CN221202860U - Take heat radiation structure's heavy current PCB board - Google Patents
Take heat radiation structure's heavy current PCB board Download PDFInfo
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- CN221202860U CN221202860U CN202323251482.1U CN202323251482U CN221202860U CN 221202860 U CN221202860 U CN 221202860U CN 202323251482 U CN202323251482 U CN 202323251482U CN 221202860 U CN221202860 U CN 221202860U
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- air
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- dielectric layer
- dispersing
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- 230000005855 radiation Effects 0.000 title claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract description 4
- 239000005871 repellent Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Abstract
The utility model discloses a high-current PCB with a heat radiation structure, which comprises a PCB layer structure, wherein the PCB layer structure is composed of a first dielectric layer and a second dielectric layer from top to bottom in sequence, a plurality of plugging areas for installing components are arranged on the first dielectric layer and the second dielectric layer, the heat radiation structure is arranged between the first dielectric layer and the second dielectric layer, the heat radiation structure comprises a heat radiation layer and a heat conduction part, the heat radiation layer comprises a heat conduction plate, a first air duct, a second air duct and a third air duct are formed in the heat conduction plate corresponding to the plugging areas, and the heat conduction part comprises a first convex edge and a second convex edge. Each air channel is of an independent structure, air is taken in through the air-dispersing plate at one side of the heat conducting plate, and air is discharged from the air-dispersing plate at the other end of the heat conducting plate, so that an air-cooling heat-dissipating structure is formed.
Description
Technical Field
The utility model relates to the technical field of PCB structures, in particular to a high-current PCB with a heat dissipation structure.
Background
With the rapid development of the age, some high power and high current applications are as follows: electric vehicles, industrial equipment, power systems, etc., are increasingly emerging, and the PCB boards of these equipment are required to withstand high currents up to 100A or more. Generally, in order to bear a large current of up to 100A or more, a PCB needs to be specially designed and optimized to ensure stability and reliability of the PCB, and the PCB cannot be designed according to previous experience, otherwise, the PCB is prone to damage.
For example, the Chinese patent application number is CN201020700226.X, and the patent name is a high-current PCB, thick conductive metal columns are formed by filling metal paste into through holes of the PCB, so that a user is ensured not to blow after the high-current passes through the through holes after the plug-in. The scheme also has the following defects: the overall structure has poor heat dissipation effect, can not meet the use requirement of a high-current PCB, and greatly reduces the service performance and has poor reliability.
Disclosure of utility model
In order to overcome the defects of the prior art, the utility model provides the high-current PCB with the heat dissipation structure, which can effectively solve the problems of the background art.
The technical scheme adopted for solving the technical problems is as follows:
the high-current PCB with the heat radiation structure comprises a PCB layer structure, wherein the PCB layer structure is composed of a first dielectric layer and a second dielectric layer from top to bottom in sequence, a plurality of plugging areas for installing components are arranged on the first dielectric layer and the second dielectric layer, the heat radiation structure is arranged between the first dielectric layer and the second dielectric layer, the heat radiation structure comprises a heat radiation layer and a heat conduction part, the heat radiation layer comprises a heat conduction plate, a first air duct, a second air duct and a third air duct are formed in the corresponding plugging areas of the heat conduction plate, and the heat conduction part comprises a first convex edge and a second convex edge;
The heat conduction plate is characterized in that a first air-dispersing plate and a second air-dispersing plate are arranged on two sides of the heat conduction plate, the first air-dispersing plate and the second air-dispersing plate are communicated with the first air duct, the second air duct and the third air duct, a heat conduction copper sheet and a plurality of heat conduction copper rings are further arranged at the positions, corresponding to the insertion areas, of the heat conduction plate, the heat conduction copper sheet is embedded into the heat conduction plate, and the heat conduction copper rings and the heat conduction copper sheet are integrally formed.
As the further description of above-mentioned technical scheme, first chimb, second chimb all with heat conduction board integrated into one piece, first chimb is two outside bellied rectangle structures, and there are a plurality of heat radiation fins on the first chimb array in proper order, the second chimb is the semicylinder, the second chimb is hollow out construction, and this hollow out construction is by a plurality of densely distributed through-holes formation.
As a further description of the above technical solution, the heat-conducting plate, the first air-dispersing plate and the second air-dispersing plate are integrally formed, and air openings are formed in the first air-dispersing plate and the second air-dispersing plate, and correspond to the first air channel, the second air channel and the third air channel respectively.
As a further description of the above technical solution, the air inlet and the air outlet of the first air duct are further provided with preformed holes for installing the thermistor.
As further description of the technical scheme, the plugging areas are densely distributed with a plurality of jacks, the heat conducting copper rings are penetrated in the jacks, and the plugging holes of the first dielectric layer and the second dielectric layer are arranged on the same axis.
As a further description of the above technical solution, the first flange is disposed along a length direction of the heat conductive plate, and the second flange is disposed along a width direction of the heat conductive plate.
As a further description of the above technical solution, the first air-dispersing plates and the second air-dispersing plates are symmetrically arranged at two ends of the heat-conducting plate, and the second air-dispersing plates of the first air-dispersing plate are arranged at one end of the heat-conducting plate in parallel.
As further description of the technical scheme, the thickness of the heat dissipation layer is not smaller than that of the first dielectric layer and the second dielectric layer, the heat dissipation layer is 1mm-1.5mm, and the thicknesses of the first dielectric layer and the second dielectric layer are 0.3mm-0.8mm.
Compared with the prior art, the utility model has the beneficial effects that:
The high-current PCB with the heat radiation structure has at least one of the following beneficial effects in the use process:
The structure is characterized in that heat generated when components are operated is conducted into the heat conducting plate in an acceleration way through copper sheets with high-efficiency heat conducting performance, a first air channel, a second air channel and a third air channel are formed between the heat conducting plate and the dielectric layer, the first air channel, the second air channel and the third air channel correspond to plug-in areas on the dielectric layer, each air channel is of an independent structure, air is introduced into the air conducting plate at one side of the heat conducting plate, and air is discharged from the air conducting plate at the other end of the heat conducting plate, so that an air cooling heat dissipation structure is formed. The heat dissipation of the heat conduction plate is improved by arranging the first convex edges on the other two sides of the heat conduction plate in a heat dissipation fin mode, the second convex edges arranged on the same side of the air-repellent plate are of a semi-cylindrical structure, a plurality of through holes with different sizes are arranged in the semi-cylindrical structure, the heat dissipation area of the heat conduction plate is further improved, and therefore the purpose of efficient heat dissipation is achieved.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a high-current PCB board with a heat dissipation structure according to the present utility model;
Fig. 2 is a schematic top view of a high-current PCB board with a heat dissipation structure according to the present utility model;
FIG. 3 is a schematic diagram of the perspective structure of FIG. 2 according to the present utility model;
fig. 4 is a schematic structural diagram of a first portion of a high-current PCB board with a heat dissipation structure according to the present utility model;
Fig. 5 is a schematic diagram of a second part of a high-current PCB board with a heat dissipation structure according to the present utility model;
Fig. 6 is a schematic diagram of a third perspective structure of a high-current PCB board with a heat dissipation structure according to the present utility model.
Reference numerals in the drawings:
1. A PCB board layer structure; 101. a first dielectric layer; 102. a second dielectric layer; 2. a heat dissipation structure; 201. a heat dissipation layer; 202. a heat conduction part; 203. a first air-repellent plate; 204. a second air-repellent plate; 205. an air port; 206. a first flange; 207. a heat radiation fin; 208. a second convex edge; 209. a first air duct; 210. a second air duct; 211. a third air duct; 212. a heat conductive plate; 3. a plug region; 301. a preformed hole; 302. a thermally conductive copper sheet; 303. a thermally conductive copper ring.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1-6, the present utility model provides a high-current PCB board with a heat dissipation structure 2, which includes a PCB board layer structure 1, the PCB board layer structure 1 is sequentially composed of a first dielectric layer 101 and a second dielectric layer 102 from top to bottom, a plurality of plugging areas 3 for mounting components are disposed on the first dielectric layer 101 and the second dielectric layer 102, a heat dissipation structure 2 is disposed between the first dielectric layer 101 and the second dielectric layer 102, the heat dissipation structure 2 includes a heat dissipation layer 201 and a heat conduction portion 202, the heat dissipation layer 201 includes a heat conduction plate 212, a first air duct 209, a second air duct 210 and a third air duct 211 are formed on the heat conduction plate 212 corresponding to the plugging areas 3, and the heat conduction portion 202 includes a first convex edge 206 and a second convex edge 208.
The PCB main body part comprises a substrate, which is composed of materials such as glass fiber cloth, epoxy resin and the like, the substrate is divided into a first dielectric layer 101 and a second dielectric layer 102, a heat dissipation structure 2 is arranged between the first dielectric layer 101 and the second dielectric layer 102, heat of the substrate is taken away through the heat dissipation structure 2, and the heat dissipation mode adopts air cooling and heat conduction materials to dissipate heat. The first dielectric layer 101 and the second dielectric layer 102 are provided with the plugging area 3 for installing components, the plugging area 3 is provided with copper sheets in the heat dissipation structure 2 for independent heat dissipation, the heat dissipation efficiency is higher, and meanwhile, the plugging areas 3 on the first dielectric layer 101 and the second dielectric layer 102 are provided with copper foil circuits for conducting electric signals and power.
The two sides of the heat conduction plate 212 are provided with a first air-repellent plate 203 and a second air-repellent plate 204, the first air-repellent plate 203 and the second air-repellent plate 204 are communicated with the first air duct 209, the second air duct 210 and the third air duct 211, the part of the heat conduction plate 212 corresponding to the plugging area 3 is also provided with a heat conduction copper sheet 302 and a plurality of heat conduction copper rings 303, the heat conduction copper sheet 302 is embedded into the heat conduction plate 212, and the heat conduction copper rings 303 and the heat conduction copper sheet 302 are integrally formed.
The heat conducting plate 212 in this embodiment is made of aluminum, the heat conducting plate 212 is provided with a groove corresponding to the plugging area 3, the groove is matched with a copper sheet, after the copper sheet contacts with the heat conducting plate 212, a heat conducting copper ring 303 on the heat conducting copper sheet 302 is correspondingly sleeved in the jack, the heat generated during operation of the component is accelerated and conducted into the heat conducting plate 212 through the copper sheet with high-efficiency heat conducting performance, a first air channel 209, a second air channel 210 and a third air channel 211 are formed between the heat conducting plate 212 and a dielectric layer, the first air channel 209, the second air channel 210 and the third air channel 211 correspond to the plugging area 3 on the dielectric layer, each air channel is of an independent structure, air is introduced from the air dispersing plate on one side of the heat conducting plate 212, and air is discharged from the air dispersing plate on the other side to form the air cooling heat dissipation structure 2. The heat dissipation of the heat conducting plate 212 is improved by arranging the first convex edge 206 on the other two sides of the heat conducting plate 212 in a heat dissipation fin 207 mode, the second convex edge 208 arranged on the same side of the air-repellent plate is of a semi-cylindrical structure, a plurality of through holes with different sizes are arranged in the semi-cylindrical structure, and the heat dissipation area of the heat conducting plate 212 is further improved, so that the purpose of efficient heat dissipation is achieved.
Further to describe, the first convex edge 206 and the second convex edge 208 are formed integrally with the heat conducting plate 212, the first convex edge 206 is in two rectangular structures protruding outwards, a plurality of heat dissipation fins 207 are sequentially arranged on the first convex edge 206 in an array mode, the second convex edge 208 is in a semi-cylindrical shape, the second convex edge 208 is in a hollow structure, and the hollow structure is formed by a plurality of densely distributed through holes.
Further, the heat conducting plate 212 is integrally formed with the first air-dispersing plate 203 and the second air-dispersing plate 204, and the first air-dispersing plate 203 and the second air-dispersing plate 204 are provided with air openings 205, and the air openings 205 correspond to the first air channel 209, the second air channel 210 and the third air channel 211, respectively.
Further, the air inlet 205 and the air outlet 205 of the first air duct 209 are also provided with a preformed hole 301 for installing a thermistor. The temperature sensor is installed through the reserved hole 301 to respectively detect the air inlet temperature and the air outlet temperature.
Further, the plugging area 3 is densely provided with a plurality of jacks, the heat conducting copper ring 303 is inserted into the jacks, and the plugging holes of the first dielectric layer 101 and the second dielectric layer 102 are arranged on the same axis.
Further illustratively, the first flange 206 is disposed along the length of the thermally conductive plate 212 and the second flange 208 is disposed along the width of the thermally conductive plate 212.
Further, the first air-dispersing plates 203 and the second air-dispersing plates 204 are symmetrically arranged at two ends of the heat conducting plate 212, and the first air-dispersing plates 203 and the second air-dispersing plates 204 are arranged at one end of the heat conducting plate 212 in parallel.
Further, the thickness of the heat dissipation layer 201 is not less than the thicknesses of the first dielectric layer 101 and the second dielectric layer 102, the heat dissipation layer 201 is 1mm-1.5mm, and the thicknesses of the first dielectric layer and the second dielectric layer are 0.3mm-0.8mm.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The high-current PCB with the heat radiation structure comprises a PCB layer structure, wherein the PCB layer structure is composed of a first dielectric layer and a second dielectric layer from top to bottom in sequence;
The heat conduction plate is characterized in that a first air-dispersing plate and a second air-dispersing plate are arranged on two sides of the heat conduction plate, the first air-dispersing plate and the second air-dispersing plate are communicated with the first air duct, the second air duct and the third air duct, a heat conduction copper sheet and a plurality of heat conduction copper rings are further arranged at the positions, corresponding to the insertion areas, of the heat conduction plate, the heat conduction copper sheet is embedded into the heat conduction plate, and the heat conduction copper rings and the heat conduction copper sheet are integrally formed.
2. The high-current PCB with heat dissipation structure of claim 1, wherein: the heat conducting plate comprises a first convex edge, a second convex edge and a heat conducting plate, wherein the first convex edge and the heat conducting plate are integrally formed, the first convex edge is of two rectangular structures protruding outwards, a plurality of heat radiating fins are sequentially arranged on the first convex edge in an array mode, the second convex edge is of a semi-cylinder shape, the second convex edge is of a hollow structure, and the hollow structure is formed by a plurality of densely distributed through holes.
3. The high-current PCB with heat dissipation structure of claim 1, wherein: the heat conducting plate, the first air-dispersing plate and the second air-dispersing plate are integrally formed, and air openings are formed in the first air-dispersing plate and the second air-dispersing plate and correspond to the first air channel, the second air channel and the third air channel respectively.
4. The high-current PCB with heat dissipation structure of claim 1, wherein: the air inlet and the air outlet of the first air channel are also provided with preformed holes for installing thermistors.
5. The high-current PCB with heat dissipation structure of claim 1, wherein: the plug-in areas are densely distributed with a plurality of jacks, the heat-conducting copper rings penetrate through the jacks, and the plug-in holes of the first dielectric layer and the plug-in holes of the second dielectric layer are arranged on the same axis.
6. The high-current PCB board with a heat dissipation structure according to claim 1 or 2, wherein: the first convex edge is arranged along the length direction of the heat conducting plate, and the second convex edge is arranged along the width direction of the heat conducting plate.
7. A high current PCB board with a heat dissipation structure according to claim 1 or 3, wherein: the first air-dispersing plates and the second air-dispersing plates are symmetrically arranged at two ends of the heat conducting plate in pairs, and the second air-dispersing plates of the first air-dispersing plates are arranged at one end of the heat conducting plate in parallel.
8. The high-current PCB with heat dissipation structure of claim 1, wherein: the thickness of the heat dissipation layer is not smaller than that of the first dielectric layer and the second dielectric layer, the heat dissipation layer is 1mm-1.5mm, and the thicknesses of the first dielectric layer and the second dielectric layer are 0.3mm-0.8mm.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221202860U true CN221202860U (en) | 2024-06-21 |
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