CN215734990U

CN215734990U - High-heat-dissipation double-layer PCB

Info

Publication number: CN215734990U
Application number: CN202121156676.1U
Authority: CN
Inventors: 龚绪金
Original assignee: Longyu Electronics Shenzhen Co ltd
Current assignee: Zhuhai Longyu Technology Co ltd
Priority date: 2021-05-27
Filing date: 2021-05-27
Publication date: 2022-02-01
Anticipated expiration: 2031-05-27

Abstract

The utility model relates to the technical field of PCB (printed circuit board), in particular to a high-heat-dissipation double-layer PCB, which comprises an upper-layer circuit board, an upper shell, a heat dissipation layer, a lower shell and a lower-layer circuit board, wherein the upper-layer circuit board, the upper shell, the heat dissipation layer, the lower shell and the lower-layer circuit board are sequentially arranged from top to bottom; the utility model has the advantages of rapid heat dissipation and good heat dissipation effect, and prolongs the service life of the PCB.

Description

High-heat-dissipation double-layer PCB

Technical Field

The utility model relates to the technical field of PCB (printed circuit board), in particular to a high-heat-dissipation double-layer PCB.

Background

The circuit board is named as a circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultrathin circuit board, a printed (copper etching technology) circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. After the existing double-layer combined PCB is assembled and installed, most of the double-layer combined PCB is combined together in a back-to-back mode or only one layer of simple aluminum alloy plate is adopted to lean against the combined PCB in a separating mode, the installation structure is simple, but the heat dissipation effect is extremely slow, long-time heat dissipation is not ideal, parts on the double-layer combined PCB are prone to being damaged, and the service life of the double-layer combined PCB is shortened seriously.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects and provide the high-heat-dissipation double-layer PCB which is rapid in heat dissipation, good in heat dissipation effect and capable of prolonging the service life of the PCB.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a double-deck PCB board of high heat dissipation, includes upper circuit board, upper casing, heat dissipation layer, casing and lower floor's circuit board that from top to bottom set gradually, be provided with the epitheca chamber in the upper casing, be provided with the upper heat absorption piece in the epitheca chamber, the heat dissipation layer is many heat dissipation strips that parallel equidistance set up, the top and the bottom of heat dissipation strip butt respectively go up the upper surface of casing bottom surface and casing down, it is adjacent form the heat dissipation passageway between the heat dissipation strip, be provided with the lower casing chamber in the casing down, be provided with lower floor's heat absorption piece in the lower casing chamber, the bottom surface of upper circuit board with the upper surface laminating of upper casing, the bottom surface of casing down with the upper surface laminating of lower floor's circuit board.

Further, the upper layer heat absorption block and the lower layer heat absorption block are both made of phase change materials.

Furthermore, a plurality of upper-layer heat-conducting fins are vertically arranged in the upper shell cavity, the top ends of the upper-layer heat-conducting fins are inserted into the upper-layer heat-absorbing block, and the bottom ends of the upper-layer heat-conducting fins penetrate out of the bottom surface of the upper shell and extend into the heat-radiating channel.

Furthermore, a plurality of lower-layer heat-conducting fins are vertically arranged in the lower shell cavity, the bottom ends of the lower-layer heat-conducting fins are inserted into the lower-layer heat-absorbing block, and the top ends of the lower-layer heat-conducting fins penetrate out of the upper surface of the lower shell and extend into the heat-radiating channel.

Further, the upper shell and the lower shell are both made of metal or carbon fiber or graphite.

The utility model has the beneficial effects that:

in practical application, when the upper circuit board and the lower circuit board are heated, the heat emitted from the bottom surface of the upper circuit board is rapidly led downwards through the upper shell, and after the heat is absorbed by the upper heat absorption block in the cavity of the upper shell, the heat is emitted through the heat dissipation channel and the heat dissipation strip; the heat dissipated from the upper surface of the lower circuit board is upwards led out through the lower shell, and after the lower heat absorption block in the cavity of the lower shell absorbs the heat, the heat is dissipated out through the heat dissipation channel and the heat dissipation strip; the utility model has the advantages of rapid heat dissipation and good heat dissipation effect, and prolongs the service life of the PCB.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

reference numerals: an upper layer circuit board 1; an upper case 2; an upper housing cavity 21; an upper layer heat-conductive sheet 22; a heat dissipation layer 3; the heat dissipation bars 31; a heat dissipation channel 32; a lower case 4; a lower housing cavity 41; a lower thermally conductive sheet 42; a lower layer circuit board 5; an upper layer heat absorption block 6; a lower heat absorbing block 7.

Detailed Description

As shown in fig. 1, a high heat dissipation double-layer PCB board, includes upper circuit board 1, upper casing 2, heat dissipation layer 3, lower casing 4 and lower floor's circuit board 5 that from top to bottom set gradually, be provided with epitheca chamber 21 in the upper casing 2, be provided with upper heat-sink block 6 in the epitheca chamber 21, heat dissipation layer 3 is many heat dissipation strips 31 that parallel equidistance set up, the top and the bottom of heat dissipation strip 31 butt respectively go up the upper surface of casing 2 bottom surface and lower casing 4, it is adjacent form heat dissipation channel 32 between the heat dissipation strip 31, be provided with lower casing chamber 41 in the lower casing 4, be provided with lower floor's heat-sink block 7 in the lower casing chamber 41, the bottom surface of upper circuit board 1 with the upper surface laminating of upper casing 2, the bottom surface of lower casing 4 with the upper surface laminating of lower floor's circuit board 5.

When the heat dissipation device is used, when the upper circuit board 1 and the lower circuit board 5 generate heat, the heat dissipated from the bottom surface of the upper circuit board 1 is rapidly led downwards through the upper shell 2, and after the heat is absorbed by the upper heat absorption block 6 in the upper shell cavity 21, the heat is dissipated out through the heat dissipation channel 32 and the heat dissipation strip 31; the heat emitted from the upper surface of the lower circuit board 5 is upwards led out through the lower shell 4, and after the lower heat absorption block 7 in the lower shell cavity 41 absorbs the heat, the heat is emitted out through the heat dissipation channel 32 and the heat dissipation strip 31; the utility model has the advantages of rapid heat dissipation and good heat dissipation effect, and prolongs the service life of the PCB.

As shown in fig. 1, the upper layer heat absorption block 6 and the lower layer heat absorption block 7 are both made of phase change material; in this embodiment, after the upper casing 2 and the lower casing 4 conduct heat, the phase change material absorbs a large amount of heat in the process of changing physical properties, and has rapid heat absorption and good heat dissipation effect.

As shown in fig. 1, a plurality of upper heat conducting fins 22 are vertically arranged in the upper casing cavity 21, top ends of the upper heat conducting fins 22 are inserted into the upper heat absorbing block 6, and bottom ends of the upper heat conducting fins 22 penetrate through the bottom surface of the upper casing 2 and extend into the heat dissipation channel 32; in this embodiment, the heat conducting area and the heat dissipating area of the upper housing 2 are increased by the upper layer of the heat conducting fins 22, the heat dissipating effect is better, and the service life of the PCB board is prolonged.

As shown in fig. 1, a plurality of lower heat conducting fins 42 are vertically disposed in the lower housing cavity 41, bottom ends of the lower heat conducting fins 42 are inserted into the lower heat absorbing block 7, and top ends of the lower heat conducting fins 42 penetrate through the upper surface of the lower housing 4 and extend into the heat dissipating channel 32; in this embodiment, the heat conducting area and the heat dissipation area of the lower housing 4 are increased by the lower layer of the heat conducting fins 42, the heat dissipation effect is better, and the service life of the PCB board is prolonged.

As shown in fig. 1, the upper case 2 and the lower case 4 are both made of metal or carbon fiber or graphite; in this embodiment, the upper case 2 and the lower case 4 made of metal, carbon fiber, or graphite have a better heat conduction effect.

The specific embodiments described herein are merely illustrative of the spirit of the utility model. Various modifications, additions and substitutions for the described embodiments may be made by those skilled in the art without departing from the scope and spirit of the utility model as defined by the accompanying claims.

Claims

1. The utility model provides a high heat dissipation double-deck PCB board which characterized in that: comprises an upper layer circuit board (1), an upper shell (2), a heat dissipation layer (3), a lower shell (4) and a lower layer circuit board (5) which are arranged from top to bottom in sequence, an upper shell cavity (21) is arranged in the upper shell (2), an upper layer heat absorption block (6) is arranged in the upper shell cavity (21), the heat dissipation layer (3) is a plurality of heat dissipation strips (31) which are arranged in parallel and at equal intervals, the top end and the bottom end of each heat dissipation strip (31) are respectively abutted against the bottom surface of the upper shell (2) and the upper surface of the lower shell (4), a heat dissipation channel (32) is formed between every two adjacent heat dissipation strips (31), a lower shell cavity (41) is arranged in the lower shell (4), a lower layer heat absorption block (7) is arranged in the lower shell cavity (41), the bottom surface of the upper layer circuit board (1) is attached to the upper surface of the upper shell (2), the bottom surface of the lower shell (4) is attached to the upper surface of the lower circuit board (5).

2. The high heat dissipation double-layer PCB board of claim 1, wherein: the upper layer heat absorption block (6) and the lower layer heat absorption block (7) are both made of phase change materials.

3. The high heat dissipation double-layer PCB board of claim 2, wherein: a plurality of upper-layer heat-conducting fins (22) are vertically arranged in the upper shell cavity (21), the top ends of the upper-layer heat-conducting fins (22) are inserted into the upper-layer heat-absorbing block (6), and the bottom ends of the upper-layer heat-conducting fins (22) penetrate through the bottom surface of the upper shell (2) and extend into the heat-radiating channel (32).

4. The high heat dissipation double-layer PCB board of claim 2, wherein: a plurality of lower-layer heat-conducting fins (42) are vertically arranged in the lower shell cavity (41), the bottom ends of the lower-layer heat-conducting fins (42) are inserted into the lower-layer heat-absorbing block (7), and the top ends of the lower-layer heat-conducting fins (42) penetrate through the upper surface of the lower shell (4) and extend into the heat-radiating channel (32).

5. The high heat dissipation double-layer PCB board of claim 1, wherein: the upper shell (2) and the lower shell (4) are both made of metal or carbon fiber or graphite.