CN216721664U - Multilayer circuit board - Google Patents

Abstract

The utility model discloses a multilayer circuit board, and relates to the technical field of circuit boards; the technical scheme is as follows: a multilayer circuit board comprises a first substrate and a second substrate, wherein a first insulating heat conduction layer, a heat conduction metal plate and a second insulating heat conduction layer are sequentially arranged between the first substrate and the second substrate in a pressing mode; the first insulating heat conduction layer and the second insulating heat conduction layer are both insulating heat conduction silica gel; still include the heat dissipation metal sheet, the heat conduction metal sheet with the heat dissipation metal sheet links to each other. According to the utility model, heat generated by the lower end surface of the first substrate is timely transferred to the heat-conducting metal plate through the first insulating heat-conducting layer, heat generated by the upper end surface of the second substrate is timely transferred to the heat-conducting metal plate through the second insulating heat-conducting layer, and then the heat is quickly transferred to the heat-radiating metal plate through the heat-conducting metal plate, so that heat between the plates of the multilayer circuit board is quickly led out, and the electronic elements on the circuit board can be ensured to work normally.

Description

Multilayer circuit board

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board.

Background

The multilayer circuit board is a multilayer PCB board taking a circuit layer or a copper surface layer as a calculation unit. The multilayer circuit board has technically reached a mature standard, but for circuit layers with more bonding pads, such as circuit boards with more SMDs and BGAs and HDI high-density laser boards, the normal operation of electronic components is affected because the board spacing is small and the heat dissipation in the board is slow.

SUMMERY OF THE UTILITY MODEL

Aiming at the technical problem of slow heat dissipation among the prior multilayer circuit boards; the utility model provides a multilayer circuit board, which can lead out heat among boards of the multilayer circuit board in time so as to ensure that electronic elements on the circuit board can work normally.

The utility model is realized by the following technical scheme:

the utility model provides a multilayer circuit board, which comprises a first substrate and a second substrate, wherein a first insulating heat conduction layer, a heat conduction metal plate and a second insulating heat conduction layer are sequentially arranged between the first substrate and the second substrate in a pressing mode; the first insulating heat conduction layer and the second insulating heat conduction layer are both insulating heat conduction silica gel; still include the heat dissipation metal sheet, the heat conduction metal sheet with the heat dissipation metal sheet links to each other.

In an optional embodiment, the width of the heat dissipation metal plate is greater than the distance from the upper end surface of the first substrate to the lower end surface of the second substrate.

In an optional embodiment, the heat dissipation metal plates are disposed on both sides of the heat conduction metal plate in the width direction or the length direction.

In an optional embodiment, a limiting part is arranged on one side of the heat dissipation metal plate, which is opposite to the heat conduction metal plate; the first substrate and the second substrate are both provided with limit grooves matched with the limit parts.

In an optional embodiment, the heat dissipation structure further comprises a shielding metal sheet, and two ends of the shielding metal sheet are fixedly connected with the corresponding heat dissipation metal sheets.

In an alternative embodiment, the shielding metal sheet is connected to the heat conductive metal sheet.

In an optional embodiment, the heat pipe is attached to the heat dissipation metal plate.

In an optional embodiment, the heat dissipation metal plate is provided with a clamping groove for clamping the heat pipe.

In an optional embodiment, the slot extends along a length direction of the heat dissipation metal plate.

In an alternative embodiment, the heat conductive metal plate is made of copper or a copper alloy.

The utility model has the following beneficial effects:

according to the multilayer circuit board provided by the utility model, the first insulating heat conduction layer, the heat conduction metal plate and the second insulating heat conduction layer are sequentially arranged between the first substrate and the second substrate in a pressing mode, the first insulating heat conduction layer and the second insulating heat conduction layer are both insulating heat conduction silica gel, and the heat conduction metal plate is connected with the heat dissipation metal plate, so that heat generated by the lower end face of the first substrate is timely transmitted to the heat conduction metal plate through the first insulating heat conduction layer, heat generated by the upper end face of the second substrate is timely transmitted to the heat conduction metal plate through the second insulating heat conduction layer, and then the heat is quickly transmitted to the heat dissipation metal plate through the heat conduction metal plate, so that heat between plates of the multilayer circuit board is quickly led out, and electronic elements on the circuit board can normally work.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic cross-sectional structural view of a multilayer circuit board according to an embodiment of the present invention.

Reference numerals:

1-a first substrate, 2-a second substrate, 3-a first insulating heat conduction layer, 4-a heat conduction metal plate, 5-a second insulating heat conduction layer, 6-a heat dissipation metal plate, 7-a limiting part, 8-a limiting groove, 9-a shielding metal sheet and 10-a heat pipe.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

In the description of the embodiments of the present application, the terms "central," "upper," "lower," "left," "right," "vertical," "longitudinal," "lateral," "horizontal," "inner," "outer," "front," "rear," "top," "bottom," and the like refer to orientations or positional relationships that are conventionally used in the manufacture of the present application, or that are routinely understood by those of ordinary skill in the art, but are merely used to facilitate the description and to simplify the description of the present application and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered limiting of the present application.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "open," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, as opposed to a removable connection, or as an integral connection; can be a mechanical connection, can be an electrical connection; may be directly connected to one another, may be indirectly connected through intervening media, and may be internal to both elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

Example 1

With reference to fig. 1, the present embodiment provides a multilayer circuit board, including a first substrate and a second substrate, where a first insulating and heat conducting layer, a heat conducting metal plate, and a second insulating and heat conducting layer are sequentially disposed between the first substrate and the second substrate; the first insulating heat conduction layer and the second insulating heat conduction layer are both insulating heat conduction silica gel; still include the heat dissipation metal sheet, the heat conduction metal sheet with the heat dissipation metal sheet links to each other.

It can be understood that the first substrate and the second substrate are fixedly connected together through a fixing screw or other fixing and connecting piece (such as a rivet and a board card), so that the lower end face of the first substrate is tightly attached to the upper end face of the first insulation heat conduction layer, the lower end face of the first insulation heat conduction layer is tightly attached to the upper end face of the heat conduction metal plate, the lower end face of the heat conduction metal plate is tightly attached to the upper end face of the second insulation heat conduction layer, and the lower end face of the second insulation heat conduction layer is tightly attached to the upper end face of the second substrate.

For the heat dissipation metal plate, the heat dissipation metal plate is usually disposed on one side or two sides of the multilayer circuit board formed by the first substrate and the second substrate.

The width of the heat dissipation metal plate is larger than the distance from the upper end face of the first substrate to the lower end face of the second substrate, so that the heat dissipation metal plate can shield signals on one sides of the first substrate and the second substrate, and meanwhile, the heat dissipation metal plate can be ensured to have enough heat dissipation area.

In order to fix the relative positions of the first substrate and the second substrate with the heat-conducting metal, one side of the heat-radiating metal plate, which is opposite to the heat-conducting metal plate, is provided with a limiting part; the first substrate and the second substrate are both provided with limit grooves matched with the limit parts.

In order to ensure that the heat-conducting metal plate has sufficient heat conductivity, the heat-conducting metal plate is made of copper or copper alloy. Accordingly, in order to ensure sufficient heat dissipation efficiency of the heat dissipation metal plate, metal plates made of copper or copper alloy materials may be used as the heat dissipation metal plate. Of course, other metal materials with high thermal conductivity, such as aluminum or aluminum alloy, may also be used.

This embodiment is pressed in proper order between first base plate and second base plate and is equipped with first insulation heat-conducting layer, heat conduction metal sheet and the insulating heat-conducting layer of second, and first insulation heat-conducting layer and the insulating heat-conducting layer of second are insulating heat conduction silica gel, heat conduction metal sheet and the heat dissipation metal sheet links to each other to in time giving the heat conduction metal sheet with the heat transfer that first base plate medial surface produced through first insulation heat-conducting layer, in time giving the heat conduction metal sheet with the heat transfer that the second base plate inboard produced through the insulating heat-conducting layer of second, by the quick transmission of heat conduction metal sheet for the heat dissipation metal sheet again, thereby quick derivation multilayer circuit board's inter-plate heat, in order to ensure that the electronic component on the circuit board can normal work.

It should be noted that, in this embodiment, the heat conducting metal plate is sandwiched between the two insulating heat conducting layers made of insulating heat conducting silica gel, and compared with the direct conduction of the heat conducting silica gel and the heat dissipating metal plate, the heat conducting efficiency is higher, and the signal is shielded by the heat conducting metal plate, so as to avoid the mutual interference of the electronic components on the first substrate and the second substrate.

Example 2

The embodiment provides a multilayer circuit board, and based on the structure and principle described in embodiment 1 or embodiment 2, the embodiment includes a shielding metal sheet, and two ends of the shielding metal sheet are fixedly connected with the corresponding heat dissipation metal sheets.

It can be understood that, shielding sheetmetal both ends and the heat dissipation sheetmetal fixed connection that corresponds, accessible shielding sheetmetal is not set up the one side of heat dissipation sheetmetal to the multilayer circuit board that first base plate and second base plate are constituteed, carries out signal shielding protection, also can dispel the heat through shielding sheetmetal, improves heat radiating area.

Preferably, the shielding metal sheet is connected to the heat conductive metal sheet such that the heat conductive metal sheet directly transfers part of the heat to the shielding metal sheet.

Example 3

The embodiment provides a multilayer circuit board, based on the structure and the principle that embodiment 1 or embodiment 2 recorded, this embodiment includes the heat pipe, the heat pipe laminating is in on the heat dissipation metal sheet to the heat that the heat dissipation metal sheet was derived through the quick derivation of heat pipe, thereby cool off multilayer circuit board fast, be applicable to the functional circuit board that heat production power is big.

In order to reduce the volume of the multilayer circuit board, the heat dissipation metal plate is provided with a clamping groove for clamping the heat pipe so as to clamp the heat pipe in the clamping groove.

Preferably, the clamping groove extends along the length direction of the heat dissipation metal plate to ensure that the heat pipe and the heat dissipation metal plate have a large enough contact area, so as to further improve the heat dissipation efficiency.

While the utility model has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the utility model is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications, equivalent arrangements, and alternatives falling within the spirit and scope of the utility model as defined by the appended claims.

Claims (10)

1. A multilayer circuit board comprises a first substrate (1) and a second substrate (2), and is characterized in that a first insulating heat conduction layer (3), a heat conduction metal plate (4) and a second insulating heat conduction layer (5) are sequentially arranged between the first substrate (1) and the second substrate (2);

the first insulating heat conduction layer (3) and the second insulating heat conduction layer (5) are both insulating heat conduction silica gel;

still include heat dissipation metal sheet (6), heat conduction metal sheet (4) with heat dissipation metal sheet (6) link to each other.

2. The multilayer wiring board according to claim 1, wherein the width of the heat dissipating metal plate (6) is larger than the distance from the upper end surface of the first substrate (1) to the lower end surface of the second substrate (2).

3. The multilayer wiring board according to claim 1 or 2, wherein the heat-dissipating metal plates (6) are provided on both sides in the width or length direction of the heat-conducting metal plate (4).

4. The multilayer circuit board of claim 3, wherein a limiting part (7) is arranged on one side of the heat-dissipating metal plate (6) opposite to the heat-conducting metal plate (4);

the first substrate (1) and the second substrate (2) are both provided with a limiting groove (8) matched with the limiting part (7).

5. The multilayer circuit board according to claim 3, further comprising a shielding metal sheet (9), wherein two ends of the shielding metal sheet (9) are fixedly connected to the corresponding heat dissipation metal plates.

6. Multilayer wiring board according to claim 5, characterized in that the shielding metal sheet (9) is connected to the heat conducting metal plate.

7. The multilayer circuit board according to claim 1, further comprising a heat pipe (10), wherein the heat pipe (10) is attached to the heat dissipation metal plate (6).

8. The multilayer circuit board according to claim 7, wherein the heat-dissipating metal plate (6) is provided with a clamping groove for clamping the heat pipe (10).

9. The multilayer wiring board according to claim 8, wherein the card slot extends along a length of the heat dissipating metal plate (6).

10. The multilayer circuit board according to claim 1, wherein the heat conductive metal plate (4) is made of copper or a copper alloy.

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