DE3852770D1 - Vorrichtung zur Handhabung von Wafern. - Google Patents
Vorrichtung zur Handhabung von Wafern.Info
- Publication number
- DE3852770D1 DE3852770D1 DE3852770T DE3852770T DE3852770D1 DE 3852770 D1 DE3852770 D1 DE 3852770D1 DE 3852770 T DE3852770 T DE 3852770T DE 3852770 T DE3852770 T DE 3852770T DE 3852770 D1 DE3852770 D1 DE 3852770D1
- Authority
- DE
- Germany
- Prior art keywords
- handling wafers
- wafers
- handling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/012,537 US4778332A (en) | 1987-02-09 | 1987-02-09 | Wafer flip apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3852770D1 true DE3852770D1 (de) | 1995-03-02 |
DE3852770T2 DE3852770T2 (de) | 1995-05-18 |
Family
ID=21755435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3852770T Expired - Lifetime DE3852770T2 (de) | 1987-02-09 | 1988-02-08 | Vorrichtung zur Handhabung von Wafern. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4778332A (de) |
EP (1) | EP0278460B1 (de) |
JP (1) | JP2550130B2 (de) |
KR (1) | KR970000967B1 (de) |
CA (1) | CA1278879C (de) |
DE (1) | DE3852770T2 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0361959B1 (de) * | 1988-09-30 | 1996-09-11 | Canon Kabushiki Kaisha | Transportvorrichtung für Substrate |
US5020789A (en) * | 1988-12-09 | 1991-06-04 | International Business Machines Corporation | Drive up teller machine |
US5344521A (en) * | 1991-04-10 | 1994-09-06 | Canon Kabushiki Kaisha | Coating film separating device and coating film separation method using the device |
US5154730A (en) * | 1991-05-17 | 1992-10-13 | Materials Research Corporation | Semiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the module |
CH686445A5 (de) * | 1992-10-06 | 1996-03-29 | Balzers Hochvakuum | Kammer und Kammerkombination fuer eine Vakuumanlage und Verfahren zum Durchreichen mindestens eines Werkstueckes. |
US5295777A (en) * | 1992-12-23 | 1994-03-22 | Materials Research Corporation | Wafer transport module with rotatable and horizontally extendable wafer holder |
US5421889A (en) * | 1993-06-29 | 1995-06-06 | Tokyo Electron Limited | Method and apparatus for inverting samples in a process |
KR0135802B1 (ko) * | 1994-07-11 | 1998-04-29 | 김광호 | 웨이퍼 운반장치 및 운반장치 제조방법 |
US5507614A (en) * | 1995-03-02 | 1996-04-16 | Cybeq Systems | Holder mechanism for simultaneously tilting and rotating a wafer cassette |
JPH08288355A (ja) * | 1995-04-12 | 1996-11-01 | Nikon Corp | 基板搬送装置 |
JP3771320B2 (ja) * | 1996-03-29 | 2006-04-26 | コマツ電子金属株式会社 | 半導体ウェハの貼付方法及び貼付装置 |
NL1003342C2 (nl) * | 1996-06-14 | 1997-12-17 | Fico Bv | Inrichting voor het gelijktijdig verplaatsen en wijzigen van de oriënta- tie van ten minste één drager voor electronische componenten. |
US5993148A (en) | 1997-07-22 | 1999-11-30 | Micron Technology, Inc. | Article transfer methods |
US5915910A (en) * | 1997-08-29 | 1999-06-29 | Daitron, Inc. | Semiconductor wafer transfer method and apparatus |
US6183186B1 (en) | 1997-08-29 | 2001-02-06 | Daitron, Inc. | Wafer handling system and method |
WO2000078654A1 (en) * | 1999-06-17 | 2000-12-28 | Speedfam-Ipec Corporation | Improved wafer handling apparatus |
US6239863B1 (en) | 1999-10-08 | 2001-05-29 | Silicon Valley Group, Inc. | Removable cover for protecting a reticle, system including and method of using the same |
US6467827B1 (en) | 1999-10-30 | 2002-10-22 | Frank J. Ardezzone | IC wafer handling apparatus incorporating edge-gripping and pressure or vacuum driven end-effectors |
DE60219844T2 (de) * | 2001-03-01 | 2008-01-17 | Asml Netherlands B.V. | Verfahren zur Übernahme einer lithographischen Maske |
US6695572B2 (en) * | 2001-09-28 | 2004-02-24 | Agere Systems Inc. | Method and apparatus for minimizing semiconductor wafer contamination |
TWI319123B (en) * | 2002-02-22 | 2010-01-01 | Asml Holding Nv | System and method for using a two part cover for protecting a reticle |
US6862817B1 (en) | 2003-11-12 | 2005-03-08 | Asml Holding N.V. | Method and apparatus for kinematic registration of a reticle |
US7993093B2 (en) * | 2004-09-15 | 2011-08-09 | Applied Materials, Inc. | Systems and methods for wafer translation |
US7819079B2 (en) | 2004-12-22 | 2010-10-26 | Applied Materials, Inc. | Cartesian cluster tool configuration for lithography type processes |
US7396412B2 (en) | 2004-12-22 | 2008-07-08 | Sokudo Co., Ltd. | Coat/develop module with shared dispense |
US7798764B2 (en) | 2005-12-22 | 2010-09-21 | Applied Materials, Inc. | Substrate processing sequence in a cartesian robot cluster tool |
US7651306B2 (en) | 2004-12-22 | 2010-01-26 | Applied Materials, Inc. | Cartesian robot cluster tool architecture |
US7374391B2 (en) * | 2005-12-22 | 2008-05-20 | Applied Materials, Inc. | Substrate gripper for a substrate handling robot |
DE102005050638B4 (de) * | 2005-10-20 | 2020-07-16 | Tdk Electronics Ag | Elektrisches Bauelement |
JP4895635B2 (ja) * | 2006-02-20 | 2012-03-14 | セイコーインスツル株式会社 | 搬送装置 |
US8376428B2 (en) * | 2006-11-15 | 2013-02-19 | Dynamic Micro System Semiconductor Equipment GmbH | Integrated gripper for workpiece transfer |
US20080166210A1 (en) * | 2007-01-05 | 2008-07-10 | Applied Materials, Inc. | Supinating cartesian robot blade |
US20090065995A1 (en) * | 2007-09-11 | 2009-03-12 | Atmel Corporation | Ambidexturous Shuttle Spoon |
JP2009105357A (ja) * | 2007-10-23 | 2009-05-14 | M Tec Kk | チップの搬送方法及び装置 |
US8613474B2 (en) | 2011-07-06 | 2013-12-24 | Tel Nexx, Inc. | Substrate loader and unloader having a Bernoulli support |
US11035591B2 (en) * | 2015-10-13 | 2021-06-15 | Corosolar Llc | Bearing assembly for solar trackers |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3437929A (en) * | 1965-08-05 | 1969-04-08 | Electroglas Inc | Automatically indexed probe assembly for testing semiconductor wafers and the like |
US3499640A (en) * | 1967-08-03 | 1970-03-10 | Electroglas Inc | Chuck assembly for automatic wafer die sort machine |
US3711081A (en) * | 1970-03-31 | 1973-01-16 | Ibm | Semiconductor wafer chuck |
US3700228A (en) * | 1970-09-25 | 1972-10-24 | Robert E Peale | Adjustable axis work support |
US3841499A (en) * | 1973-10-31 | 1974-10-15 | Armflex Inc | Work transfer apparatus |
US3960277A (en) * | 1974-09-30 | 1976-06-01 | Flint Alan G | Mask plate handling apparatus |
US4042122A (en) * | 1975-05-27 | 1977-08-16 | The Bendix Corporation | Reorientation device for an object manipulator |
FR2352640A1 (fr) * | 1976-05-24 | 1977-12-23 | Bretagne Atel Chantiers | Telemanipulateur a faible encombrement |
CA1034393A (en) * | 1976-10-13 | 1978-07-11 | Henry J. Taylor | Powered wrist joint |
FR2388372A1 (fr) * | 1977-04-20 | 1978-11-17 | Thomson Csf | Platine a rattrapage de niveau et positionneur a indexation mecanique utilisant une telle platine |
US4262891A (en) * | 1979-06-04 | 1981-04-21 | Kinney Charles G | Three dimensional positionable workpiece support table |
FR2461556A1 (fr) * | 1979-07-18 | 1981-02-06 | Bretagne Atel Chantiers | Bras de manipulation a distance |
JPS5912435B2 (ja) * | 1980-07-25 | 1984-03-23 | ファナック株式会社 | 工業用ロボットの安全機構 |
JPS5912436B2 (ja) * | 1980-08-05 | 1984-03-23 | ファナック株式会社 | 工業用ロボットの安全機構 |
JPS6039518B2 (ja) * | 1980-09-30 | 1985-09-06 | ファナック株式会社 | 工業用ロボットの手首機構 |
GB2102763B (en) * | 1981-07-31 | 1985-05-30 | Bird Johnson Co | Three-axes actuator assembly |
US4568070A (en) * | 1981-09-15 | 1986-02-04 | Severt W | Positioning and turning apparatus |
US4444492A (en) * | 1982-05-15 | 1984-04-24 | General Signal Corporation | Apparatus for projecting a series of images onto dies of a semiconductor wafer |
GB2126559A (en) * | 1982-09-07 | 1984-03-28 | Itt | Manipulator apparatus |
US4603897A (en) * | 1983-05-20 | 1986-08-05 | Poconics International, Inc. | Vacuum pickup apparatus |
US4684312A (en) * | 1984-04-30 | 1987-08-04 | Westinghouse Electric Corp. | Robotic wrist |
US4566726A (en) * | 1984-06-13 | 1986-01-28 | At&T Technologies, Inc. | Method and apparatus for handling semiconductor wafers |
US4557514A (en) * | 1984-07-18 | 1985-12-10 | At&T Technologies, Inc. | Vacuum pick and place robotic hand |
US4586743A (en) * | 1984-09-24 | 1986-05-06 | Intelledex Incorporated | Robotic gripper for disk-shaped objects |
DD240166A1 (de) * | 1985-08-14 | 1986-10-22 | Karl Marx Stadt Tech Hochschul | Revolverkopf fuer industrieroboter |
-
1987
- 1987-02-09 US US07/012,537 patent/US4778332A/en not_active Expired - Lifetime
-
1988
- 1988-02-04 CA CA000558131A patent/CA1278879C/en not_active Expired - Lifetime
- 1988-02-08 EP EP88101809A patent/EP0278460B1/de not_active Expired - Lifetime
- 1988-02-08 DE DE3852770T patent/DE3852770T2/de not_active Expired - Lifetime
- 1988-02-09 JP JP2670988A patent/JP2550130B2/ja not_active Expired - Lifetime
- 1988-02-09 KR KR1019880001178A patent/KR970000967B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA1278879C (en) | 1991-01-08 |
JP2550130B2 (ja) | 1996-11-06 |
US4778332A (en) | 1988-10-18 |
JPS6419741A (en) | 1989-01-23 |
DE3852770T2 (de) | 1995-05-18 |
KR880010475A (ko) | 1988-10-10 |
EP0278460A3 (en) | 1990-07-18 |
EP0278460B1 (de) | 1995-01-18 |
EP0278460A2 (de) | 1988-08-17 |
KR970000967B1 (ko) | 1997-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |