CN115629658A - Water-cooling type chip radiator - Google Patents
Water-cooling type chip radiator Download PDFInfo
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- CN115629658A CN115629658A CN202211131845.5A CN202211131845A CN115629658A CN 115629658 A CN115629658 A CN 115629658A CN 202211131845 A CN202211131845 A CN 202211131845A CN 115629658 A CN115629658 A CN 115629658A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
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- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a water-cooling chip radiator, which comprises a heat dissipation mounting rack, a heat dissipation circulation chamber, a circulation pipeline group and a refrigerator, wherein the refrigerator comprises a refrigeration rack, a liquid storage chamber arranged in the refrigeration rack and a water pump arranged on one side of the liquid storage chamber, a refrigeration semiconductor fin, a heat conduction copper sheet, a heat dissipation fin and a heat dissipation fan are sequentially arranged at the bottom of the liquid storage chamber downwards, and a power supply for supplying power to the water pump, the refrigeration semiconductor fin and the heat dissipation fan is also arranged on one side of the liquid storage chamber; the cooling fan can strengthen the air flow among the cooling fins, and carry out heat dissipation and cooling on the refrigeration semiconductor wafer, thereby ensuring that the refrigeration semiconductor wafer continuously cools the cooling liquid; thereby realizing the low-temperature heat dissipation of the cooling liquid for the computer chip.
Description
Technical Field
The invention relates to the technical field of computer chip heat dissipation, in particular to a water-cooling chip heat radiator.
Background
In recent years, as the performance of computer systems has been gradually improved, the heat generated by electronic components such as CPUs has inevitably increased, and in order to solve the problem of heat generation, a heat dissipation system is usually used to dissipate heat quickly to prevent the electronic components from being overheated and thus reducing their life or being damaged. The existing heat dissipation systems mainly include a wind cooling heat dissipation system and a water cooling heat dissipation system, wherein the water cooling heat dissipation system has been largely applied to the heat dissipation of the CPU due to its remarkable heat dissipation performance and low noise, and has become one of the important development trends of computer cooling systems.
A water-cooling radiator of current patent, patent application number is: 201410058972.6 specifically discloses a water-cooled radiator, which includes: the heat dissipation part is provided with a water inlet and a water outlet; the heat absorption part is provided with a water inlet and a water outlet, and a water pump is arranged inside the heat absorption part; the pipeline part comprises a first pipeline and a second pipeline, one end of the first pipeline and one end of the second pipeline are respectively connected with the water inlet and the water outlet of the heat dissipation part, the other end of the first pipeline and the other end of the second pipeline are respectively connected with the water outlet and the water inlet of the heat absorption part, and under the action of a water pump, cooling liquid circularly flows among the heat dissipation part, the pipeline part and the heat absorption part; the other ends of the first pipeline and the second pipeline are hermetically connected with a water outlet and a water inlet of the heat absorption part through the pipe joints; and the installation part is provided with a plurality of groups of installation positions so as to install the heat absorption part on the main boards of different models. The invention has the advantages that the water-cooled radiator has good sealing performance and can prevent the leakage of cooling liquid; the novel mainboard assembling device is suitable for various models of mainboards, wide in application range and simple and convenient to install and disassemble.
However, the patent only discloses that the cooling liquid circularly flows between the heat dissipation part and the heat absorption part, but the cooling liquid cannot be subjected to temperature reduction treatment below normal temperature, and the temperature of the cooling liquid is gradually increased after long-term circulation; and the coolant liquid of radiating part flows through, though short heat dissipation, the temperature of coolant liquid still is higher than normal atmospheric temperature, and that will gradually add up a definite value at the temperature of coolant liquid in long-time use, even if can not make the temperature of coolant liquid reduce to normal atmospheric temperature through radiating part yet, will lead to the water-cooling effect to progressively worsen like this, especially present computer chip mostly is multicore chip universal applications such as dual-core, quad-core. The heat productivity of the core is mainly determined by the core technology of the chip, and the multi-core heat of the chip of the same generation is larger than the single-core heat.
Therefore, a high performance water-cooled chip heat sink is needed.
Disclosure of Invention
In view of the above, the present invention provides a water-cooling chip heat sink.
In order to solve the technical problem, the technical scheme of the invention is as follows: the utility model provides a water-cooling type chip radiator, includes the heat dissipation mounting bracket, sets up the heat dissipation circulation chamber of heat dissipation mounting bracket top, circulation pipe group is installed to the heat dissipation circulation chamber, reaches the refrigerator that passes through circulation pipe group link with the heat dissipation circulation chamber, the refrigerator includes the refrigeration frame, sets up at the inside stock solution room of refrigeration frame, and set up stock solution room one side, be used for driving the water pump of water liquid circulation, set up and be in stock solution room bottom has set gradually refrigeration semiconductor piece, heat conduction copper sheet, radiating fin and radiator fan downwards, stock solution room one side still is provided with the power that is used for water-feeding pump, refrigeration semiconductor piece and radiator fan power supply.
Preferably, a sealed heat dissipation chamber bin is arranged inside the heat dissipation circulation chamber, the sealed heat dissipation chamber bin is provided with a water outlet and a water inlet which are communicated with the outside, a heat conduction copper disc is arranged at the bottom of the sealed heat dissipation chamber bin, four fixing holes are distributed in the annular array on the periphery of the heat dissipation chamber bin, and the fixing holes in the two sides of the water outlet and the water inlet are respectively provided with a transverse threaded hole.
Preferably, the heat dissipation circulation chamber and the circulation pipeline group are fixedly installed through a pipe joint, a plurality of sealing grooves are annularly formed in the pipe joint, sealing gaskets are annularly arranged on the sealing grooves, and the pipe joint is in sealing connection with a water outlet and a water inlet of the heat dissipation circulation chamber through the sealing gaskets.
Preferably, the pipe joint and the heat dissipation circulation chamber are fixedly installed through a fixing plate, the fixing plate is provided with a groove for embedding the pipe joint, and through holes are further formed in two sides of the fixing plate.
Preferably, the through hole of the fixing plate is aligned with the center of the transverse threaded hole for bolt fixing connection.
Preferably, the circulating pipeline group is provided with a water outlet pipe and a water inlet pipe.
Preferably, the water outlet pipe structure layer is a soft copper pipe layer, a reflection film layer, a pearl bubble film layer and an outer rubber pipe layer from inside to outside.
Preferably, the reflecting film layer consists of an air cushion film, a common aluminum-plated film or a plastic-coated aluminum-plated film; and a layer of common aluminum-plated film or a plastic-coated aluminum-plated film is compounded on two surfaces of the air cushion film through an adhesive layer in a hot-pressing mode.
Preferably, the water outlet pipe and the water inlet pipe have the same hierarchical structure.
The technical effects of the invention are mainly embodied as follows: according to the invention, the liquid storage chamber stores cooling liquid, the refrigeration semiconductor wafer can cool the cooling liquid, so that the temperature of the cooling liquid is lower than the normal temperature, and the water pump sends the low-temperature cooling liquid to the heat dissipation circulation chamber, thereby cooling the computer chip; the cooling fan can strengthen the air flow among the cooling fins, and carry out heat dissipation and cooling on the refrigeration semiconductor wafer, thereby ensuring that the refrigeration semiconductor wafer continuously cools the cooling liquid; thereby realizing the low-temperature heat dissipation of the cooling liquid for the computer chip.
Drawings
FIG. 1 is a block diagram of a water-cooled chip heat sink according to the present invention;
FIG. 2 is a block diagram of the heat dissipation cycle chamber and pipe joint of FIG. 1;
FIG. 3 is a view showing an internal structure of the refrigerator of FIG. 1;
fig. 4 is a structural view of the water outlet pipe and the water inlet pipe in fig. 1.
Detailed Description
The following detailed description of the embodiments of the present invention is provided in order to make the technical solution of the present invention easier to understand and understand.
In the present embodiment, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description of the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a bolt fixing manner, a pin connecting manner, or the like, which is commonly used in the prior art, and therefore, details thereof are not described in the present embodiment.
A water-cooling chip radiator is shown in figures 1-2 and comprises a radiating mounting frame 1, a radiating circulation chamber 2 arranged above the radiating mounting frame 1, a circulation pipeline group 3 arranged on the radiating circulation chamber 2, and a refrigerator 4 connected with the radiating circulation chamber 2 through the circulation pipeline group 3.
Inside sealed heat dissipation room storehouse 21 that is provided with of heat dissipation circulation room 2, sealed heat dissipation room storehouse 21 is provided with outside delivery port 22 of intercommunication and water inlet 23, sealed heat dissipation room storehouse 21 bottom is provided with heat conduction copper dish 24, and is concrete, be connected through heat dissipation silica gel between 2 bottoms of heat dissipation circulation room and the computer chip, heat conduction copper dish 24 can accelerate the heat exchange between the inside coolant liquid in sealed heat dissipation room storehouse 21 and the computer chip for the cooling to the computer chip. Four fixing holes 25 are distributed in the periphery of the heat dissipation chamber 21 in an annular array, and specifically, the four fixing holes 25 can enable the heat dissipation chamber 21 to be fixedly installed on a computer chip. The fixing holes 25 on both sides of the water outlet 22 and the water inlet 23 are also respectively provided with a transverse threaded hole 26. In particular, the transverse threaded hole 26 is used for mounting a fixing plate 27.
The heat dissipation circulation chamber 2 is installed fixedly with circulation pipeline group 3 through coupling 6, the annular is provided with a plurality of seal groove 61, a plurality of on the coupling 6 equal annular is provided with seal ring 62 on the seal groove 61, seal ring 62 makes delivery port 22 and the water inlet 23 realization sealed the linking of coupling 6 and heat dissipation circulation chamber 2. Specifically, the sealing washer 62 enables the pipe joint 6 to be in interference fit with the water outlet 22 and the water inlet 23 respectively, so as to prevent liquid leakage.
The pipe joint 6 and the heat dissipation circulation chamber 2 are fixedly installed through a fixing plate 27, the fixing plate 27 is provided with a groove 271 for embedding the pipe joint 6, and through holes 272 are further formed in two sides of the fixing plate 27. The through hole 272 of the fixing plate 27 is aligned with the center of the transverse threaded hole 26 for bolt fixing connection. Specifically, the fixing plate 27 reinforces the connection between the pipe joint 6 and the heat dissipation circulation chamber 2, and prevents the pipe joint 6 from being washed away from the heat dissipation circulation chamber 2 by hydraulic impact force, so that liquid leaks.
As shown in fig. 3, the refrigerator 4 includes a refrigerator frame 41, and a reservoir 42 disposed inside the refrigerator frame 41, specifically, the reservoir 42 is used for storing a cooling liquid. And a water pump 43 arranged on one side of the liquid storage chamber 42 and used for driving water liquid to circulate, specifically, the water pump 43 is communicated with the circulating pipeline group 3, and the cooling liquid in the liquid storage chamber 42 is pumped and sent into the sealed heat dissipation chamber 21 through the water pump 43. The refrigeration semiconductor fins 43 are sequentially arranged at the bottom of the liquid storage chamber 42 downwards, and specifically, the refrigeration semiconductor fins 43 can cool the cooling liquid in the liquid storage chamber 42. The heat conducting copper sheet 44, specifically, the heat conducting copper sheet 44 can conduct the heat energy at the bottom of the refrigeration semiconductor wafer 43 to the heat dissipation fins 45. The heat dissipation fins 45 and the heat dissipation fan 46, specifically, the heat dissipation fan 46 accelerates the air flow between the heat dissipation fins 45, and enhances the heat dissipation effect of the heat dissipation fins 45. A power supply 47 for supplying power to the water pump 43, the refrigeration semiconductor wafer 43 and the heat dissipation fan 46 may be further provided on the reservoir 42 side.
In particular, the semiconductor chilling plate is a heat transfer tool. When a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material has current flowing through the pair, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. But the semiconductor itself presents a resistance that will generate heat when current passes through the semiconductor, thereby affecting heat transfer. But the heat between the two plates is also transferred through the air and the semiconductor material itself in a reverse direction. When the cold end and the hot end reach a certain temperature difference and the heat transfer amounts of the two types are equal, a balance point is reached, and the positive heat transfer and the reverse heat transfer are mutually counteracted. The temperature of the cold and hot ends will not change continuously. In order to reach lower temperature, the temperature of the hot end can be reduced by adopting a heat dissipation mode and the like.
As shown in fig. 4, the circulation pipe group 3 is provided with an outlet pipe 31 and an inlet pipe 32. The structure layers of the water outlet pipe 31 are a soft copper pipe layer 311, a reflection film layer 312, a pearl bubble film layer 313 and an outer rubber pipe layer 314 from inside to outside. The reflection film layer 312 is composed of an air cushion film, a common aluminum-plated film or a plastic-coated aluminum-plated film; and a layer of common aluminum-plated film or a plastic-coated aluminum-plated film is compounded on two surfaces of the air cushion film through an adhesive layer in a hot-pressing mode. The water outlet pipe 31 and the water inlet pipe 32 have the same hierarchical structure. Specifically, the cooling liquid is input into the water outlet pipe 31 and the water inlet pipe 3 and is conveyed to the sealed heat dissipation chamber 21, the reflection film layer 312 is used for blocking the heat from radiating outwards, and the heat preservation effect can be achieved by combining the use of the pearl bubble film layer 313; so that the water drops are not condensed on the exterior of the water outlet pipe 31 and the water inlet pipe 3 because of the cold air.
The working principle is as follows: heat dissipation circulation chamber 2 is installed on the computer chip through heat dissipation mounting bracket 1, scribble heat dissipation silica gel between heat dissipation circulation chamber 2 and the computer chip, heat dissipation circulation chamber 2 is installed fixedly through coupling 6 with circulating line group 3, refrigerator 4 is placed at computer machine case outside, refrigeration semiconductor wafer 43 can be to the coolant liquid in the stock solution room 42 processing of cooling down, is sent into sealed heat dissipation chamber storehouse 21 by the extraction of coolant liquid in the water pump 43 with the stock solution room 42 again, heat conduction copper dish 24 can accelerate the heat exchange between the inside coolant liquid in sealed heat dissipation chamber storehouse 21 and the computer chip for the cooling to the computer chip.
The technical effects of the invention are mainly embodied as follows: according to the invention, the liquid storage chamber stores cooling liquid, the refrigeration semiconductor wafer can cool the cooling liquid, so that the temperature of the cooling liquid is lower than the normal temperature, and the low-temperature cooling liquid is sent to the heat dissipation circulating chamber by the water pump, so that the computer chip is cooled; the cooling fan can strengthen the air flow among the cooling fins, carry out heat dissipation and cooling on the refrigerating semiconductor wafer and ensure that the refrigerating semiconductor wafer continuously cools the cooling liquid; thereby realizing the low-temperature heat dissipation of the cooling liquid for the computer chip.
The above are only typical examples of the present invention, and besides, the present invention may have other embodiments, and all the technical solutions formed by equivalent substitutions or equivalent changes are within the scope of the present invention as claimed.
Claims (9)
1. The utility model provides a water-cooling type chip radiator, includes the heat dissipation mounting bracket, sets up the heat dissipation circulation chamber of heat dissipation mounting bracket top, circulation pipeline group is installed to the heat dissipation circulation chamber, reaches the refrigerator through circulation pipeline group link with the heat dissipation circulation chamber, a serial communication port, the refrigerator includes the refrigeration frame, sets up at the inside stock solution room of refrigeration frame, and set up stock solution room one side, be used for driving the water pump of water liquid circulation, set up and be in stock solution room bottom has set gradually refrigeration semiconductor piece, heat conduction copper sheet, radiating fin and radiator fan downwards, stock solution room one side still is provided with the power that is used for water-feeding pump, refrigeration semiconductor piece and radiator fan power supply.
2. The water-cooling chip radiator according to claim 1, wherein a sealed radiating chamber is arranged inside the radiating circulation chamber, the sealed radiating chamber is provided with a water outlet and a water inlet which are communicated with the outside, a heat conducting copper disc is arranged at the bottom of the sealed radiating chamber, four fixing holes are distributed in an annular array on the periphery of the radiating chamber, and transverse threaded holes are respectively formed in the fixing holes on two sides of the water outlet and the water inlet.
3. The water-cooled chip radiator according to claim 2, wherein the heat-dissipating circulation chamber and the circulation pipe set are fixed by a pipe joint, the pipe joint is annularly provided with a plurality of sealing grooves, each of the plurality of sealing grooves is annularly provided with a sealing gasket, and the sealing gaskets enable the pipe joint to be hermetically connected with the water outlet and the water inlet of the heat-dissipating circulation chamber.
4. The water-cooled chip heat sink as claimed in claim 3, wherein the pipe joint and the heat-dissipating circulation chamber are fixed by a fixing plate, the fixing plate is provided with a groove for inserting the pipe joint, and through holes are further provided on both sides of the fixing plate.
5. The water-cooled chip heat sink of claim 1, wherein: and the through hole of the fixing plate is aligned with the center of the transverse threaded hole to be fixedly connected with the bolt.
6. The water-cooled chip heat sink of claim 1, wherein: the circulating pipeline group is provided with a water outlet pipe and a water inlet pipe.
7. The water-cooled chip heat sink of claim 6, wherein: the water outlet pipe structure layer is respectively a soft copper pipe layer, a reflection film layer, a pearl bubble film layer and an outer rubber pipe layer from inside to outside.
8. The water-cooled chip heat sink of claim 7, wherein: the reflecting film layer consists of an air cushion film, a common aluminum-plated film or a plastic-coated aluminum-plated film; and a layer of common aluminum-plated film or a plastic-coated aluminum-plated film is compounded on two surfaces of the air cushion film through an adhesive layer in a hot-pressing mode.
9. The water-cooled chip heat sink of claim 6, wherein: the water outlet pipe and the water inlet pipe are identical in hierarchical structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211131845.5A CN115629658A (en) | 2022-09-16 | 2022-09-16 | Water-cooling type chip radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211131845.5A CN115629658A (en) | 2022-09-16 | 2022-09-16 | Water-cooling type chip radiator |
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| Publication Number | Publication Date |
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| CN115629658A true CN115629658A (en) | 2023-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211131845.5A Pending CN115629658A (en) | 2022-09-16 | 2022-09-16 | Water-cooling type chip radiator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116301264A (en) * | 2023-05-18 | 2023-06-23 | 成都特锐泰雷兹电子应用科技有限公司 | Miniature liquid cold source and working method thereof |
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2022
- 2022-09-16 CN CN202211131845.5A patent/CN115629658A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116301264A (en) * | 2023-05-18 | 2023-06-23 | 成都特锐泰雷兹电子应用科技有限公司 | Miniature liquid cold source and working method thereof |
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