CN105281198A - Semiconductor laser device heat management device - Google Patents
Semiconductor laser device heat management device Download PDFInfo
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- CN105281198A CN105281198A CN201410239521.2A CN201410239521A CN105281198A CN 105281198 A CN105281198 A CN 105281198A CN 201410239521 A CN201410239521 A CN 201410239521A CN 105281198 A CN105281198 A CN 105281198A
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Abstract
The invention relates to a semiconductor laser device heat management device comprising a convection heat exchange module (2) filled with low-melting-point metal (3). Heat transfer between a semiconductor laser device (0) and the convection heat exchange module (2) is realized via an expansion matching and heat conducting layer (1). The convection heat exchange module (2) absorbs heat and then temperature rises, and heat radiation is performed via a high-heat-conductivity metal shell (200) and low-melting-point metal (3). Device aging and corrosion caused by long-term operation in water circulation operation when micro-channel water cooling is adopted can be avoided based on the structure; meanwhile, the problems that water quality and pipelines require to be strictly controlled and water requires to be periodically changed can be solved, cooling efficiency is greatly enhanced, the device size and system noise are reduced and device reliability and stability are enhanced. The semiconductor laser device heat management device can be applied to the semiconductor laser device, especially to the field of heat management of high-average-power semiconductor laser arrays.
Description
Technical field
The present invention relates to the thermal management technology field of semiconductor laser, particularly relate to a kind of heat management device of semiconductor laser of high heat flux.
Background technology
The cooling means of current semiconductor laser is broadly divided into radiation heat transfer, conduction heat exchange and heat convection three major types.Radiation heat transfer is mainly for the lower application of density of heat flow rate; Conduction heat exchange then realizes mainly through modes such as heat sink, thermoelectric cooling modules (TEC), and the heat exchange of density of heat flow rate relative radiation is slightly high; Heat convection then mainly utilizes the fluid such as gas, liquid, as utilized fan forced convection air and air-cooled moderate fever current density heat dissipation technology for representative and taking channel water-cooling as the high heat flux heat dissipation technology of representative.
Adopt phase-change heat-exchange mode to drain hot quantifier elimination also extensively to carry out.Compared with single-phase heat transfer or heat conduction, adopt working medium needed for phase-change heat transfer method few, have Heat transmission amount large, heat transfer efficiency high, therefore can reduce weight and volume.It is represented as hot pipe technique, its major way using phase transformation (evaporation and condensation) heat exchange as heat transfer, have temperature control capability strong, the features such as high heat flux heat radiation can be solved, the application in the heat radiation of computer components and parts draws attention.
A remarkable trend of current semiconductor Development of Laser Technology is the continuous lifting of average power, thing followed major issue how to carry out effective heat management to semiconductor laser (LD) system, is namely promptly to be fallen apart by the high heat that LD produces.Find that to have the heat dissipating method that High Efficiency Thermal transports usefulness be the target that people pursue for many years always.
Because optical semiconductor volume is general less, adopt array structure at present, component compact requires only to allow to retain limited cooling space, and therefore for high-power LD, than radiation heat transfer, the heat exchange mode that conduction adds convection current has more advantage more in addition.And the micro-channel heat sink cooling scheme common scheme especially in heat convection.As mainstream technology microchannel water-cooling project, some restrictions that own characteristic brings.First, (0.6W.m is only using water as hot working fluid conductance is lower
-1.K
-1), limit its heat exchange coefficient in microchannel; Second, in water circulation is run, long-term running can cause device aging, corrosion, thus cause the requirement for water quality and flow duct higher, in addition there is strict restriction to electrical conductivity of water in part microchannel water-cooling structure, therefore, need to carry out strict control to electrical conductivity of water and need often to change; 3rd, because the thermal conductivity of water is not high, cause cooling effectiveness to be restricted, need in the unit interval with larger flow to be derived by heat, complex structure is unfavorable for equipment miniaturization; 4th, utilize water-cooling pattern only to drive by mechanical pump, the noise of plant running is comparatively large, is ensure system reliability, must adopts split-type design, therefore to device volume conditional application scenario difficulties.
And heat pipe is as the type of cooling of phase-change heat transfer, although the higher hot-fluid transfer flux of relative monophasic fluid can be reached, its manufacture craft as core material preparation, working medium encapsulation, to safeguard and reliability etc. still awaits improving.
Low-melting-point metal is as flow working medium for computer chip and semiconductor light-emitting-diode (LED) chip cooling, and recent years have been used among the heat management of nuclear reactor and accelerator.By this Technology application in the heat management of semiconductor laser, to must solve the problem of microchannel cooling and semiconductor laser hot interface.Due to liquid metal good conductivity, be directly used in the microchannel cooling that laser folds battle array or face battle array entirety, be easy to the short circuit causing device; And be subject to by distributed cooling the heat radiation difficulty that area constraints is difficult to solve high power array structure, although so up till now those skilled in the art make great efforts the heat management device failing to realize being directly used in semiconductor laser and array structure thereof always.
Summary of the invention
(1) technical problem that will solve
The technical problem to be solved in the present invention is exactly the heat management device how providing a kind of semiconductor laser, when avoiding adopting microchannel water-cooled, in water circulation is run, long-term running causes device aging, corrosion, thus it is higher to the requirement of flow duct and water quality and conductivity etc., and often need change flow working medium, solution cooling effectiveness is not high, noise large, and complex structure is unfavorable for the problem of equipment miniaturization.
(2) technical scheme
In order to solve the problems of the technologies described above, the invention provides a kind of heat management device of semiconductor laser, it is characterized in that, comprise the well-matched CTE heat-conducting layer that one side is connected with semiconductor laser, the another side of well-matched CTE heat-conducting layer and heat convection model calling;
Melting range is had from the low-melting-point metal of-10 DEG C ~ 60 DEG C in heat convection module;
Heat convection module comprises thermal conductivity >100W.m
-1.K
-1high heat conductivity metal shell.
Preferably, heat convection module is by pipeline and external cooling model calling;
Melting range is had from the low-melting-point metal of-10 DEG C ~ 60 DEG C in described heat convection module, pipeline, external cooling module;
The closed-loop path of described heat convection module, pipeline, external cooling module generation circulation;
Liquid metal in heat convection module, pipeline, external cooling module is driven by driving pump, and driving pump is mechanical pump, or electromagnetic pump, or centrifugal pump, or the combination in any of above-mentioned several pump.
Preferably, heat convection model calling has radiating fin, or is connected with air cooling module, or is connected with auxiliary electrical refrigerating/heating device, or be connected with the heat sink of heat convection, or be connected with radiating fin, air cooling module, auxiliary electrical refrigerating/heating device, heat sink combination in any;
The heat sink geometry of described heat convection is by weld layer/heat-conducting glue coating and well-matched CTE heat-conducting layer compact siro spinning technology.
The composition of described metal shell is gold, silver, copper, aluminium.
Preferably, the heat sink geometry of described heat convection is annular seal space, or single channel or multiplexer channel, or Micro Channel Architecture;
Be filled with low-melting-point metal in the heat sink geometry of described heat convection, heat convection mode comprises free convection, forced convertion.
Preferably, the liquid metal heat exchanger in heat convection module and external cooling module carries out UNICOM by pipeline, and pipeline is the flexible duct made by plastics, or the Hard link pipeline that aluminium, copper or silver or glass are made.
Preferably, external cooling module comprises liquid metal heat exchanger;
Wherein liquid metal heat exchanger composition comprises: plate heat exchanger or pipe heat exchanger or finned heat exchanger.
Preferably, liquid metal heat exchanger JA(junction ambient) heat exchanger components, or refrigerating/heating unit, or simultaneously JA(junction ambient) heat exchanger components and refrigerating/heating unit;
Wherein environment heat exchanger components composition comprises: conduct heat sink or radiation heat transfer sheet or plate heat exchanger or pipe heat exchanger or finned heat exchanger or air-cooled or water cooling heat exchanger or said units combination in any;
Refrigerating/heating unit comprises: air cooling module or water-filled radiator or by the refrigerating/heating unit of refrigerant or the combination in any of said units.
Preferably, described external cooling module comprises temperature sensor, insulating box, feedback control circuit, by controlling heat exchange rate, keeps liquid metal to get back to the temperature constant at heat convection module place.
Preferably, the initial condition of described low-melting-point metal is liquid, solid-state, or solid-liquid mixing; Its composition is low-melting-point metal simple substance, or the mixture of various metals;
Phase-change heat-exchange is realized by the phase transition process of low-melting-point metal.
Preferably, described well-matched CTE heat-conducting layer is by diamond, or metal oxide, or metal nitride, or the sheet of nonmetal and compound composition or the thermal conductive insulator of lath-shaped or membrane structure.
(3) beneficial effect
The heat management device of a kind of semiconductor laser of the present invention, comprise the heat convection module that circulation has low-melting-point metal, heat transmission is realized by well-matched CTE heat-conducting layer between semiconductor laser and heat convection module, after heat convection module absorbs heat, temperature raises, and is dispelled the heat by high heat conductivity metal shell and low-melting-point metal.By adopting above structure, avoid adopt microchannel water-cooled time, water circulation run in operate for a long time cause device aging, corrosion, solve the requirement of microchannel water-cooled to flow duct higher; Well-matched CTE heat-conducting layer also adopts insulation system, liquid heat conductance need not be controlled, thus water quality is carried out to the problem of strict control, and because low-melting-point metal thermal conductivity is much larger than water, increase substantially cooling effectiveness, and electromagnetic pump can be adopted to drive, mechanical parts, thus significantly can reduce noise, enhance the reliability and stability of device.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1: the heat management device comprising a kind of semiconductor laser of external cooling module provided by the invention;
Fig. 2: the heat management device comprising a kind of semiconductor laser of radiating fin and air cooling module provided by the invention;
Fig. 3: the heat management device comprising a kind of semiconductor laser of auxiliary electrical refrigerating/heating device provided by the invention;
In figure: 0, semiconductor laser; 1, well-matched CTE heat-conducting layer; 2, heat convection module; 200, high heat conductivity metal shell; 201, radiating fin; 202, air cooling module; 203, auxiliary electrical refrigerating/heating device; 204, heat sink; 205, weld layer/heat-conducting glue coating; 3, low-melting-point metal; 4, pipeline; 5, external cooling module; 501, liquid metal heat exchanger; 502, refrigerating/heating unit; 503, environment heat exchanger components; 504, temperature sensor; 505, insulating box; 506, feedback control circuit; 6, driving pump.
Embodiment
Below in conjunction with drawings and Examples, embodiments of the present invention are described in further detail.Following examples for illustration of the present invention, but can not be used for limiting the scope of the invention.
Embodiment 1, as shown in Figure 1, the heat management device of a kind of semiconductor laser that the present embodiment provides, comprise the well-matched CTE heat-conducting layer 1 that one side is connected with semiconductor laser 0, the another side of well-matched CTE heat-conducting layer 1 is connected with heat convection module 2; Heat convection module 2 comprises high heat conductivity metal shell 200.Heat convection module 2 is connected with external cooling module 5 by pipeline 4; In described heat convection module 2, pipeline 4, external cooling module 5, circulation has low-melting-point metal 3; Described heat convection module 2, pipeline 4, external cooling module 5 form the closed-loop path of circulation.
The heat that semiconductor laser 0 produces is transmitted in heat convection module 2 through well-matched CTE heat-conducting layer 1, because LD adopts high-power diode array composition face-pumping structure, and higher (the about 100W/cm of density of heat flow rate
2), therefore adopt the heat loss through convection module 2 of large discharge, with efficient outer loop radiating module 5, heat is exported to device outside.
The well-matched CTE heat-conducting layer 1 of bottom is made up of heat-conducting metal copper sheet and heat conductive insulating silicon chip; Heat convection module 2 comprises the high heat conductivity metal shell 200 be made up of the oxygen-free copper of high heat conductance, by weld layer and well-matched CTE heat-conducting layer 1 compact siro spinning technology of golden tin solder.
High heat conductivity metal shell 200 is made up of red copper; Comprise the oxygen-free copper heat sink (204) of Micro Channel Architecture, be filled with low-melting-point metal 3 in Micro Channel Architecture, described low-melting-point metal 3 is the alloy of gallium, indium, tin three kinds of metal compositions, mass percent is: 62.8%Ga, 21.3%In, with 15.9%Sn, the fusing point of alloy is about 11 DEG C.Connecting heat convection module 2 with the pipeline 4 of external cooling module 5 is the flexible ducts made by plastics, and the present embodiment adopts electromagnetic pump to drive external cooling module 5 as driving pump 6, in device without any mechanical component, thus without wearing and tearing, low noise; For realizing the accuracy of temperature control requirement of 0.1 degree, the heat that semiconductor laser produces is through heat convection module 2, pipeline 4, directly be transferred in liquid metal heat radiation device 501, it is plate heat exchanger structure in the present embodiment, carry out exchange heat wherein with by refrigerant (model R410a), heat exports to refrigerating/heating element 502 through refrigerant, and final heat is directed in external environment condition by environment heat exchanger components 503.
In the present embodiment, within the duct 4, insulating box 505 is set, in insulating box 505, is placed with temperature sensor 504, by temperature signal real-time Transmission to feedback control circuit 506, then control the flow velocity of electromagnetic pump 6 and the refrigeration work consumption of refrigerating/heating element 502 by feedback control circuit 506; To ensure the stable of liquid metal temperature in insulating box 505.
Wherein in the present embodiment, refrigerating/heating element 502 is compression refigerating machine, identical with associated components structure in existing laser water cold, comprises evaporator, compressor, condenser, and the element such as ducted dual pressure controller, expansion valve.
Embodiment 2, as shown in Figure 2, the heat management device of a kind of semiconductor laser that the present embodiment provides, comprise the well-matched CTE heat-conducting layer 1 that one side is connected with semiconductor laser 0, the another side of well-matched CTE heat-conducting layer 1 is connected with heat convection module 2;
In heat convection module 2, circulation has low-melting-point metal 3;
Heat convection module 2 comprises high heat conductivity metal shell 200.
In the present embodiment, well-matched CTE heat-conducting layer 1 is diamond heat-conducting film, be connected by weld layer between diamond heat-conducting film with semiconductor laser 0, the heat that semiconductor laser 0 produces is transmitted in heat convection module 2 through diamond heat-conducting film and weld layer, because LD is high power single bar structure, due to density of heat flow rate higher (about 100W/cm2), therefore low-melting-point metal 3 adopts gallium to form, and the fusing point of gallium is 29.8 DEG C.Liquid metal gallium as the good conductor of heat, rapidly by heat conduction to the oxygen-free copper shell of heat loss through convection module 2, and radiating fin 201 place of the oxygen-free copper of outside, high heat conductivity metal shell 200 top, by weld layer, is connected with diamond heat-conducting film.Because total amount of heat is not high, the present embodiment adopts fan as air cooling module 202, utilizes the air of flowing, takes away the heat brought out through high heat conductivity metal shell 200 and radiating fin 201.
Embodiment 3, as shown in Figure 3, the heat management device of a kind of semiconductor laser that the present embodiment provides, comprise the well-matched CTE heat-conducting layer 1 that one side is connected with semiconductor laser 0, the another side of well-matched CTE heat-conducting layer 1 is connected with heat convection module 2;
In heat convection module 2, circulation has low-melting-point metal 3;
Heat convection module 2 comprises high heat conductivity metal shell 200.
In the present embodiment, semiconductor laser 0 adopts intermittent running, low-melting-point metal 3 is gallium, heat is after well-matched CTE heat-conducting layer 1 is transmitted to high heat conductivity metal shell 200, and the heat that metal shell 200 absorbs is absorbed by low-melting-point metal gallium, and it is solid-liquid mixing by Solid State Transformation simultaneously.The latent heat of a large amount of hot-cast socket needed for phase transformation, maintains the temperature constant of system simultaneously.And high heat conductivity metal shell 200 is connected by auxiliary electrical refrigerating/heating device with the external world, auxiliary electrical refrigerating/heating device 203 in the present embodiment is the thermoelectric refrigerating unit TEC based on paltie effect, is led outside auto levelizer by heat by TEC in the intermittent phase of bright dipping by high heat conductivity metal shell 200 inside.Realize the reset of system.The face of high heat conductivity metal shell 200 except contacting with LD, all the other each all adopts TEC to be derived by heat, greatly extends area of dissipation, maintain the small size of system simultaneously.The present embodiment stores the heat absorbed by latent heat of phase change, thus the compactedness of further lifting device.
Above embodiment is the liquid metal of low melting point due to what adopt operation material, need not as water-cooling project frequent replacing water and filter core, in case blocking channel, select suitable material by pipeline and heat exchanger inwall, therefore can substantially accomplish non-maintaining.Heat-sinking capability is strong, and the liquid metal thermal conductivity of use is high, and viscosity is low, and heat exchange efficiency is high, thus can reduce flows per unit time, thus is conducive to the miniaturization at identical refrigeration work consumption lower device.
Above execution mode is only for illustration of the present invention, but not limitation of the present invention.Although with reference to embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, various combination, amendment or equivalent replacement are carried out to technical scheme of the present invention, do not depart from the spirit and scope of technical solution of the present invention, all should be encompassed in the middle of right of the present invention.
Claims (10)
1. the heat management device of a semiconductor laser, it is characterized in that, comprise the well-matched CTE heat-conducting layer (1) that one side is connected with semiconductor laser (0), the another side of well-matched CTE heat-conducting layer (1) is connected with heat convection module (2);
Melting range is had from the low-melting-point metal (3) of-10 DEG C ~ 60 DEG C in heat convection module (2);
Heat convection module (2) comprises thermal conductivity >100W.m
-1.K
-1high heat conductivity metal shell (200).
2. the heat management device of semiconductor laser according to claim 1, is characterized in that, heat convection module (2) is connected with external cooling module (5) by pipeline (4);
Melting range is had from the low-melting-point metal (3) of-10 DEG C ~ 60 DEG C in described heat convection module (2), pipeline (4), external cooling module (5);
Described heat convection module (2), pipeline (4), external cooling module (5) form the closed-loop path of circulating;
Liquid metal (3) in heat convection module (2), pipeline (4), external cooling module (5) is driven by driving pump (6), driving pump (6) is mechanical pump, or electromagnetic pump, or centrifugal pump, or the combination in any of above-mentioned several pump.
3. the heat management device of semiconductor laser according to claim 1, it is characterized in that, heat convection module (2) is connected with radiating fin (201), or be connected with air cooling module (202), or be connected with auxiliary electrical refrigerating/heating device (203), or be connected with heat sink (204) of heat convection, or be connected with the combination in any of radiating fin (201), air cooling module (202), auxiliary electrical refrigerating/heating device (203), heat sink (204);
The geometry of heat sink (204) of described heat convection is by weld layer/heat-conducting glue coating (205) and well-matched CTE heat-conducting layer (1) compact siro spinning technology.
The composition of described metal shell (200) is gold, silver, copper, aluminium.
4. the heat management device of semiconductor laser according to claim 3, is characterized in that, the geometry of heat sink (204) of described heat convection is annular seal space, or single channel or multiplexer channel, or Micro Channel Architecture;
Be filled with low-melting-point metal (3) in the geometry of heat sink (204) of described heat convection, heat convection mode comprises free convection, forced convertion.
5. the heat management device of semiconductor laser according to claim 2, it is characterized in that, heat convection module (2) carries out UNICOM with the liquid metal heat exchanger (500) in external cooling module (5) by pipeline (4), pipeline (4) is the flexible duct made by plastics, or aluminium, copper or silver or the Hard link pipeline made of glass.
6. the heat management device of semiconductor laser according to claim 2, is characterized in that, external cooling module (5) comprises liquid metal heat exchanger (501);
Wherein liquid metal heat exchanger (501) composition comprises: plate heat exchanger or pipe heat exchanger or finned heat exchanger.
7. the heat management device of semiconductor laser according to claim 6, it is characterized in that, liquid metal heat exchanger (501) JA(junction ambient) heat exchanger components (503), or refrigerating/heating unit (502), or simultaneously JA(junction ambient) heat exchanger components (503) and refrigerating/heating unit (502);
Wherein environment heat exchanger components (503) composition comprises: conduct heat sink or radiation heat transfer sheet or plate heat exchanger or pipe heat exchanger or finned heat exchanger or air-cooled or water cooling heat exchanger or said units combination in any;
Refrigerating/heating unit (502) comprising: air cooling module or water-filled radiator or by the refrigerating/heating unit of refrigerant or the combination in any of said units.
8. the heat management device of semiconductor laser according to claim 2, it is characterized in that, described external cooling module (5) comprises temperature sensor (504), insulating box (505), feedback control circuit (506), by controlling heat exchange rate, liquid metal is kept to get back to the temperature constant at heat convection module (2) place.
9. the heat management device of semiconductor laser as claimed in any of claims 1 to 8, is characterized in that, the initial condition of described low-melting-point metal (3) is liquid, solid-state, or solid-liquid mixing; Its composition is low-melting-point metal simple substance, or the mixture of various metals;
Phase-change heat-exchange is realized by the phase transition process of low-melting-point metal.
10. the heat management device of semiconductor laser as claimed in any of claims 1 to 8, it is characterized in that, described well-matched CTE heat-conducting layer (1) is by diamond, or metal oxide, or metal nitride, or the sheet of nonmetal and compound composition or the thermal conductive insulator of lath-shaped or membrane structure.
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| CN201410239521.2A CN105281198A (en) | 2014-05-30 | 2014-05-30 | Semiconductor laser device heat management device |
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| CN105578850A (en) * | 2016-03-15 | 2016-05-11 | 哈尔滨工业大学 | Magnetic fluid micro-channel thermal control system of microsatellite standalone |
| CN105932525A (en) * | 2016-05-11 | 2016-09-07 | 深圳市酷凌时代科技有限公司 | Portable laser cooling and power supply apparatus |
| CN107204562A (en) * | 2017-06-16 | 2017-09-26 | 云南靖创液态金属热控技术研发有限公司 | A kind of high power laser heat abstractor |
| CN107677698A (en) * | 2016-08-01 | 2018-02-09 | 中国电力科学研究院 | A kind of liquid metal heat convection coefficient detection means |
| CN109244805A (en) * | 2018-11-02 | 2019-01-18 | 中国科学院西安光学精密机械研究所 | A kind of phase transformation thermal control system and method for high-power laser diode pumping source array |
| CN111129919A (en) * | 2019-12-17 | 2020-05-08 | 中国科学院理化技术研究所 | High-power solid laser gain module, laser oscillator and laser amplifier |
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| CN113300194A (en) * | 2021-07-15 | 2021-08-24 | 武汉锐科光纤激光技术股份有限公司 | Self-circulation liquid cooling system and pulse laser |
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| CN105578850A (en) * | 2016-03-15 | 2016-05-11 | 哈尔滨工业大学 | Magnetic fluid micro-channel thermal control system of microsatellite standalone |
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| CN111129919A (en) * | 2019-12-17 | 2020-05-08 | 中国科学院理化技术研究所 | High-power solid laser gain module, laser oscillator and laser amplifier |
| CN111129919B (en) * | 2019-12-17 | 2021-10-26 | 中国科学院理化技术研究所 | High-power solid laser gain module, laser oscillator and laser amplifier |
| CN113300194A (en) * | 2021-07-15 | 2021-08-24 | 武汉锐科光纤激光技术股份有限公司 | Self-circulation liquid cooling system and pulse laser |
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Application publication date: 20160127 |