CN115047961A - Edge server cooling system and wide-ring-temperature edge server - Google Patents
Edge server cooling system and wide-ring-temperature edge server Download PDFInfo
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- CN115047961A CN115047961A CN202210687655.5A CN202210687655A CN115047961A CN 115047961 A CN115047961 A CN 115047961A CN 202210687655 A CN202210687655 A CN 202210687655A CN 115047961 A CN115047961 A CN 115047961A
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- 238000001816 cooling Methods 0.000 title claims description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 37
- 238000010521 absorption reaction Methods 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 55
- 229910052802 copper Inorganic materials 0.000 claims description 55
- 239000010949 copper Substances 0.000 claims description 55
- 238000007789 sealing Methods 0.000 claims description 20
- 238000009825 accumulation Methods 0.000 abstract description 6
- 230000010354 integration Effects 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 description 14
- 238000012546 transfer Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000004364 calculation method Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
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- 230000004044 response Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
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- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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Abstract
The invention provides an edge server heat dissipation system and a wide-ring temperature edge server, wherein the heat dissipation system comprises: the chassis shell is arranged into a sealed box structure; the chip unit is arranged inside the chassis shell; the heat absorption end of the thermoelectric refrigerator is arranged in the case shell and below the upper cover of the case shell, the heat absorption end of the thermoelectric refrigerator is in contact with the surface of the chip unit, the heat release end of the thermoelectric refrigerator is arranged outside the case shell and above the upper cover, and the heat absorption end and the heat release end are connected through a mounting hole reserved in the upper cover. By using the scheme of the invention, the heat generated by the chip in the server can be transferred to the maximum extent, the problem of heat accumulation in the server with high protection level can be effectively solved, the integration of edge server equipment can be improved, and the reliability and the operating efficiency of the edge server are greatly improved.
Description
Technical Field
The present invention relates to the field of computers, and more particularly to an edge server heat dissipation system and a wide-loop temperature edge server.
Background
With the rapid development of China in a series of novel infrastructure fields such as 5G, artificial intelligence, industrial Internet and the like, the concept of 'edge computing' gets more and more attention in the novel fields. Edge computing means that an open platform integrating network, computing, storage and application core capabilities is adopted on one side close to an object or a data source to generate faster network service response so as to meet basic requirements of the industry on real-time business, application intelligence, traffic safety and the like, urban development potential can be greatly released, and therefore trillion-scale intelligent network connection and intelligent traffic new economy are brought, and therefore, the development of edge computing and related server products becomes one of the most important directions in the new infrastructure field of China.
Because the application scenarios of edge calculation are more and more diverse and complex, how to ensure the long-term safe and reliable operation of the edge calculation puts higher requirements on the matched heat dissipation unit, the structure and the heat dissipation design of the heat dissipation unit need to be continuously optimized. Unlike conventional indoor general servers, most edge servers are used in outdoor scenes, and therefore, it is necessary to design extremely high waterproof and dustproof levels for these edge servers, which results in that the conventional manner of installing fans and air ducts inside the servers is no longer applicable, and the internal chips and power supply units must be effectively isolated from the outside air. The traditional heat dissipation mode has limited heat dissipation capability and is generally only suitable for edge servers with low power consumption. With the increasing demand of society for computing power of edge servers, the power consumption of the corresponding chip units is also gradually increased, and the search for a heat dissipation method with higher heat dissipation capability becomes a problem to be solved urgently in development of the edge servers.
Disclosure of Invention
In view of this, an embodiment of the present invention provides an edge server heat dissipation system and a wide-loop temperature edge server, and through the use of the technical solution of the present invention, heat generated by a chip inside a server can be transferred to the maximum extent, so as to effectively solve the problem of heat accumulation inside a server with a high protection level, improve integration of edge server equipment, and greatly improve reliability and operating efficiency of the edge server.
In view of the above object, an aspect of an embodiment of the present invention provides an edge server heat dissipation system, including:
the chassis shell is arranged into a sealed box structure;
the chip unit is arranged inside the chassis shell;
the heat absorption end of the thermoelectric refrigerator is arranged in the case shell and below the upper cover of the case shell, the heat absorption end of the thermoelectric refrigerator is in contact with the surface of the chip unit, the heat release end of the thermoelectric refrigerator is arranged outside the case shell and above the upper cover, and the heat absorption end and the heat release end are connected through a mounting hole reserved in the upper cover.
According to an embodiment of the present invention, further comprising:
the fan radiator module is arranged above the heat release end and is in contact heat conduction with the heat release end through a heat conduction pad, the fan radiator module comprises a fin structure and a plurality of groups of fans, the fin structure is arranged above the heat conduction pad, the plurality of groups of fans are arranged at the end part of the fin structure, and the fan radiator module is configured to transmit the heat of the heat release end into the fin structure through the heat conduction pad and blow out the heat in the fin structure through the wind generated by the fans.
According to one embodiment of the invention, the bottom of the fin structure is provided with a groove with the shape and height consistent with those of the heat release end so that the heat release end is embedded into the fin structure, the bottom of the fin structure is tightly attached to the chassis shell, and a heat conduction plate is arranged between the bottom of the fin structure and the chassis shell.
According to an embodiment of the present invention, the heat absorbing end is in contact with the surfaces of the chip units through a copper heat conducting column, one end of the copper heat conducting column has a first copper contact surface identical to the surface of each chip unit, the first copper contact surface is closely attached to the surface of each chip unit, the other end of the copper heat conducting column has a second copper contact surface identical to the surface of the heat absorbing end, and the second copper contact surface is closely attached to the heat absorbing end.
According to one embodiment of the invention, the chassis shell comprises a bottom plate, a machine shell and an upper cover, wherein the machine shell is fixedly connected with the bottom plate through screws, a sealing gasket is arranged between the machine shell and the bottom plate, the upper cover is provided with a hollow structure at a preset position to form the mounting hole, the upper cover is fixedly connected with the machine shell through screws, and the sealing gasket is arranged between the upper cover and the machine shell.
In another aspect of the embodiments of the present invention, there is also provided a wide ring temperature edge server, including an edge server heat dissipation system, the edge server heat dissipation system including:
the chassis shell is arranged into a sealed box structure;
the chip unit is arranged inside the chassis shell;
the heat absorption end of the thermoelectric refrigerator is arranged in the case shell and below the upper cover of the case shell, the heat absorption end of the thermoelectric refrigerator is in contact with the surface of the chip unit, the heat release end of the thermoelectric refrigerator is arranged outside the case shell and above the upper cover, and the heat absorption end and the heat release end are connected through a mounting hole reserved in the upper cover.
According to an embodiment of the present invention, further comprising:
the fan radiator module, the fan radiator module sets up in the top of sending out the heat end and through heat conduction pad and send out heat end contact heat conduction, the fan radiator module includes fin structure and a plurality of group's fan, the fin structure sets up the top at the heat conduction pad, a plurality of groups fan setting are at the tip of fin structure, the fan radiator module configuration is to sending out the heat transfer of heat end to the fin structure in through the heat conduction pad, and blow off the heat in the fin structure through the wind that the fan produced.
According to one embodiment of the invention, the bottom of the fin structure is provided with a groove with the shape and the height consistent with those of the heat release end so that the heat release end is embedded into the fin structure, the bottom of the fin structure is tightly attached to the chassis shell, and a heat conduction plate is arranged between the bottom of the fin structure and the chassis shell.
According to one embodiment of the invention, the heat absorbing end is in contact with the surfaces of the chip units through a copper heat conducting column, one end of the copper heat conducting column is provided with a first copper contact surface which is the same as the surface of each chip unit, the first copper contact surface is tightly attached to the surface of each chip unit, the other end of the copper heat conducting column is provided with a second copper contact surface which is the same as the surface of the heat absorbing end, and the second copper contact surface is tightly attached to the heat absorbing end.
According to one embodiment of the invention, the chassis shell comprises a bottom plate, a machine shell and an upper cover, wherein the machine shell is fixedly connected with the bottom plate through screws, a sealing gasket is arranged between the machine shell and the bottom plate, the upper cover is provided with a hollow structure at a preset position to form a mounting hole, the upper cover is fixedly connected with the machine shell through screws, and the sealing gasket is arranged between the upper cover and the machine shell.
The invention has the following beneficial technical effects: according to the edge server cooling system provided by the embodiment of the invention, the chassis shell is arranged into a sealed box structure; the chip unit is arranged inside the chassis shell; thermoelectric refrigerator, thermoelectric refrigerator's heat absorption end sets up in chassis exterior's inside and sets up the below at chassis exterior's upper cover, the surface contact of heat absorption end and chip unit, thermoelectric refrigerator's heat release end sets up in chassis exterior's outside and sets up the top at the upper cover, the technical scheme that the mounting hole that heat absorption end and heat release end were reserved on the upper cover is connected, the heat that the inside chip of server produced can furthest be shifted, effectively solve the inside heat accumulation's of high protection level server difficult problem, can improve integrating of edge server equipment, edge server's reliability and operating efficiency have greatly been improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1 is a schematic diagram of an edge server heat dissipation system according to one embodiment of the present invention;
FIG. 2 is a schematic view of an upper cover according to one embodiment of the present invention;
FIG. 3 is a diagram illustrating a fan radiator module according to an embodiment of the invention.
Detailed Description
Embodiments of the present disclosure are described below. However, it is to be understood that the disclosed embodiments are merely examples and that other embodiments may take various and alternative forms. The figures are not necessarily to scale; certain features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention. As one of ordinary skill in the art will appreciate, various features illustrated and described with reference to any one of the figures may be combined with features illustrated in one or more other figures to produce embodiments that are not explicitly illustrated or described. The combination of features shown provides a representative embodiment for a typical application. However, various combinations and modifications of the features consistent with the teachings of the present disclosure may be desirable for certain specific applications or implementations.
In view of the above objects, a first aspect of embodiments of the present invention proposes an embodiment of an edge server heat dissipation system. Fig. 1 shows a schematic diagram of the edge server heat dissipation system.
As shown in fig. 1, the edge server heat dissipation system may include:
The thermoelectric refrigerator 6 comprises a thermoelectric refrigerator 6, wherein a heat absorption end of the thermoelectric refrigerator 6 is arranged inside the case shell 8 and below the upper cover 5 of the case shell 8, the heat absorption end is in contact with the surface of the chip unit 4, a heat release end of the thermoelectric refrigerator 6 is arranged outside the case shell 8 and above the upper cover 5, and the heat absorption end and the heat release end are connected through a mounting hole reserved in the upper cover 5. The thermoelectric cooling technology is a novel refrigeration technology, the principle of the thermoelectric cooling technology is that the Peltier effect of semiconductor materials is utilized, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, a heat absorption end is placed on the surface of a power consumption device to effectively cool the device so as to achieve the purpose of heat dissipation, even the range of the heat dissipation capacity can be varied by about 10-400W, and meanwhile, the switching from refrigeration to heating can be realized by changing the polarity of electrodes at two ends of a refrigeration piece so as to heat a target device. Therefore, the heat absorption end of the thermoelectric refrigerator 6 is arranged inside the case shell 8, the heat release end of the thermoelectric refrigerator 6 is arranged outside the case shell 8, the upper cover 5 needs to be preset with a mounting hole for connecting the heat absorption end and the heat release end of the thermoelectric refrigerator 6, and in order to better radiate the chip unit 4, the heat absorption end needs to be in contact with the surface of the chip unit 4, so that the heat generated by the chip unit 4 can be better transferred to the heat absorption end.
By the technical scheme, the heat generated by the chip in the server can be transferred to the maximum extent, the problem of heat accumulation in the server with a high protection level is effectively solved, the integration of edge server equipment can be improved, and the reliability and the operating efficiency of the edge server are greatly improved.
In a preferred embodiment of the present invention, the method further comprises:
In a preferred embodiment of the present invention, the bottom of the fin structure has a groove with a shape and a height consistent with those of the heat release end so that the heat release end is embedded into the fin structure, the bottom of the fin structure is tightly attached to the chassis housing 8, and a heat conducting plate is arranged between the bottom of the fin structure and the chassis housing 8. In order to further dissipate heat of the edge server, the upper cover 5 needs to be made of a heat conducting material, the temperature inside the chassis housing 8 is also increased by heat generated by each chip unit 4, that is, a part of the heat generated by the chip unit 4 is accumulated in the space inside the chassis housing 8, the upper cover 5 made of a heat conducting material transfers the heat in the space inside the chassis housing 8 to dissipate the heat, and therefore, the bottom of the fin structure is in contact with the surface of the upper cover 5 to transfer the heat transferred by the upper cover 5 to the fin structure. The end of sending out heat sets up in upper cover 5 top, consequently need form the recess that can hold the end of sending out heat with the bottom of fin structure according to the shape and the height of the end of sending out heat, the end of sending out heat can the embedded fin structure in, the area of the end of sending out heat and fin structure contact this moment is 5 face contacts, all be provided with the heat conduction pad on every contact surface, the contact surface that has increased the end of sending out heat and fin structure can be more effectively with the heat transfer of the end of sending out heat to the fin structure, can improve the holistic heat-sinking capability of server. After the heat release end is embedded in the fin structure, the bottom surface of the fin structure can be in contact with the upper cover 5, a heat conducting plate is arranged between the bottom surface and the upper cover 5, heat on the bottom surface is transferred to the fin structure through the heat conducting plate, the fin structure forms a plurality of channels through a plurality of fins, the fan is arranged at one end of the channel, wind energy blown out by the fan can form forced convection in the channel formed between the fins so as to reinforce active heat dissipation, the heat of the upper cover 5 can be taken away more, and the overall heat dissipation capacity of the server is improved.
In a preferred embodiment of the present invention, the heat absorbing end contacts the surface of the chip unit 4 through a copper heat conducting column, one end of the copper heat conducting column has a first copper contact surface identical to the surface of each chip unit 4, the first copper contact surface is closely attached to the surface of each chip unit 4, the other end of the copper heat conducting column has a second copper contact surface identical to the surface of the heat absorbing end, and the second copper contact surface is closely attached to the heat absorbing end. The heat absorbing end needs to be in contact with the surface of each chip unit 4 to better absorb heat generated by the chip unit 4, and the heat absorbing end is arranged on the upper cover 5, so that the heat absorbing end needs to be connected with each chip unit 4 through a copper heat conducting column, one end of the copper heat conducting column is provided with a first copper contact surface which is the same as the surface of the chip unit 4, the first copper contact surface can be arranged to be a copper surface which is the same as the surface of each chip unit 4 in size and shape, the chip unit 4 can also be wrapped according to the actual situation of the chip unit 4, the surface area of each chip unit 4 is different, and therefore the size of each first copper contact surface is also different and the customization needs to be carried out according to the chip unit 4. The other end of the copper heat conduction column is provided with a second copper contact surface which is the same as the surface of the heat absorption end. Through setting up first copper contact surface and second copper contact surface can be better with the heat transfer that each chip unit 4 produced to the heat absorption end, and then improve the holistic heat-sinking capability of server. In some embodiments, the heat absorbing end and each chip unit 4 are connected by a hollow pipe, the pipe needs to be made of a non-heat conducting material, one end of the pipe is connected to each chip unit 4 and wraps the surface of the chip unit 4, the other end of the pipe is connected to the heat absorbing end and wraps the surface of the heat absorbing end, and the heat generated by the chip unit 4 is transferred to the heat absorbing end through the pipe without being dissipated into the case shell 8.
In a preferred embodiment of the present invention, the chassis housing 8 includes a bottom plate 1, a casing 2 and an upper cover 5, the casing 2 is fixedly connected to the bottom plate 1 by screws, a sealing gasket is disposed between the casing 2 and the bottom plate 1, the upper cover 5 has a hollow structure at a predetermined position to form a mounting hole, the upper cover 5 is fixedly connected to the casing 2 by screws, and the sealing gasket is disposed between the upper cover 5 and the casing 2.
In a preferred embodiment of the present invention, the edge server heat dissipation system is mainly composed of seven parts, including a server bottom board 1, a server casing 2, a PCB motherboard 3, a chip unit 4, a server top cover 5, a TEC (thermoelectric cooler) cooling plate 6, and a fan-radiator module 7. Wherein, the server bottom plate 1 mainly playing a role in supporting and fixing fixes the PCB mainboard 3 above the server bottom plate in a positioning pin mode, and a certain interval is reserved to ensure that the PCB mainboard and the server bottom plate are not contacted with each other. The server casing 2 mainly serves as a sealed container for the PCB main board 3 and the chip unit 4, is matched in structure through the server bottom board 1 and is fixed on the bottom board 1 through screws, and a sealing gasket is arranged between the server main board 1 and the bottom board 1 to improve the sealing protection grade of the server. The PCB main board 3 serves as a supporting body for each chip unit 4, and also serves as a carrier for each chip unit 4 for electrical connection, and is mainly fixed above the server bottom board 1, and also plays a certain role in mechanical support. The chip unit 4 is a core part of the whole server, mainly provides functions of signal processing, data calculation, logic control and the like for the server, and is fixed on the PCB mainboard 3 in a welding mode. The server upper cover 5 is used for providing sealing for the PCB main board 3 and the chip unit 4 inside through a sealing washer, and is fixed with the server shell 2 through screws, and meanwhile, a hollow structure is formed in the middle of the upper cover 5 and used for installing the TEC refrigerating piece 6. The TEC refrigeration piece 6 mainly dissipates heat for the chip unit 4 inside, the heat absorption end of the TEC refrigeration piece is positioned inside the case and connected with the chip unit 4 through the copper heat conduction column to form a heat conduction path, and the heat dissipation end is positioned outside the case and forms thermal contact with the bottom of the heat sink of the radiator through the heat conduction pad. The fan radiator module 7 forms forced convection among the radiator fins through a fan to strengthen active heat dissipation, so that heat at the heat release end of the TEC refrigeration piece 6 can be taken away more, and the overall heat dissipation capacity of the server is improved. According to the technical scheme, on the basis of ensuring that the whole server has a high protection level, more heat is transferred through a thermoelectric cooling technology, so that the equipment has higher temperature adaptability. Specifically, when the edge server is in operation, heat generated by the chip unit 4 is conducted to the heat absorption end of the TEC refrigeration plate 6 through the copper heat conduction column, and a large amount of heat, including heat generation of the chip and electric power of the chip, is accumulated at the heat release end. The heat release end is in contact heat conduction with the fan radiator module 7 at the top through the heat conduction pad, so that most of heat is transferred to the bottom of the heat sink of the radiator to form a temperature equalizing effect, meanwhile, forced convection heat transfer is formed through the parallel turbine fans, a large amount of heat is taken away, and the purpose of cooling the server is achieved. In the whole working process, the TEC refrigeration piece 6 is powered by the power supply unit inside the server, and heat generated by the chip unit 4 is continuously transferred to the external fan radiator module 7 through the TEC refrigeration piece 6, so that heat generated by chips inside the server is transferred to the maximum extent, and the problem of heat accumulation inside the server with high protection grade is effectively solved.
By the technical scheme, the heat generated by the chip in the server can be transferred to the maximum extent, the problem of heat accumulation in the server with a high protection level is effectively solved, the integration of edge server equipment can be improved, and the reliability and the operating efficiency of the edge server are greatly improved.
In view of the above object, a second aspect of the embodiments of the present invention provides a wide ring temperature edge server, where the wide ring temperature edge server includes an edge server heat dissipation system, and the edge server heat dissipation system includes:
the chassis shell is arranged into a sealed box structure;
the chip unit is arranged inside the chassis shell;
and the heat absorption end of the thermoelectric refrigerator is arranged in the case shell and below the upper cover of the case shell, the heat absorption end of the thermoelectric refrigerator is in contact with the surface of the chip unit, the heat release end of the thermoelectric refrigerator is arranged outside the case shell and above the upper cover, and the heat absorption end and the heat release end are connected through a mounting hole reserved in the upper cover.
In a preferred embodiment of the present invention, the method further comprises:
the fan radiator module, the fan radiator module sets up in the top of sending out the heat end and through heat conduction pad and send out heat end contact heat conduction, the fan radiator module includes fin structure and a plurality of group's fan, the fin structure sets up the top at the heat conduction pad, a plurality of groups fan setting are at the tip of fin structure, the fan radiator module configuration is to sending out the heat transfer of heat end to the fin structure in through the heat conduction pad, and blow off the heat in the fin structure through the wind that the fan produced.
In a preferred embodiment of the invention, the bottom of the fin structure is provided with a groove with the shape and the height consistent with those of the heat release end so that the heat release end is embedded into the fin structure, the bottom of the fin structure is tightly attached to the chassis shell, and a heat conduction plate is arranged between the bottom of the fin structure and the chassis shell.
In a preferred embodiment of the present invention, the heat absorbing end contacts the surfaces of the chip units through a copper heat conducting column, one end of the copper heat conducting column has a first copper contact surface identical to the surface of each chip unit, the first copper contact surface is closely attached to the surface of each chip unit, the other end of the copper heat conducting column has a second copper contact surface identical to the surface of the heat absorbing end, and the second copper contact surface is closely attached to the heat absorbing end.
In a preferred embodiment of the present invention, the chassis housing includes a bottom plate, a chassis and an upper cover, the chassis is fixedly connected to the bottom plate by screws, a sealing gasket is disposed between the chassis and the bottom plate, the upper cover has a hollow structure at a predetermined position to form a mounting hole, the upper cover is fixedly connected to the chassis by screws, and the sealing gasket is disposed between the upper cover and the chassis.
In a preferred embodiment of the present invention, the wide ring temperature edge server is mainly composed of seven parts, including a server bottom plate, a server casing, a PCB motherboard, a chip unit, a server top cover, a TEC refrigeration plate, and a fan radiator module. The server bottom plate mainly plays a role in supporting and fixing, the PCB main board is fixed above the bottom plate in a locating pin mode, and the PCB main board and the bottom plate are not in contact with each other and are spaced at a certain interval. The server casing is mainly used as a sealing container for the PCB main board and the chip unit, is structurally matched with the bottom plate and is fixed above the bottom plate through screws, and a sealing gasket is packaged between the PCB main board and the bottom plate to form a higher protection grade inside the server. The PCB mainboard is a supporting body of each chip unit and is also a carrier for electrically interconnecting each chip unit, is mainly fixed above the server bottom plate, and plays a certain mechanical supporting role at the same time. The chip unit is a core part of the server, mainly provides functions of signal processing, data calculation, logic control and the like for the server, and is fixed on a PCB mainboard in a welding mode. The server upper cover plays a role in sealing the PCB main board and the chip unit inside, is fixed with the server shell through screws and forms a gasket for sealing, and meanwhile, a hollow structure is formed in the middle of the upper cover and used for installing the TEC refrigerating piece. The TEC refrigeration piece mainly dissipates heat for an internal chip unit, a heat absorption end of the TEC refrigeration piece is positioned in the case and connected with the chip unit through a copper heat conduction column to form a heat conduction path, and a heat release end of the TEC refrigeration piece is positioned outside the case and forms thermal contact with the bottom of a heat sink of the radiator through a heat conduction pad. The fan radiator module forms forced convection among the radiator fins through the fan to strengthen active heat dissipation, so that heat at the heat dissipation end of the TEC refrigeration fin can be taken away more, and the overall heat dissipation capacity of the server is improved. According to the technical scheme, on the basis of ensuring that the whole server has a high protection level, more heat is transferred through a thermoelectric cooling technology, so that the equipment has higher temperature adaptability.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The embodiments described above, particularly any "preferred" embodiments, are possible examples of implementations and are presented merely to clearly understand the principles of the invention. Many variations and modifications may be made to the above-described embodiments without departing from the spirit and principles of the technology described herein. All such modifications are intended to be included within the scope of this disclosure and protected by the following claims.
Claims (10)
1. An edge server heat dissipation system, comprising:
a chassis housing configured as a sealed box structure;
a chip unit disposed inside the chassis housing;
the heat absorption end of the thermoelectric refrigerator is arranged in the case shell and below the upper cover of the case shell, the heat absorption end of the thermoelectric refrigerator is in contact with the surface of the chip unit, the heat release end of the thermoelectric refrigerator is arranged outside the case shell and above the upper cover, and the heat absorption end and the heat release end are connected through a mounting hole reserved in the upper cover.
2. The edge server heat dissipation system of claim 1, further comprising:
the fan radiator module is arranged above the heat release end and is in contact heat conduction with the heat release end through a heat conduction pad, the fan radiator module comprises a fin structure and a plurality of groups of fans, the fin structure is arranged above the heat conduction pad, the plurality of groups of fans are arranged at the end part of the fin structure, and the fan radiator module is configured to transmit the heat of the heat release end into the fin structure through the heat conduction pad and blow out the heat in the fin structure through the wind generated by the fans.
3. The edge server cooling system according to claim 2, wherein the bottom of the fin structure has a groove corresponding to the shape and height of the heat releasing end so that the heat releasing end is embedded in the fin structure, the bottom of the fin structure is tightly attached to the chassis housing, and a heat conducting plate is disposed between the bottom of the fin structure and the chassis housing.
4. The edge server heat dissipation system of claim 1, wherein the heat sink contacts the surfaces of the chip units through copper heat-conducting posts, one ends of the copper heat-conducting posts have a first copper contact surface identical to the surface of each chip unit, the first copper contact surface is in close contact with the surface of each chip unit, the other ends of the copper heat-conducting posts have a second copper contact surface identical to the surface of the heat sink, and the second copper contact surface is in close contact with the heat sink.
5. The edge server cooling system according to claim 1, wherein the chassis housing includes a bottom plate, a casing, and an upper cover, the casing is fixedly connected to the bottom plate by screws, a sealing gasket is disposed between the casing and the bottom plate, the upper cover has a hollow structure at a predetermined position to form the mounting hole, the upper cover is fixedly connected to the casing by screws, and the sealing gasket is disposed between the upper cover and the casing.
6. A wide ring temperature edge server, comprising an edge server heat dissipation system, the edge server heat dissipation system comprising:
a chassis housing configured as a sealed box structure;
a chip unit disposed inside the chassis housing;
the heat absorption end of the thermoelectric refrigerator is arranged in the case shell and below the upper cover of the case shell, the heat absorption end of the thermoelectric refrigerator is in contact with the surface of the chip unit, the heat release end of the thermoelectric refrigerator is arranged outside the case shell and above the upper cover, and the heat absorption end and the heat release end are connected through a mounting hole reserved in the upper cover.
7. The wide ring edge server of claim 6, further comprising:
the fan radiator module is arranged above the heat release end and is in contact heat conduction with the heat release end through a heat conduction pad, the fan radiator module comprises a fin structure and a plurality of groups of fans, the fin structure is arranged above the heat conduction pad, the plurality of groups of fans are arranged at the end part of the fin structure, and the fan radiator module is configured to transmit the heat of the heat release end into the fin structure through the heat conduction pad and blow out the heat in the fin structure through the wind generated by the fans.
8. The wide ring warm edge server of claim 7, wherein the fin structure bottom has a groove conforming to the shape and height of the heat release end to embed the heat release end into the fin structure, the fin structure bottom is closely attached to the chassis housing, and a heat conducting plate is disposed between the fin structure bottom and the chassis housing.
9. The wide loop warm edge server of claim 6, wherein the heat sink is in contact with the surfaces of the chip units through copper heat conducting posts, one end of each copper heat conducting post has a first copper contact surface identical to the surface of each chip unit, the first copper contact surface is in close contact with the surface of each chip unit, the other end of each copper heat conducting post has a second copper contact surface identical to the surface of the heat sink, and the second copper contact surface is in close contact with the heat sink.
10. The wide-ring warm-edge server according to claim 6, wherein the case housing comprises a bottom plate, a case and an upper cover, the case is fixedly connected with the bottom plate through screws, a sealing gasket is arranged between the case and the bottom plate, the upper cover has a hollow structure at a preset position to form the mounting hole, the upper cover is fixedly connected with the case through screws, and the sealing gasket is arranged between the upper cover and the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210687655.5A CN115047961A (en) | 2022-06-17 | 2022-06-17 | Edge server cooling system and wide-ring-temperature edge server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210687655.5A CN115047961A (en) | 2022-06-17 | 2022-06-17 | Edge server cooling system and wide-ring-temperature edge server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115047961A true CN115047961A (en) | 2022-09-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210687655.5A Withdrawn CN115047961A (en) | 2022-06-17 | 2022-06-17 | Edge server cooling system and wide-ring-temperature edge server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115047961A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118131873A (en) * | 2024-04-29 | 2024-06-04 | 苏州元脑智能科技有限公司 | Outdoor server heat abstractor and outdoor server |
-
2022
- 2022-06-17 CN CN202210687655.5A patent/CN115047961A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118131873A (en) * | 2024-04-29 | 2024-06-04 | 苏州元脑智能科技有限公司 | Outdoor server heat abstractor and outdoor server |
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