DE112015002211A5 - Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements - Google Patents

Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements Download PDF

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Publication number
DE112015002211A5
DE112015002211A5 DE112015002211.2T DE112015002211T DE112015002211A5 DE 112015002211 A5 DE112015002211 A5 DE 112015002211A5 DE 112015002211 T DE112015002211 T DE 112015002211T DE 112015002211 A5 DE112015002211 A5 DE 112015002211A5
Authority
DE
Germany
Prior art keywords
optoelectronic component
mountable optoelectronic
producing
mountable
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112015002211.2T
Other languages
English (en)
Inventor
Siegfried Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112015002211A5 publication Critical patent/DE112015002211A5/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE112015002211.2T 2014-05-12 2015-04-30 Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements Withdrawn DE112015002211A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014208960.3A DE102014208960A1 (de) 2014-05-12 2014-05-12 Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements
DE102014208960.3 2014-05-12
PCT/EP2015/059530 WO2015173031A1 (de) 2014-05-12 2015-04-30 Oberflächenmontierbares optoelektronisches bauelement und verfahren zum herstellen eines oberflächenmontierbaren optoelektronischen bauelements

Publications (1)

Publication Number Publication Date
DE112015002211A5 true DE112015002211A5 (de) 2017-01-19

Family

ID=53039428

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102014208960.3A Withdrawn DE102014208960A1 (de) 2014-05-12 2014-05-12 Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements
DE112015002211.2T Withdrawn DE112015002211A5 (de) 2014-05-12 2015-04-30 Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102014208960.3A Withdrawn DE102014208960A1 (de) 2014-05-12 2014-05-12 Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zum Herstellen eines oberflächenmontierbaren optoelektronischen Bauelements

Country Status (2)

Country Link
DE (2) DE102014208960A1 (de)
WO (1) WO2015173031A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019202715A1 (de) 2019-02-28 2020-09-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Folienbasiertes package mit distanzausgleich
DE102019202716B4 (de) 2019-02-28 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Flex-folien-package mit coplanarer topologie für hochfrequenzsignale und verfahren zum herstellen eines derartigen flex-folien-packages
DE102019202718B4 (de) 2019-02-28 2020-12-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Dünnes Dual-Folienpackage und Verfahren zum Herstellen desselben
DE102019202721B4 (de) 2019-02-28 2021-03-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. 3d-flexfolien-package

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2372879B (en) * 2001-07-14 2003-06-04 Wjw Ltd An led for use in reflector-based light devices
US6799870B2 (en) * 2002-09-19 2004-10-05 Para Light Electronics Co. Ltd. Sideway-projecting light emitting diode structure
KR100732267B1 (ko) * 2003-09-29 2007-06-25 마츠시타 덴끼 산교 가부시키가이샤 선형 광원장치 및 그 제조방법, 그리고 면 발광장치
JP2006024645A (ja) * 2004-07-06 2006-01-26 Rohm Co Ltd 半導体発光装置
KR100772433B1 (ko) * 2006-08-23 2007-11-01 서울반도체 주식회사 반사면을 구비하는 리드단자를 채택한 발광 다이오드패키지
KR100839122B1 (ko) * 2006-12-21 2008-06-20 서울반도체 주식회사 측면 발광형 ｌｅｄ 램프 및 그 제조방법과, 그 ｌｅｄ램프를 포함하는 발광장치
JP2008187030A (ja) * 2007-01-30 2008-08-14 Stanley Electric Co Ltd 発光装置
KR101352921B1 (ko) * 2007-05-25 2014-01-24 삼성디스플레이 주식회사 광원모듈, 이를 갖는 백라이트 어셈블리 및 이를 갖는표시장치
KR101039994B1 (ko) * 2010-05-24 2011-06-09 엘지이노텍 주식회사 발광소자 및 이를 구비한 라이트 유닛
US8210716B2 (en) * 2010-08-27 2012-07-03 Quarkstar Llc Solid state bidirectional light sheet for general illumination

Also Published As

Publication number Publication date
WO2015173031A1 (de) 2015-11-19
DE102014208960A1 (de) 2015-11-12

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee