊이는 0.02mm-0.08mm인 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
  8. 제1항에 있어서, 조성물 기판은 다수의 평행한 홈들을 포함하는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
  9. 제8항에 있어서, 인접 홈들의 중심선들 간의 거리가 1mm-2.5mm 범위내에 있는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
  10. 제1항에 있어서, 조성물 기판은 구멍으로부터 방사상으로 뻗은 다수의 홈들을 포함하는 것을 특징으로 하는 세라믹-금속 접합 조성물 기판.
  11. 면을 둘러싸는 홈이 없는 가장자리를 가지는 소정 형상의 동 회로 기판의 한면상에 적어도 하나의 홈을 형성하고, 홈내로 동 회로 기판을 관통하는 적어도 하나의 구멍을 형성하고 : 및 세라믹 기판에 동 회로 기판의 면을 가열 접합하는 단계들로 이루어진 것을 특징으로 하는 세라믹 회로 기판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880016895A 1987-12-18 1988-12-16 세라믹-금속 접합 조성물 기판 및 그 제조방법 KR910005960B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62320741A JPH01161892A (ja) 1987-12-18 1987-12-18 セラミックス回路基板およびその製造方法
JP?62-320741 1987-12-18
JP87-320741 1987-12-18

Publications (2)

Publication Number Publication Date
KR890011501A true KR890011501A (ko) 1989-08-14
KR910005960B1 KR910005960B1 (ko) 1991-08-09

Family

ID=18124777

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880016895A KR910005960B1 (ko) 1987-12-18 1988-12-16 세라믹-금속 접합 조성물 기판 및 그 제조방법

Country Status (5)

Country Link
US (1) US4954386A (ko)
EP (2) EP0525820B1 (ko)
JP (1) JPH01161892A (ko)
KR (1) KR910005960B1 (ko)
DE (2) DE3855854T2 (ko)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07502B2 (ja) * 1989-03-01 1995-01-11 同和鉱業株式会社 非酸化物系セラミックスのメタライズ方法
JPH0812947B2 (ja) * 1989-10-12 1996-02-07 株式会社東芝 回路基板
US5328751A (en) * 1991-07-12 1994-07-12 Kabushiki Kaisha Toshiba Ceramic circuit board with a curved lead terminal
US5490627A (en) * 1994-06-30 1996-02-13 Hughes Aircraft Company Direct bonding of copper composites to ceramics
US5876859A (en) * 1994-11-10 1999-03-02 Vlt Corporation Direct metal bonding
US5906310A (en) * 1994-11-10 1999-05-25 Vlt Corporation Packaging electrical circuits
US5945130A (en) 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
JP2732823B2 (ja) * 1995-02-02 1998-03-30 ヴィエルティー コーポレーション はんだ付け方法
US5900097A (en) * 1996-10-30 1999-05-04 Brown; Dennis P. Method of fabricating a laminated composite material
US6106923A (en) * 1997-05-20 2000-08-22 Fujitsu Limited Venting hole designs for multilayer conductor-dielectric structures
US5986391A (en) * 1998-03-09 1999-11-16 Feldman Technology Corporation Transparent electrodes
KR100277204B1 (ko) * 1998-07-24 2001-01-15 김충섭 질화규소와 탄소강의 접합방법
US7754976B2 (en) 2002-04-15 2010-07-13 Hamilton Sundstrand Corporation Compact circuit carrier package
KR20040023150A (ko) * 2002-09-10 2004-03-18 손호익 고순도가스를 이용한 동판 부착방법
DE102004033933B4 (de) 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
CN102656684B (zh) * 2009-11-27 2015-02-04 丰田自动车株式会社 半导体装置及其制造方法
CN101814439B (zh) * 2010-04-06 2011-07-20 淄博市临淄银河高技术开发有限公司 Igbt模块用低热阻陶瓷覆铜板的制作工艺
DE102010023637B4 (de) 2010-06-14 2012-01-12 Ixys Semiconductor Gmbh Verfahren zum Herstellen von doppelseitig metallisierten Metall-Keramik-Substraten
CN104557099B (zh) * 2013-10-25 2017-03-01 深圳光启创新技术有限公司 用于将导电几何结构贴压到陶瓷基板上的方法及制得组件和超材料
CN103824824B (zh) * 2014-03-03 2017-01-04 中国科学院微电子研究所 一种集成散热结构及其制造方法
JP6939596B2 (ja) * 2018-01-24 2021-09-22 三菱マテリアル株式会社 パワーモジュール用基板の製造方法及びセラミックス‐銅接合体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US171451A (en) * 1875-12-21 Improvement in trucks
US3826629A (en) * 1970-10-07 1974-07-30 Olin Corp Products formed of glass or ceramicmetal composites
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
GB2099742B (en) * 1981-06-05 1985-07-31 Philips Electronic Associated Bonding metals to non-metals
US4608321A (en) * 1984-02-20 1986-08-26 Ngk Spark Plug Co., Ltd. Ceramic and metal composite body
JPS6272576A (ja) * 1985-09-26 1987-04-03 株式会社東芝 セラミツクス−金属接合体
US4739443A (en) * 1985-12-30 1988-04-19 Olin Corporation Thermally conductive module
JPS62224995A (ja) * 1986-03-27 1987-10-02 同和鉱業株式会社 パワ−モジュ−ル基盤の製造方法
JPS62288177A (ja) * 1986-06-04 1987-12-15 株式会社東芝 セラミツクス−金属接合体用部材
JPS63165068A (ja) * 1986-12-26 1988-07-08 Japan Steel Works Ltd:The 金属板と基体との接合体

Also Published As

Publication number Publication date
EP0525820A3 (en) 1993-06-02
DE3884772D1 (de) 1993-11-11
DE3855854T2 (de) 1997-07-17
EP0321246A1 (en) 1989-06-21
EP0321246B1 (en) 1993-10-06
JPH01161892A (ja) 1989-06-26
DE3884772T2 (de) 1994-01-27
KR910005960B1 (ko) 1991-08-09
EP0525820A2 (en) 1993-02-03
EP0525820B1 (en) 1997-04-02
DE3855854D1 (de) 1997-05-07
US4954386A (en) 1990-09-04

Similar Documents

Publication Publication Date Title
KR890011501A (ko) 세라믹-금속 접합 조성물 기판 및 그 제조방법
KR870002751A (ko) 다층세라믹 기판 및 그 제조 방법
KR920009558A (ko) 적층물의 코어물질 및 그 코어물질의 제조방법
KR900017449A (ko) 전자 어셈블리 및 전자 어셈블리를 형성하는 공정
KR890003020A (ko) 캐리어 테이프의 칩 지지부를 시일링 하기 위한 카바 테이프 및 그 제조방법
KR870008339A (ko) 칩형 저항기
KR950023239A (ko) 세라믹스 회로기판
KR870003031A (ko) 세라믹스-금속접합체
KR900004226A (ko) 관통공에서 전기적 접속하는 가요성 양면 회로 기판 제조방법
KR920018834A (ko) 탄화규소질 지그
KR880700616A (ko) 다층 프린트 기판
JP2000507135A5 (ko)
KR860007087A (ko) 적층판(plywood)의 제조방법
KR900004077Y1 (ko) 튜너(Tuner)용 PCB
JPS6144904U (ja) 導波管回路
JPS61251189A (ja) プリント配線板の製造方法
KR910019074A (ko) 마킹을 갖는 세라믹 다중층 캐패시터 제조 방법
JPS609440U (ja) まな板
KR940003435A (ko) 알루미늄 회로기판의 제조방법 및 그 회로기판
KR890007409A (ko) 세라믹 기판의 소성방법
KR880012136A (ko) 프린트 기판의 절연구조
JPS6276562U (ko)
JPS5830305U (ja) ストリツプライン共振器
JPH0315467U (ko)
JPH0165173U (ko)

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19960729

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee