DE3786273D1 - Vorrichtung zur bestueckung mit chips. - Google Patents

Vorrichtung zur bestueckung mit chips.

Info

Publication number
DE3786273D1
DE3786273D1 DE8787400440T DE3786273T DE3786273D1 DE 3786273 D1 DE3786273 D1 DE 3786273D1 DE 8787400440 T DE8787400440 T DE 8787400440T DE 3786273 T DE3786273 T DE 3786273T DE 3786273 D1 DE3786273 D1 DE 3786273D1
Authority
DE
Germany
Prior art keywords
chips
equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787400440T
Other languages
English (en)
Inventor
Teruhiko Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TENRYU TECHNICS CO
Original Assignee
TENRYU TECHNICS CO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TENRYU TECHNICS CO filed Critical TENRYU TECHNICS CO
Application granted granted Critical
Publication of DE3786273D1 publication Critical patent/DE3786273D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Specific Conveyance Elements (AREA)
  • Die Bonding (AREA)
DE8787400440T 1986-02-28 1987-02-27 Vorrichtung zur bestueckung mit chips. Expired - Lifetime DE3786273D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986029400U JPS62142845U (de) 1986-02-28 1986-02-28

Publications (1)

Publication Number Publication Date
DE3786273D1 true DE3786273D1 (de) 1993-07-29

Family

ID=12275089

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787400440T Expired - Lifetime DE3786273D1 (de) 1986-02-28 1987-02-27 Vorrichtung zur bestueckung mit chips.

Country Status (5)

Country Link
US (1) US4753004A (de)
EP (1) EP0235047B1 (de)
JP (1) JPS62142845U (de)
CA (1) CA1298694C (de)
DE (1) DE3786273D1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4844324A (en) * 1987-09-29 1989-07-04 Todd Thomas W Solder system and method of using same
US5497983A (en) * 1987-10-16 1996-03-12 Tenryu Technics Co., Ltd. Work positioner of chip mounter for monitoring a chip-shaped electronic part onto a substrate
US4883300A (en) * 1988-10-13 1989-11-28 Intelmatec Corporation End effector for IC chip handling
US4950011A (en) * 1988-10-24 1990-08-21 Nicky Borcea Tool for precisely positioning a workpiece
DE3904587A1 (de) * 1989-02-16 1990-08-23 Arnold & Richter Kg Montagekopf fuer handhabungsgeraete
DE8904031U1 (de) * 1989-04-01 1989-05-18 SES Electronics GmbH, 8860 Nördlingen Bestückkopf
US5106138A (en) * 1989-06-05 1992-04-21 Hewlett-Packard Company Linear tweezers
US4987676A (en) * 1989-08-23 1991-01-29 Quad Systems Corporation End effector for a robotic system
EP0500246B1 (de) * 1991-02-20 1996-05-08 Matsumoto Giken Co., Ltd. Vorrichtung zur Halterung und Positionierung von elektronischen Chips
US5160181A (en) * 1991-09-09 1992-11-03 Intelmatec Corporation Pick-up head assembly
US5315189A (en) * 1991-09-25 1994-05-24 Systems, Machines, Automation Corporation Actuator with translational and rotational control
US5284413A (en) * 1992-08-05 1994-02-08 Intelmatec Corporation Apparatus for loading and unloading thin integrated circuits into and from carriers
JPH06224595A (ja) * 1993-01-19 1994-08-12 Juki Corp 部品吸着搭載ヘッド装置
DE4430381C2 (de) * 1993-08-31 1997-02-27 Smc Kk Saugpipette
DE19500416A1 (de) * 1995-01-10 1996-07-11 Atg Test Systems Gmbh Haltevorrichtung für flächenförmige Prüflinge
US5697658A (en) * 1995-05-05 1997-12-16 Samsung Electronics Co., Ltd. Centering apparatus for component mounting device
US6139078A (en) * 1998-11-13 2000-10-31 International Business Machines Corporation Self-aligning end effector for small components
FR2859197B1 (fr) * 2003-09-02 2006-10-13 Commissariat Energie Atomique Dispositif de manutention de fut
US9258936B2 (en) * 2011-12-27 2016-02-09 Hanwha Techwin Co., Ltd. Adsorption head for surface mounting device
CN102632638A (zh) * 2012-03-16 2012-08-15 安徽德力日用玻璃股份有限公司 压机自动吸取杯机构
ITFI20120233A1 (it) * 2012-10-29 2014-04-30 Esanastri S R L Dispositivo di micro-sfridatura di film plastici o in carta a uno o più strati autoadesivi, biadesivizzati o elettrostatici accoppiati con un liner di supporto antiaderente
CN108275466A (zh) * 2018-03-30 2018-07-13 青岛元启智能机器人科技有限公司 一种液晶屏抓取装置
CN108674968B (zh) * 2018-05-29 2020-05-12 江西绣丽织带有限公司 一种用于织机的纱管自动上下料设备
CN110729217A (zh) * 2019-10-22 2020-01-24 江苏佳晟精密设备科技有限公司 一种安装半导体芯片的装置
CN113644019B (zh) * 2021-08-09 2024-03-19 恩纳基智能科技无锡有限公司 一种半导体贴片机的复合上料装置
CN113692137B (zh) * 2021-10-22 2022-01-04 苏州联讯仪器有限公司 通讯芯片的自动贴片机
CN115372243B (zh) * 2022-10-21 2023-02-03 东营华亚国联航空燃料有限公司 一种航空燃料测试用铜片腐蚀试验设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4438559A (en) * 1980-06-27 1984-03-27 Fuji Machine Mfg. Co. Ltd. Apparatus for automatically mounting non-lead electronic components on printed-circuit
JPS59224279A (ja) * 1983-06-01 1984-12-17 富士機械製造株式会社 電子部品の位置決め保持方法および装置
WO1985003404A1 (en) * 1984-01-23 1985-08-01 Dyna/Pert - Precima Limited Head for handling electrical components
DE3411125A1 (de) * 1984-03-26 1985-10-03 Alfred 8000 München Lemmer Vorrichtung zum greifen von elektronischen bauelementen, insbesondere ic's

Also Published As

Publication number Publication date
JPS62142845U (de) 1987-09-09
EP0235047A2 (de) 1987-09-02
CA1298694C (en) 1992-04-14
EP0235047A3 (en) 1989-09-06
EP0235047B1 (de) 1993-06-23
US4753004A (en) 1988-06-28

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Legal Events

Date Code Title Description
8332 No legal effect for de