CN218162983U

CN218162983U - Circuit ceramic substrate with strong heat dissipation capability

Info

Publication number: CN218162983U
Application number: CN202221698820.9U
Authority: CN
Inventors: 牛瑞波; 丁彦奇; 张天宇
Original assignee: Hunan Tongdaxin Electronic Technology Co ltd
Current assignee: Hunan Tongdaxin Electronic Technology Co ltd
Priority date: 2022-07-04
Filing date: 2022-07-04
Publication date: 2022-12-27
Anticipated expiration: 2032-07-04

Abstract

The utility model discloses a circuit ceramic substrate that heat-sinking capability is strong relates to ceramic substrate body technical field, the utility model discloses a ceramic substrate body is provided with radiator unit on the ceramic substrate body, radiator unit includes the radiating block, the heat conduction piece, adapting unit, heat dissipation fin and heating panel, the thermal conductivity of radiating block and heating panel is greater than the thermal conductivity of ceramic substrate body, radiating block and ceramic substrate body bottom fixed connection, the heat conduction piece passes through adapting unit and is connected with the radiating block, and the mounting groove has been seted up at the heat conduction piece top, heating panel and heat conduction piece bottom fixed connection, the top fixed connection of heat dissipation fin and heating panel. The utility model relates to a circuit ceramic substrate that heat-sinking capability is strong, through setting up radiator unit, can improve the heat-sinking capability of ceramic substrate body, reduce the influence of heat to the component performance of ceramic substrate body, improve the life of ceramic substrate body component.

Description

Circuit ceramic substrate with strong heat dissipation capability

Technical Field

The utility model relates to a ceramic substrate body technical field, in particular to circuit ceramic substrate that heat-sinking capability is strong.

Background

The ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface (single side or double sides) of an aluminum oxide or aluminum nitride ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material for high-power electronic circuit structure technology and interconnection technology.

In the existing market, a large amount of copper foils are bonded on the surface of the existing ceramic substrate, so that a large amount of heat can be generated during working, the ceramic substrate is not easy to dissipate heat, if the heat generated by a heating element cannot be dissipated in time, the temperature of the element rises sharply, the use of the ceramic substrate body can be influenced, the service life of the ceramic substrate body can be shortened, and therefore, the circuit ceramic substrate with strong heat dissipation capability is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a circuit ceramic substrate that heat-sinking capability is strong can effectively solve current ceramic substrate among the background art, has a large amount of copper foils because of its surface bonding, leads to its during operation can produce a large amount of heats, and is difficult for the heat dissipation, if can not in time dispel the heat that heating element produced, just lead to the component temperature sharply to rise, not only can influence the use of ceramic substrate body, still can shorten the problem of the life of ceramic substrate body.

In order to achieve the above purpose, the utility model adopts the technical proposal that: a circuit ceramic substrate with strong heat dissipation capacity comprises a ceramic substrate body, wherein a heat dissipation assembly is arranged on the ceramic substrate body;

the heat dissipation assembly comprises a heat dissipation block, a heat conduction block, a connecting part, heat dissipation fins and a heat dissipation plate, wherein the heat conductivity of the heat dissipation block and the heat dissipation plate is greater than that of the ceramic substrate body;

the connecting component comprises a contact spring and a clamping block, a placing groove is formed in the inner wall of the mounting groove, one end of the contact spring is fixedly connected with the inner wall of the placing groove, the other end of the contact spring is fixedly connected with the clamping block, and a clamping groove matched with the clamping block is formed in the side face of the heat dissipation block, so that the heat conduction block can be conveniently connected with the heat dissipation block;

still include heat-conduction assembly, heat-conduction assembly includes horizontal heat dissipation strip and vertical heat dissipation strip, the bottom fixed connection of horizontal heat dissipation strip and ceramic substrate body, the one end of vertical heat dissipation strip and the side fixed connection of horizontal heat dissipation strip, the other end and the radiating block side fixed connection of vertical heat dissipation strip can increase the heat radiating area of ceramic substrate body.

Preferably, the fixture block is movably arranged inside the clamping groove, the side face of the heat dissipation block is provided with a sliding groove used for moving the fixture block, and the clamping groove is located inside the sliding groove, so that the fixture block can be conveniently moved out of the clamping groove.

Preferably, the top of the heat dissipation plate is fixedly connected with a heat conduction column, and the top of the ceramic substrate body is provided with a positioning groove matched with the heat conduction column, so that the ceramic substrate body can be further cooled, and can be supported.

Preferably, the number of the heat conduction columns is four, the four heat conduction columns are distributed on the top of the heat dissipation plate in a rectangular mode, and the heat conductivity of the heat conduction columns is larger than that of the ceramic substrate body.

Preferably, the heat dissipation plate is internally provided with four strip-shaped heat dissipation holes, and the four strip-shaped heat dissipation holes are distributed in the heat dissipation plate in a rectangular shape, so that heat transferred by the ceramic substrate body can be dissipated conveniently.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses in, through setting up radiator unit, at first carry out the block with the radiating block of this body coupling of ceramic substrate with the heat conduction piece of connecting on the heating panel, make the fixture block in the mounting groove of heat conduction piece can be under the extrusion of radiating block, move in to the standing groove, make the conflict spring be in compression state, when the fixture block tip remove to with the spout when same vertical line, the fixture block can remove along the spout, until removing to the draw-in groove position, make the fixture block drive the fixture block and reset under the reset action of conflict spring, thereby make the fixture block can block with draw-in groove each other, the heat that later electric elements work produced on the ceramic substrate body, transmit for the radiating block through horizontal radiating strip and vertical radiating strip, rethread heat conduction piece gives the heating panel heat transfer, the heating panel can give off the heat of ceramic substrate body fast, ceramic substrate body heat all around can also transmit for the heating panel through the heat conduction post, further give off the heat of ceramic substrate body, simultaneously through setting up the radiating fin, can transmit the heat of all the other regions of ceramic substrate body and transmit, finally carry out fast through the radiating strip and the radiating strip of inside, thereby can improve the ceramic substrate body's heat radiating element's heat life-span, ceramic substrate body.

Drawings

Fig. 1 is a perspective view of the whole structure of the circuit ceramic substrate with strong heat dissipation capability of the present invention;

FIG. 2 is a perspective view of a heat sink plate structure of a circuit ceramic substrate with high heat dissipation capability according to the present invention;

FIG. 3 is a perspective view of a ceramic substrate body structure of a circuit ceramic substrate with high heat dissipation capability according to the present invention;

FIG. 4 is a front sectional view of the connection structure of the heat dissipation block and the heat conduction block of the circuit ceramic substrate with high heat dissipation capability of the present invention;

fig. 5 is an enlarged view of a structure of a circuit ceramic substrate of fig. 4 with strong heat dissipation capability.

In the figure: 1. a ceramic substrate body; 2. a heat dissipating block; 3. a heat conducting block; 4. a heat dissipating fin; 5. a heat dissipation plate; 6. against the spring; 7. a clamping block; 8. a transverse heat dissipation strip; 9. a longitudinal heat dissipation strip; 10. a heat-conducting column; 11. strip-shaped heat dissipation holes; 12. a card slot; 13. a placement groove; 14. a chute.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-5, the present invention relates to a circuit ceramic substrate with strong heat dissipation capability, which includes a ceramic substrate body 1, wherein a heat dissipation assembly is disposed on the ceramic substrate body 1;

the heat dissipation assembly comprises a heat dissipation block 2, a heat conduction block 3, a connecting part, a heat dissipation fin 4 and a heat dissipation plate 5, the heat conductivity of the heat dissipation block 2 and the heat dissipation plate 5 is larger than that of the ceramic substrate body 1, the heat dissipation block 2 is fixedly connected with the bottom of the ceramic substrate body 1, the heat conduction block 3 is connected with the heat dissipation block 2 through the connecting part, the top of the heat conduction block 3 is provided with an installation groove, the heat dissipation plate 5 is fixedly connected with the bottom of the heat conduction block 3, the heat dissipation fin 4 is fixedly connected with the top of the heat dissipation plate 5, and the top of the heat dissipation fin 4 is in contact with the bottom of the ceramic substrate body 1;

the connecting component comprises a contact spring 6 and a clamping block 7, a placing groove 13 is formed in the inner wall of the mounting groove, one end of the contact spring 6 is fixedly connected with the inner wall of the placing groove 13, the other end of the contact spring 6 is fixedly connected with the clamping block 7, and a clamping groove 12 matched with the clamping block 7 is formed in the side face of the heat dissipation block 2, so that the heat conduction block 3 can be conveniently connected with the heat dissipation block 2;

still include heat-conduction assembly, heat-conduction assembly includes horizontal radiating strip 8 and vertical radiating strip 9, and horizontal radiating strip 8 and ceramic substrate body 1's bottom fixed connection, the one end of vertical radiating strip 9 and the side fixed connection of horizontal radiating strip 8, the other end and the 2 side fixed connections of radiating block of vertical radiating strip 9 can increase ceramic substrate body 1's heat radiating area.

The clamping block 7 is movably arranged inside the clamping groove 12, the side face of the heat dissipation block 2 is provided with a sliding groove 14 used for moving the clamping block 7, and the clamping groove 12 is located inside the sliding groove 14, so that the clamping block 7 can be conveniently moved out of the clamping groove 12.

5 top fixedly connected with heat conduction post 10 of heating panel, the constant head tank with heat conduction post 10 looks adaptation is seted up at the top of ceramic substrate body 1, can further dispel the heat to ceramic substrate body 1, can support ceramic substrate body 1 simultaneously.

The number of the heat conduction columns 10 is four, the four heat conduction columns 10 are distributed on the top of the heat dissipation plate 5 in a rectangular shape, and the thermal conductivity of the heat conduction columns 10 is larger than that of the ceramic substrate body 1.

The bar louvres 11 have been seted up to the inside of heating panel 5, and the quantity of bar louvre 11 has four, and four bar louvres 11 are the rectangle in the inside of heating panel 5 and distribute, are convenient for distribute the heat of ceramic substrate body 1 transmission.

The utility model discloses a theory of operation does: when the heat dissipation plate is used, firstly, the heat conduction block 3 connected to the heat dissipation plate 5 is clamped with the heat dissipation block 2 connected to the ceramic substrate body 1, so that the fixture block 7 in the installation groove of the heat conduction block 3 can be extruded by the heat dissipation block 2 and can move into the placement groove 13, so that the collision spring 6 is in a compression state, when the end part of the fixture block 7 moves to be on the same vertical line with the sliding groove 14, the fixture block 7 can move along the sliding groove 14 until moving to the position of the clamping groove 12, so that the fixture block 7 drives the fixture block 7 to reset under the resetting action of the collision spring 6, so that the fixture block 7 can be clamped with the clamping groove 12, heat generated by the work of an electrical element on the ceramic substrate body 1 is transmitted to the heat dissipation block 2 through the transverse heat dissipation strips 8 and the longitudinal heat dissipation strips 9, and then is transmitted to the heat dissipation plate 5 through the heat conduction block 3, the heat dissipation plate 5 can rapidly dissipate heat in the ceramic substrate body 1, heat around the ceramic substrate body 1 can also be transmitted to the heat dissipation plate 5 through the heat conduction columns 10, further dissipate heat of the ceramic substrate body 1 and heat dissipation plate 5 through the heat dissipation fins 4, and other heat dissipation plate 5, and the technical specifications of the heat dissipation plate are not described in the prior art.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a circuit ceramic substrate that heat-sinking capability is strong, includes ceramic substrate body (1), its characterized in that: the ceramic substrate body (1) is provided with a heat dissipation assembly;

the heat dissipation assembly comprises a heat dissipation block (2), a heat conduction block (3), a connecting part, heat dissipation fins (4) and a heat dissipation plate (5), wherein the heat dissipation block (2) is fixedly connected with the bottom of the ceramic substrate body (1), the heat conduction block (3) is connected with the heat dissipation block (2) through the connecting part, the top of the heat conduction block (3) is provided with an installation groove, the heat dissipation plate (5) is fixedly connected with the bottom of the heat conduction block (3), the heat dissipation fins (4) are fixedly connected with the top of the heat dissipation plate (5), and the tops of the heat dissipation fins (4) are contacted with the bottom of the ceramic substrate body (1);

adapting unit includes conflict spring (6) and fixture block (7), standing groove (13) have been seted up to the mounting groove inner wall, the one end and standing groove (13) inner wall fixed connection of conflict spring (6), the other end and fixture block (7) fixed connection of conflict spring (6), just draw-in groove (12) with fixture block (7) looks adaptation are seted up to the side of radiating block (2).

2. The circuit ceramic substrate with strong heat dissipation capability of claim 1, wherein: the clamping block (7) is movably arranged in the clamping groove (12), and a sliding groove (14) used for moving the clamping block (7) is formed in the side face of the heat dissipation block (2).

3. The circuit ceramic substrate with strong heat dissipation capability of claim 1, wherein: further comprising a heat conducting assembly comprising lateral heat dissipating strips (8) and longitudinal heat dissipating strips (9).

4. The circuit ceramic substrate with strong heat dissipation capability of claim 3, wherein: horizontal heat dissipation strip (8) and the bottom fixed connection of ceramic substrate body (1), the one end of vertical heat dissipation strip (9) and the side fixed connection of horizontal heat dissipation strip (8), the other end and radiating block (2) side fixed connection of vertical heat dissipation strip (9).

5. The circuit ceramic substrate with strong heat dissipation capability of claim 1, wherein: the top of the heat dissipation plate (5) is fixedly connected with a heat conduction column (10), and the top of the ceramic substrate body (1) is provided with a positioning groove matched with the heat conduction column (10).

6. The circuit ceramic substrate with strong heat dissipation capability of claim 5, wherein: the number of the heat conduction columns (10) is four, and the four heat conduction columns (10) are distributed on the top of the heat dissipation plate (5) in a rectangular shape.

7. The circuit ceramic substrate with strong heat dissipation capability of claim 1, wherein: the heat dissipation plate is characterized in that the heat dissipation plate (5) is internally provided with four strip-shaped heat dissipation holes (11), and the four strip-shaped heat dissipation holes (11) are distributed in a rectangular shape in the heat dissipation plate (5).