CN216437559U - Circuit board that radiating effect is good - Google Patents
Circuit board that radiating effect is good Download PDFInfo
- Publication number
- CN216437559U CN216437559U CN202122725215.8U CN202122725215U CN216437559U CN 216437559 U CN216437559 U CN 216437559U CN 202122725215 U CN202122725215 U CN 202122725215U CN 216437559 U CN216437559 U CN 216437559U
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- Prior art keywords
- heat
- circuit board
- heat conduction
- radiating
- frame
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- 230000000694 effects Effects 0.000 title claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- 238000001816 cooling Methods 0.000 claims abstract description 25
- 239000002826 coolant Substances 0.000 abstract description 12
- 238000009434 installation Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a circuit board technical field's a circuit board that radiating effect is good, including frame and inner panel, the standing groove has been seted up at the top of frame, and the equal fixed mounting in four corners of standing groove inner chamber bottom has the card post, and the inside fixed mounting of frame has the heat conduction bottom plate, and the equal fixed mounting in both sides of frame has the heat conduction curb plate, and the opposite side intercommunication of heat conduction curb plate has the cooling tube, and the equal fixed mounting in one side of frame has the heat dissipation wing is kept away from to the heat conduction curb plate. The inside heat conduction bottom plate of frame can be transmitted through the heat conduction silk to its heat that produces when the inner panel moves, the heat conduction bottom plate then transmits the heat for the cooling pipe that its bottom contacted, the inside cooling agent of cooling pipe can absorb the heat, the cooling agent can absorb a large amount of heats, then transmit the heat for the heat conduction curb plate at both ends, then the heat conduction curb plate transmits the heat for the radiating fin that its both ends contacted with, the radiating fin is discharged the heat through inside first radiating groove and the second radiating groove of seting up, thereby the realization is effectively cooled down to the inner panel.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a circuit board that the radiating effect is good.
Background
The names of the circuit boards are as follows: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances. The circuit board can be called as a printed circuit board or a printed circuit board, an FPC circuit board and a rigid-flexible printed circuit board-the birth and development of FPC and PCB, and a new product of the rigid-flexible printed circuit board is promoted. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.
The circuit board radiating effect that uses on the existing market is poor for the circuit board temperature is too high after long-time work of circuit board, thereby makes the circuit board operation not smooth, makes mechanical operation unstable and produces huge harm, and the circuit board that uses on the market simultaneously operates for a long time under the high temperature and can make the life of this circuit board shorten greatly, thereby has reduced the practicality of general circuit board, for this we propose a circuit board that the radiating effect is good.
SUMMERY OF THE UTILITY MODEL
To the above problem, the utility model provides a circuit board that radiating effect is good has the good advantage of radiating effect.
The technical scheme of the utility model is that: the utility model provides a circuit board that radiating effect is good, includes frame and inner panel, the standing groove has been seted up at the top of frame, the equal fixed mounting in four corners of standing groove inner chamber bottom has the card post, the inside fixed mounting of frame has the heat conduction bottom plate, the equal fixed mounting in both sides of frame has the heat conduction curb plate, the opposite side intercommunication of heat conduction curb plate has the cooling tube, the equal fixed mounting in one side that the frame was kept away from to the heat conduction curb plate has the heat dissipation wing, the second radiating groove has been seted up to the inside of heat dissipation wing, first radiating groove has been seted up to the inside of heat dissipation wing, the louvre has all been seted up at the front and the back of frame, the card hole has all been seted up in the four corners of inner panel, the bottom fixed mounting of inner panel has the heat conduction silk.
The working principle of the technical scheme is as follows:
the inside at the standing groove at frame top is placed with the inner panel at first, the heat that its produced when the inner panel operation can transmit for the inside heat conduction bottom plate of frame through the conducting wire, the heat conduction bottom plate then transmits the heat for the cooling tube that its bottom contacted, the inside coolant of cooling tube can absorb the heat, the coolant can absorb a large amount of heats, then transmit the heat for the heat conduction curb plate at both ends, then the heat conduction curb plate transmits the heat for the radiating fin that its both ends contacted, the radiating fin is discharged the heat through inside first radiating groove and the second radiating groove of seting up, thereby realize effectively cooling to the inner panel, in addition, the louvre has all been seted up at the front and the back of frame, the louvre can prevent that the heat from piling up between frame and inner panel, accelerate the radiating rate.
In a further technical scheme, the specification size of the inner plate is matched with the specification size of the placing groove.
The inner panel can be placed in the inside of standing groove to the realization is installed the inner panel in the inside of frame, can improve the whole radiating rate of inner panel on the one hand, and on the other hand can protect the inner panel, prevents that the inner panel from receiving the impact damage.
In a further technical scheme, the specification size of the clamping column is matched with the specification size of the clamping hole, and the position of the clamping column corresponds to the position of the clamping hole.
The card post can the joint in the inside in card hole to with the inner panel spacing in the inside of frame, prevent that the inner panel from removing in the inside of frame, play and carry out spacing effect to the inner panel.
In a further technical scheme, the top of the heat conduction bottom plate is located inside the placing groove, and the bottom of the heat conduction bottom plate is in contact with the top of the cooling pipe.
The heat conduction bottom plate can transmit the received heat to the cooling pipe contacted with the bottom of the heat conduction bottom plate, the cooling agent in the cooling pipe can absorb the heat, and the cooling agent can absorb a large amount of heat.
In a further technical scheme, a functional assembly is fixedly mounted on the top of the inner plate.
The circuit board with different functions can be obtained by welding different functional components on the top of the inner plate.
In a further technical scheme, the two sides of the front surface and the back surface of the outer frame are fixedly provided with connecting blocks, the bottom of each connecting block is fixedly provided with a mounting bar, and threaded holes are formed in the two sides of each mounting bar.
The accessible is with bolt threaded connection in the inside of screw hole to the realization is installed circuit board wholly, and the installation rate is fast, and it is convenient to install.
In a further technical scheme, the second heat dissipation grooves and the first heat dissipation grooves are vertically staggered in the heat dissipation wings.
The second radiating grooves and the first radiating grooves which are vertically and alternately arranged can ensure the permeability inside the radiating wings, so that the radiating wings can effectively discharge heat, and the radiating effect is improved.
The utility model has the advantages that:
1. the heat generated by the inner plate during operation can be transmitted to the heat conduction bottom plate in the outer frame through the heat conduction wires, the heat conduction bottom plate then transmits the heat to the cooling pipes with the contacted bottoms, the cooling agent in the cooling pipes can absorb the heat, the cooling agent can absorb a large amount of heat, then the heat is transmitted to the heat conduction side plates at two ends, then the heat is transmitted to the heat dissipation wings with the contacted two ends by the heat conduction side plates, the heat dissipation wings discharge the heat through the first heat dissipation grooves and the second heat dissipation grooves which are formed in the heat dissipation wings, so that the inner plate is effectively cooled, in addition, heat dissipation holes are formed in the front side and the back side of the outer frame, the heat can be prevented from being accumulated between the outer frame and the inner plate through the heat dissipation holes, and the heat dissipation speed is accelerated;
2. the inner plate can be placed in the placing groove, so that the inner plate is installed in the outer frame, the overall heat dissipation speed of the inner plate can be improved, and the inner plate can be protected to prevent the inner plate from being damaged by impact;
3. the clamping column can be clamped in the clamping hole, so that the inner plate is limited in the outer frame, the inner plate is prevented from moving in the outer frame, and the effect of limiting the inner plate is achieved;
4. the heat conducting bottom plate can transmit the received heat to the cooling pipe contacted with the bottom of the heat conducting bottom plate, the heat can be absorbed by the cooling agent in the cooling pipe, and the cooling agent can absorb a large amount of heat;
5. different functional components can be welded on the top of the inner plate to obtain circuit boards with different functions;
6. the bolt is connected inside the threaded hole in a threaded manner, so that the circuit board can be integrally installed, and the circuit board is high in installation speed and convenient and fast to install;
7. the second radiating grooves and the first radiating grooves which are vertically and alternately arranged can ensure the permeability inside the radiating wings, so that the radiating wings can effectively discharge heat, and the radiating effect is improved.
Drawings
Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention;
fig. 2 is a schematic view of the overall bottom perspective structure of the embodiment of the present invention;
fig. 3 is a schematic partial perspective view of an embodiment of the present invention;
fig. 4 is a schematic view of a partial bottom view of an embodiment of the present invention;
fig. 5 is a front view structure diagram of the cooling pipe according to the embodiment of the present invention.
Description of reference numerals:
1. an outer frame; 2. an inner plate; 3. clamping the column; 4. a heat conducting side plate; 5. a heat dissipating fin; 6. connecting blocks; 7. heat dissipation holes; 8. a functional component; 9. mounting a bar; 10. a first heat sink; 11. a second heat sink; 12. a cooling pipe; 13. a placement groove; 14. a thermally conductive base plate; 15. a clamping hole; 16. heat conducting wires; 17. a threaded bore.
Detailed Description
The embodiments of the present invention will be further explained with reference to the drawings.
Example (b):
as shown in fig. 1-5, a circuit board with good heat dissipation effect, including outer frame 1 and inner panel 2, standing groove 13 has been seted up at the top of outer frame 1, the equal fixed mounting in four corners of standing groove 13 inner chamber bottom has card post 3, the inside fixed mounting of outer frame 1 has heat conduction bottom plate 14, the equal fixed mounting in both sides of outer frame 1 has heat conduction curb plate 4, the opposite side intercommunication of heat conduction curb plate 4 has cooling tube 12, the equal fixed mounting in one side that outer frame 1 was kept away from to heat conduction curb plate 4 has heat dissipation wing 5, second radiating groove 11 has been seted up to the inside of heat dissipation wing 5, first radiating groove 10 has been seted up to the inside of heat dissipation wing 5, louvre 7 has all been seted up at the front of outer frame 1 and the back, card hole 15 has all been seted up at the four corners of inner panel 2, the bottom fixed mounting of inner panel 2 has heat conduction silk 16.
The working principle of the technical scheme is as follows:
at first place the inside at the standing groove 13 at frame 1 top with inner panel 2, the heat that its produced can transmit for the inside heat conduction bottom plate 14 of frame 1 through conducting wire 16 when inner panel 2 moves, heat conduction bottom plate 14 then transmits the heat for the cooling tube 12 that its bottom contacted, the inside refrigerant of cooling tube 12 can absorb the heat, the refrigerant can absorb a large amount of heats, then transmit the heat for the heat conduction curb plate 4 at both ends, then heat conduction curb plate 4 transmits the heat for the radiating fin 5 that its both ends contacted, radiating fin 5 discharges the heat through inside first radiating groove 10 and the second radiating groove 11 of seting up, thereby realize effectively cooling to inner panel 2, in addition in the front of frame 1 and the back all seted up louvre 7, louvre 7 louvre can prevent that the heat from piling up between frame 1 and inner panel 2, accelerate the radiating rate.
In another embodiment, as shown in fig. 1 to 5, the specification of the inner panel 2 is adapted to the specification of the placing groove 13, the specification of the clipping column 3 is adapted to the specification of the clipping hole 15, and the position of the clipping column 3 corresponds to the position of the clipping hole 15.
In another embodiment, as shown in fig. 1-5, the top of the heat conducting bottom plate 14 is located inside the placing groove 13, and the bottom of the heat conducting bottom plate 14 is in contact with the top of the cooling pipe 12.
The heat conduction bottom plate 14 can transmit the received heat to the cooling pipe 12 with the bottom contacted, the cooling agent in the cooling pipe 12 can absorb the heat, and the cooling agent can absorb a large amount of heat.
In another embodiment, as shown in fig. 1 to 4, the functional module 8 is fixedly mounted on the top of the inner plate 2, the connecting blocks 6 are fixedly mounted on both sides of the front and back surfaces of the outer frame 1, the mounting bar 9 is fixedly mounted on the bottom of the connecting blocks 6, and the threaded holes 17 are formed in both sides of the mounting bar 9.
Can obtain the circuit board of different functions according to the functional component 8 of welding difference at the top of inner panel 2, the accessible is with bolt threaded connection in the inside of screw hole 17 to the realization is installed circuit board wholly, and the installation rate is fast, and it is convenient to install.
In another embodiment, as shown in fig. 1-4, the second heat dissipation grooves 11 are vertically staggered with the first heat dissipation grooves 10 inside the heat dissipation fins 5.
The second heat dissipation grooves 11 and the first heat dissipation grooves 10 which are vertically and alternately arranged can ensure the permeability inside the heat dissipation wing 5, so that the heat dissipation wing 5 can effectively discharge heat, and the heat dissipation effect is improved.
The above embodiments only express the specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention.
Claims (7)
1. The utility model provides a circuit board that radiating effect is good, includes frame (1) and inner panel (2), its characterized in that: a placing groove (13) is arranged at the top of the outer frame (1), clamping columns (3) are fixedly arranged at four corners of the bottom of an inner cavity of the placing groove (13), a heat-conducting bottom plate (14) is fixedly arranged in the outer frame (1), heat-conducting side plates (4) are fixedly arranged on both sides of the outer frame (1), the opposite side of the heat conduction side plate (4) is communicated with a cooling pipe (12), one side of the heat conduction side plate (4) far away from the outer frame (1) is fixedly provided with a radiating wing (5), a second radiating groove (11) is arranged inside the radiating wing (5), a first radiating groove (10) is arranged inside the radiating wing (5), the heat dissipation holes (7) are formed in the front and the back of the outer frame (1), the clamping holes (15) are formed in the four corners of the inner plate (2), and the heat conduction wires (16) are fixedly mounted at the bottom of the inner plate (2).
2. The circuit board with good heat dissipation effect according to claim 1, wherein: the specification and the size of the inner plate (2) are matched with those of the placing groove (13).
3. The circuit board with good heat dissipation effect according to claim 1, wherein: the specification and size of the clamping column (3) are matched with the specification and size of the clamping hole (15), and the position of the clamping column (3) corresponds to the position of the clamping hole (15).
4. The circuit board with good heat dissipation effect according to claim 1, wherein: the top of the heat conduction bottom plate (14) is positioned in the placing groove (13), and the bottom of the heat conduction bottom plate (14) is in contact with the top of the cooling pipe (12).
5. The circuit board with good heat dissipation effect according to claim 1, wherein: and a functional component (8) is fixedly mounted at the top of the inner plate (2).
6. The circuit board with good heat dissipation effect according to claim 1, wherein: the frame (1) is the equal fixed mounting in both sides at the front and the back has connecting block (6), the bottom fixed mounting of connecting block (6) has mounting bar (9), threaded hole (17) have all been seted up to the both sides of mounting bar (9).
7. The circuit board with good heat dissipation effect according to claim 1, wherein: the second radiating grooves (11) and the first radiating grooves (10) are vertically staggered in the radiating fins (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122725215.8U CN216437559U (en) | 2021-11-09 | 2021-11-09 | Circuit board that radiating effect is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122725215.8U CN216437559U (en) | 2021-11-09 | 2021-11-09 | Circuit board that radiating effect is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216437559U true CN216437559U (en) | 2022-05-03 |
Family
ID=81334965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122725215.8U Active CN216437559U (en) | 2021-11-09 | 2021-11-09 | Circuit board that radiating effect is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216437559U (en) |
-
2021
- 2021-11-09 CN CN202122725215.8U patent/CN216437559U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A circuit board with good heat dissipation effect Effective date of registration: 20230414 Granted publication date: 20220503 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2023420000161 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220503 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2023420000161 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A circuit board with good heat dissipation effect Granted publication date: 20220503 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2024980013795 |