CN215578521U - Radiating structure of chip packaging - Google Patents
Radiating structure of chip packaging Download PDFInfo
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- CN215578521U CN215578521U CN202121435806.5U CN202121435806U CN215578521U CN 215578521 U CN215578521 U CN 215578521U CN 202121435806 U CN202121435806 U CN 202121435806U CN 215578521 U CN215578521 U CN 215578521U
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Abstract
A chip packaging and radiating structure comprises a packaging shell, a heat conducting block, a refrigerating sheet, a micro mechanical pump, a fixed pipe, a diaphragm and a temperature sensing bulb; a silicon wafer is arranged in the packaging shell, the heat conduction block is arranged in the packaging shell, and the heat conduction block is sleeved with the spring tube; an inner cavity is arranged in the packaging shell, and one end of the spring tube is inserted into the inner cavity; the refrigeration piece is arranged on the packaging shell, the micro-mechanical pump is arranged in the packaging shell, and a first connecting pipe and a second connecting pipe are arranged at the input end of the micro-mechanical pump; the fixed pipe is arranged in the packaging shell, and a liquid inlet pipe of the fixed pipe is communicated with the second connecting pipe; a fixed block is arranged in the fixed pipe, a through hole is formed in the fixed block, a spring is arranged in the fixed pipe, a conical block is arranged at the other end of the spring, and a liquid outlet pipe of the fixed pipe is communicated with the other end of the spring pipe; the diaphragm is arranged in the fixed pipe, and a connecting rod is fixedly arranged on the diaphragm; the temperature sensing bulb is arranged in the packaging shell, and the other end of the third connecting pipe is inserted into the diaphragm. The utility model has the advantages of fast cooling and heat dissipation and stable structure.
Description
Technical Field
The utility model relates to the technical field of chip heat dissipation, in particular to a chip packaging heat dissipation structure.
Background
The encapsulation can be defined as: the semiconductor chip is connected with the conductor part in the frame or the substrate or the plastic sheet or the printed circuit board by using a membrane technology and a micro-connection technology so as to lead out a wiring pin, and the wiring pin is encapsulated and fixed by a plastic insulating medium to form the process technology of the integral three-dimensional structure. The device has the functions of circuit connection, physical support and protection, external field shielding, stress buffering, heat dissipation, excessive size and standardization.
According to the chip, the chip which is commonly used is not an exposed silicon wafer, but a micro system is formed after layer-by-layer packaging, when the chip works, the silicon wafer which really generates heat inside is wrapped by the packaging shell of the chip layer by layer, the main heat dissipation mode of the chip at present is that the heat dissipation fins are attached to the shell of the chip, the heat dissipation fins are cooled by liquid circulation or a fan blowing mode, the inside of the chip is cooled indirectly, the heat dissipation efficiency of the heat dissipation mode is low, and the power consumption is large.
SUMMERY OF THE UTILITY MODEL
Objects of the utility model
In order to solve the technical problems in the background art, the utility model provides a chip packaging and radiating structure which is high in cooling and radiating speed and efficiency, stable in structure and capable of prolonging the stable working time of a chip.
(II) technical scheme
The utility model provides a chip packaging and radiating structure which comprises a packaging shell, a heat conducting block, a refrigerating sheet, a micro-mechanical pump, a fixed pipe, a diaphragm and a temperature sensing bulb, wherein the heat conducting block is arranged on the packaging shell;
a silicon wafer is arranged in the packaging shell, the heat conduction block is arranged in the packaging shell, one end of the heat conduction block is in contact with the surface of the silicon wafer, and the heat conduction block is sleeved with the spring tube; an inner cavity is arranged in the packaging shell, and one end of the spring tube is inserted into the inner cavity; the refrigeration piece is arranged on the packaging shell, a heat-conducting plate is arranged at the refrigeration end of the refrigeration piece, and the heat-conducting plate is positioned in the inner cavity;
the micro-mechanical pump is arranged in the packaging shell, a first connecting pipe is arranged at the input end of the micro-mechanical pump, the other end of the first connecting pipe is inserted into the inner cavity, and a second connecting pipe is arranged at the output end of the micro-mechanical pump; the fixed pipe is arranged in the packaging shell, the input end of the fixed pipe is provided with a liquid inlet pipe, and the liquid inlet pipe is communicated with the other end of the second connecting pipe; a fixed block is arranged in the fixed pipe, a through hole is formed in the fixed block, a spring is arranged in the fixed pipe, a conical block is arranged at the other end of the spring, and the conical block is inserted into the through hole of the fixed block in a sliding manner; the output end of the fixed tube is provided with a liquid outlet tube which is communicated with the other end of the spring tube;
the diaphragm is arranged in the fixed pipe, the connecting rod is fixedly arranged on the diaphragm, and the other end of the connecting rod penetrates through the through hole of the fixed block and is connected with the conical block; the temperature sensing bulb is arranged in the packaging shell and is in contact with the surface of the silicon wafer; the temperature sensing bulb is provided with a third connecting pipe communicated with the inside of the temperature sensing bulb, and the other end of the third connecting pipe is inserted into the diaphragm.
Preferably, the package housing is provided with a plurality of pins, and the pins are inserted into the package housing and connected with the output end of the silicon wafer.
Preferably, the heat conducting plate is provided with a plurality of heat conducting fins.
Preferably, the inner cavity is filled with cooling liquid, and the heat conducting fins are inserted below the liquid level of the cooling liquid.
Preferably, a liquid feeding hole is formed in the packaging shell, and a detachable sealing cover is arranged in the liquid feeding hole.
Preferably, the heat dissipation end of the refrigeration piece is provided with a heat dissipation fin, and the joint of the heat dissipation fin and the refrigeration piece is coated with a layer of heat conduction silica gel.
Preferably, a temperature control switch is further arranged in the packaging shell, a sensing end of the temperature control switch is in contact with the outer surface of the silicon wafer, and the temperature control switch is electrically connected with the micro-mechanical pump.
Preferably, a limiting block is further arranged in the fixed pipe, and the connecting rod penetrates through the limiting block and is in sliding connection with the limiting block.
The technical scheme of the utility model has the following beneficial technical effects:
through the arrangement of the heat-conducting block and the spring tube, the heat generated by the silicon wafer is conducted out by the heat-conducting block, and the temperature of the silicon wafer is rapidly reduced through the low-temperature cooling liquid in the spring tube, so that the overall temperature of the chip is rapidly reduced, the cooling efficiency of the chip is improved, and the working time of the chip is prolonged; through the arrangement of the matching structure of the fixed pipe and the thermal bulb, the thermal bulb senses heat and pushes the connecting rod through the bulging of the diaphragm, so that the gap between the conical block and the fixed block is changed, the flow of the cooling liquid introduced into the spring pipe is increased, and the cooling efficiency is further improved; the utility model has high structural stability, is very practical and is suitable for popularization.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation structure of a chip package according to the present invention.
Fig. 2 is an enlarged view of a portion a of a heat dissipation structure of a chip package according to the present invention.
Reference numerals: 1. a package housing; 2. a silicon wafer; 3. a pin; 4. a heat conducting block; 5. a spring tube; 6. an inner cavity; 7. a refrigeration plate; 8. a heat conducting plate; 9. a heat conductive sheet; 10. a micro-mechanical pump; 11. a first connecting pipe; 12. a second connecting pipe; 13. a fixed tube; 14. a liquid inlet pipe; 15. a fixed block; 16. a spring; 17. a conical block; 18. a connecting rod; 19. a membrane; 20. a liquid outlet pipe; 21. a temperature sensing bulb; 22. and a third connecting pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-2, the chip package heat dissipation structure provided by the present invention includes a package housing 1, a heat conduction block 4, a refrigeration plate 7, a micro-mechanical pump 10, a fixed tube 13, a diaphragm 19, and a thermal bulb 21;
a silicon wafer 2 is arranged in the packaging shell 1, a heat conduction block 4 is arranged in the packaging shell 1, one end of the heat conduction block 4 is in contact with the surface of the silicon wafer 2, and a spring tube 5 is sleeved on the heat conduction block 4; an inner cavity 6 is arranged in the packaging shell 1, and one end of the spring tube 5 is inserted into the inner cavity 6; the refrigerating sheet 7 is arranged on the packaging shell 1, a heat conducting plate 8 is arranged on the refrigerating end of the refrigerating sheet 7, and the heat conducting plate 8 is positioned in the inner cavity 6;
the micro-mechanical pump 10 is arranged in the packaging shell 1, a first connecting pipe 11 is arranged at the input end of the micro-mechanical pump 10, the other end of the first connecting pipe 11 is inserted into the inner cavity 6, and a second connecting pipe 12 is arranged at the output end of the micro-mechanical pump 10; the fixed pipe 13 is arranged in the packaging shell 1, the input end of the fixed pipe 13 is provided with a liquid inlet pipe 14, and the liquid inlet pipe 14 is communicated with the other end of the second connecting pipe 12; a fixed block 15 is arranged in the fixed pipe 13, a through hole is formed in the fixed block 15, a spring 16 is arranged in the fixed pipe 13, a conical block 17 is arranged at the other end of the spring 16, and the conical block 17 is inserted into the through hole of the fixed block 15 in a sliding manner; a liquid outlet pipe 20 is arranged at the output end of the fixed pipe 13, and the liquid outlet pipe 20 is communicated with the other end of the spring pipe 5;
the diaphragm 19 is arranged in the fixed pipe 13, the connecting rod 18 is fixedly arranged on the diaphragm 19, and the other end of the connecting rod 18 penetrates through the through hole of the fixed block 15 and is connected with the conical block 17; the thermal bulb 21 is arranged in the packaging shell 1, and the thermal bulb 21 is in contact with the surface of the silicon wafer 2; the bulb 21 is provided with a third connection pipe 22 communicating with the inside thereof, and the other end of the third connection pipe 22 is inserted into the diaphragm 19.
In an alternative embodiment, a plurality of pins 3 are provided on the package housing 1, and the pins 3 are inserted into the package housing 1 and connected to the output terminals of the silicon wafer 2.
In an alternative embodiment, the heat-conducting plate 8 is provided with a plurality of heat-conducting fins 9; the contact area of the heat-conducting fins 9 and the cooling liquid is increased, so that the heat exchange efficiency between the cold end of the refrigerating fin 7 and the cooling liquid is improved.
In an alternative embodiment, the cavity 6 is filled with a cooling fluid and the heat-conducting fins 9 are inserted below the level of the cooling fluid.
In an optional embodiment, the packaging shell 1 is provided with a liquid feeding hole, and a detachable sealing cover is arranged in the liquid feeding hole; when the chip is maintained, cooling liquid can be injected into the inner cavity 6 through the liquid adding hole.
In an optional embodiment, the heat dissipation end of the refrigeration sheet 7 is provided with a heat dissipation fin, and a layer of heat-conducting silica gel is coated at the joint of the heat dissipation fin and the refrigeration sheet 7, so that the heat conduction efficiency is improved.
In an alternative embodiment, a temperature controlled switch is further disposed in the package housing 1, a sensing end of the temperature controlled switch contacts with an outer surface of the silicon wafer 2, and the temperature controlled switch is electrically connected to the micro-mechanical pump 10.
In an alternative embodiment, a limit block is further arranged in the fixed pipe 13, and the connecting rod 18 penetrates through the limit block and is connected with the limit block in a sliding manner; the stability of the sliding of the connecting rod is further improved.
In the utility model, when the temperature of the chip is high, the temperature control switch is automatically switched on, the micro-mechanical pump 10 starts to work, the refrigerating sheet 7 starts to work at the same time, the low temperature generated by the refrigerating sheet 7 is led out through the heat conducting plate 8 and the heat conducting sheet 9 and contacts with the cooling liquid, and the temperature of the cooling liquid is rapidly reduced; the micro mechanical pump 10 extracts low-temperature cooling liquid and injects the low-temperature cooling liquid into the spring tube 5, the low-temperature cooling liquid in the spring tube 5 exchanges heat with the heat conducting block 4, the temperature of the low-temperature cooling liquid is increased, and the temperature of the silicon wafer 2 is rapidly reduced; the high-temperature cooling liquid flows back into the inner cavity 6 and is cooled by the refrigerating sheet 7 again to enter circulation;
when the temperature of the chip changes, the temperature sensing bulb 21 senses the temperature change, the diaphragm 19 bulges along with the change of the temperature sensing bulb 21, so that the connecting rod 18 is pushed to move, the connecting rod 18 moves to drive the conical block 17 to move, the gap between the conical block 17 and the through hole in the fixed block 15 changes, and the flow rate of the cooling liquid is controlled.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the utility model and are not to be construed as limiting the utility model. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (8)
1. A chip packaging heat dissipation structure is characterized by comprising a packaging shell (1), a heat conduction block (4), a refrigerating sheet (7), a micro-mechanical pump (10), a fixed pipe (13), a diaphragm (19) and a temperature sensing bulb (21);
a silicon wafer (2) is arranged in the packaging shell (1), a heat conduction block (4) is arranged in the packaging shell (1), one end of the heat conduction block (4) is in contact with the surface of the silicon wafer (2), and a spring tube (5) is sleeved on the heat conduction block (4); an inner cavity (6) is arranged in the packaging shell (1), and one end of the spring tube (5) is inserted into the inner cavity (6); the refrigeration piece (7) is arranged on the packaging shell (1), a heat conduction plate (8) is arranged on the refrigeration end of the refrigeration piece (7), and the heat conduction plate (8) is positioned in the inner cavity (6);
the micro-mechanical pump (10) is arranged in the packaging shell (1), a first connecting pipe (11) is arranged at the input end of the micro-mechanical pump (10), the other end of the first connecting pipe (11) is inserted into the inner cavity (6), and a second connecting pipe (12) is arranged at the output end of the micro-mechanical pump (10); the fixed pipe (13) is arranged in the packaging shell (1), the input end of the fixed pipe (13) is provided with a liquid inlet pipe (14), and the liquid inlet pipe (14) is communicated with the other end of the second connecting pipe (12); a fixing block (15) is arranged in the fixing pipe (13), a through hole is formed in the fixing block (15), a spring (16) is arranged in the fixing pipe (13), a conical block (17) is arranged at the other end of the spring (16), and the conical block (17) is inserted into the through hole of the fixing block (15) in a sliding mode; a liquid outlet pipe (20) is arranged on the output end of the fixed pipe (13), and the liquid outlet pipe (20) is communicated with the other end of the spring pipe (5);
the diaphragm (19) is arranged in the fixed pipe (13), the connecting rod (18) is fixedly arranged on the diaphragm (19), and the other end of the connecting rod (18) penetrates through the through hole of the fixed block (15) and is connected with the conical block (17); the thermal bulb (21) is arranged in the packaging shell (1), and the thermal bulb (21) is in contact with the surface of the silicon wafer (2); the temperature sensing bulb (21) is provided with a third connecting pipe (22) communicated with the inside of the temperature sensing bulb, and the other end of the third connecting pipe (22) is inserted into the diaphragm (19).
2. The chip package heat dissipation structure according to claim 1, wherein the package housing (1) is provided with a plurality of pins (3), and the pins (3) are inserted into the package housing (1) and connected to the output terminals of the silicon wafer (2).
3. The heat dissipation structure of chip package according to claim 1, wherein the heat conducting plate (8) is provided with a plurality of heat conducting fins (9).
4. A heat sink structure for chip packaging according to claim 1 or 3, wherein the cavity (6) is filled with a cooling liquid, and the heat conducting plate (9) is inserted below the liquid level of the cooling liquid.
5. The heat dissipation structure for chip packaging according to claim 1, wherein the packaging case (1) is provided with a liquid feeding hole, and a detachable sealing cover is arranged in the liquid feeding hole.
6. The chip packaging heat dissipation structure according to claim 1, wherein heat dissipation fins are disposed on the heat dissipation end of the cooling fin (7), and a layer of heat conductive silica gel is coated on a joint of the heat dissipation fins and the cooling fin (7).
7. The chip packaging heat dissipation structure according to claim 1, wherein a temperature controlled switch is further disposed in the packaging case (1), a sensing end of the temperature controlled switch contacts with an outer surface of the silicon wafer (2), and the temperature controlled switch is electrically connected to the micro-mechanical pump (10).
8. The heat dissipation structure for chip packaging according to claim 1, wherein a limiting block is further disposed in the fixing tube (13), and the connecting rod (18) passes through the limiting block and is slidably connected thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121435806.5U CN215578521U (en) | 2021-06-25 | 2021-06-25 | Radiating structure of chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121435806.5U CN215578521U (en) | 2021-06-25 | 2021-06-25 | Radiating structure of chip packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215578521U true CN215578521U (en) | 2022-01-18 |
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ID=79821004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121435806.5U Active CN215578521U (en) | 2021-06-25 | 2021-06-25 | Radiating structure of chip packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215578521U (en) |
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2021
- 2021-06-25 CN CN202121435806.5U patent/CN215578521U/en active Active
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