DE3770953D1 - Halbleiterspeichervorrichtungen. - Google Patents
Halbleiterspeichervorrichtungen.Info
- Publication number
- DE3770953D1 DE3770953D1 DE8787301506T DE3770953T DE3770953D1 DE 3770953 D1 DE3770953 D1 DE 3770953D1 DE 8787301506 T DE8787301506 T DE 8787301506T DE 3770953 T DE3770953 T DE 3770953T DE 3770953 D1 DE3770953 D1 DE 3770953D1
- Authority
- DE
- Germany
- Prior art keywords
- storage devices
- semiconductor storage
- semiconductor
- devices
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61036361A JPS62208658A (ja) | 1986-02-20 | 1986-02-20 | ダイナミツクランダムアクセスメモリ |
JP61045822A JPH0797621B2 (ja) | 1986-03-03 | 1986-03-03 | ダイナミツクランダムアクセスメモリ |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3770953D1 true DE3770953D1 (de) | 1991-08-01 |
Family
ID=26375405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8787301506T Expired - Lifetime DE3770953D1 (de) | 1986-02-20 | 1987-02-20 | Halbleiterspeichervorrichtungen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4801989A (de) |
EP (1) | EP0234891B1 (de) |
KR (1) | KR870008318A (de) |
DE (1) | DE3770953D1 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4745081A (en) * | 1985-10-31 | 1988-05-17 | International Business Machines Corporation | Method of trench filling |
US4918502A (en) * | 1986-11-28 | 1990-04-17 | Hitachi, Ltd. | Semiconductor memory having trench capacitor formed with sheath electrode |
EP0283964B1 (de) * | 1987-03-20 | 1994-09-28 | Nec Corporation | Aus einer Vielzahl von Eintransistorzellen bestehende dynamische Speichervorrichtung mit wahlfreiem Zugriff |
JPS6427252A (en) * | 1987-04-13 | 1989-01-30 | Nec Corp | Semiconductor storage device |
DE3851102D1 (de) * | 1987-07-10 | 1994-09-22 | Siemens Ag | Hochintegrierbare Speicherzelle und Verfahren zu ihrer Herstellung. |
US4912535A (en) * | 1987-08-08 | 1990-03-27 | Mitsubishi Denki Kabushiki Kaisha | Trench type semiconductor memory device having side wall contact |
JP2517015B2 (ja) * | 1987-11-06 | 1996-07-24 | シャープ株式会社 | 半導体メモリの製造方法 |
US4942554A (en) * | 1987-11-26 | 1990-07-17 | Siemens Aktiengesellschaft | Three-dimensional, one-transistor cell arrangement for dynamic semiconductor memories comprising trench capacitor and method for manufacturing same |
JPH06105773B2 (ja) * | 1987-12-22 | 1994-12-21 | 株式会社東芝 | 半導体装置 |
KR910000246B1 (ko) * | 1988-02-15 | 1991-01-23 | 삼성전자 주식회사 | 반도체 메모리장치 |
US4958318A (en) * | 1988-07-08 | 1990-09-18 | Eliyahou Harari | Sidewall capacitor DRAM cell |
US5182224A (en) * | 1988-09-22 | 1993-01-26 | Hyundai Electronics Industries Co., Ltd. | Method of making dynamic random access memory cell having a SDHT structure |
JPH03165558A (ja) * | 1989-11-24 | 1991-07-17 | Toshiba Corp | 半導体記憶装置およびその製造方法 |
US4988637A (en) * | 1990-06-29 | 1991-01-29 | International Business Machines Corp. | Method for fabricating a mesa transistor-trench capacitor memory cell structure |
US5065273A (en) * | 1990-12-04 | 1991-11-12 | International Business Machines Corporation | High capacity DRAM trench capacitor and methods of fabricating same |
JP2994110B2 (ja) * | 1991-09-09 | 1999-12-27 | 株式会社東芝 | 半導体記憶装置 |
US5335196A (en) * | 1992-04-23 | 1994-08-02 | Nippon Steel Corporation | Semiconductor memory device having memory cells formed of one transistor and one capacitor and a method of producing the same |
US5363327A (en) * | 1993-01-19 | 1994-11-08 | International Business Machines Corporation | Buried-sidewall-strap two transistor one capacitor trench cell |
JP3480745B2 (ja) | 1993-09-16 | 2003-12-22 | 株式会社東芝 | 半導体装置の製造方法 |
JP3466851B2 (ja) * | 1997-01-20 | 2003-11-17 | 株式会社東芝 | 半導体装置及びその製造方法 |
US5885863A (en) * | 1997-03-31 | 1999-03-23 | Kabushiki Kaisha Toshiba | Method of making a contact for contacting an impurity region formed in a semiconductor substrate |
TW471164B (en) * | 1998-06-02 | 2002-01-01 | Ibm | Deep trench-based storage capacitor and method of fabricating |
DE19842665C2 (de) * | 1998-09-17 | 2001-10-11 | Infineon Technologies Ag | Herstellungsverfahren für einen Grabenkondensator mit einem Isolationskragen |
JP3205306B2 (ja) * | 1998-12-08 | 2001-09-04 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
US6255683B1 (en) * | 1998-12-29 | 2001-07-03 | Infineon Technologies Ag | Dynamic random access memory |
US7208789B2 (en) * | 2002-08-02 | 2007-04-24 | Promos Technologies, Inc. | DRAM cell structure with buried surrounding capacitor and process for manufacturing the same |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5982761A (ja) * | 1982-11-04 | 1984-05-12 | Hitachi Ltd | 半導体メモリ |
JPS59141262A (ja) * | 1983-02-02 | 1984-08-13 | Nec Corp | 半導体メモリセル |
JPS59213460A (ja) * | 1983-05-17 | 1984-12-03 | Ube Ind Ltd | サイクロン |
JPS6054472A (ja) * | 1983-09-05 | 1985-03-28 | Nec Corp | 半導体記憶装置およびその製造方法 |
JPS60152058A (ja) * | 1984-01-20 | 1985-08-10 | Toshiba Corp | 半導体記憶装置 |
JPS60223153A (ja) * | 1984-04-19 | 1985-11-07 | Nippon Telegr & Teleph Corp <Ntt> | Mis型キャパシタを有する半導体装置の製法 |
JPS6115362A (ja) * | 1984-06-29 | 1986-01-23 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | ダイナミツクramセル |
US4672410A (en) * | 1984-07-12 | 1987-06-09 | Nippon Telegraph & Telephone | Semiconductor memory device with trench surrounding each memory cell |
-
1987
- 1987-02-19 US US07/016,611 patent/US4801989A/en not_active Expired - Lifetime
- 1987-02-20 KR KR870001438A patent/KR870008318A/ko not_active Application Discontinuation
- 1987-02-20 DE DE8787301506T patent/DE3770953D1/de not_active Expired - Lifetime
- 1987-02-20 EP EP87301506A patent/EP0234891B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0234891B1 (de) | 1991-06-26 |
US4801989A (en) | 1989-01-31 |
EP0234891A3 (en) | 1987-11-25 |
KR870008318A (ko) | 1987-09-25 |
EP0234891A2 (de) | 1987-09-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |