CN220750545U - Temperature fast switching device capable of meeting semiconductor process requirements - Google Patents
Temperature fast switching device capable of meeting semiconductor process requirements Download PDFInfo
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- CN220750545U CN220750545U CN202322350304.8U CN202322350304U CN220750545U CN 220750545 U CN220750545 U CN 220750545U CN 202322350304 U CN202322350304 U CN 202322350304U CN 220750545 U CN220750545 U CN 220750545U
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 230000008569 process Effects 0.000 title claims abstract description 17
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 65
- 239000012530 fluid Substances 0.000 claims abstract description 59
- 238000005192 partition Methods 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims description 21
- 238000004891 communication Methods 0.000 claims description 13
- 239000007769 metal material Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 claims description 3
- 230000004044 response Effects 0.000 abstract description 5
- 238000005057 refrigeration Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a temperature rapid switching device capable of meeting the requirements of a semiconductor process, which is applied to the technical field of temperature control equipment, and the technical scheme is as follows: the water storage tank is internally and fixedly provided with a partition board for dividing the water storage tank into a high-temperature area and a low-temperature area, the water storage tank is fixedly provided with a first communicating valve and a second communicating valve respectively in the high-temperature area and the low-temperature area, the first communicating valve is provided with a high-temperature inlet connected with a water chilling unit, the second communicating valve is provided with a low-temperature outlet used for providing cooled fluid for the water chilling unit, a communicating pipeline is arranged between the first communicating valve and the second communicating valve, and the communicating pipeline is provided with a control valve; the method has the technical effects that: the structure is simple, the temperature can be switched rapidly while the power is kept unchanged, and the temperature response efficiency is high.
Description
Technical Field
The utility model relates to the technical field of temperature control equipment, in particular to a temperature rapid switching device capable of meeting the requirements of a semiconductor process.
Background
The existing water chiller temperature control equipment is generally provided with two modules for refrigerating and heating, the two modules are matched with each other according to the requirement to realize temperature control, but any temperature change needs a time process, particularly the refrigerating process, because of the specificity, the required time is generally longer than the heating time, but the rapid response of an advanced semiconductor process technology to the temperature also puts forward higher requirements, the existing water chiller temperature control equipment usually realizes the reduction of the temperature change time by increasing the refrigerating power, but the energy consumption is increased, the control requirements on components are also increased, and the requirement for improvement is necessary;
disclosure of Invention
The utility model aims to provide a temperature rapid switching device capable of meeting the requirements of a semiconductor process, and the temperature rapid switching device has the advantages of simple structure, capability of realizing rapid switching of temperature while keeping the power unchanged and high temperature response efficiency.
The technical aim of the utility model is realized by the following technical scheme: a temperature fast switching device capable of meeting the requirements of a semiconductor process comprises a water storage tank; the water storage tank is internally and fixedly provided with a partition plate for dividing the water storage tank into a high-temperature area and a low-temperature area, the water storage tank is fixedly provided with a first communicating valve and a second communicating valve respectively in the high-temperature area and the low-temperature area, the first communicating valve is provided with a high-temperature inlet for connecting a water chilling unit and for collecting surplus fluid of the water chilling unit, the second communicating valve is provided with a low-temperature outlet for providing cooled fluid for the water chilling unit, a communicating pipeline for guiding the fluid in the high-temperature area into the low-temperature area and guaranteeing sufficient fluid supply is arranged between the first communicating valve and the second communicating valve, and the communicating pipeline is provided with a control valve.
The utility model is further provided with: the height of the partition is not higher than the height of the water storage tank so that heat transfer of fluid between the high temperature region and the low temperature region is achieved.
The utility model is further provided with: the water storage tank is provided with a liquid level switch for measuring the liquid level of the fluid in the high temperature area and the low temperature area, and meanwhile, two sides of the water storage tank are provided with liquid level meters for visually observing the liquid level of the fluid in the high temperature area and the low temperature area.
The utility model is further provided with: and an overflow pipeline for avoiding overhigh fluid level is fixedly arranged at the top of the water storage tank.
The utility model is further provided with: the first communication valve is higher than the second communication valve.
The utility model is further provided with: the water storage tank shell is made of metal materials, and the partition plate is made of heat insulation plate materials.
The utility model is further provided with: the water storage tank is fixedly provided with a plurality of mounting holes for facilitating mounting.
In summary, the utility model has the following beneficial effects:
1. the high-temperature inlet is arranged in the high-temperature area, and the low-temperature outlet is arranged in the low-temperature area, so that the hot fluid and the cold fluid are unavoidable in the running process of the water chilling unit, the surplus fluid of the water chilling unit is led into the high-temperature area through the high-temperature inlet, the fluid in the high-temperature area is led into the low-temperature area through the communication pipeline to ensure sufficient fluid in the low-temperature area, when refrigeration is required, the fluid stored in the low-temperature area is discharged through the low-temperature outlet and mixed with the fluid to be refrigerated, so that the temperature of the fluid is primarily reduced, and the fluid after primary cooling is cooled in a refrigerating module entering the water chilling unit, so that the refrigerating time is reduced, the quick temperature reduction is realized on the basis of ensuring the constant refrigerating power, the refrigerating efficiency and the response efficiency of the temperature are improved, the structure is simple, and the device is easy to upgrade and reform the existing water chilling unit;
2. the height of the partition plate is not higher than that of the water storage tank, the partition plate is made of heat insulation plate materials, so that fluid between the high-temperature area and the low-temperature area can be subjected to air heat transfer, the temperature of the fluid in the high-temperature area is reduced, the temperature of the fluid in the low-temperature area is not influenced by too low temperature drop, and meanwhile, the water storage tank is made of metal materials, so that the temperature exchange rate of the fluid in the water storage tank and the outside is improved, and the temperature drop rate is improved;
3. the first communication valve is higher than the second communication valve, so that fluid in the high-temperature region can smoothly enter the low-temperature region, and the loss of kinetic energy caused by flowing in the communication pipeline is avoided.
Drawings
Fig. 1 is a schematic overall structure of the present embodiment;
fig. 2 is a structural cross-sectional view of the whole of the present embodiment.
Reference numerals: 1. a water storage tank; 11. a partition plate; 12. a high temperature zone; 13. a low temperature zone; 14. a first communication valve; 15. a second coupling valve; 16. a high temperature inlet; 17. a low temperature outlet; 18. a communicating pipeline; 19. a control valve; 2. a liquid level switch; 3. a liquid level gauge; 4. an overflow pipe; 5. and (5) mounting holes.
Detailed Description
The present utility model will be described in further detail with reference to the accompanying drawings.
Examples:
referring to fig. 1 and 2, a temperature fast switching device capable of meeting the requirements of a semiconductor process comprises a water storage tank 1, wherein a partition 11 is fixedly arranged in the water storage tank 1 and is used for dividing the water storage tank 1 into a high temperature area 12 and a low temperature area 13, a first communicating valve 14 and a second communicating valve 15 are respectively fixedly arranged in the high temperature area 12 and the low temperature area 13, a high temperature inlet 16 for collecting surplus fluid of the water chiller is arranged on the first communicating valve 14, a low temperature outlet 17 for providing cooled fluid for the water chiller is arranged on the second communicating valve 15, a communicating pipeline 18 for guiding the fluid in the high temperature area 12 into the low temperature area 13 and ensuring sufficient fluid supply is arranged between the first communicating valve 14 and the second communicating valve 15, the first communicating valve 14 is higher than the second communicating valve 15, so that the fluid in the high temperature area 12 can smoothly enter the low temperature area 13 to avoid the loss of kinetic energy caused by flowing in the communication pipeline, the communication pipeline 18 is provided with a control valve 19 for controlling the fluid to flow into the low temperature area 13 from high temperature, and the surplus fluid of the water chiller is led into the high temperature area 12 through the high temperature inlet 16 and the fluid in the high temperature area 12 is led into the low temperature area 13 through the communication pipeline 18 to ensure sufficient fluid in the low temperature area 13, when refrigeration is needed, the fluid stored in the low temperature area 13 is discharged through the low temperature outlet 17 and mixed with the fluid to be refrigerated to primarily reduce the temperature of the fluid, the fluid after primarily cooling is cooled in the refrigeration module of the water chiller, thereby reducing the refrigeration time, and realize the rapid cooling on the basis of guaranteeing the invariable refrigeration power in order to realize the rapid switching of temperature, promoted refrigeration efficiency and response efficiency of temperature.
Referring to fig. 2, specifically, the height of the partition 11 is not higher than the height of the water storage tank 1 so as to realize heat transfer of fluid between the high temperature area 12 and the low temperature area 13, meanwhile, the casing of the water storage tank 1 is made of metal materials, the partition 11 is made of heat insulation board materials, so that the fluid between the high temperature area 12 and the low temperature area 13 can perform air heat transfer, the temperature of the fluid in the high temperature area 12 is reduced, the temperature of the fluid in the low temperature area 13 is not influenced too slowly, and meanwhile, the temperature of the fluid in the low temperature area 13 is improved by setting the water storage tank 1 to be made of metal materials so as to improve the temperature exchange rate of the fluid in the water storage tank 1 and the outside, and the temperature reduction speed is improved. In the present embodiment, the water tank 1 is made of stainless steel, and a metal such as aluminum alloy may be used.
Referring to fig. 1, specifically, the water tank 1 is provided with a liquid level switch 2 for measuring the liquid level in the high temperature area 12 and the low temperature area 13, meanwhile, two sides of the water tank 1 are provided with a liquid level meter 3 for visually observing the liquid level in the high temperature area 12 and the low temperature area 13, and the liquid level in the water tank 1 can be judged by observing the signal of the liquid level switch 2 or by observing the liquid level meter 3, so that the flow of the fluid can be realized by conveniently adjusting the switch of the control valve 19, meanwhile, the liquid level meter 3 can also help to observe and confirm when the liquid level switch 2 fails, and an overflow pipeline 4 for avoiding the overhigh liquid level is fixedly arranged at the top position of the water tank 1, so that the damage of the water tank 1 caused by the overhigh liquid level in the water tank 1 is avoided.
Referring to fig. 1, specifically, a plurality of mounting holes 5 for facilitating installation are fixedly arranged on a water storage tank 1, and the water storage tank 1 can be conveniently fixed on a water chiller through the mounting holes 5 so as to be convenient for refitting an existing water chiller.
The use process is briefly described: the surplus fluid of the water chilling unit is firstly led into the high-temperature area 12 through the high-temperature inlet 16, the fluid of the high-temperature area 12 is led into the low-temperature area 13 through the communication pipeline 18 to ensure sufficient fluid of the low-temperature area 13, the fluid in the water storage tank 1 is cooled through exchanging with outside air, when refrigeration is required, the fluid stored in the low-temperature area 13 is discharged through the low-temperature outlet 17 and mixed with the fluid required to be refrigerated, so that the temperature of the fluid is primarily reduced, and the fluid after primary cooling is rapidly cooled in the refrigerating module entering the water chilling unit.
The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and modifications to the present embodiment which may creatively contribute to the present utility model as required may be made by those skilled in the art after reading the present specification, but are protected by patent laws within the scope of claims of the present utility model.
Claims (7)
1. A temperature fast switching device capable of meeting the requirements of semiconductor technology comprises a water storage tank (1); the water storage tank (1) is fixedly provided with a partition plate (11) and is used for dividing the water storage tank (1) into a high-temperature area (12) and a low-temperature area (13), the water storage tank (1) is fixedly provided with a first communicating valve (14) and a second communicating valve (15) respectively in the high-temperature area (12) and the low-temperature area (13), the first communicating valve (14) is provided with a high-temperature inlet (16) for collecting surplus fluid of the water chiller, the second communicating valve (15) is provided with a low-temperature outlet (17) for providing cooled fluid for the water chiller, a communicating pipeline (18) for guiding the fluid in the high-temperature area (12) into the low-temperature area (13) so as to ensure sufficient fluid supply is arranged between the first communicating valve (14) and the second communicating valve (15), and the communicating pipeline (18) is provided with a control valve (19).
2. A fast switching device for temperature capable of meeting the requirements of semiconductor processes according to claim 1, characterized in that the height of the partition (11) is not higher than the height of the water storage tank (1) so as to enable the heat transfer of the fluid between the high temperature zone (12) and the low temperature zone (13).
3. A rapid temperature switching device capable of meeting semiconductor process requirements according to claim 1, characterized in that the water storage tank (1) is provided with a liquid level switch (2) for measuring the liquid level of the fluid in the high temperature zone (12) and the low temperature zone (13), and simultaneously, two sides of the water storage tank (1) are provided with liquid level meters (3) for visually observing the liquid level of the fluid in the high temperature zone (12) and the low temperature zone (13).
4. A rapid temperature switching device capable of meeting semiconductor process requirements according to claim 3, characterized in that the top position of the water storage tank (1) is fixedly provided with an overflow pipe (4) for avoiding overhigh fluid level.
5. A fast switching device for temperature capable of meeting semiconductor process requirements according to claim 1, characterized in that the first communication valve (14) is arranged higher than the second communication valve (15).
6. The rapid temperature switching device capable of meeting the requirements of the semiconductor process according to claim 1, wherein the shell of the water storage tank (1) is made of metal materials, and the partition plate (11) is made of heat insulation plate materials.
7. The rapid temperature switching device capable of meeting the requirements of semiconductor technology according to claim 1, wherein a plurality of mounting holes (5) for facilitating mounting are fixedly arranged on the water storage tank (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322350304.8U CN220750545U (en) | 2023-08-30 | 2023-08-30 | Temperature fast switching device capable of meeting semiconductor process requirements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322350304.8U CN220750545U (en) | 2023-08-30 | 2023-08-30 | Temperature fast switching device capable of meeting semiconductor process requirements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220750545U true CN220750545U (en) | 2024-04-09 |
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ID=90565727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322350304.8U Active CN220750545U (en) | 2023-08-30 | 2023-08-30 | Temperature fast switching device capable of meeting semiconductor process requirements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220750545U (en) |
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2023
- 2023-08-30 CN CN202322350304.8U patent/CN220750545U/en active Active
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