CN210267799U - Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment - Google Patents
Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment Download PDFInfo
- Publication number
- CN210267799U CN210267799U CN201920046172.0U CN201920046172U CN210267799U CN 210267799 U CN210267799 U CN 210267799U CN 201920046172 U CN201920046172 U CN 201920046172U CN 210267799 U CN210267799 U CN 210267799U
- Authority
- CN
- China
- Prior art keywords
- heat
- refrigeration
- temperature
- heat exchanger
- heat exchange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/005—Arrangement or mounting of control or safety devices of safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The refrigeration chip comprises a plurality of refrigeration modules, each refrigeration module comprises a P-type material and an N-type material, and two ends of the P-type material and the N-type material are respectively connected by a metal conductor; the surface of the hot end of the refrigeration chip is connected with a base of a radiating block, and the radiating surface of the radiating block is communicated with cooling liquid in the heat exchange plate; the cold end of the refrigeration chip is communicated with the reaction cavity. The direct cooling machine comprises a heat exchanger, a cooling liquid tank, a pump and a plurality of pipelines, wherein cooling liquid in the cooling liquid tank is pressurized by the pump and is conveyed to a heat exchange plate of the heat exchanger through the pipelines, and the cooling liquid is refluxed to the cooling liquid tank after heat is carried away; while the other heat exchange plate is connected to the reaction chamber. The utility model discloses utilize semiconductor accuse temperature chip to control by temperature change reaction cavity for accuse temperature precision and energy consumption have an obvious improvement.
Description
Technical Field
The utility model relates to an accurate temperature regulating equipment for semiconductor production, specifically speaking are a heat exchanger and direct cooling machine that is used for semiconductor equipment reaction cavity accuse temperature.
Background
In the semiconductor manufacturing industry, a direct cooling machine is generally adopted for controlling the temperature of a process reaction cavity (namely a wafer chuck); the conventional compressor is usually adopted in the conventional direct cooling machine, so that the energy consumption is high, the temperature control precision is poor, and the high-precision semiconductor production requirement cannot be met.
Chinese patent No. CN 201320656711.5 provides a semiconductor temperature control storage device, which comprises a box body, wherein: the semiconductor refrigeration system comprises a semiconductor refrigeration piece, wherein one end of the semiconductor refrigeration piece is connected with the water cooling head and exchanges heat with liquid in the water cooling head, and the other end of the semiconductor refrigeration piece is connected with a radiating fin and exchanges heat with the outside of the box body; the water circulating system realizes heat exchange with the semiconductor refrigerating sheet and provides cold air or hot air into the box body; the control chip comprises a singlechip, a driving water circulation system and a semiconductor system, has low manufacturing cost and is suitable for constant-temperature sealed storage of articles with smaller volume.
Disclosure of Invention
The utility model aims to solve the existing problems and provide a heat exchanger and a direct cooling machine for controlling the temperature of a reaction cavity of semiconductor equipment.
In order to achieve the above object, the utility model discloses a technical scheme including refrigeration chip, radiating block and heat exchange board, wherein:
the refrigeration chip comprises a plurality of refrigeration modules, each refrigeration module comprises a P-type material and an N-type material, and two ends of each P-type material and two ends of each N-type material are respectively connected by a metal conductor;
the surface of one end of the refrigeration chip is connected with a base of a radiating block, and a radiating surface of the radiating block is communicated with cooling liquid in the heat exchange plate; the other end of the refrigeration chip is communicated with the reaction cavity.
The refrigeration device comprises a plurality of refrigeration chips which are electrically connected in parallel, wherein a heat exchange plate is shared between the adjacent refrigeration chips, namely, two sides of the heat exchange plate are respectively connected with heat dissipation surfaces of two heat dissipation blocks; and the other end of the refrigeration chip is respectively communicated with the reaction cavities.
The refrigeration device comprises a plurality of refrigeration chips which are electrically connected in series, namely a heat exchange plate is provided with a plurality of refrigeration chips, the surface of one end of each refrigeration chip is connected with one side of a heat dissipation block, and the heat dissipation surfaces of the heat dissipation blocks are respectively communicated with cooling liquid in the heat exchange plate; and the other end of the refrigeration chip is communicated with the reaction cavity.
The liquid cooling channel is arranged in the heat exchange plate, and the heat dissipation surface of the heat dissipation block is immersed in the liquid cooling channel.
The liquid channel is provided with a water inlet and a water outlet at two ends of the side edge of the heat exchange plate respectively, and a liquid cooling channel is arranged between the water inlet and the water outlet; the liquid cooling channel is immersed in the space between the periphery of the liquid cooling channel and the heat dissipation surface.
The heat-radiating block is characterized by further comprising a sealing ring, the heat-exchanging plate is provided with a mounting port, one side of the mounting port is communicated with cooling liquid, the other side of the mounting port is connected with a heat-radiating block, a heat-radiating surface of the heat-radiating block is immersed in the cooling liquid, and the sealing ring is arranged on the connecting surface of the mounting port and the base of the heat-radiating block.
And moisture-proof, corrosion-proof and static-proof PTFE layers are respectively arranged on the surfaces of the cold end and the hot end of the refrigeration chip.
The other end of the refrigeration chip is connected with another heat exchange plate through a heat dissipation block, and the other heat exchange plate is communicated with the reaction cavity.
The utility model also provides a direct cooling machine for controlling the temperature of the reaction cavity of the semiconductor equipment, which comprises the heat exchanger, a cooling liquid tank, a pump and a plurality of pipelines, wherein, the cooling liquid in the cooling liquid tank is pressurized by the pump and is conveyed to the heat exchange plate of the heat exchanger through the pipelines, and flows back to the cooling liquid tank after the heat is removed, so as to form liquid circulation; while the other heat exchange plate is connected to the reaction chamber.
The liquid circulation system further comprises a one-way valve, and the one-way valve is arranged on any pipeline for liquid circulation.
The device comprises a heat exchanger, a temperature switch, a temperature sensor and a temperature sensor, wherein the heat exchanger is arranged in the heat exchanger; the temperature switch is arranged on the heating circuit bus; the temperature switch can disconnect and connect the heating circuit according to a set temperature range.
The heating device also comprises a controller and a power supply for supplying power to the controller, wherein the controller is respectively connected with and controls the pump and the heating circuit; the controller also carries out human-computer interaction through a touch screen; and stores the information through the USB interface.
The monitoring system comprises a plurality of direct cooling machines, communication modules are arranged on the direct cooling machines respectively and connected with the server respectively, and the communication modules transmit working state information to the server; the server is connected with the terminal display.
Compared with the prior art, the utility model utilizes the semiconductor temperature control chip to control the temperature of the reaction cavity, so that the temperature control precision and the energy consumption are obviously improved; the utility model provides a heat price changer refrigeration effect is good, the cooling is rapid, and can adjust quantity and connected mode as required conveniently.
Drawings
FIG. 1 is a schematic view of a heat exchanger according to an embodiment;
FIG. 2 is a schematic view of a heat exchanger according to an embodiment;
FIG. 3 is a schematic structural view of a heat exchanger according to a second embodiment;
FIG. 4 is a schematic structural view of a heat exchanger according to a second embodiment;
FIG. 5 is a schematic structural view of a third heat exchanger according to an embodiment;
FIG. 6 is a schematic structural view of a third heat exchanger according to an embodiment;
FIG. 7 is a schematic structural disassembly diagram of the vertical cooler;
FIG. 8 is a schematic structural view of an over-temperature protection device;
FIG. 9 is a schematic diagram of a liquid cooling channel;
FIG. 10 is a schematic structural diagram of a refrigeration chip;
fig. 11 is a schematic structural diagram of a monitoring system.
Detailed Description
The present invention will now be further described with reference to the accompanying drawings.
Example one
Referring to fig. 1 and 2, fig. 1 and 2 show a first embodiment of the present invention, namely, a single unit heat exchanger, including a refrigeration chip, a heat dissipating block, and a heat exchange plate, wherein:
the refrigeration chip comprises a plurality of refrigeration modules, each refrigeration module comprises a P-type material and an N-type material, and two ends of each P-type material and two ends of each N-type material are respectively connected by a metal conductor.
The surface of the hot end of the refrigeration chip is connected with a base of a radiating block, and the radiating surface of the radiating block is communicated with cooling liquid in the heat exchange plate; the cold end of the refrigeration chip is communicated with the reaction cavity.
The refrigeration chip operates after power is applied (turning on both pins of the refrigeration chip), and a positive voltage applied to the N-type material drives electrons from the P-type to the N-type material and back to the voltage source. The temperature of the cold end decreases with the heat absorption. The heat is then conducted to the hot side for dissipation through the heat sink. If the voltage is reversed, the above is also reversed. The temperature control precision and the energy consumption of the refrigeration chip for controlling the temperature of the reaction cavity are obviously improved.
Example two
Referring to fig. 2, fig. 2 shows a second embodiment of the present invention, which includes two electrically parallel refrigeration chips, and a heat exchange plate is shared between the adjacent refrigeration chips, that is, two sides of the heat exchange plate are respectively connected to the heat dissipation surfaces of two heat dissipation blocks; and the cold ends of the refrigeration chips are respectively communicated with the reaction cavities.
The working principle is the same as that of the first embodiment; and the circuit is arranged according to the parallel connection relation, so that the refrigeration effect can be adjusted.
Third embodiment referring to fig. 2, fig. 2 shows a second embodiment of the present invention,
the refrigerating device comprises twelve refrigerating chips which are electrically connected in series, namely a heat exchange plate is provided with a plurality of six refrigerating chips which are connected in series. There are two heat exchanger plates in parallel relationship and thus a total of twelve. The surface of the hot end of the refrigeration chip is connected with one side of the heat dissipation block, and the heat dissipation surfaces of the heat dissipation block are respectively communicated with cooling liquid in the heat exchange plate; and the cold end of the refrigeration chip is communicated with the reaction cavity. The working principle is the same as that of the first embodiment; the circuit is arranged according to the series connection relationship, so that the refrigeration effect can be adjusted; and the number of the refrigeration chips can be increased or reduced according to actual needs, so that the refrigeration effect is further optimized.
Preferably, referring to fig. 9, the heat exchange plate of any of the above embodiments is provided with a liquid cooling channel therein, said liquid cooling channel submerging the heat dissipating surface of said heat dissipating block. The heat dissipation surface of the present embodiment is a plurality of parallel heat dissipation plates. A water inlet and a water outlet are respectively formed in two ends of the side edge of the heat exchange plate, and a liquid cooling channel is arranged between the water inlet and the water outlet. The liquid cooling channel is immersed in the space between the periphery of the liquid cooling channel and the heat dissipation surface. The cooling liquid in the liquid cooling channel can quickly take away the heat coming out from the radiating surface,
the heat exchange plate is provided with a mounting port, one side of the mounting port is communicated with cooling liquid, the other side of the mounting port is connected with a radiating block, the radiating surface of the radiating block is immersed in the cooling liquid, and a sealing ring is arranged on the connecting surface of the mounting port and the base of the radiating block. The sealing ring separates the cooling liquid from the refrigeration chip, and water tightness is guaranteed.
Preferably, referring to fig. 10, the cold end surface and the hot end surface of the refrigeration chip in any of the above embodiments may be further provided with moisture-proof, corrosion-proof and static-proof PTFE layers. PTFE, namely polytetrafluoroethylene, has the effect of protecting metal by spraying after the surface treatment of the metal surface, and has excellent corrosion resistance: chemical corrosion resistance and the like.
Example four
Referring to fig. 7 and 8, the utility model also provides a direct cooling machine for controlling the temperature of the reaction cavity of the semiconductor device, which comprises a box body, a heat exchanger, a cooling liquid tank, a pump and a plurality of pipelines. The cooling liquid in the cooling liquid tank is pressurized by a pump and is conveyed into a heat exchange plate of a heat exchanger through a pipeline, and the heat exchanger is fixed in the box body through a bracket; after taking away the heat, the liquid flows back to the cooling liquid tank, so that liquid circulation is formed; while the other heat exchange plate is connected to the reaction chamber.
In use, the controller receives a sensed temperature of the process fluid returning from the process reaction chamber (wafer chuck) and varies the temperature of the process fluid supplied to the process reaction chamber by the TE chipset to compensate for changes in process conditions.
The pump is a power device for providing the process cooling liquid for circulation, so that the cooling liquid can circularly flow among the heat exchanger, the cooling liquid tank and the process reaction cavity.
Wherein, referring to fig. 7, a one-way valve is further included, which is provided on any of the pipes for liquid circulation. The cooling liquid in the one-way valve can only flow along the direction of the water inlet, and the medium at the water outlet can not flow back. It is used in hydraulic systems to prevent reverse flow of fluid. When the liquid in the cooling liquid tank is full, the one-way valve can form the circulation of the liquid, and simultaneously can prevent the redundant liquid from entering the cooling liquid tank.
Referring to fig. 8, the heat exchanger further comprises an over-temperature protection device, wherein the over-temperature protection device comprises a temperature switch and a heating circuit, and the temperature switch is fixed on the outer surface of the heat exchanger; the temperature switch is arranged on the heating circuit bus; the temperature switch can disconnect and connect the heating circuit according to the set temperature range and is fixed on the surface of the heat exchanger. When the temperature of the heat exchanger is too high, the temperature switch can cut off the heating circuit; and the circuit is communicated only when the temperature of the heat exchanger returns to normal.
The heating device also comprises a controller and a power supply for supplying power to the controller, wherein the controller is respectively connected with and controls the pump and the heating circuit; the controller receives a signal fed back by the main machine station to control the temperature and reach the required condition of the production equipment. The heat dissipation block is added on the control part, so that the heat generated by the control unit can be effectively reduced, and the service life of the unit is prolonged.
The controller also carries out human-computer interaction through a touch screen, and the change of the actual temperature curve can be displayed on the controller, so that a client can conveniently observe the change.
The controller stores information through the USB interface, can download temperature data of nearly three months at the USB interface, and is convenient to solve the problem.
In addition, the heat exchanger is also provided with a partition plate which is used for dividing the electronic control unit and the mechanical part, playing a role of protecting the electronic control unit and simultaneously ensuring that the heat generated by the control part does not influence the normal work of the heat exchanger.
Further, referring to fig. 11, a monitoring system is also provided. The monitoring system comprises a plurality of direct cooling machines, communication modules are respectively arranged on the direct cooling machines and are respectively connected with the server, and the communication modules transmit working state information to the server; the server is connected with the terminal display.
By additionally arranging a set of communication modules (including main stream communication signals such as RS232 and RS 484), different direct cooling machines can carry out real-time communication with the server, so that a user can monitor the working states of all water coolers in real time at a terminal display.
Each terminal display of the system can monitor 255 vertical coolers at the same time. In semiconductor industry factories, the use of direct cooling machines is very extensive, each factory has thousands of direct cooling machine devices, the installation positions of the direct cooling machines are very dispersed, and a user needs to spend a large amount of manpower to patrol every day. By using the central monitoring system of the direct cooling machine, a user can monitor the working condition of each direct cooling machine in real time by a special terminal display in an office or a workshop, so that the working efficiency of the user can be greatly improved, and a large amount of manpower resources can be saved. The embodiments of the present invention have been described in conjunction with the accompanying drawings and examples, the structures of which are not intended to limit the present invention, and those skilled in the art can make modifications as required, and all changes and modifications within the scope of the appended claims are within the scope of protection.
Claims (13)
1. A heat exchanger for controlling temperature of a reaction cavity of semiconductor equipment is characterized in that: including refrigeration chip, radiating block and heat exchange board, wherein:
the refrigeration chip comprises a plurality of refrigeration modules, each refrigeration module comprises a P-type material and an N-type material, and two ends of each P-type material and two ends of each N-type material are respectively connected by a metal conductor;
the surface of one end of the refrigeration chip is connected with a base of a radiating block, and a radiating surface of the radiating block is communicated with cooling liquid in the heat exchange plate; the other end of the refrigeration chip is communicated with the reaction cavity.
2. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 1, wherein: the refrigeration device comprises a plurality of refrigeration chips which are electrically connected in parallel, wherein a heat exchange plate is shared between the adjacent refrigeration chips, namely, two sides of the heat exchange plate are respectively connected with the heat dissipation surfaces of two heat dissipation blocks; and the other end of the refrigeration chip is respectively communicated with the reaction cavities.
3. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 1, wherein: the refrigeration device comprises a plurality of refrigeration chips which are electrically connected in series, namely a heat exchange plate is provided with a plurality of refrigeration chips, the surface of one end of each refrigeration chip is connected with one side of a heat dissipation block, and the heat dissipation surfaces of the heat dissipation blocks are respectively communicated with cooling liquid in the heat exchange plate; and the other end of the refrigeration chip is communicated with the reaction cavity.
4. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 1, 2 or 3, wherein: a liquid cooling channel is arranged inside the heat exchange plate and is immersed in the heat dissipation surface of the heat dissipation block.
5. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 4, wherein: the liquid channel is provided with a water inlet and a water outlet at two ends of the side edge of the heat exchange plate respectively, and a liquid cooling channel is arranged between the water inlet and the water outlet; the liquid cooling channel is immersed in the space between the periphery of the liquid cooling channel and the heat dissipation surface.
6. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 4, wherein: the heat-radiating block is characterized by further comprising a sealing ring, the heat-exchanging plate is provided with a mounting port, one side of the mounting port is communicated with cooling liquid, the other side of the mounting port is connected with a heat-radiating block, the heat-radiating surface of the heat-radiating block is immersed in the cooling liquid, and the sealing ring is arranged on the connecting surface of the mounting port and the base of the heat-radiating block.
7. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 1, 2 or 3, wherein: and moisture-proof, corrosion-proof and static-proof PTFE layers are respectively arranged on the surfaces of the cold end and the hot end of the refrigeration chip.
8. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 1, 2 or 3, wherein: the other end of the refrigeration chip is connected with another heat exchange plate through a heat dissipation block, and the other heat exchange plate is communicated with the reaction cavity.
9. A direct cooling machine for controlling the temperature of a reaction cavity of semiconductor equipment is characterized in that: the heat exchanger of any one of claims 1 to 8, further comprising a cooling liquid tank, a pump and a plurality of pipelines, wherein the cooling liquid in the cooling liquid tank is pressurized by the pump and is conveyed to the heat exchange plates of the heat exchanger through the pipelines, and flows back to the cooling liquid tank after heat is removed, so that liquid circulation is formed; while the other heat exchange plate is connected to the reaction chamber.
10. The direct cooler for controlling the temperature of the reaction chamber of the semiconductor device according to claim 9, wherein: the liquid circulation system also comprises a one-way valve, wherein the one-way valve is arranged on any pipeline for liquid circulation.
11. The direct cooler for controlling the temperature of the reaction chamber of the semiconductor device according to claim 9, wherein: the device also comprises an over-temperature protection device, wherein the over-temperature protection device comprises a temperature switch and a heating circuit, and the temperature switch is fixed on the outer surface of the heat exchanger; the temperature switch is arranged on the heating circuit bus; the temperature switch can disconnect and connect the heating circuit according to a set temperature range.
12. The direct cooler for controlling the temperature of the reaction chamber of the semiconductor device according to claim 9, wherein: the heating device also comprises a controller and a power supply for supplying power to the controller, wherein the controller is respectively connected with and controls the pump and the heating circuit; the controller also carries out human-computer interaction through a touch screen; and stores the information through the USB interface.
13. The direct cooler for controlling the temperature of the reaction chamber of the semiconductor device according to any one of claims 9 to 12, wherein: the monitoring system comprises a plurality of direct cooling machines, communication modules are arranged on the direct cooling machines respectively and connected with the server respectively, and the communication modules transmit working state information to the server; the server is connected with the terminal display.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019100014628 | 2019-01-02 | ||
| CN201910001462 | 2019-01-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210267799U true CN210267799U (en) | 2020-04-07 |
Family
ID=67825349
Family Applications (8)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920045647.4U Active CN211503310U (en) | 2019-01-02 | 2019-01-11 | Liquid cooling passage structure of heat exchanger |
| CN201920046134.5U Active CN210267798U (en) | 2019-01-02 | 2019-01-11 | Film coating structure of direct cooling machine chip |
| CN201920045643.6U Active CN210220285U (en) | 2019-01-02 | 2019-01-11 | Over-temperature protection device of heat exchanger |
| CN201920046172.0U Active CN210267799U (en) | 2019-01-02 | 2019-01-11 | Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment |
| CN201920045648.9U Active CN210220286U (en) | 2019-01-02 | 2019-01-11 | Heat exchanger structure |
| CN201910026792.2A Pending CN111457617A (en) | 2019-01-02 | 2019-01-11 | Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment |
| CN201920046105.9U Active CN209375692U (en) | 2019-01-02 | 2019-01-11 | A kind of monitoring system of direct-cooled machine |
| CN201920093126.6U Active CN210220287U (en) | 2019-01-02 | 2019-01-21 | One-way valve structure of direct cooling machine |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920045647.4U Active CN211503310U (en) | 2019-01-02 | 2019-01-11 | Liquid cooling passage structure of heat exchanger |
| CN201920046134.5U Active CN210267798U (en) | 2019-01-02 | 2019-01-11 | Film coating structure of direct cooling machine chip |
| CN201920045643.6U Active CN210220285U (en) | 2019-01-02 | 2019-01-11 | Over-temperature protection device of heat exchanger |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920045648.9U Active CN210220286U (en) | 2019-01-02 | 2019-01-11 | Heat exchanger structure |
| CN201910026792.2A Pending CN111457617A (en) | 2019-01-02 | 2019-01-11 | Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment |
| CN201920046105.9U Active CN209375692U (en) | 2019-01-02 | 2019-01-11 | A kind of monitoring system of direct-cooled machine |
| CN201920093126.6U Active CN210220287U (en) | 2019-01-02 | 2019-01-21 | One-way valve structure of direct cooling machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (8) | CN211503310U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111457617A (en) * | 2019-01-02 | 2020-07-28 | 江苏中科新源半导体科技有限公司 | Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115031442A (en) * | 2022-05-18 | 2022-09-09 | 杭州大和热磁电子有限公司 | Water-cooled semiconductor water chiller |
| CN115164490B (en) * | 2022-07-20 | 2023-03-10 | 安徽中科新源半导体科技有限公司 | High-power high-efficiency semiconductor direct cooling machine |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5640852A (en) * | 1995-10-06 | 1997-06-24 | Atlas; Boris | Compact thermal electric heat exchanger |
| KR100746763B1 (en) * | 2005-11-14 | 2007-08-06 | 정상호 | Temperature control system and vehicle seat temperature control system |
| WO2009111008A1 (en) * | 2008-03-05 | 2009-09-11 | Sheetak, Inc. | Method and apparatus for switched thermoelectric cooling of fluids |
| CN205227914U (en) * | 2015-12-09 | 2016-05-11 | 广州市奥冷电子科技发展有限公司 | Semiconductor refrigeration thermostatted water bath |
| CN105576113A (en) * | 2016-02-16 | 2016-05-11 | 广东富信科技股份有限公司 | Semiconductor refrigeration component |
| CN211503310U (en) * | 2019-01-02 | 2020-09-15 | 江苏中科新源半导体科技有限公司 | Liquid cooling passage structure of heat exchanger |
-
2019
- 2019-01-11 CN CN201920045647.4U patent/CN211503310U/en active Active
- 2019-01-11 CN CN201920046134.5U patent/CN210267798U/en active Active
- 2019-01-11 CN CN201920045643.6U patent/CN210220285U/en active Active
- 2019-01-11 CN CN201920046172.0U patent/CN210267799U/en active Active
- 2019-01-11 CN CN201920045648.9U patent/CN210220286U/en active Active
- 2019-01-11 CN CN201910026792.2A patent/CN111457617A/en active Pending
- 2019-01-11 CN CN201920046105.9U patent/CN209375692U/en active Active
- 2019-01-21 CN CN201920093126.6U patent/CN210220287U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111457617A (en) * | 2019-01-02 | 2020-07-28 | 江苏中科新源半导体科技有限公司 | Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN210220285U (en) | 2020-03-31 |
| CN111457617A (en) | 2020-07-28 |
| CN211503310U (en) | 2020-09-15 |
| CN210220287U (en) | 2020-03-31 |
| CN210267798U (en) | 2020-04-07 |
| CN210220286U (en) | 2020-03-31 |
| CN209375692U (en) | 2019-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210267799U (en) | Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment | |
| US11632879B2 (en) | Heat dissipation plate for chip heat dissipation, server heat dissipation system, and heating device | |
| CN106604618B (en) | Liquid cooling and air cooling composite cooling device for data center | |
| CN204145970U (en) | A kind of cooling system | |
| US11959695B2 (en) | Liquid cooling system with water quality monitoring | |
| CN210602327U (en) | High-power double-flow module type thermoelectric water cooling machine device | |
| CN112566475A (en) | Cooling system | |
| CN202364097U (en) | Frequency converter with water-cooling heat dissipation | |
| CN209787684U (en) | Liquid cooling device for cooling electronic equipment and electronic equipment | |
| CN217009340U (en) | Energy storage container | |
| CN115629658A (en) | Water-cooling type chip radiator | |
| TWM589423U (en) | Liquid-cooling heat dissipation system with water quality monitoring function | |
| CN213755512U (en) | Cooling system | |
| CN212457076U (en) | Intelligent electric heating chip heating electric boiler | |
| CN201417763Y (en) | Semi-conductor water cooling system of computer central processing unit | |
| CN210605614U (en) | Heat abstractor for computer machine case | |
| CN208364538U (en) | A kind of hydraulic oil cooling system for vegetable oil mill bulking equipment | |
| CN217213630U (en) | Liquid cooling equipment shell, liquid cooling equipment and liquid cooling system | |
| CN101645431A (en) | Improved semiconductor water cooling system of computer central processing unit | |
| CN115164490B (en) | High-power high-efficiency semiconductor direct cooling machine | |
| CN220750545U (en) | Temperature fast switching device capable of meeting semiconductor process requirements | |
| CN218998712U (en) | Water cooling device for cooling industrial microwave power supply | |
| CN221172682U (en) | Refrigeration system matched with workshop equipment | |
| CN220733337U (en) | Empty water-cooling heat radiation structure of energy storage converter current transformation module | |
| CN220913286U (en) | High-power chip aging test cabinet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 230000, floor 2, building A3, Zhongan chuanggu science and Technology Park, high tech Zone, Hefei, Anhui Province Patentee after: Anhui Zhongke Xinyuan Semiconductor Technology Co.,Ltd. Address before: 226500 No.3, East 1st Telecom Road, Chengnan street, Rugao City, Nantong City, Jiangsu Province Patentee before: JIANGSU ZHONGKE XINYUAN SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |