CN219876625U - Heat abstractor and unmanned aerial vehicle - Google Patents
Heat abstractor and unmanned aerial vehicle Download PDFInfo
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- CN219876625U CN219876625U CN202320317433.4U CN202320317433U CN219876625U CN 219876625 U CN219876625 U CN 219876625U CN 202320317433 U CN202320317433 U CN 202320317433U CN 219876625 U CN219876625 U CN 219876625U
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- heat
- fins
- heat conduction
- heat dissipation
- pipe
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 57
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- SXHLTVKPNQVZGL-UHFFFAOYSA-N 1,2-dichloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1 SXHLTVKPNQVZGL-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the utility model discloses a heat dissipation device and an unmanned aerial vehicle, wherein the heat dissipation device comprises: a heat dissipating substrate having a first surface and a second surface; a plurality of first fins arranged on the first surface adjacently, wherein two adjacent first fins form a first heat dissipation air duct, the first heat dissipation air duct is parallel to the length direction of the heat dissipation substrate, and the top ends of the first fins are provided with grooves; the heat conduction device comprises a first heat conduction pipe, a second heat conduction pipe and a heat conduction component connected with the heat conduction pipe, wherein the heat conduction pipe is connected between the first heat conduction pipe and the second heat conduction pipe; the first heat conduction pipes are arranged at the top ends of the first fins and are attached to the grooves, and the first heat conduction pipes are perpendicular to the length direction of the heat dissipation substrate; the second heat conduction pipe is located on the second surface, and the second heat conduction pipe is parallel to the second surface. Through the mode, the heat dissipation problem of the multi-layer circuit board with double-sided heat dissipation requirements can be effectively solved under the condition that the heat dissipation space of the unmanned aerial vehicle is limited and the weight of the heat dissipation device is strictly limited.
Description
Technical Field
The embodiment of the utility model relates to the field of heat dissipation structures, in particular to a heat dissipation device and an unmanned aerial vehicle.
Background
With the development of unmanned aerial vehicle technology, miniaturization and high power density requirements are becoming more and more urgent. The interior of the unmanned aerial vehicle often comprises a plurality of layers of printed circuit boards (Pr i nted Ci rcu it Board, PCBs), and the power consumption of the internal structure of the unmanned aerial vehicle is larger and larger. And as the integration level of the unmanned aerial vehicle is higher and higher, the internal heat dissipation space reserved in the unmanned aerial vehicle is smaller and smaller.
However, the conventional method is to adopt a plurality of heat dissipation systems to solve the heat dissipation requirement of a plurality of modules or a plurality of circuit boards inside the unmanned aerial vehicle, but the unmanned aerial vehicle is more complicated in structure, which will cause the weight and the volume of the unmanned aerial vehicle to exceed the limit.
Disclosure of Invention
In order to solve the technical problems, the utility model adopts a technical scheme that: provided is a heat sink applied to a PCB, the heat sink including: a heat dissipating substrate having a first surface and a second surface; the first fins are adjacently arranged on the first surface, two adjacent first fins form a first heat dissipation air duct, the first heat dissipation air duct is parallel to the length direction of the heat dissipation substrate, and the top ends of the first fins are provided with grooves; the heat conduction device comprises a first heat conduction pipe, a second heat conduction pipe and a heat conduction component connected with the heat conduction pipe, wherein the connected heat conduction pipe is connected between the first heat conduction pipe and the second heat conduction pipe; the first heat conduction pipes are arranged at the top ends of the first fins and are attached to the grooves, and the first heat conduction pipes are perpendicular to the length direction of the heat dissipation substrate; the second heat conduction pipe is positioned on the second surface and is parallel to the second surface; the PCB is arranged between the second heat conduction pipe and the heat dissipation substrate, and the PCB conducts heat to the first fins through the heat dissipation substrate and the heat conduction component.
In some embodiments, the apparatus further comprises: the plurality of second fins are arranged on the first surface adjacently, and are arranged on one side of the plurality of first fins in the length direction of the heat dissipation substrate; two adjacent second fins form a second heat dissipation air duct, and the second heat dissipation air duct is parallel to the length direction of the heat dissipation substrate; the PCB conducts heat to the second fins through the heat dissipating substrate.
In some embodiments, the grooves of the first fins are provided with arc-shaped heat conducting fins; the arc-shaped heat conducting fin and the first fin are integrally formed, and the arc-shaped heat conducting fin is attached to the groove.
In some embodiments, the heat dissipating substrate is provided with a number of through holes.
In some embodiments, the second surface of the heat dissipating substrate is further provided with a first heat conducting fin.
In some embodiments, a side of the second heat conduction pipe facing the second surface is provided with a second heat conduction sheet.
In some embodiments, the first heat pipe, the second heat pipe, and the connecting heat pipe are integrally formed.
In some embodiments, the thermally conductive member is graphene, a liquid-cooled tube, a loop heat pipe, or a loop thermosiphon.
In order to solve the technical problems, the utility model adopts another technical scheme that: provided is a unmanned aerial vehicle including: the heat dissipation device comprises a body, a PCB and the heat dissipation device, wherein the PCB and the heat dissipation device are all arranged inside the body; the PCB is arranged on the second surface of the radiating substrate of the radiating device, and the top-layer component of the PCB is attached to the first heat-conducting fin of the radiating device; and the bottom component of the PCB is attached to the second heat conduction pipe or the second heat conduction sheet of the heat dissipation device.
In some embodiments, the drone further comprises: the fan is arranged in the machine body, is arranged on the first surface of the radiating substrate of the radiating device and is positioned on the other side of the first fins along the length direction of the radiating substrate; the machine body is provided with an air outlet, and the fan brings heat on the first fins and the second fins out of the machine body through the air outlet.
The embodiment of the utility model has the beneficial effects that: different from the situation of the prior art, the embodiment of the utility model can effectively solve the heat dissipation problem of the multi-layer circuit board with double-sided heat dissipation requirements under the condition that the heat dissipation space of the unmanned aerial vehicle is limited and the weight of the heat dissipation device is strictly limited.
Drawings
Fig. 1 is an assembly view of a heat dissipating device according to an embodiment of the present utility model, showing a structure on a first surface of a heat dissipating substrate thereof;
fig. 2 is an assembly view of a heat dissipating device according to an embodiment of the present utility model, showing a structure on a second surface of a heat dissipating substrate thereof;
FIG. 3 is a cross-sectional view of a heat dissipating device according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of an unmanned aerial vehicle according to an embodiment of the present utility model.
Detailed Description
In order that the utility model may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween.
In the description of the present utility model, it should be noted that, the azimuth or positional relationship indicated by the terms "inner", "outer", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that is commonly put in use of the product of this application, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and therefore should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.
The technical scheme of the utility model is described below with reference to the accompanying drawings:
first aspect embodiment
Referring to fig. 1 and fig. 2, fig. 1 and fig. 2 are assembly diagrams of a heat dissipating device according to an embodiment of the present utility model, which respectively show structures on a first surface and a second surface of a heat dissipating substrate. The heat dissipating device includes a heat dissipating substrate 100, a plurality of first fins 200, an arc-shaped heat conductive sheet 210, a plurality of second fins 300, a heat conductive member 400, a first heat conductive sheet 110 and a second heat conductive sheet 500, wherein the heat dissipating substrate 100 has a first surface and a second surface, and the heat conductive member 400 includes a connection heat conductive pipe 410, a first heat conductive pipe 420 and a second heat conductive pipe 430.
As can be seen from fig. 1, a plurality of first fins 200 are adjacently disposed on the first surface of the heat dissipation substrate 100, two adjacent first fins 200 form one first heat dissipation air channel, and the first heat dissipation air channel is parallel to the length direction of the heat dissipation substrate 100.
In consideration of heat conduction efficiency, grooves are formed at the top ends of the first fins 200, and arc-shaped heat conductive sheets 210 are provided at the grooves, and the arc-shaped heat conductive sheets 210 are attached to the grooves to increase the contact area of the first fins 200 with the first heat conductive pipes 420. In addition, the arc-shaped heat conductive sheet 210 and the first fin 200 may be integrally formed to improve the connection strength of the arc-shaped heat conductive sheet 210 and the first fin 200.
Only the first heat conductive pipe 420 and the connection heat conductive pipe 410 of the heat conductive member 400 are shown in fig. 1, and the second heat conductive pipe 430 thereof needs to be shown in conjunction with fig. 2. As can be seen from fig. 1, the first heat conducting pipes are disposed at the top ends of the first fins 200 and are attached to the grooves of the first fins 200. In the case where the first fin 200 is provided with the arc-shaped heat conductive sheet 210, the first heat conductive pipe 420 is attached to the arc-shaped heat conductive sheet 210. In the case that the plurality of first fins 300 are adjacently disposed along the length direction of the heat dissipation substrate 100, the first heat conductive pipes 420 are perpendicular to the length direction of the heat dissipation substrate 100.
As can be seen in fig. 2, the second heat pipe 430 is located on the second surface, and the second heat pipe 430 is parallel to the second surface. The first heat conductive pipe 420 and the second heat conductive pipe 430 are connected by the connection heat conductive pipe 410, thereby realizing conduction of the second heat conductive pipe 430 to the first heat conductive pipe 420. The connection heat pipe 410 is disposed at one side of the heat dissipation substrate 100 to avoid damaging the integrity of the PCB. The first heat conductive pipe 420, the connection heat conductive pipe 410, and the second heat conductive pipe 430 may be separately provided or integrally formed.
When the PCB is disposed between the heat radiating substrate 100 and the second heat conductive pipe 430, the PCB conducts heat to the plurality of first fins 200 through the heat radiating substrate 100 and the heat conductive member 400.
In the present embodiment, to improve heat conduction efficiency and connection strength, the first heat conduction pipe 420, the connection heat conduction pipe 410, and the second heat conduction pipe 430 are integrally formed to constitute the heat conduction member 400. The heat conducting member 400 may be graphene, a liquid-cooled tube, a loop heat pipe, or a loop thermosiphon, among other heat conducting members.
The plurality of second fins 300 are also disposed adjacent to the first surface of the heat dissipating substrate 100, and the plurality of second fins 300 are disposed on one side of the plurality of first fins 200 in the length direction of the heat dissipating substrate 100. Two adjacent second fins 300 form a second heat dissipation air duct, which is parallel to the length direction of the heat dissipation substrate 100.
When the PCB is disposed between the heat radiating substrate 100 and the second heat conductive pipes 430, the PCB conducts heat to the plurality of second fins 300 through the heat radiating substrate 100.
As can be seen from fig. 2, the first heat conductive sheet 110 is disposed on the second surface of the heat dissipating substrate 100, the second heat conductive sheet 500 is disposed on the side of the second heat conductive pipe 430 facing the second surface of the heat dissipating substrate 100, and the purpose of the first heat conductive sheet 110 and the second heat conductive sheet 500 is to increase the contact area between the PCB and the heat dissipating device, so as to improve the heat conducting efficiency.
In the case where the first and second heat conductive sheets 110 and 500 are provided, when the heat dissipating device is applied, the PCB needs to be disposed between the first and second heat conductive sheets 110 and 500, and the areas of the first and second heat conductive sheets 110 and 500 should be larger than the area of the PCB. In the embodiment of the present utility model, both the first and second heat conductive sheets 110 and 500 are rectangular. In other embodiments, the first and second heat conductive sheets 110 and 500 may be provided in other shapes without any limitation on the shapes of the first and second heat conductive sheets 110 and 500 on the premise that all components on the top and bottom layers of the PCB can be covered.
The PCB disposed between the first and second heat conductive sheets 110 and 500 transfers heat to the first and second heat conductive sheets 110 and 500, and then transfers heat to the plurality of first fins 200 through the heat dissipation substrate 100 and the heat conductive member 400, respectively.
The PCB disposed between the first and second heat conductive sheets 110 and 500 conducts heat to the first heat conductive sheet 110 and then to the plurality of second fins 300 through the heat dissipation substrate 100.
Referring to fig. 3, fig. 3 is a cross-sectional view of a heat dissipating device according to an embodiment of the present utility model, and fig. 3 shows that the second fin 300 is integrally formed with the heat dissipating substrate 100, so as to improve heat conduction efficiency and connection strength between the second fin 300 and the heat dissipating substrate 100.
It should be noted that, in the embodiment of the present utility model, the heat dissipating substrate 100 is provided with a plurality of through holes for mounting and fixing the heat dissipating device.
The heat dissipation substrate 100, the first fin 200, the second fin 300, the arc-shaped heat conductive sheet 210, the first heat conductive sheet 110, and the second heat conductive sheet 500 may be made of high thermal conductivity materials such as copper, silver, pure aluminum, aluminum alloy, or graphite sheet.
Different from the situation of the prior art, the embodiment of the utility model can effectively solve the heat dissipation problem of the multilayer circuit board on the structure of the multilayer circuit board with double-sided heat dissipation requirements.
Second aspect of embodiments
An embodiment of the second aspect of the present utility model provides a unmanned aerial vehicle, please refer to fig. 4, fig. 4 is a schematic structural diagram of the unmanned aerial vehicle, the unmanned aerial vehicle includes a main body 40, a PCB 20, a fan 30, and a heat dissipating device 10 according to the embodiment of the first aspect, wherein the PCB 20, the heat dissipating device 10 and the fan 30 are disposed inside the main body 40.
The PCB 20 is disposed on the second surface of the heat dissipating substrate of the heat dissipating device 10, and the top component of the PCB 20 is attached to the first heat conducting fin of the heat dissipating device 10 to conduct heat for dissipating heat, so that heat is conducted to the plurality of first fins and the plurality of second fins of the heat dissipating device 10. The bottom component of the PCB 20 is attached to the second heat conductive pipe of the heat dissipating device 10 to conduct heat and dissipate heat, and if the second heat conductive fin is provided in the heat dissipating device 10, the bottom component of the PCB 20 is attached to the second heat conductive pipe to conduct heat and dissipate heat, so that heat is conducted to the plurality of first fins of the heat dissipating device 10.
The fan 30 is disposed on the first surface of the heat dissipation substrate of the heat dissipation device 10, and is located at the other side of the plurality of first fins along the length direction of the heat dissipation substrate; the body 40 is provided with an air outlet, and the fan 30 brings heat on the first fins and the second fins out of the body 40 through the air outlet.
Different from the situation of the prior art, the embodiment of the utility model can effectively solve the heat dissipation problem of the multi-layer circuit board with double-sided heat dissipation requirements under the condition that the heat dissipation space of the unmanned aerial vehicle is limited and the weight of the heat dissipation device is strictly limited.
It should be noted that the description of the present utility model and the accompanying drawings illustrate preferred embodiments of the present utility model, but the present utility model may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, which are not to be construed as additional limitations of the utility model, but are provided for a more thorough understanding of the present utility model. The above-described features are further combined with each other to form various embodiments not listed above, and are considered to be the scope of the present utility model described in the specification; further, modifications and variations of the present utility model may be apparent to those skilled in the art in light of the foregoing teachings, and all such modifications and variations are intended to be included within the scope of this utility model as defined in the appended claims.
Claims (10)
1. A heat sink, for use with a PCB, comprising:
a heat dissipating substrate having a first surface and a second surface;
the first fins are adjacently arranged on the first surface, two adjacent first fins form a first heat dissipation air duct, the first heat dissipation air duct is parallel to the length direction of the heat dissipation substrate, and the top ends of the first fins are provided with grooves;
the heat conduction device comprises a first heat conduction pipe, a second heat conduction pipe and a heat conduction component connected with the heat conduction pipe, wherein the connected heat conduction pipe is connected between the first heat conduction pipe and the second heat conduction pipe;
the first heat conduction pipes are arranged at the top ends of the first fins and are attached to the grooves, and the first heat conduction pipes are perpendicular to the length direction of the heat dissipation substrate;
the second heat conduction pipe is positioned on the second surface and is parallel to the second surface;
when the PCB is disposed between the second heat conductive pipe and the heat dissipation substrate, the PCB conducts heat to the first fin through the heat dissipation substrate and the heat conductive member.
2. The apparatus as recited in claim 1, further comprising:
the plurality of second fins are arranged on the first surface adjacently, and are arranged on one side of the plurality of first fins in the length direction of the heat dissipation substrate;
two adjacent second fins form a second heat dissipation air duct, and the second heat dissipation air duct is parallel to the length direction of the heat dissipation substrate;
the PCB conducts heat to the second fins through the heat dissipating substrate.
3. The device according to claim 2, wherein the grooves of the first fins are provided with arc-shaped heat conducting fins;
the arc-shaped heat conducting fin and the first fin are integrally formed, and the arc-shaped heat conducting fin is attached to the groove.
4. A device according to claim 3, characterized in that the heat-dissipating substrate is provided with a number of through holes.
5. The device of claim 4, wherein the second surface of the heat dissipating substrate is further provided with a first thermally conductive sheet.
6. The device according to claim 5, wherein a side of the second heat conduction pipe facing the second surface is provided with a second heat conduction sheet.
7. The apparatus of claim 6, wherein the first heat pipe, the second heat pipe, and the connecting heat pipe are integrally formed.
8. The apparatus of claim 7, wherein the thermally conductive member is graphene, a liquid-cooled tube, a loop heat pipe, or a loop thermosiphon.
9. An unmanned aerial vehicle, comprising: fuselage, PCB and a heat sink as claimed in any of claims 1-8, wherein,
the PCB and the heat dissipation device are arranged inside the machine body;
the PCB is arranged on the second surface of the radiating substrate of the radiating device, and the top-layer component of the PCB is attached to the first heat-conducting fin of the radiating device;
and the bottom component of the PCB is attached to the second heat conduction pipe or the second heat conduction sheet of the heat dissipation device.
10. The unmanned aerial vehicle of claim 9, further comprising:
the fan is arranged in the machine body, is arranged on the first surface of the radiating substrate of the radiating device and is positioned on the other side of the first fins along the length direction of the radiating substrate;
the machine body is provided with an air outlet, and the fan brings heat on the first fins and the second fins out of the machine body through the air outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320317433.4U CN219876625U (en) | 2023-02-20 | 2023-02-20 | Heat abstractor and unmanned aerial vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320317433.4U CN219876625U (en) | 2023-02-20 | 2023-02-20 | Heat abstractor and unmanned aerial vehicle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219876625U true CN219876625U (en) | 2023-10-20 |
Family
ID=88319595
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320317433.4U Active CN219876625U (en) | 2023-02-20 | 2023-02-20 | Heat abstractor and unmanned aerial vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219876625U (en) |
-
2023
- 2023-02-20 CN CN202320317433.4U patent/CN219876625U/en active Active
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