CN218160348U

CN218160348U - High heat conduction surface mounting discrete device packaging structure

Info

Publication number: CN218160348U
Application number: CN202222056274.5U
Authority: CN
Inventors: 朱文锋
Original assignee: Shenzhen Sanliansheng Technology Co ltd
Current assignee: Shenzhen Sanliansheng Technology Co ltd
Priority date: 2022-08-05
Filing date: 2022-08-05
Publication date: 2022-12-27
Anticipated expiration: 2032-08-05

Abstract

The utility model discloses a high heat conduction surface mounting discrete device packaging structure, which comprises a housin, three spouts have all been seted up to the two inner walls of the left and right sides of casing, and the three spouts of homonymy are vertical equidistance and distribute, three first slot has all been run through and has been seted up at both ends about the casing, the three first slot of homonymy is vertical equidistance and distributes, two corresponding spouts are removable mounting jointly and have the placement component, the discrete device is all fixed mounting in the upper end of three placement component, the clamping component is all movable mounting in the upper end of three discrete device, and the clamping component is equal with the area size of placement component, through setting up the placement component, reach the purpose of in time dispelling the heat, improve the life of discrete device; through setting up the centre gripping subassembly, reach the purpose of quick installation and demolish discrete device.

Description

High heat conduction surface mounting discrete device packaging structure

Technical Field

The utility model relates to a discrete device technical field of semiconductor, in particular to high heat conduction surface mounting discrete device packaging structure.

Background

As high performance computer and communication products are increasingly miniaturized, it is very important to reduce the board layout area. The design of DC-DC conversion applications faces issues of both increasing power density to save circuit board space and reducing thermal resistance.

Traditional surface mounting device relies on Printed Circuit Board (PCB) heat dissipation, and printed circuit board's substrate is hot bad conductor, is difficult to in time dispel the heat to the device, may lead to the serious problem that appears in the use, and simultaneously, after the encapsulation of current packaging structure is accomplished, is difficult to demolish the discrete device, influences maintenance and maintenance after the device damages. Therefore, a package structure of a high thermal conductivity surface mount discrete device is proposed.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides high heat conduction surface mounting discrete device packaging structure can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

high heat conduction surface mounting discrete device packaging structure, which comprises a housin, three spout has all been seted up to two inner walls about the casing, and the three spout of homonymy is vertical equidistance and distributes, both ends all run through and have seted up three first slot about the casing, the three of homonymy first slot is vertical equidistance and distributes, two corresponds the common demountable installation of spout has the subassembly of placing, and is three the equal fixed mounting in upper end of placing the subassembly has discrete device, and is three the equal movable mounting in upper end of discrete device has the centre gripping subassembly, and the area size of centre gripping subassembly and placing the subassembly equals.

Preferably, place the subassembly including placing the board, the equal fixed mounting in both ends has the slider about placing the board, the front end of placing the board runs through and has seted up the draw-in groove, fixed mounting has the fin in the draw-in groove, the upper end fixed mounting who places the board has the filter screen, the upper end of placing the board runs through and has seted up a plurality of louvre.

Preferably, the size of the radiating fin corresponds to that of the clamping groove, and the plurality of radiating holes are distributed in a rectangular shape with equal size.

Preferably, the size of the sliding block is equal to that of the sliding groove, and the upper end of the filter screen is fixedly connected with the discrete device.

Preferably, the centre gripping subassembly includes the grip block, the upper end fixed mounting of grip block has a plurality of spring, the second slot, two have all been seted up at both ends about the grip block the equal demountable installation of second slot has the picture peg.

Preferably, the size of the inserting plate corresponds looks adaptation, a plurality of with the size of second slot and first slot the spring is rectangle equidistance and distributes, the size of grip block equals with the size of discrete device.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the utility model discloses a set up and place the subassembly, the simultaneous action through fin and louvre makes the heat that discrete device produced distribute away in time, simultaneously because be separated by the filter screen between fin and the discrete device, can not directly act on the discrete device, can protect the normal use of discrete device, reaches the purpose of in time dispelling the heat, improving the life of discrete device;

2. the utility model discloses a set up the centre gripping subassembly, make the discrete device install in the upper end of placing the subassembly jointly through spring and grip block, prevent that it from falling out in the use accident, when the discrete device produces the damage, can in time take out it and maintain simultaneously, reach quick installation and demolish the purpose of discrete device.

Drawings

Fig. 1 is a schematic view of the overall structure of the packaging structure of the high thermal conductivity surface mount discrete device of the present invention;

fig. 2 is a schematic structural view of the package structure of the high thermal conductivity surface mount discrete device of the present invention;

fig. 3 is a schematic structural view of the placement component of the high thermal conductivity surface mount discrete device package structure of the present invention;

fig. 4 is the utility model discloses high heat conduction surface mounting discrete device packaging structure clamping component's schematic structure.

In the figure: 1. a housing; 2. placing the component; 3. a clamping assembly; 4. a discrete device; 11. a first slot; 12. a chute; 21. placing the plate; 22. a slider; 23. a card slot; 24. a heat sink; 25. heat dissipation holes; 26. a filter screen; 31. a clamping plate; 32. a spring; 33. a second slot; 34. and (4) inserting plates.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, high heat conduction surface mounting discrete device packaging structure, including casing 1, three spout 12 has all been seted up to two inner walls about casing 1, and the three spout 12 of homonymy is vertical equidistance and distributes, casing 1 all runs through at both ends about and has seted up three first slot 11, the three first slot 11 of homonymy is vertical equidistance and distributes, the common demountable installation of two spout 12 that correspond has place subassembly 2, the equal fixed mounting in upper end of three place subassembly 2 has discrete device 4, the equal movable mounting in upper end of three discrete device 4 has clamping component 3, and clamping component 3 equals with the area size of placing subassembly 2.

In this embodiment, the placing assembly 2 includes a placing plate 21, sliders 22 are fixedly mounted at both left and right ends of the placing plate 21, a slot 23 is formed through the front end of the placing plate 21, a heat sink 24 is fixedly mounted in the slot 23, a filter screen 26 is fixedly mounted at the upper end of the placing plate 21, a plurality of heat dissipation holes 25 are formed through the upper end of the placing plate 21, the size of the heat sink 24 corresponds to the size of the slot 23, the plurality of heat dissipation holes 25 are distributed in a rectangular shape with equal size, the size of the slider 22 is equal to the size of the chute 12, and the upper end of the filter screen 26 is fixedly connected with the discrete device 4; when placing subassembly 2 at discrete device 4, fin 24 plays main radiating effect, in time dredge the heat that discrete device 4 produced in work, place the lower extreme of board 21 in addition and seted up a plurality of louvre 25, play supplementary radiating effect, be connected through filter screen 26 between fin 24 and the discrete device 4, avoid fin 24 direct and discrete device 4 contact and influence discrete device 4's work efficiency, place subassembly 2 and through slider 22 and casing 1 demountable installation, high durability and convenient use, therefore, the clothes hanger is strong in practicability.

In this embodiment, the clamping assembly 3 includes a clamping plate 31, a plurality of springs 32 are fixedly mounted at the upper end of the clamping plate 31, second slots 33 are respectively formed at the left end and the right end of the clamping plate 31, two second slots 33 are detachably mounted with an inserting plate 34, the size of the inserting plate 34 is correspondingly matched with the size of the second slots 33 and the size of the first slot 11, the plurality of springs 32 are distributed in a rectangular shape at equal intervals, and the size of the clamping plate 31 is equal to the size of the discrete device 4; a plurality of spring 32 is installed to grip block 31's upper end, after discrete device 4 has been placed to the lower extreme as grip block 31, grip block 31 is by the jack-up, grip block 31 receives spring 32's effect to push down simultaneously, compress tightly discrete device 4, at this moment, second slot 33 corresponds each other with first slot 11's position, insert picture peg 34 between first slot 11 and the second slot 33, fix grip block 31, stabilize discrete device 4, when discrete device 4 needs maintenance, pull out picture peg 34, can take out discrete device 4, reach the mesh of in time maintaining discrete device 4.

It should be noted that, the utility model discloses a high heat conduction surface mounting discrete device packaging structure, in the use, at first place discrete device 4 in the upper end of placing subassembly 2, because a plurality of spring 32 is installed to the upper end of grip block 31, after discrete device 4 has been placed to the lower extreme of grip block 31, grip block 31 is by jack-up, grip block 31 receives the effect of spring 32 to push down simultaneously, compress tightly discrete device 4, at this moment, second slot 33 corresponds each other with first slot 11's position, insert between first slot 11 and the second slot 33 picture peg 34, fix grip block 31, stabilize discrete device 4, when discrete device 4 needs the maintenance, pull out picture peg 34, can take out discrete device 4, reach the purpose of in time maintaining discrete device 4, when discrete device 4 is placed on placing subassembly 2, fin 24 plays main radiating effect, in time dredge the heat that discrete device 4 produced in work, a plurality of louvre 25 has been seted up to the lower extreme of placing board 21 in addition, play the effect of supplementary heat dissipation, 24 and discrete device contact with discrete device 4 through discrete device 24, the slider is convenient for use the practicality is strong with discrete device 4 and is connected through discrete device contact efficiency 1, the detachable device 4, the convenience is avoided the practicality.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. High heat conduction surface mounting discrete device packaging structure, including casing (1), its characterized in that: three spout (12) have all been seted up to two inner walls about casing (1), and three spout (12) of homonymy are vertical equidistance and distribute, casing (1) about both ends all run through and have seted up three first slot (11), the three of homonymy first slot (11) are vertical equidistance and distribute, two correspond spout (12) common demountable installation has place subassembly (2), three the equal fixed mounting in upper end of placing subassembly (2) has discrete device (4), and is three the equal movable mounting in upper end of discrete device (4) has centre gripping subassembly (3), and centre gripping subassembly (3) and the area size of placing subassembly (2) equal.

2. The high thermal conductivity surface mount discrete device package structure as recited in claim 1, wherein: the placement component (2) comprises a placement plate (21), sliders (22) are fixedly mounted at the left end and the right end of the placement plate (21), a clamping groove (23) is formed in the front end of the placement plate (21) in a penetrating mode, cooling fins (24) are fixedly mounted in the clamping groove (23), a filter screen (26) is fixedly mounted at the upper end of the placement plate (21), and a plurality of cooling holes (25) are formed in the upper end of the placement plate (21) in a penetrating mode.

3. The high thermal conductivity surface mount discrete device package structure as recited in claim 2, wherein: the size of the radiating fin (24) corresponds to that of the clamping groove (23), and the radiating holes (25) are distributed in a rectangular shape with equal size.

4. The high thermal conductivity surface mount discrete device package structure as recited in claim 2, wherein: the size of the sliding block (22) is equal to that of the sliding groove (12), and the upper end of the filter screen (26) is fixedly connected with the discrete device (4).

5. The high thermal conductivity surface mount discrete device package structure as recited in claim 1, wherein: centre gripping subassembly (3) include grip block (31), the upper end fixed mounting of grip block (31) has a plurality of spring (32), second slot (33), two have all been seted up at both ends about grip block (31) equal demountable installation of second slot (33) picture peg (34).

6. The high thermal conductivity surface mount discrete device package structure as recited in claim 5, wherein: the size of picture peg (34) corresponds the looks adaptation with the size of second slot (33) and first slot (11), a plurality of spring (32) are the rectangle equidistance and distribute, the size of grip block (31) equals with the size of discrete device (4).