DE3786600D1 - Mehrschichtige gedruckte schaltung und verfahren zu ihrer herstellung. - Google Patents
Mehrschichtige gedruckte schaltung und verfahren zu ihrer herstellung.Info
- Publication number
- DE3786600D1 DE3786600D1 DE8787107642T DE3786600T DE3786600D1 DE 3786600 D1 DE3786600 D1 DE 3786600D1 DE 8787107642 T DE8787107642 T DE 8787107642T DE 3786600 T DE3786600 T DE 3786600T DE 3786600 D1 DE3786600 D1 DE 3786600D1
- Authority
- DE
- Germany
- Prior art keywords
- production
- printed circuit
- multilayer printed
- multilayer
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12511886 | 1986-05-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3786600D1 true DE3786600D1 (de) | 1993-08-26 |
DE3786600T2 DE3786600T2 (de) | 1993-11-04 |
Family
ID=14902290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE87107642T Expired - Fee Related DE3786600T2 (de) | 1986-05-30 | 1987-05-26 | Mehrschichtige gedruckte schaltung und verfahren zu ihrer herstellung. |
Country Status (5)
Country | Link |
---|---|
US (2) | US4791239A (de) |
EP (1) | EP0247575B1 (de) |
JP (1) | JPS63170994A (de) |
KR (1) | KR960001351B1 (de) |
DE (1) | DE3786600T2 (de) |
Families Citing this family (79)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01259596A (ja) * | 1988-04-11 | 1989-10-17 | Canon Inc | プリント配線板の製造方法 |
US4987100A (en) * | 1988-05-26 | 1991-01-22 | International Business Machines Corporation | Flexible carrier for an electronic device |
US4937707A (en) * | 1988-05-26 | 1990-06-26 | International Business Machines Corporation | Flexible carrier for an electronic device |
US4900878A (en) * | 1988-10-03 | 1990-02-13 | Hughes Aircraft Company | Circuit terminations having improved electrical and structural integrity |
DE3837206C2 (de) * | 1988-11-02 | 1998-07-23 | Bosch Gmbh Robert | Elektrisches Schaltgerät |
US5084323A (en) * | 1989-04-07 | 1992-01-28 | Nippondenso Co., Ltd. | Ceramic multi-layer wiring substrate and process for preparation thereof |
JPH0793502B2 (ja) * | 1989-09-26 | 1995-10-09 | 松下電工株式会社 | 多層積層板の製造方法 |
US5072075A (en) * | 1989-06-28 | 1991-12-10 | Digital Equipment Corporation | Double-sided hybrid high density circuit board and method of making same |
FR2650472A1 (fr) * | 1989-07-27 | 1991-02-01 | Bull Sa | Procede de depot d'une couche isolante sur une couche conductrice du reseau multicouche d'une carte de connexion de circuit integre de haute densite, et carte en resultant |
JPH03283594A (ja) * | 1990-03-30 | 1991-12-13 | Toshiba Lighting & Technol Corp | 回路基板 |
JPH04355990A (ja) * | 1990-09-18 | 1992-12-09 | Fujitsu Ltd | 回路基板およびその製造方法 |
US5189261A (en) * | 1990-10-09 | 1993-02-23 | Ibm Corporation | Electrical and/or thermal interconnections and methods for obtaining such |
US5393934A (en) * | 1991-02-28 | 1995-02-28 | Yazaki Corporation | Busbar conductor |
US5106308A (en) * | 1991-03-04 | 1992-04-21 | Allied-Signal Inc. | Planar contact grid array connector |
US5414224A (en) * | 1991-04-01 | 1995-05-09 | Filial Vsesojuznogo Nauchno Issledovatelskogo Instituta | Multilayer printed circuit board and method of manufacturing same |
US5283948A (en) * | 1991-05-31 | 1994-02-08 | Cray Research, Inc. | Method of manufacturing interconnect bumps |
CA2072817A1 (en) * | 1991-07-02 | 1993-01-03 | Miksa Desorgo | Multi-layer circuit board |
EP1132961B1 (de) * | 1991-07-24 | 2011-01-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Verfahren zur Herstellung eines Schaltungssubstrates mit einem montierten Halbleiterelement |
US6133534A (en) * | 1991-11-29 | 2000-10-17 | Hitachi Chemical Company, Ltd. | Wiring board for electrical tests with bumps having polymeric coating |
US6568073B1 (en) * | 1991-11-29 | 2003-05-27 | Hitachi Chemical Company, Ltd. | Process for the fabrication of wiring board for electrical tests |
US5220487A (en) * | 1992-01-27 | 1993-06-15 | International Business Machines Corporation | Electronic package with enhanced heat sinking |
US5391841A (en) * | 1992-12-08 | 1995-02-21 | Quick; Nathaniel R. | Laser processed coatings on electronic circuit substrates |
EP0647090B1 (de) * | 1993-09-03 | 1999-06-23 | Kabushiki Kaisha Toshiba | Leiterplatte und Verfahren zur Herstellung solcher Leiterplatten |
EP0677897A3 (de) * | 1994-04-14 | 1996-09-11 | Siemens Ag | Leiterplattenanordnung für Steckverbindungen. |
US6175084B1 (en) * | 1995-04-12 | 2001-01-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
US5670750A (en) * | 1995-04-27 | 1997-09-23 | International Business Machines Corporation | Electric circuit card having a donut shaped land |
US6271576B1 (en) * | 1996-12-05 | 2001-08-07 | Nathaniel R. Quick | Laser synthesized ceramic sensors and method for making |
US6670693B1 (en) | 1996-12-05 | 2003-12-30 | Nathaniel R. Quick | Laser synthesized wide-bandgap semiconductor electronic devices and circuits |
US6080668A (en) * | 1996-05-30 | 2000-06-27 | International Business Machines Corporation | Sequential build-up organic chip carrier and method of manufacture |
US5665650A (en) * | 1996-05-30 | 1997-09-09 | International Business Machines Corporation | Method for manufacturing a high density electronic circuit assembly |
US5822856A (en) * | 1996-06-28 | 1998-10-20 | International Business Machines Corporation | Manufacturing circuit board assemblies having filled vias |
EP1137333B1 (de) * | 1998-09-17 | 2010-04-21 | Ibiden Co., Ltd. | Vielschichtig aufgebaute leiterplatte |
US6232383B1 (en) * | 1998-11-06 | 2001-05-15 | Nurescell, Inc. | Nuclear resistance cell and methods for making same |
EP2086299A1 (de) | 1999-06-02 | 2009-08-05 | Ibiden Co., Ltd. | Mehrschichtige bestückte Leiterplatte und Verfahren zur Herstellung einer mehrschichtigen bestückten Leiterplatte |
US6732562B2 (en) * | 2000-05-09 | 2004-05-11 | University Of Central Florida | Apparatus and method for drawing continuous fiber |
US6412168B1 (en) * | 2000-09-06 | 2002-07-02 | Visteon Global Tech, Inc. | Method of making an electrical circuit board |
JP3434808B2 (ja) * | 2001-05-31 | 2003-08-11 | 三井金属鉱業株式会社 | 樹脂付銅箔及びその樹脂付銅箔を用いたプリント配線板 |
JP4062907B2 (ja) * | 2001-11-12 | 2008-03-19 | 松下電器産業株式会社 | 回路基板およびその製造方法 |
US6645567B2 (en) * | 2001-12-19 | 2003-11-11 | Intel Corporation | Electroless plating bath composition and method of using |
JP4042497B2 (ja) * | 2002-04-15 | 2008-02-06 | セイコーエプソン株式会社 | 導電膜パターンの形成方法、配線基板、電子デバイス、電子機器、並びに非接触型カード媒体 |
JP3925283B2 (ja) * | 2002-04-16 | 2007-06-06 | セイコーエプソン株式会社 | 電子デバイスの製造方法、電子機器の製造方法 |
EP1357773A3 (de) * | 2002-04-25 | 2005-11-30 | Matsushita Electric Industrial Co., Ltd. | Leiterübertragungsfolie und Verfahren zu deren Herstellung, und Leiterplatte und Verfahren zu deren Herstellung |
CN100334929C (zh) * | 2002-05-21 | 2007-08-29 | 株式会社大和工业 | 层间连接结构的形成方法 |
JP2004214573A (ja) * | 2003-01-09 | 2004-07-29 | Murata Mfg Co Ltd | セラミック多層基板の製造方法 |
JP4346333B2 (ja) * | 2003-03-26 | 2009-10-21 | 新光電気工業株式会社 | 半導体素子を内蔵した多層回路基板の製造方法 |
JP4029759B2 (ja) * | 2003-04-04 | 2008-01-09 | 株式会社デンソー | 多層回路基板およびその製造方法 |
US6939748B1 (en) | 2003-10-13 | 2005-09-06 | Nathaniel R. Quick | Nano-size semiconductor component and method of making |
JP3979391B2 (ja) | 2004-01-26 | 2007-09-19 | 松下電器産業株式会社 | 回路形成基板の製造方法および回路形成基板の製造用材料 |
US7618880B1 (en) * | 2004-02-19 | 2009-11-17 | Quick Nathaniel R | Apparatus and method for transformation of substrate |
US8617965B1 (en) | 2004-02-19 | 2013-12-31 | Partial Assignment to University of Central Florida | Apparatus and method of forming high crystalline quality layer |
US7268063B1 (en) * | 2004-06-01 | 2007-09-11 | University Of Central Florida | Process for fabricating semiconductor component |
US7419887B1 (en) * | 2004-07-26 | 2008-09-02 | Quick Nathaniel R | Laser assisted nano deposition |
DE102004058335A1 (de) * | 2004-11-29 | 2006-06-14 | Schulz-Harder, Jürgen, Dr.-Ing. | Substrat |
US7951632B1 (en) | 2005-01-26 | 2011-05-31 | University Of Central Florida | Optical device and method of making |
TWI286454B (en) * | 2005-03-09 | 2007-09-01 | Phoenix Prec Technology Corp | Electrical connector structure of circuit board and method for fabricating the same |
TWI261329B (en) | 2005-03-09 | 2006-09-01 | Phoenix Prec Technology Corp | Conductive bump structure of circuit board and method for fabricating the same |
KR100675012B1 (ko) * | 2006-02-06 | 2007-01-29 | 삼성전자주식회사 | 강화된 구리 도금막을 포함하는 pcb 및 그 제조 방법 |
WO2007114111A1 (ja) * | 2006-03-28 | 2007-10-11 | Matsushita Electric Industrial Co., Ltd. | 多層配線基板とその製造方法 |
US8617669B1 (en) | 2006-04-20 | 2013-12-31 | Partial Assignment to University of Central Florida | Laser formation of graphene |
US7811914B1 (en) * | 2006-04-20 | 2010-10-12 | Quick Nathaniel R | Apparatus and method for increasing thermal conductivity of a substrate |
US20070246158A1 (en) * | 2006-04-21 | 2007-10-25 | 3M Innovative Properties Company | Wiring board, production process thereof and connection method using same |
US8067303B1 (en) | 2006-09-12 | 2011-11-29 | Partial Assignment University of Central Florida | Solid state energy conversion device |
KR100789521B1 (ko) * | 2006-09-28 | 2007-12-28 | 삼성전기주식회사 | 다층 인쇄회로기판의 제조방법 |
TWI342732B (en) * | 2006-12-27 | 2011-05-21 | Unimicron Technology Corp | Circuit board structure and fabrication method thereof |
US20080318061A1 (en) * | 2007-06-20 | 2008-12-25 | Akira Inaba | Insulation paste for a metal core substrate and electronic device |
TWI337059B (en) * | 2007-06-22 | 2011-02-01 | Princo Corp | Multi-layer substrate and manufacture method thereof |
US8114693B1 (en) | 2007-09-18 | 2012-02-14 | Partial Assignment University of Central Florida | Method of fabricating solid state gas dissociating device by laser doping |
USPP19906P2 (en) * | 2007-10-31 | 2009-04-14 | Tai-Ling Biotech Inc. | Phalaenopsis plant named ‘Queen V6’ |
KR100969437B1 (ko) * | 2008-06-13 | 2010-07-14 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
TWI387417B (zh) * | 2008-08-29 | 2013-02-21 | Ind Tech Res Inst | 電路板結構及其製作方法 |
CA2745634A1 (en) * | 2008-12-02 | 2010-06-10 | University Of Central Florida | Energy conversion device |
TWI442526B (zh) * | 2010-09-17 | 2014-06-21 | Subtron Technology Co Ltd | 導熱基板及其製作方法 |
US9059079B1 (en) | 2012-09-26 | 2015-06-16 | Ut-Battelle, Llc | Processing of insulators and semiconductors |
US9601641B1 (en) | 2013-12-10 | 2017-03-21 | AppliCote Associates, LLC | Ultra-high pressure doping of materials |
US9620667B1 (en) | 2013-12-10 | 2017-04-11 | AppliCote Associates LLC | Thermal doping of materials |
KR101976300B1 (ko) * | 2015-01-22 | 2019-05-07 | 알프스 알파인 가부시키가이샤 | 압분 코어, 그 압분 코어의 제조 방법, 그 압분 코어를 구비하는 전기·전자 부품, 및 그 전기·전자 부품이 실장된 전기·전자 기기 |
JP6908398B2 (ja) * | 2017-03-08 | 2021-07-28 | 株式会社Adeka | 樹脂組成物、硬化物を形成する方法および硬化物 |
JP7381323B2 (ja) * | 2019-12-17 | 2023-11-15 | 日東電工株式会社 | 両面配線回路基板の製造方法および両面配線回路基板 |
CN112752438A (zh) * | 2020-12-11 | 2021-05-04 | 厦门市铂联科技股份有限公司 | 一种fpc镀孔方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3264402A (en) * | 1962-09-24 | 1966-08-02 | North American Aviation Inc | Multilayer printed-wiring boards |
FR2404990A1 (fr) * | 1977-10-03 | 1979-04-27 | Cii Honeywell Bull | Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation |
EP0048992B1 (de) * | 1980-09-30 | 1988-12-07 | Kabushiki Kaisha Toshiba | Platte für gedruckte Schaltungen und Verfahren zu ihrer Herstellung |
US4417393A (en) * | 1981-04-01 | 1983-11-29 | General Electric Company | Method of fabricating high density electronic circuits having very narrow conductors |
JPS5817651A (ja) * | 1981-07-24 | 1983-02-01 | Hitachi Ltd | 多層回路板とその製造方法 |
US4492730A (en) * | 1982-03-26 | 1985-01-08 | Showa Denko Kabushiki Kaisha | Substrate of printed circuit |
JPS5975695A (ja) * | 1982-10-23 | 1984-04-28 | 日本碍子株式会社 | セラミツク厚膜回路基板 |
JPS6047495A (ja) * | 1983-08-25 | 1985-03-14 | 株式会社日立製作所 | セラミツク配線基板 |
JPS61125118A (ja) * | 1984-11-22 | 1986-06-12 | 日本ケミコン株式会社 | 電解コンデンサの製造方法 |
JPH0716094B2 (ja) * | 1986-03-31 | 1995-02-22 | 日立化成工業株式会社 | 配線板の製造法 |
US4788766A (en) * | 1987-05-20 | 1988-12-06 | Loral Corporation | Method of fabricating a multilayer circuit board assembly |
US4799984A (en) * | 1987-09-18 | 1989-01-24 | E. I. Du Pont De Nemours And Company | Method for fabricating multilayer circuits |
-
1987
- 1987-05-26 EP EP87107642A patent/EP0247575B1/de not_active Expired - Lifetime
- 1987-05-26 JP JP62127176A patent/JPS63170994A/ja active Pending
- 1987-05-26 DE DE87107642T patent/DE3786600T2/de not_active Expired - Fee Related
- 1987-05-27 KR KR1019870005268A patent/KR960001351B1/ko active IP Right Grant
- 1987-05-29 US US07/055,706 patent/US4791239A/en not_active Expired - Fee Related
-
1988
- 1988-09-13 US US07/244,050 patent/US4893404A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4893404A (en) | 1990-01-16 |
KR960001351B1 (ko) | 1996-01-26 |
EP0247575B1 (de) | 1993-07-21 |
DE3786600T2 (de) | 1993-11-04 |
EP0247575A3 (en) | 1989-10-11 |
JPS63170994A (ja) | 1988-07-14 |
US4791239A (en) | 1988-12-13 |
EP0247575A2 (de) | 1987-12-02 |
KR870011821A (ko) | 1987-12-26 |
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