DE10259362A1 - Process for depositing an alloy on a substrate - Google Patents
Process for depositing an alloy on a substrate Download PDFInfo
- Publication number
- DE10259362A1 DE10259362A1 DE10259362A DE10259362A DE10259362A1 DE 10259362 A1 DE10259362 A1 DE 10259362A1 DE 10259362 A DE10259362 A DE 10259362A DE 10259362 A DE10259362 A DE 10259362A DE 10259362 A1 DE10259362 A1 DE 10259362A1
- Authority
- DE
- Germany
- Prior art keywords
- current
- alloy
- pulse
- electrolyte
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
Abstract
Bisherige elektrolytische Abscheidungsverfahren können keine Legierungen nur schlecht aus den Bestandteilen auf ein Substrat abscheiden. DOLLAR A Das erfindungsgemäße Verfahren ermöglicht das Abscheiden einer Legierungsschicht auf ein Substrat (13) durch das Pulsen des zum elektrolytischen Abscheiden verwendeten Stroms/Spannung.Previous electrolytic deposition processes are difficult to deposit alloys from the components on a substrate. DOLLAR A The method according to the invention enables the deposition of an alloy layer on a substrate (13) by pulsing the current / voltage used for electrolytic deposition.
Description
Die Erfindung betrifft ein Verfahren zum Abscheiden einer Legierung auf ein Substrat.The invention relates to a method for depositing an alloy on a substrate.
Es sind verschiedene Verfahren bekannt, um Schichten auf einem Substrat aufzubringen. Dies sind z.B. Plasmaspritzen, galvanische Abscheidung oder Aufdampfverfahren, u.a..Various methods are known to apply layers on a substrate. These are e.g. Plasma spraying, galvanic deposition or vapor deposition, etc.
Ein Artikel von G. Devaray im Bulletin of Electrochemistry 8 (8), 1992, pp. 390–392. mit dem Titel „Electro deposited composites- a review on new technologies for aerospace and other field" gibt eine Übersicht über Verfahren zur elektrochemischen Abscheidung von Schichten.An article by G. Devaray in the bulletin of Electrochemistry 8 (8), 1992, pp. 390-392. with the title “Electro deposited composites- a review on new technologies for aerospace and other field " an overview of procedures for the electrochemical deposition of layers.
Die
Die
Weitere elektrolytische Verfahren
zur Beschichtung sind bekannt aus der
In Electrochemical Society Proceedings Vol. 95–18, S. 543 ff. von Sarhadi et al. mit dem Titel „Development of a low current density electroplating bath ..." ist die Verwendung von Bädern beschrieben, die Kobalt-, Nickel- oder Eisenverbindungen enthalten.In Electrochemical Society Proceedings Vol. 95-18, P. 543 ff. By Sarhadi et al. with the title “Development of a low current density electroplating bath ... "is the use of baths described that contain cobalt, nickel or iron compounds.
Die
Die
Die
Die
Die
V. Sova beschreibt in dem Artikel „Electrodeposited composite coatings for protection from high temperature corrosion" in Trans IMF 1987, 65, 21ff ein elektrolytisches Abscheidungsverfahren, bei dem im Elektrolyten ungelöste Partikel für die aufzubringende Schicht verwendet werden. Ebenso ist die Anwendung von Pulsströmen beschrieben.V. Sova describes in the article “Electrodeposited composite coatings for protection from high temperature corrosion "in Trans IMF 1987, 65, 21ff an electrolytic deposition process, in which Undissolved electrolytes Particles for the layer to be applied can be used. The application is the same of pulse currents described.
Mit den -bekannten Verfahren aufgebrachte Schichten weisen unter den Bedingungen mancher Einsatzzwecke eine schlechte Haftung gegenüber dem Substrat auf. Ausserdem können nur Materialien einer konstanten Zusammensetzung abgeschieden werden.Layers applied using the known methods show a bad under the conditions of some uses Liability towards the Substrate on. You can also only materials with a constant composition are deposited.
Es ist daher Aufgabe der Erfindung, die obengenannten Probleme zu überwinden.It is therefore an object of the invention to overcome the above problems.
Die Aufgabe wird gelöst durch ein Verfahren zum Abscheiden einer Legierung auf ein Substrat gemäß Anspruch 1.The task is solved by a method for depositing an alloy on a substrate according to claim 1.
Durch die Verwendung von gepulsten Strömen bzw. die Erzeugung von gradierten Schichten wird die Haftung von Schichten auf dem Substrat bzw. die Abscheidungsrate verbessert.By using pulsed Stream or the creation of graded layers, the liability of Layers on the substrate and the deposition rate improved.
Weitere vorteilhafte Ausgestaltungen des Verfahrens sind in den Ansprüchen aufgelistet.Further advantageous configurations of the method are in the claims listed.
Ein Ausführungsbeispiel der Erfindung ist in den Figuren näher erläutert.An embodiment of the invention is closer in the figures explained.
Es zeigen:Show it:
In einem Behälter
Das Substrat
In dem Elektrolyten
Durch geeignete Wahl der Prozessparameter
(
Ebenso können in der herzustellenden Schicht durch geeignete Wahl der Prozessparameter Gradienten in der chemischen Zusammensetzung erzeugt werden.Likewise, in the layer to be manufactured by suitable choice of the process parameters gradient in the chemical Composition are generated.
Beispielsweise wird auf das Substrat
Durch einen nachfolgenden thermischen Prozess kann die Schicht homogenisiert oder verdichtet werden oder bestimmte Phasen können in der Schicht eingestellt werden.Through a subsequent thermal process the layer can be homogenized or compacted or certain Phases can be set in the shift.
Eine Ultraschallsonde
Für
jeden Bestandteil
Eine Sequenz
Ein Strompuls
Die Sequenz
Als Abschluss der Sequenz
Die Sequenz kann mehrfach wiederholt werden.The sequence can be repeated several times become.
Die Einzelpulszeiten ton betragen
vorzugsweise größenordnungsmäßig etwa
1 bis 100 Millisekunden. Die zeitliche Dauer des Blocks
Die Belegung sowohl während der Pulsabfolgen als auch in der Pausenzeit mit einem geringen Potential (Basisstrom) ist optional möglich. Somit wird eine Unterbrechung der Elektroabscheidung, die Inhomogenitäten verursachen kann, vermieden.The occupancy both during the Pulse sequences as well as in the break time with a low potential (Base current) is optional. Thus, an interruption of the electrodeposition will cause inhomogeneities can, avoided.
Ein Block
Diese Optimierung kann für zumindest
einen weiteren, bspw. alle, Bestandteile
Beispielsweise durch die Dauer der
einzelnen Blöcke
Gradienten können ebenso in der Schicht
zu erzeugt werden. Dies geschieht dadurch, dass die Dauer des Blocks
Ebenso können weitere Nichtlegierungsbestandteile,
wie z.B. Sekundärphasen,
in dem Elektrolyten
Claims (13)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10259362A DE10259362A1 (en) | 2002-12-18 | 2002-12-18 | Process for depositing an alloy on a substrate |
PCT/DE2003/004155 WO2004055245A2 (en) | 2002-12-18 | 2003-12-16 | Method for the deposition of an alloy on a substrate |
EP03813080A EP1573090A2 (en) | 2002-12-18 | 2003-12-16 | Method for the deposition of an alloy on a substrate |
CNA2003801069201A CN1729314A (en) | 2002-12-18 | 2003-12-16 | Method for the deposition of an alloy on a substrate |
US10/539,938 US20060131175A1 (en) | 2002-12-18 | 2003-12-16 | Method for the deposition of an alloy on a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10259362A DE10259362A1 (en) | 2002-12-18 | 2002-12-18 | Process for depositing an alloy on a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10259362A1 true DE10259362A1 (en) | 2004-07-08 |
Family
ID=32477771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10259362A Withdrawn DE10259362A1 (en) | 2002-12-18 | 2002-12-18 | Process for depositing an alloy on a substrate |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060131175A1 (en) |
EP (1) | EP1573090A2 (en) |
CN (1) | CN1729314A (en) |
DE (1) | DE10259362A1 (en) |
WO (1) | WO2004055245A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060207884A1 (en) * | 2005-03-17 | 2006-09-21 | Volodymyr Shpakovsky | Method of producing corundum layer on metal parts |
US8143550B2 (en) * | 2005-06-21 | 2012-03-27 | International Advanced Research Centre For Powder Metallurgy And New Materials (Arci) | Device for controlling the on and off time of the metal oxide semiconductor field effect transistor (MOSFET), a device spark coating the surfaces of metal workpiece incorporating the said control device and a method of coating metal surfaces using the said device |
US20080271995A1 (en) * | 2007-05-03 | 2008-11-06 | Sergey Savastiouk | Agitation of electrolytic solution in electrodeposition |
US10030312B2 (en) * | 2009-10-14 | 2018-07-24 | Massachusetts Institute Of Technology | Electrodeposited alloys and methods of making same using power pulses |
CN102776512B (en) * | 2012-08-10 | 2014-07-23 | 苏州市涵信塑业有限公司 | Method for preparing novel gradient thermal barrier coating |
CN104862748B (en) * | 2015-05-29 | 2017-06-13 | 中国科学院金属研究所 | A kind of crystal particle scale graded metal nickel and its controllable method for preparing |
WO2018013868A1 (en) * | 2016-07-13 | 2018-01-18 | Alligant Scientific, LLC | Electrochemical methods, devices and compositions |
US20180322972A1 (en) * | 2017-05-04 | 2018-11-08 | General Electric Company | System and method for making a solid target within a production chamber of a target assembly |
CN107254697B (en) * | 2017-06-06 | 2020-02-14 | 秦皇岛瀚丰长白结晶器有限责任公司 | Gradient distribution process and electroplating device for nickel-cobalt alloy plating cobalt of crystallizer copper plate |
Citations (14)
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---|---|---|---|---|
GB2167446A (en) * | 1984-10-05 | 1986-05-29 | Baj Ltd | Electrode deposited composite coating |
EP0443877A1 (en) * | 1990-02-23 | 1991-08-28 | Baj Coatings Limited | Gas turbine blades |
EP0448888A1 (en) * | 1990-03-27 | 1991-10-02 | Ets Michel S.A. | Process for galvanic treatment with pulsed currents |
EP0267972B1 (en) * | 1985-10-06 | 1993-02-10 | Technion Research & Development Foundation Ltd. | A method for the electrodeposition of an ordered alloy |
DE3943669C2 (en) * | 1989-02-20 | 1993-08-19 | Hans 8500 Nuernberg De Henig | Vibration device on electrolytic treatment appts. |
WO1997000980A1 (en) * | 1995-06-21 | 1997-01-09 | Peter Torben Tang | An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys |
DE19545231A1 (en) * | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Process for the electrolytic deposition of metal layers |
EP0825281A1 (en) * | 1996-08-21 | 1998-02-25 | Lucent Technologies Inc. | Tin electroplating process |
WO1999024647A1 (en) * | 1997-11-06 | 1999-05-20 | Chromalloy Gas Turbine Corporation | Method for producing abrasive tips for gas turbine blades |
DE19653681C2 (en) * | 1996-12-13 | 2000-04-06 | Atotech Deutschland Gmbh | Process for the electrolytic deposition of copper layers with a uniform layer thickness and good optical and metal-physical properties and application of the process |
EP1132500A2 (en) * | 2000-03-08 | 2001-09-12 | Applied Materials, Inc. | Method for electrochemical deposition of metal using modulated waveforms |
DE10113767A1 (en) * | 2000-03-22 | 2001-10-11 | Toyoda Automatic Loom Works | Electrolytic plating method and device for a circuit board |
DE10061186C1 (en) * | 2000-12-07 | 2002-01-17 | Astrium Gmbh | Electroplating of nickel, cobalt, and their alloys onto rocket engine components, uses differing current densities and pulsed charge ratios at anode and cathode |
US6375823B1 (en) * | 1999-02-10 | 2002-04-23 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
Family Cites Families (8)
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DE2261782C3 (en) * | 1972-12-16 | 1978-09-14 | Battelle-Institut E.V., 6000 Frankfurt | Electroplating of a chromium-nickel-iron alloy |
US4461680A (en) * | 1983-12-30 | 1984-07-24 | The United States Of America As Represented By The Secretary Of Commerce | Process and bath for electroplating nickel-chromium alloys |
US4869971A (en) * | 1986-05-22 | 1989-09-26 | Nee Chin Cheng | Multilayer pulsed-current electrodeposition process |
JPH0230790A (en) * | 1988-07-15 | 1990-02-01 | Seiko Instr Inc | Method for electrodepositing alloy |
US6319384B1 (en) * | 1998-10-14 | 2001-11-20 | Faraday Technology Marketing Group, Llc | Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates |
DK173515B1 (en) * | 1998-12-18 | 2001-01-22 | Per Moeller | Process and apparatus for the controlled electrochemical deposition of metals and alloys involving the use of an acoustic flow |
AU2001229457A1 (en) * | 2000-01-14 | 2001-07-24 | Dow Agrosciences Llc | Selective electrochemical reduction of halogenated 4-aminopicolinic acids |
DE10259365A1 (en) * | 2002-04-08 | 2003-10-30 | Siemens Ag | Device and method for removing surface areas of a component |
-
2002
- 2002-12-18 DE DE10259362A patent/DE10259362A1/en not_active Withdrawn
-
2003
- 2003-12-16 WO PCT/DE2003/004155 patent/WO2004055245A2/en not_active Application Discontinuation
- 2003-12-16 US US10/539,938 patent/US20060131175A1/en not_active Abandoned
- 2003-12-16 CN CNA2003801069201A patent/CN1729314A/en active Pending
- 2003-12-16 EP EP03813080A patent/EP1573090A2/en not_active Withdrawn
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2167446A (en) * | 1984-10-05 | 1986-05-29 | Baj Ltd | Electrode deposited composite coating |
EP0267972B1 (en) * | 1985-10-06 | 1993-02-10 | Technion Research & Development Foundation Ltd. | A method for the electrodeposition of an ordered alloy |
DE3943669C2 (en) * | 1989-02-20 | 1993-08-19 | Hans 8500 Nuernberg De Henig | Vibration device on electrolytic treatment appts. |
EP0443877A1 (en) * | 1990-02-23 | 1991-08-28 | Baj Coatings Limited | Gas turbine blades |
EP0448888A1 (en) * | 1990-03-27 | 1991-10-02 | Ets Michel S.A. | Process for galvanic treatment with pulsed currents |
WO1997000980A1 (en) * | 1995-06-21 | 1997-01-09 | Peter Torben Tang | An electroplating method of forming platings of nickel, cobalt, nickel alloys or cobalt alloys |
DE19545231A1 (en) * | 1995-11-21 | 1997-05-22 | Atotech Deutschland Gmbh | Process for the electrolytic deposition of metal layers |
EP0825281A1 (en) * | 1996-08-21 | 1998-02-25 | Lucent Technologies Inc. | Tin electroplating process |
DE19653681C2 (en) * | 1996-12-13 | 2000-04-06 | Atotech Deutschland Gmbh | Process for the electrolytic deposition of copper layers with a uniform layer thickness and good optical and metal-physical properties and application of the process |
WO1999024647A1 (en) * | 1997-11-06 | 1999-05-20 | Chromalloy Gas Turbine Corporation | Method for producing abrasive tips for gas turbine blades |
US6375823B1 (en) * | 1999-02-10 | 2002-04-23 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
EP1132500A2 (en) * | 2000-03-08 | 2001-09-12 | Applied Materials, Inc. | Method for electrochemical deposition of metal using modulated waveforms |
DE10113767A1 (en) * | 2000-03-22 | 2001-10-11 | Toyoda Automatic Loom Works | Electrolytic plating method and device for a circuit board |
DE10061186C1 (en) * | 2000-12-07 | 2002-01-17 | Astrium Gmbh | Electroplating of nickel, cobalt, and their alloys onto rocket engine components, uses differing current densities and pulsed charge ratios at anode and cathode |
Non-Patent Citations (2)
Title |
---|
JORDAN,Manfred: Die galvanische Abscheidung von Zinn und Zinnlegierungen, Eugen G. Leuze Verlag, Saulgau/Württ., 1993, S.165-167,177,306-309 * |
JORDAN,Manfred: Die galvanische Abscheidung von Zinn und Zinnlegierungen, Eugen G. Leuze Verlag, Saulgau/Württ., 1993, S.165-167,177,306-309; |
Also Published As
Publication number | Publication date |
---|---|
US20060131175A1 (en) | 2006-06-22 |
EP1573090A2 (en) | 2005-09-14 |
CN1729314A (en) | 2006-02-01 |
WO2004055245A3 (en) | 2004-09-02 |
WO2004055245A2 (en) | 2004-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8139 | Disposal/non-payment of the annual fee |