CN219352223U

CN219352223U - Integrated circuit board heat abstractor

Info

Publication number: CN219352223U
Application number: CN202320116562.7U
Authority: CN
Inventors: 姚泽建
Original assignee: Huizhou Jiayan Microchip Co ltd
Current assignee: Huizhou Jiayan Microchip Co ltd
Priority date: 2023-02-06
Filing date: 2023-02-06
Publication date: 2023-07-14
Anticipated expiration: 2033-02-06

Abstract

The utility model discloses a heat dissipating device of an integrated circuit board, which comprises a supporting frame, wherein the upper end of the supporting frame is provided with a fixing component, the lower end of the supporting frame is provided with a heat dissipating component, the fixing component comprises two clamping grooves, the two clamping grooves are symmetrically arranged on the side wall of the upper end of the supporting frame, the inner walls of the two clamping grooves are fixedly connected with fixed shafts, the surfaces of the two fixed shafts are respectively and rotatably connected with an L-shaped plate, the inner walls of the two L-shaped plates are clamped with the same circuit board, and the lower surfaces of the two L-shaped plates are respectively and fixedly connected with a lug, and the heat dissipating device has the beneficial effects that: the heat in the circuit board is absorbed through the heat conducting fin and then input into the fixed plate, the heat is input into the radiating fins at the lower end through the fixed plate, then the air in the supporting frame is extracted through the fan, so that the air flows through the surface of the radiating fins at a high speed, the heat in the radiating fins is rapidly dissipated, the temperature in the circuit board is kept stable, and the circuit board is prevented from being damaged.

Description

Integrated circuit board heat abstractor

Technical Field

The utility model relates to the technical field of heat dissipation of circuit boards, in particular to a heat dissipation device of an integrated circuit board.

Background

The circuit board enables the circuit to be miniaturized and visualized, plays an important role in mass production of fixed circuits and optimizing layout of electrical appliances, and can generate certain heat during operation for electronic equipment, so that the internal temperature of the equipment rises rapidly, if the heat is not timely emitted, the equipment can continuously raise the temperature, the device can fail due to overheating, and the reliability of the electronic equipment can be reduced.

At present, the widely used PCB board materials are copper-clad, epoxy glass cloth base materials, phenolic resin glass cloth base materials and a small amount of used paper-based copper-clad board materials, and the base materials have excellent electrical performance and processing performance, but have poor heat dissipation performance, and are hardly expected to conduct heat by the resin of the PCB as a heat dissipation path of a high-heat-generating element, so that a large amount of heat easily accumulated by the PCB cannot be dissipated, and the circuit board is damaged.

Disclosure of Invention

The present utility model is directed to a heat dissipating device for an integrated circuit board, which solves the above-mentioned problems.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the integrated circuit board heat dissipation device comprises a support frame, wherein a fixing assembly is arranged at the upper end of the support frame, and a heat dissipation assembly is arranged at the lower end of the support frame;

the fixing assembly comprises two clamping grooves, the two clamping grooves are symmetrically formed in the side wall of the upper end of the supporting frame, fixing shafts are fixedly connected to the inner walls of the two clamping grooves, an L-shaped plate is rotationally connected to the surfaces of the two fixing shafts, the same circuit board is clamped to the inner walls of the two L-shaped plates, protruding blocks are fixedly connected to the lower surfaces of the two L-shaped plates, the two protruding blocks are slidably connected to the inner portions of the two grooves, and rubber strips are fixedly connected to the inner walls of the two grooves;

the heat dissipation assembly comprises a fixing plate, the fixing plate is fixedly connected to the inner wall of the supporting frame, a plurality of heat conducting fins are fixedly connected to the upper surface of the fixing plate, a plurality of heat dissipation fins are fixedly connected to the lower surface of the fixing plate, two air channels are formed in the side wall of the lower end of the supporting frame, and a fan is fixedly connected to the inner portion of each air channel on one side.

Preferably, cambered surfaces are formed at two ends of the circuit board.

Preferably, the circuit board is closely attached to the heat conductive sheet.

Preferably, two of said rubber strips are located between two lugs.

Preferably, the radiating fins are arranged perpendicular to the air duct.

Compared with the prior art, the utility model has the beneficial effects that: the heat in the circuit board is absorbed through the heat conducting fin and then input into the fixed plate, the heat is input into the radiating fins at the lower end through the fixed plate, then the air in the supporting frame is extracted through the fan, so that the air flows through the surface of the radiating fins at a high speed, the heat in the radiating fins is rapidly dissipated, the temperature in the circuit board is kept stable, and the circuit board is prevented from being damaged.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of a support frame structure according to the present utility model;

FIG. 3 is an enlarged view of portion A of FIG. 1 in accordance with the present utility model;

fig. 4 is a schematic view of a fixing plate structure of the present utility model.

In the figure: 1. a support frame; 2. a fixing assembly; 21. a clamping groove; 22. a fixed shaft; 23. an L-shaped plate; 24. a circuit board; 25. a bump; 26. a groove; 27. a rubber strip; 3. a heat dissipation assembly; 31. a fixing plate; 32. a heat conductive sheet; 33. a heat radiation fin; 34. an air duct; 35. a fan.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution: the integrated circuit board heat dissipating double-fuselage, including supporting the frame 1, the upper end of the supporting frame 1 is provided with the fixed assembly 2, the lower end of the supporting frame 1 is provided with the heat dissipating double-fuselage 3;

the fixing assembly 2 comprises two clamping grooves 21, the two clamping grooves 21 are symmetrically formed in the side wall of the upper end of the supporting frame 1, fixing shafts 22 are fixedly connected to the inner walls of the two clamping grooves 21, L-shaped plates 23 are rotatably connected to the surfaces of the two fixing shafts 22, the same circuit board 24 is clamped on the inner walls of the two L-shaped plates 23, protruding blocks 25 are fixedly connected to the lower surfaces of the two L-shaped plates 23, the two protruding blocks 25 are slidably connected to the inside of the two grooves 26, rubber strips 27 are fixedly connected to the inner walls of the two grooves 26, a heat conducting sheet 32 is attached to a fixing plate 31 according to the positions of parts on the surface of the circuit board 24, then the circuit board 24 is clamped between the two L-shaped plates 23, the protruding blocks 25 are extruded through the rubber strips 27, the protruding blocks 25 are pushed by the L-shaped plates 23 to rotate around the fixing shafts 22, the circuit board 24 is clamped by the two L-shaped plates 23, and the circuit board 24 is tightly attached to the fixing plate 31;

the heat dissipation assembly 3 comprises a fixing plate 31, the fixing plate 31 is fixedly connected to the inner wall of the supporting frame 1, a plurality of heat conducting fins 32 are fixedly connected to the upper surface of the fixing plate 31, a plurality of heat dissipation fins 33 are fixedly connected to the lower surface of the fixing plate 31, two air channels 34 are formed in the side wall of the lower end of the supporting frame 1, a fan 35 is fixedly connected to the inside of the air channel 34 on one side, heat in the circuit board 24 is absorbed through the heat conducting fins 32 and then is input into the fixing plate 31, then the heat is input into the heat dissipation fins 33 at the lower end through the fixing plate 31, then air in the supporting frame 1 is extracted through the fan 35, the air flows through the surfaces of the heat dissipation fins 33 at a high speed, heat in the heat dissipation fins 33 is dissipated rapidly, the temperature in the circuit board 24 is kept stable, and damage to the circuit board 24 is prevented.

Cambered surfaces are formed at two ends of the circuit board 24, so that the L-shaped plate 23 can clamp the circuit board 24 conveniently.

The circuit board 24 is closely attached to the heat conductive sheet 32, and heat in the circuit board 24 is extracted through the heat conductive sheet 32.

The two rubber strips 27 are positioned between the two convex blocks 25, and the convex blocks 25 are pushed by the rubber strips 27 to drive the upper ends of the L-shaped plates 23 to press the circuit board 24.

The heat radiation fins 33 are disposed perpendicularly to the air duct 34, so that air flowing through the air duct 34 passes over the surfaces of the plurality of heat radiation fins 33.

Specifically, when the utility model is used, firstly, the heat conducting sheet 32 is attached to the fixed plate 31 according to the positions of parts on the surface of the circuit board 24, then the circuit board 24 is clamped between the two L-shaped plates 23, the convex blocks 25 are extruded by the rubber strips 27, then the convex blocks 25 push the L-shaped plates 23 to rotate around the fixed shaft 22, the two L-shaped plates 23 clamp the circuit board 24, then the circuit board 24 is tightly attached to the fixed plate 31, heat in the circuit board 24 is absorbed by the heat conducting sheet 32 and then is input into the fixed plate 31, then the heat is input into the heat radiating fins 33 at the lower end by the fixed plate 31, then air in the supporting frame 1 is extracted by the fan 35, so that the air flows through the surfaces of the heat radiating fins 33 at a high speed, and then the heat in the heat radiating fins 33 is rapidly radiated, and the temperature in the circuit board 24 is kept stable, and the circuit board 24 is prevented from being damaged.

In the description of the present utility model, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "another end," "upper," "one side," "top," "inner," "front," "center," "two ends," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," "third," "fourth," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby features defining "first," "second," "third," "fourth" may explicitly or implicitly include at least one such feature.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The integrated circuit board heat dissipation device comprises a support frame (1), wherein a fixing assembly (2) is arranged at the upper end of the support frame (1), and a heat dissipation assembly (3) is arranged at the lower end of the support frame (1);

the method is characterized in that: the fixing assembly (2) comprises two clamping grooves (21), the two clamping grooves (21) are symmetrically formed in the side wall of the upper end of the supporting frame (1), fixed shafts (22) are fixedly connected to the inner walls of the two clamping grooves (21), L-shaped plates (23) are rotatably connected to the surfaces of the two fixed shafts (22), the same circuit board (24) is clamped on the inner walls of the two L-shaped plates (23), protruding blocks (25) are fixedly connected to the lower surfaces of the two L-shaped plates (23), the two protruding blocks (25) are slidably connected to the inner sides of the two grooves (26), and rubber strips (27) are fixedly connected to the inner walls of the two grooves (26);

the heat dissipation assembly (3) comprises a fixing plate (31), the fixing plate (31) is fixedly connected to the inner wall of the supporting frame (1), a plurality of heat conducting fins (32) are fixedly connected to the upper surface of the fixing plate (31), a plurality of heat dissipation fins (33) are fixedly connected to the lower surface of the fixing plate (31), two air channels (34) are formed in the side wall of the lower end of the supporting frame (1), and a fan (35) is fixedly connected to the inner portion of each air channel (34) on one side.

2. The integrated circuit board heat sink of claim 1, wherein: cambered surfaces are formed at two ends of the circuit board (24).

3. The integrated circuit board heat sink of claim 1, wherein: the circuit board (24) is tightly attached to the heat conductive sheet (32).

4. The integrated circuit board heat sink of claim 1, wherein: two rubber strips (27) are positioned between two lugs (25).

5. The integrated circuit board heat sink of claim 1, wherein: the radiating fins (33) are arranged perpendicular to the air duct (34).