DE3773810D1 - Optoelektronische verpackungseinheit fuer einen halbleiterlaser. - Google Patents

Optoelektronische verpackungseinheit fuer einen halbleiterlaser.

Info

Publication number
DE3773810D1
DE3773810D1 DE8787306979T DE3773810T DE3773810D1 DE 3773810 D1 DE3773810 D1 DE 3773810D1 DE 8787306979 T DE8787306979 T DE 8787306979T DE 3773810 T DE3773810 T DE 3773810T DE 3773810 D1 DE3773810 D1 DE 3773810D1
Authority
DE
Germany
Prior art keywords
optoelectronic
semiconductor laser
packing unit
packing
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787306979T
Other languages
English (en)
Inventor
Eugene Irving Gordon
Robert James Nielsen
John William Stafford
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/902,997 external-priority patent/US4752109A/en
Priority claimed from US06/902,998 external-priority patent/US4818053A/en
Priority claimed from US06/902,374 external-priority patent/US4762386A/en
Application filed by AMP Inc filed Critical AMP Inc
Application granted granted Critical
Publication of DE3773810D1 publication Critical patent/DE3773810D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE8787306979T 1986-09-02 1987-08-06 Optoelektronische verpackungseinheit fuer einen halbleiterlaser. Expired - Fee Related DE3773810D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/902,997 US4752109A (en) 1986-09-02 1986-09-02 Optoelectronics package for a semiconductor laser
US06/902,998 US4818053A (en) 1986-09-02 1986-09-02 Optical bench for a semiconductor laser and method
US06/902,374 US4762386A (en) 1986-09-02 1986-09-02 Optical fiber assembly including means utilizing a column load to compensate for thermal effects

Publications (1)

Publication Number Publication Date
DE3773810D1 true DE3773810D1 (de) 1991-11-21

Family

ID=27420594

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787306979T Expired - Fee Related DE3773810D1 (de) 1986-09-02 1987-08-06 Optoelektronische verpackungseinheit fuer einen halbleiterlaser.

Country Status (4)

Country Link
EP (1) EP0259018B1 (de)
JP (1) JP2627900B2 (de)
KR (1) KR880004611A (de)
DE (1) DE3773810D1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3835701A1 (de) * 1988-10-20 1990-04-26 Messerschmitt Boelkow Blohm Anordnung fuer eine laserdiode mit integrierter ansteuerelektronik
GB2229856B (en) * 1989-03-31 1993-04-21 Stc Plc Electro-optic transducer assembly
GB2230348A (en) * 1989-04-08 1990-10-17 Plessey Co Plc Optical coupling through an image surface.
JP2684219B2 (ja) * 1989-07-05 1997-12-03 三菱電機株式会社 光半導体モジュール
DE58909311D1 (de) * 1989-08-09 1995-07-27 Siemens Ag Optoelektronischer Wandler mit einer Linsenkoppeloptik.
US5018820A (en) * 1990-03-02 1991-05-28 Gte Laboratories Incorporated Method of optically coupling an uptapered single-mode optical fiber to optoelectronic components
JP3110039B2 (ja) * 1990-10-31 2000-11-20 日本電気株式会社 半導体レーザモジュール
US5241614A (en) * 1991-04-29 1993-08-31 International Business Machines Corporation Apparatus and a method for an optical fiber interface
US5155786A (en) * 1991-04-29 1992-10-13 International Business Machines Corporation Apparatus and a method for an optical fiber interface
JP2681032B2 (ja) * 1994-07-26 1997-11-19 山形大学長 強誘電性高分子単結晶、その製造方法、およびそれを用いた圧電素子、焦電素子並びに非線形光学素子
JP3116777B2 (ja) * 1995-07-07 2000-12-11 日本電気株式会社 半導体レーザモジュール
GB9608381D0 (en) * 1996-04-23 1996-06-26 Baillie Hamilton William J Combined light emitting and light guide collection and output device
JPH10229253A (ja) * 1997-02-13 1998-08-25 Nec Corp 半導体レーザモジュール
EP0948104B1 (de) * 1998-03-30 2003-02-12 Sumitomo Electric Industries, Ltd. Halbleiterlaser-Modul und Herstellungsverfahren
DE10117018C2 (de) * 2001-04-05 2003-08-07 Unique M O D E Ag Optische oder optoelektronische Anordnung
JP3802844B2 (ja) 2002-06-14 2006-07-26 古河電気工業株式会社 光半導体モジュール
JP4639578B2 (ja) * 2003-06-27 2011-02-23 日本電気株式会社 半導体レーザモジュール及びその製造方法
CN103944062A (zh) * 2014-04-29 2014-07-23 鞍山创鑫激光技术有限公司 一种单芯片光纤耦合输出的半导体激光器
DE102016102327B4 (de) * 2016-02-10 2018-02-08 Schott Ag Gehäuse für ein elektronisches Bauelement sowie Lasermodul
CN108092130B (zh) * 2017-12-25 2019-10-01 北京凯普林光电科技股份有限公司 一种半导体激光器封装结构
CN113131330B (zh) * 2021-03-31 2022-10-21 杭州耀芯科技有限公司 一种激光器发光功率监测***、监测方法及其准直透镜

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58106513A (ja) * 1981-12-19 1983-06-24 Sumitomo Electric Ind Ltd 光コネクタ
JPS5947789A (ja) * 1982-09-10 1984-03-17 Nec Corp 光フアイバを備えた光半導体モジユ−ル
DE3405805A1 (de) * 1984-02-17 1985-08-22 Siemens AG, 1000 Berlin und 8000 München Schutzrohranordnung fuer glasfaser

Also Published As

Publication number Publication date
EP0259018B1 (de) 1991-10-16
KR880004611A (ko) 1988-06-07
EP0259018A1 (de) 1988-03-09
JP2627900B2 (ja) 1997-07-09
JPS6364008A (ja) 1988-03-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee