CN218647925U

CN218647925U - Radiating block and radiating structure of high-voltage plug-in MOS (metal oxide semiconductor) tube

Info

Publication number: CN218647925U
Application number: CN202223258332.9U
Authority: CN
Inventors: 王成功
Original assignee: Chengdu Fujin Power Semiconductor Technology Development Co ltd
Current assignee: Chengdu Fujin Power Semiconductor Technology Development Co ltd
Priority date: 2022-12-06
Filing date: 2022-12-06
Publication date: 2023-03-17
Anticipated expiration: 2032-12-06

Abstract

The utility model discloses a heat dissipation block and a heat dissipation structure of a high-voltage plug-in MOS tube, belonging to the technical field of testing, comprising a bottom plate, wherein two side plates are arranged on the bottom plate, cover plates are arranged on the two side plates, and the plug hole end of the MOS tube is arranged in the space formed by the bottom plate, the two side plates and the cover plates; the cover plate and the bottom plate are correspondingly provided with first through holes, and the jack on the jack end of the MOS tube and the two first through holes are positioned on the same axis. The plug-in type MOS tube jack end is mounted on the heat dissipation block and then can be directly mounted on the mainboard, so that the horizontal mounting of the plug-in type MOS tube is realized, and the design thickness of the whole board is greatly reduced; meanwhile, the MOS tube can conduct heat through the heat dissipation block, the heat dissipation efficiency is high, and the belly is exposed in the air, so that the heat dissipation is facilitated; the fixing of the three can be realized through the jack of MOS pipe, the through-hole reserved on the radiating block cooperation mainboard, compare in welded connection, the operation is simple and convenient more.

Description

Radiating block and radiating structure of high-voltage plug-in MOS (metal oxide semiconductor) tube

Technical Field

The utility model relates to a test technical field especially relates to a radiating block and heat radiation structure of high pressure plug-in components MOS pipe.

Background

In the design and manufacturing process of the PCBA, as part of devices such as MOSFET (metal oxide semiconductor field effect transistor) devices need to use high-voltage and high-current high-power models, the high-power devices generate extremely large heat during continuous operation, and the heat of the devices needs to be dissipated timely. The heat dissipation mode generally includes medium heat conduction, fan heat dissipation or water-cooling heat dissipation, and the heat dissipation can be realized only through medium heat conduction without installing a fan or a water-cooling main board.

Under the scene through medium heat conduction radiating, PCBA board designer generally can be with the MOS pipe of plug-in components formula as far as possible lectotype for the device of SMD encapsulation form, realizes MOS pipe and mainboard fixed connection through solder paste or glue to conduct the heat part that the device produced for the PCBA mainboard and then realize dispelling the heat fast, thereby reduce thermal gathering, avoid damaging the device that generates heat and device on every side. However, the device is directly soldered to the main board through the solder paste, and a bonding pad needs to be reserved on the surface of the PCB. Meanwhile, as the PCBA board is designed, the types of high voltage and large current are required to be adopted in part of the MOS tubes, and the selection of the SMD packaging form of the device is very rare, or no proper high-power SMD type exists, so that only the plug-in type MOS tube can be selected for circuit design in the device selection. The device has large heat productivity, and timely heat dissipation is difficult to realize. Because the PCBA board has a strict requirement on the thickness of the whole board, when auxiliary heat dissipation devices such as a fan and a water cooling mechanism are not allowed to be installed, an auxiliary heat dissipation block is required to be installed after a high-power MOS tube plug-in unit is installed, the thickness and the occupied space of the whole board are greatly increased, and the design requirement cannot be met.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's problem, provide a radiating block and heat radiation structure of high pressure plug-in components MOS pipe.

The purpose of the utility model is realized through the following technical scheme: a heat dissipation block of a high-voltage plug-in MOS tube comprises a bottom plate, wherein two side plates are arranged on the bottom plate, cover plates are arranged on the two side plates, and an MOS tube jack end is arranged in a space formed by the bottom plate, the two side plates and the cover plates; the cover plate and the bottom plate are correspondingly provided with first through holes, and the jack at the jack end of the MOS tube and the two first through holes are positioned on the same axis.

In one example, the height between the cover plate and the bottom plate is matched with the height of the pin end of the MOS tube.

In one example, the heat dissipation block is made of metal.

In one example, a supporting plate is arranged on the bottom plate, and second through holes are correspondingly arranged on the supporting plate and the bottom plate.

In one example, the bottom of the supporting plate is arranged to protrude from the bottom plate.

It should be further noted that, the technical features corresponding to the above-mentioned heat dissipation blocks can be combined with each other or replaced to form a new technical solution.

The utility model discloses still include a heat radiation structure of high pressure plug-in components MOS pipe, heat radiation structure includes that any above-mentioned example or a plurality of examples are constituteed and are formed the radiating block still includes the fixer, and the fixer is held the third through-hole on jack, the mainboard through first through-hole, MOS pipe jack and is realized MOS pipe, radiating block and mainboard fixed.

In one example, the fastener is a screw-and-nut type fastener.

In one example, the fixer comprises a screw and a connecting rod, a blind hole is formed in the connecting rod, and threads matched with the screw are arranged on the inner wall of the blind hole.

In one example, the connecting rod is a plastic connecting rod.

In one example, the bottom of the connecting rod is provided with a groove.

It should be further noted that, the technical features corresponding to the above-mentioned examples of the heat dissipation structure may be combined with each other or replaced to form a new technical solution.

Compared with the prior art, the utility model discloses beneficial effect is:

1. in one example, the plug-in type MOS tube jack end can be directly installed on the mainboard after being installed on the heat dissipation block, so that the horizontal installation of the plug-in type MOS tube is realized, and the design thickness of the whole board is greatly reduced; meanwhile, the MOS tube can conduct heat through the heat dissipation block, the heat dissipation efficiency is high, and the belly is exposed in the air, so that the heat dissipation is facilitated; the fixing of the three can be realized through the jack of MOS pipe, the through-hole reserved on the radiating block cooperation mainboard, compare in welded connection, the operation is simple and convenient more.

2. In one example, the height of the cover plate and the bottom plate is matched with that of the jack end, so that the height of the heat dissipation block and the height of the MOS tube are reduced to the greatest extent while the jack end is placed, and the flat design of the whole plate is realized.

3. In one example, the heat dissipation block made of metal has good heat conduction performance, is beneficial to heat dissipation of the high-voltage plug-in MOS tube, and ensures the working stability of the MOS tube.

4. In an example, the second through hole can further improve the connection stability between the heat dissipation block and the main board, and on the other hand, the first through hole can assist in positioning and matching with the main board.

5. In one example, the bottom of the supporting plate protrudes out of the bottom plate, the supporting plate is in contact connection with the main plate, and when the heat transfer of the medium is achieved, the heat is uniformly dissipated to the surrounding environment through the effective space between the heat dissipation block and the main plate.

6. In one example, the high-voltage plug-in MOS tube embedded in the radiating block is horizontally fixed on the main board through the fixer matched with the jack, the first through hole and the third through hole, so that the horizontal installation of the MOS tube is realized, and the design thickness of the whole board is greatly reduced; the main board, the MOS tube and the radiating block are fixed through the fixer, a welding pad is not required to be reserved, and the problems that other surrounding devices are damaged due to welding and the design reliability of the whole PCBA board is reduced are solved; simultaneously, compare in installing the MOS pipe on the radiating block, direct contact stress point is on MOS pipe and mainboard during screw locking, and the MOS pipe does not exist by high temperature and locking force and causes the risk of damage, the utility model discloses a with the intraductal embedding of MOS in the radiating block, the jack of device is only passed through, not atress, MOS pipe damage failure point produces, greatly reduced the risk of MOS pipe damage.

7. In one example, the main board, the MOS tube and the radiating block are fixed by adopting a screw-nut type structure or a fixer of a screw and connecting rod structure, so that the operation is simple, and the mounting stability is high.

8. In one example, the connecting rod is made of plastic, the hardness of the connecting rod is lower than that of a metal device or a main board, damage to the main board and the device can be reduced, and the reliability of the whole PCBA is guaranteed; meanwhile, the strength when the main board is screwed with the screw is correspondingly reduced, and the structural stress on the whole main board is reduced.

9. In one example, the groove is reserved at the bottom of the connecting rod, and an external tool such as a screwdriver abuts against the groove, so that the connecting rod can be prevented from rotating, and smooth implementation of fixing operation is facilitated.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention.

Fig. 1 is a schematic diagram of a MOS transistor according to an example of the present invention;

fig. 2 is a schematic view of a heat dissipation block according to an example of the present invention;

fig. 3 is a schematic view of a screw according to an example of the present invention;

fig. 4 is a schematic diagram of a connecting rod according to an example of the present invention.

In the figure: 11-a jack end; 12-abdomen; 13-pin; 21-a bottom plate; 22-side plate; 23-a cover plate; 24-a support plate; 25-a first via; 26-a second via; 31-a screw; 32-connecting rod.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are the directions or positional relationships indicated on the basis of the drawings, and are only for convenience of description and simplification of the description, but not for indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, ordinal words (e.g., "first and second," "first through fourth," etc.) are used to distinguish between objects, and are not limited to the order, but rather are to be construed to indicate or imply relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

In an example, as shown in fig. 1, the MOS transistor includes a socket end 11, a web 12, and pins 13, where the socket end 11 is provided with a socket, the web 12 is integrated with a chip, and the pins 13 are connected to other devices on a main board (PCB).

As shown in fig. 2, the heat dissipation block includes a bottom plate 21, two side plates 22 are disposed on the sides of the bottom plate 21, the two side plates 22 are connected through a cover plate 23, a space for accommodating the MOS tube pin hole end 11 is enclosed by the bottom plate 21, the two side plates 22 and the cover plate 23, and at this time, the MOS tube web 12 is exposed, which is beneficial to heat dissipation of the core plate in the web 12. Simultaneously, the heat that the chip produced in MOS pipe belly 12 still conducts through radiating block bottom plate 21, and preferred bottom plate 21 size combines the size adaptation of its jack end 11 with MOS pipe belly 12 to the at utmost is dispelled the heat through radiating block transmission to the mainboard, correspondingly, reserves the mounted position of radiating block on the mainboard, and preferred concrete size based on the radiating block reserves. Preferably, to further increase the heat dissipation efficiency of the chip in the MOS tube web 12, a heat dissipation medium, such as heat dissipation silicone grease, heat dissipation paste, or the like, is applied to the MOS tube web 12, preferably heat dissipation silicone grease.

In the example, the MOS tube jack end 11 is directly inserted between the bottom plate 21 and the cover plate 23 of the heat dissipation block (internally buckled inside the heat dissipation block, embedded installation), and then is directly fixed at the corresponding position of the mainboard, so that the horizontal installation of the plug-in MOS tube is realized, and the design thickness of the whole board is greatly reduced; meanwhile, the embedded design matched with the MOS tube jack end 11 enables the subsequent process manufacturing to be simpler, and meanwhile, the MOS tube and the mainboard are beneficial to accurate alignment. Furthermore, the MOS tube can be cooled through the cooling block and the cooling silicone grease, and the cooling efficiency is high.

Furthermore, the cover plate 23 and the bottom plate 21 are correspondingly provided with first through holes 25, and the two first through holes 25 and the plug hole on the mos transistor plug hole end 11 are located on the same axis, that is, the two first through holes 25 are aligned with the plug hole. The socket of the MOS tube, the first through hole 26 on the radiating block are matched with the through hole reserved on the mainboard and matched with the external fixer, so that the fixing of the socket, the radiating block and the external fixer can be realized, compared with welding, no welding pad needs to be reserved, the short circuit risk caused by tin throwing or flowing is avoided, surrounding devices are not easy to damage, and the fixing reliability is high; meanwhile, compared with welding or glue bonding, glue or tin paste does not need to be coated, waste of glue drying oven equipment for fixing the radiating block and baking time is reduced, the process flow is simplified, the operation is simpler and more convenient, and cost is greatly saved.

In an example, the bottom plate 21, the space formed by the two side plates 22 and the cover plate 23 is matched with the size and shape of the MOS tube jack end 11, namely, the space between the two side plates 22 is matched with the width of the MOS tube jack end 11, and the space between the cover plate 23 and the bottom plate 21 is matched with the height of the MOS tube jack end 11, so that the MOS tube jack end 11 is installed in the space formed by the bottom plate 21 and the two side plates 22 and the cover plate 23 in an embedded manner, the height of the heat dissipation block and the MOS tube is reduced to the greatest extent while the MOS tube jack end 11 is placed, the flat design of the whole plate is realized, and meanwhile, the bottom plate 21 can support the MOS tube, so that the MOS tube does not fall down, and an additional support jig is not needed.

In an example, the heat dissipation block is made of metal, that is, the bottom plate 21, the side plate 22 and the cover plate 23 are made of aluminum, and preferably made of aluminum, so that the heat dissipation block is low in price, light in weight, easy to machine, and good in heat conduction performance, and is beneficial to heat dissipation of the high-voltage plug-in MOS tube, and the working stability of the MOS tube is ensured. Of course, as an option, the bottom plate 21, the side plate 22 and the cover plate 23 may be made of different metal materials or other heat conductive materials.

In one example, the bottom plate 21 is provided with a support plate 24, and preferably, a support plate 24 is provided at the outer side of each of the two side plates 22, and the height of the support plate may be slightly higher than that of the side plates 22. The supporting plate 24 (at least one supporting plate) and the bottom plate 21 are correspondingly provided with second through holes 26, a fourth through hole is correspondingly reserved on the main plate at the moment, an external fixer such as a rivet penetrates through the second through hole 26 and the fourth through hole, secondary fixing of the main plate and the radiating block is realized, the connection stability between the radiating block and the main plate is improved, the radiating block can be ensured not to deviate under the condition of not using fixing glue, and surrounding devices are prevented from being damaged; on the other hand, the first through hole 25 and the main board can be assisted to be positioned and matched, and the positioning accuracy of the fixed matching is improved.

In an example, the bottom of the supporting plate 24 protrudes out of the bottom plate 21 (not shown in the figure), the bottoms of the two supporting plates 24 all protrude out of the bottom plate 21, only the supporting plate 24 is in contact connection with the main board at this time, the rest parts are hollow, the heat on the main board is conducted to the main board through the supporting plate 24, meanwhile, the heat generated by the MOS transistor is uniformly dissipated to the surrounding environment through the effective space between the heat dissipation block and the main board, and the influence of the heat directly guided to the main board to cause the excessive heating of the main board and the heating of other devices is reduced.

The above examples are combined to obtain the preferable example of the heat dissipation block of the present invention, each part of the heat dissipation block is made of metal, and includes a bottom plate 21, two side plates 22 are arranged on the bottom plate 21, a supporting plate 24 is respectively arranged outside the two side plates 22, the bottom of the supporting plate 24 protrudes out of the bottom plate 21, and second through holes 26 are correspondingly arranged on the supporting plate 24 and the bottom plate 21; cover plates 23 are arranged on the two side plates 22, and spaces formed by the bottom plate 21, the two side plates 22 and the cover plates 23 are matched with the MOS tube jack ends 11, so that the MOS tube jack ends 11 are embedded in the spaces; the cover plate 23 and the bottom plate 21 are correspondingly provided with first through holes 25, and the jacks on the MOS tube jack end 11 and the two first through holes 25 are positioned on the same axis. In the manufacturing process of the PCBA board, the MOS tube jack end 11 is inserted into a space formed by the bottom plate 21, the two side plates 22 and the cover plate 23, and jacks on the MOS tube jack end 11 and the two first through holes 25 are located on the same axis.

The invention also comprises a heat dissipation structure of the high-voltage plug-in MOS tube, which comprises the heat dissipation block formed in any example, and a fixer, such as a screw, a nut, a rivet and the like, wherein the fixer realizes the fixed connection of the MOS tube, the heat dissipation block and the mainboard through the first through hole 25, the jack on the MOS tube jack end 11 and the third through hole on the mainboard. In the example, the high-voltage plug-in MOS tube embedded in the radiating block is horizontally fixed on the main board through the fixer matched with the jack, the first through hole 25 and the third through hole, so that the horizontal installation of the MOS tube is realized, and the design thickness of the whole board is greatly reduced; the main board, the MOS tube and the radiating block are fixed through the fixer, a welding pad is not required to be reserved, and the problems that other surrounding devices are damaged due to welding and the design reliability of the whole PCBA board is reduced are solved; simultaneously, compare in installing the MOS pipe on the radiating block, direct contact stress point is on MOS pipe and mainboard when fixer locks, and the MOS pipe exists by high temperature and locking force cause the risk of damage, the utility model discloses an inlay in the radiating block with the MOS pipe, the jack of device is only passed through, does not receive the force, and MOS pipe damage failure point produces, greatly reduced the risk that the MOS pipe damaged.

In an example, as shown in fig. 3-4, the fastener is a screw nut type fastener, and includes a screw 31 and a connecting rod 32 (pin structure), a blind hole is formed in the connecting rod 32, and a thread adapted to the screw 31 is formed on an inner wall of the blind hole.

In one example, the connecting rod 32 is made of plastic, and the hardness of the connecting rod 32 is lower than that of a metal device or a main board, so that damage to the main board and the device can be reduced, and the reliability of the whole PCBA is ensured; meanwhile, the strength when the main board is screwed with the screw is correspondingly reduced, and the structural stress on the whole main board is reduced. Further, the screw 31 is the screw 31 of metal material, is connected with the connecting rod 32 of plastics material, can further promote fixed stability.

In an example, the bottom of the connecting rod 32 is provided with a groove, which may be a through groove penetrating through the connecting rod 32, the groove is adapted to a working surface (such as a screwdriver edge of a screw 31) of an external tool, the connecting rod 32 sequentially passes through the third through hole, the first through hole 25 on the bottom plate 21, the jack of the MOS transistor, and the first through hole 25 on the cover plate 23 from the bottom of the main plate, the upper portion is locked by using the metal screw 31, the groove is tightly abutted by the screw 31, the connecting rod 32 can be prevented from rotating, and smooth implementation of fixing operation is facilitated.

The above examples are combined to obtain a preferred example of the heat dissipation structure of the present invention, which includes a heat dissipation block and a holder, wherein the heat dissipation block is the heat dissipation block in the above preferred example. The fixer is of a screw and nut type structure and comprises a screw 31 and a connecting rod 32 (connecting rod 32), wherein a blind hole is formed in the connecting rod 32, and threads matched with the screw 31 are arranged on the inner wall of the blind hole. Wherein, the connecting rod 32 is a connecting rod 32 made of plastic, the screw 31 is a screw 31 made of metal, and the bottom of the connecting rod 32 is provided with a groove. In the manufacturing process of the PCBA, the MOS tube jack end 11 is inserted into a space formed by the bottom plate 21, the two side plates 22 and the cover plate 23, and jacks on the MOS tube jack end 11 and the two first through holes 25 are positioned on the same axis to form a combined structure; the combined structure is placed on the mainboard, the jack on the MOS tube jack end 11, the first through hole 25 and the third through hole on the mainboard are located on the same axis, the connecting rod 32 sequentially penetrates through the third through hole, the first through hole 25 on the bottom plate 21, the jack of the MOS tube and the first through hole 25 on the cover plate 23 from the bottom of the mainboard, the metal screw 31 is used on the upper portion of the connecting rod to realize the fixed locking of the third through hole, the first through hole 25 on the bottom plate 21 and the first through hole 25 on the cover plate 23, and the installation of the MOS tube on the mainboard is completed. The utility model discloses with the optional plug-in components formula MOS pipe application in PCBA manufacturing process in market, realize the design of formula cartridge that crouches to do and can in time dispel the heat and handle, and reduced the whole thickness of mainboard, reduce the use of specific equipment, improve manufacturing efficiency.

The above detailed description is the detailed description of the present invention, and it can not be considered that the detailed description of the present invention is limited to these descriptions, and to the ordinary skilled person in the art to which the present invention belongs, without departing from the concept of the present invention, a plurality of simple deductions and replacements can be made, which should be regarded as belonging to the protection scope of the present invention.

Claims

1. The utility model provides a radiating block of high pressure plug-in components MOS pipe which characterized in that: the MOS tube inserting hole end is arranged in a space formed by the bottom plate, the two side plates and the cover plate; the cover plate and the bottom plate are correspondingly provided with first through holes, and the jack on the jack end of the MOS tube and the two first through holes are positioned on the same axis.

2. The heat dissipation block of the high-voltage plug-in MOS tube as claimed in claim 1, wherein: the height between the cover plate and the bottom plate is matched with the height of the MOS tube jack end.

3. The heat dissipation block of the high-voltage plug-in MOS tube as claimed in claim 1, wherein: the radiating block is made of metal.

4. The heat dissipation block of the high-voltage plug-in MOS tube as claimed in claim 1, wherein: the bottom plate is provided with a supporting plate, and the supporting plate and the bottom plate are correspondingly provided with second through holes.

5. The heat dissipation block of the high-voltage plug-in MOS tube as claimed in claim 4, wherein: the bottom of the supporting plate protrudes out of the bottom plate.

6. The utility model provides a heat radiation structure of high pressure plug-in components MOS pipe which characterized in that: the heat dissipation block comprises the heat dissipation block as recited in any one of claims 1 to 4, and further comprises a fixer, wherein the fixer is used for fixing the MOS tube, the heat dissipation block and the main board through the first through hole, the jack at the jack end of the MOS tube and the third through hole on the main board.

7. The heat dissipation structure of claim 6, wherein: the fixer is of a screw and nut type structure.

8. The heat dissipation structure of claim 6, wherein: the fixer comprises a screw and a connecting rod, a blind hole is formed in the connecting rod, and threads matched with the screw are arranged on the inner wall of the blind hole.

9. The heat dissipation structure of claim 8, wherein: the connecting rod is made of plastic.

10. The heat dissipation structure of claim 8, wherein: the bottom of the connecting rod is provided with a groove.