CN111457617A - Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment - Google Patents
Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment Download PDFInfo
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- CN111457617A CN111457617A CN201910026792.2A CN201910026792A CN111457617A CN 111457617 A CN111457617 A CN 111457617A CN 201910026792 A CN201910026792 A CN 201910026792A CN 111457617 A CN111457617 A CN 111457617A
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- 238000001816 cooling Methods 0.000 title claims abstract description 43
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 42
- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000005057 refrigeration Methods 0.000 claims abstract description 62
- 239000000110 cooling liquid Substances 0.000 claims abstract description 38
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 31
- 230000017525 heat dissipation Effects 0.000 claims description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000004891 communication Methods 0.000 claims description 9
- 238000012544 monitoring process Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 230000003993 interaction Effects 0.000 claims description 3
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/005—Arrangement or mounting of control or safety devices of safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The refrigeration chip comprises a plurality of refrigeration modules, each refrigeration module comprises a P-type material and an N-type material, and two ends of the P-type material and the N-type material are respectively connected by a metal conductor; the surface of the hot end of the refrigeration chip is connected with a base of a radiating block, and the radiating surface of the radiating block is communicated with cooling liquid in the heat exchange plate; the cold end of the refrigeration chip is communicated with the reaction cavity. The direct cooling machine comprises a heat exchanger, a cooling liquid tank, a pump and a plurality of pipelines, wherein cooling liquid in the cooling liquid tank is pressurized by the pump and is conveyed to a heat exchange plate of the heat exchanger through the pipelines, and the cooling liquid is refluxed to the cooling liquid tank after heat is carried away; while the other heat exchange plate is connected to the reaction chamber. The invention utilizes the semiconductor temperature control chip to control the temperature of the reaction cavity, so that the temperature control precision and the energy consumption are obviously improved.
Description
Technical Field
The invention relates to accurate temperature control equipment for semiconductor production, in particular to a heat exchanger and a direct cooling machine for controlling the temperature of a reaction cavity of semiconductor equipment.
Background
In the semiconductor manufacturing industry, a direct cooling machine is generally adopted for controlling the temperature of a process reaction cavity (namely a wafer chuck); the conventional compressor is usually adopted in the conventional direct cooling machine, so that the energy consumption is high, the temperature control precision is poor, and the high-precision semiconductor production requirement cannot be met.
Chinese patent No. CN 201320656711.5 provides a semiconductor temperature control storage device, which comprises a box body, wherein: the semiconductor refrigeration system comprises a semiconductor refrigeration piece, wherein one end of the semiconductor refrigeration piece is connected with the water cooling head and exchanges heat with liquid in the water cooling head, and the other end of the semiconductor refrigeration piece is connected with a radiating fin and exchanges heat with the outside of the box body; the water circulating system realizes heat exchange with the semiconductor refrigerating sheet and provides cold air or hot air into the box body; the control chip comprises a singlechip, a driving water circulation system and a semiconductor system, has low manufacturing cost and is suitable for constant-temperature sealed storage of articles with smaller volume.
Disclosure of Invention
The invention aims to solve the existing problems and provide a heat exchanger and a direct cooling machine for controlling the temperature of a reaction cavity of semiconductor equipment.
In order to achieve the purpose, the technical scheme adopted by the invention comprises a refrigeration chip, a heat dissipation block and a heat exchange plate, wherein:
the refrigeration chip comprises a plurality of refrigeration modules, each refrigeration module comprises a P-type material and an N-type material, and two ends of each P-type material and two ends of each N-type material are respectively connected by a metal conductor;
the surface of one end of the refrigeration chip is connected with a base of a radiating block, and a radiating surface of the radiating block is communicated with cooling liquid in the heat exchange plate; the other end of the refrigeration chip is communicated with the reaction cavity.
The refrigeration device comprises a plurality of refrigeration chips which are electrically connected in parallel, wherein a heat exchange plate is shared between the adjacent refrigeration chips, namely, two sides of the heat exchange plate are respectively connected with heat dissipation surfaces of two heat dissipation blocks; and the other end of the refrigeration chip is respectively communicated with the reaction cavities.
The refrigeration device comprises a plurality of refrigeration chips which are electrically connected in series, namely a heat exchange plate is provided with a plurality of refrigeration chips, the surface of one end of each refrigeration chip is connected with one side of a heat dissipation block, and the heat dissipation surfaces of the heat dissipation blocks are respectively communicated with cooling liquid in the heat exchange plate; and the other end of the refrigeration chip is communicated with the reaction cavity.
The liquid cooling channel is arranged in the heat exchange plate, and the heat dissipation surface of the heat dissipation block is immersed in the liquid cooling channel.
The liquid channel is provided with a water inlet and a water outlet at two ends of the side edge of the heat exchange plate respectively, and a liquid cooling channel is arranged between the water inlet and the water outlet; the liquid cooling channel is immersed in the space between the periphery of the liquid cooling channel and the heat dissipation surface.
The heat-radiating block is characterized by further comprising a sealing ring, the heat-exchanging plate is provided with a mounting port, one side of the mounting port is communicated with cooling liquid, the other side of the mounting port is connected with a heat-radiating block, a heat-radiating surface of the heat-radiating block is immersed in the cooling liquid, and the sealing ring is arranged on the connecting surface of the mounting port and the base of the heat-radiating block.
And moisture-proof, corrosion-proof and static-proof PTFE layers are respectively arranged on the surfaces of the cold end and the hot end of the refrigeration chip.
The other end of the refrigeration chip is connected with another heat exchange plate through a heat dissipation block, and the other heat exchange plate is communicated with the reaction cavity.
The invention also provides a direct cooling machine for controlling the temperature of the reaction cavity of the semiconductor equipment, which comprises the heat exchanger, a cooling liquid tank, a pump and a plurality of pipelines, wherein the cooling liquid in the cooling liquid tank is pressurized by the pump and is conveyed to a heat exchange plate of the heat exchanger through the pipelines, and flows back to the cooling liquid tank after heat is removed, so that liquid circulation is formed; while the other heat exchange plate is connected to the reaction chamber.
The liquid circulation system further comprises a one-way valve, and the one-way valve is arranged on any pipeline for liquid circulation.
The device comprises a heat exchanger, a temperature switch, a temperature sensor and a temperature sensor, wherein the heat exchanger is arranged in the heat exchanger; the temperature switch is arranged on the heating circuit bus; the temperature switch can disconnect and connect the heating circuit according to a set temperature range.
The heating device also comprises a controller and a power supply for supplying power to the controller, wherein the controller is respectively connected with and controls the pump and the heating circuit; the controller also carries out human-computer interaction through a touch screen; and stores the information through the USB interface.
The monitoring system comprises a plurality of direct cooling machines, communication modules are arranged on the direct cooling machines respectively and connected with the server respectively, and the communication modules transmit working state information to the server; the server is connected with the terminal display.
Compared with the prior art, the invention utilizes the semiconductor temperature control chip to control the temperature of the reaction cavity, so that the temperature control precision and the energy consumption are obviously improved; the heat exchanger provided by the invention has the advantages of good refrigeration effect and rapid cooling, and the quantity and the connection mode can be conveniently adjusted according to the requirement.
Drawings
FIG. 1 is a schematic view of a heat exchanger according to an embodiment;
FIG. 2 is a schematic view of a heat exchanger according to an embodiment;
FIG. 3 is a schematic structural view of a heat exchanger according to a second embodiment;
FIG. 4 is a schematic structural view of a heat exchanger according to a second embodiment;
FIG. 5 is a schematic structural view of a third heat exchanger according to an embodiment;
FIG. 6 is a schematic structural view of a third heat exchanger according to an embodiment;
FIG. 7 is a schematic structural disassembly diagram of the vertical cooler;
FIG. 8 is a schematic structural view of an over-temperature protection device;
FIG. 9 is a schematic diagram of a liquid cooling channel;
FIG. 10 is a schematic structural diagram of a refrigeration chip;
fig. 11 is a schematic structural diagram of a monitoring system.
Detailed Description
The invention will now be further described with reference to the accompanying drawings.
Example one
Referring to fig. 1 and 2, fig. 1 and 2 show a first embodiment of the present invention, a single unit heat exchanger including a refrigerant chip, a heat dissipating block and a heat exchange plate, wherein:
the refrigeration chip comprises a plurality of refrigeration modules, each refrigeration module comprises a P-type material and an N-type material, and two ends of each P-type material and two ends of each N-type material are respectively connected by a metal conductor.
The surface of the hot end of the refrigeration chip is connected with a base of a radiating block, and the radiating surface of the radiating block is communicated with cooling liquid in the heat exchange plate; the cold end of the refrigeration chip is communicated with the reaction cavity.
The refrigeration chip operates after power is applied (turning on both pins of the refrigeration chip), and a positive voltage applied to the N-type material drives electrons from the P-type to the N-type material and back to the voltage source. The temperature of the cold end decreases with the heat absorption. The heat is then conducted to the hot side for dissipation through the heat sink. If the voltage is reversed, the above is also reversed.
The temperature control precision and the energy consumption of the refrigeration chip for controlling the temperature of the reaction cavity are obviously improved.
Example two
Referring to fig. 2, fig. 2 shows a second embodiment of the present invention, which includes two electrically parallel-connected cooling chips, and a heat exchange plate is shared between the adjacent cooling chips, that is, two sides of the heat exchange plate are respectively connected to the heat dissipating surfaces of two heat dissipating blocks; and the cold ends of the refrigeration chips are respectively communicated with the reaction cavities.
The working principle is the same as that of the first embodiment; and the circuit is arranged according to the parallel connection relation, so that the refrigeration effect can be adjusted.
EXAMPLE III
Referring to fig. 2, fig. 2 shows a second embodiment of the present invention,
the refrigerating device comprises twelve refrigerating chips which are electrically connected in series, namely a heat exchange plate is provided with a plurality of six refrigerating chips which are connected in series. There are two heat exchanger plates in parallel relationship and thus a total of twelve. The surface of the hot end of the refrigeration chip is connected with one side of the heat dissipation block, and the heat dissipation surfaces of the heat dissipation block are respectively communicated with cooling liquid in the heat exchange plate; and the cold end of the refrigeration chip is communicated with the reaction cavity. The working principle is the same as that of the first embodiment; the circuit is arranged according to the series connection relationship, so that the refrigeration effect can be adjusted; and the number of the refrigeration chips can be increased or reduced according to actual needs, so that the refrigeration effect is further optimized.
Preferably, referring to fig. 9, the heat exchange plate of any of the above embodiments is provided with a liquid cooling channel therein, said liquid cooling channel submerging the heat dissipating surface of said heat dissipating block. The heat dissipation surface of the present embodiment is a plurality of parallel heat dissipation plates. A water inlet and a water outlet are respectively formed in two ends of the side edge of the heat exchange plate, and a liquid cooling channel is arranged between the water inlet and the water outlet. The liquid cooling channel is immersed in the space between the periphery of the liquid cooling channel and the heat dissipation surface. The cooling liquid in the liquid cooling channel can quickly take away the heat coming out from the radiating surface,
the heat exchange plate is provided with a mounting port, one side of the mounting port is communicated with cooling liquid, the other side of the mounting port is connected with a radiating block, the radiating surface of the radiating block is immersed in the cooling liquid, and a sealing ring is arranged on the connecting surface of the mounting port and the base of the radiating block. The sealing ring separates the cooling liquid from the refrigeration chip, and water tightness is guaranteed.
Preferably, referring to fig. 10, the cold end surface and the hot end surface of the refrigeration chip in any of the above embodiments may be further provided with moisture-proof, corrosion-proof and static-proof PTFE layers. PTFE, namely polytetrafluoroethylene, has the effect of protecting metal by spraying after the surface treatment of the metal surface, and has excellent corrosion resistance: chemical corrosion resistance and the like.
Example four
Referring to fig. 7 and 8, the invention further provides a direct cooling machine for controlling the temperature of the reaction cavity of the semiconductor equipment, which comprises a box body, a heat exchanger, a cooling liquid tank, a pump and a plurality of pipelines. The cooling liquid in the cooling liquid tank is pressurized by a pump and is conveyed into a heat exchange plate of a heat exchanger through a pipeline, and the heat exchanger is fixed in the box body through a bracket; after taking away the heat, the liquid flows back to the cooling liquid tank, so that liquid circulation is formed; while the other heat exchange plate is connected to the reaction chamber.
In use, the controller receives a sensed temperature of the process fluid returning from the process reaction chamber (wafer chuck) and varies the temperature of the process fluid supplied to the process reaction chamber by the TE chipset to compensate for changes in process conditions.
The pump is a power device for providing the process cooling liquid for circulation, so that the cooling liquid can circularly flow among the heat exchanger, the cooling liquid tank and the process reaction cavity.
Wherein, referring to fig. 7, a one-way valve is further included, which is provided on any of the pipes for liquid circulation. The cooling liquid in the one-way valve can only flow along the direction of the water inlet, and the medium at the water outlet can not flow back. It is used in hydraulic systems to prevent reverse flow of fluid. When the liquid in the cooling liquid tank is full, the one-way valve can form the circulation of the liquid, and simultaneously can prevent the redundant liquid from entering the cooling liquid tank.
Referring to fig. 8, the heat exchanger further comprises an over-temperature protection device, wherein the over-temperature protection device comprises a temperature switch and a heating circuit, and the temperature switch is fixed on the outer surface of the heat exchanger; the temperature switch is arranged on the heating circuit bus; the temperature switch can disconnect and connect the heating circuit according to the set temperature range and is fixed on the surface of the heat exchanger. When the temperature of the heat exchanger is too high, the temperature switch can cut off the heating circuit; and the circuit is communicated only when the temperature of the heat exchanger returns to normal.
The heating device also comprises a controller and a power supply for supplying power to the controller, wherein the controller is respectively connected with and controls the pump and the heating circuit. (ii) a The controller receives a signal fed back by the main machine station to control the temperature and reach the required condition of the production equipment. The heat dissipation block is added on the control part, so that the heat generated by the control unit can be effectively reduced, and the service life of the unit is prolonged.
The controller also carries out human-computer interaction through a touch screen, and the change of the actual temperature curve can be displayed on the controller, so that a client can conveniently observe the change.
The controller stores information through the USB interface, can download temperature data of nearly three months at the USB interface, and is convenient to solve the problem.
In addition, the heat exchanger is also provided with a partition plate which is used for dividing the electronic control unit and the mechanical part, playing a role of protecting the electronic control unit and simultaneously ensuring that the heat generated by the control part does not influence the normal work of the heat exchanger.
Further, referring to fig. 11, a monitoring system is also provided. The monitoring system comprises a plurality of direct cooling machines, communication modules are respectively arranged on the direct cooling machines and are respectively connected with the server, and the communication modules transmit working state information to the server; the server is connected with the terminal display.
By additionally arranging a set of communication modules (including main stream communication signals such as RS232 and RS 484), different direct cooling machines can carry out real-time communication with the server, so that a user can monitor the working states of all water coolers in real time at a terminal display.
Each terminal display of the system can monitor 255 vertical coolers at the same time. In semiconductor industry factories, the use of direct cooling machines is very extensive, each factory has thousands of direct cooling machine devices, the installation positions of the direct cooling machines are very dispersed, and a user needs to spend a large amount of manpower to patrol every day. By using the central monitoring system of the direct cooling machine, a user can monitor the working condition of each direct cooling machine in real time by a special terminal display in an office or a workshop, so that the working efficiency of the user can be greatly improved, and a large amount of manpower resources can be saved.
The embodiments of the present invention have been described in conjunction with the accompanying drawings and examples, the structures of which are given by way of illustration and not limitation, and those skilled in the art can make modifications as required, and various changes and modifications can be made within the scope of the appended claims.
Claims (13)
1. A heat exchanger for controlling temperature of a reaction cavity of semiconductor equipment is characterized in that: including refrigeration chip, radiating block and heat exchange board, wherein:
the refrigeration chip comprises a plurality of refrigeration modules, each refrigeration module comprises a P-type material and an N-type material, and two ends of each P-type material and two ends of each N-type material are respectively connected by a metal conductor;
the surface of one end of the refrigeration chip is connected with a base of a radiating block, and a radiating surface of the radiating block is communicated with cooling liquid in the heat exchange plate; the other end of the refrigeration chip is communicated with the reaction cavity.
2. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 1, wherein: the refrigeration device comprises a plurality of refrigeration chips which are electrically connected in parallel, wherein a heat exchange plate is shared between the adjacent refrigeration chips, namely, two sides of the heat exchange plate are respectively connected with the heat dissipation surfaces of two heat dissipation blocks; and the other end of the refrigeration chip is respectively communicated with the reaction cavities.
3. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 1, wherein: the refrigeration device comprises a plurality of refrigeration chips which are electrically connected in series, namely a heat exchange plate is provided with a plurality of refrigeration chips, the surface of one end of each refrigeration chip is connected with one side of a heat dissipation block, and the heat dissipation surfaces of the heat dissipation blocks are respectively communicated with cooling liquid in the heat exchange plate; and the other end of the refrigeration chip is communicated with the reaction cavity.
4. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 1, 2 or 3, wherein: a liquid cooling channel is arranged inside the heat exchange plate and is immersed in the heat dissipation surface of the heat dissipation block.
5. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 4, wherein: the liquid channel is provided with a water inlet and a water outlet at two ends of the side edge of the heat exchange plate respectively, and a liquid cooling channel is arranged between the water inlet and the water outlet; the liquid cooling channel is immersed in the space between the periphery of the liquid cooling channel and the heat dissipation surface.
6. The heat exchanger for controlling the temperature of a reaction chamber of a semiconductor device according to claim 4 or 5, wherein: the heat-radiating block is characterized by further comprising a sealing ring, the heat-exchanging plate is provided with a mounting port, one side of the mounting port is communicated with cooling liquid, the other side of the mounting port is connected with a heat-radiating block, the heat-radiating surface of the heat-radiating block is immersed in the cooling liquid, and the sealing ring is arranged on the connecting surface of the mounting port and the base of the heat-radiating block.
7. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 1, 2 or 3, wherein: and moisture-proof, corrosion-proof and static-proof PTFE layers are respectively arranged on the surfaces of the cold end and the hot end of the refrigeration chip.
8. The heat exchanger for temperature control of a reaction chamber of a semiconductor device according to claim 1, 2 or 3, wherein: the other end of the refrigeration chip is connected with another heat exchange plate through a heat dissipation block, and the other heat exchange plate is communicated with the reaction cavity.
9. A direct cooling machine for controlling the temperature of a reaction cavity of semiconductor equipment is characterized in that: the heat exchanger of any one of claims 1 to 8, further comprising a cooling liquid tank, a pump and a plurality of pipelines, wherein the cooling liquid in the cooling liquid tank is pressurized by the pump and is conveyed to the heat exchange plates of the heat exchanger through the pipelines, and flows back to the cooling liquid tank after heat is removed, so that liquid circulation is formed; while the other heat exchange plate is connected to the reaction chamber.
10. The direct cooler for controlling the temperature of the reaction chamber of the semiconductor device according to claim 9, wherein: the liquid circulation system also comprises a one-way valve, wherein the one-way valve is arranged on any pipeline for liquid circulation.
11. The direct cooler for controlling the temperature of the reaction chamber of the semiconductor device according to claim 9, wherein: the device also comprises an over-temperature protection device, wherein the over-temperature protection device comprises a temperature switch and a heating circuit, and the temperature switch is fixed on the outer surface of the heat exchanger; the temperature switch is arranged on the heating circuit bus; the temperature switch can disconnect and connect the heating circuit according to a set temperature range.
12. The direct cooler for controlling the temperature of the reaction chamber of the semiconductor device according to claim 9, wherein: the heating device also comprises a controller and a power supply for supplying power to the controller, wherein the controller is respectively connected with and controls the pump and the heating circuit; the controller also carries out human-computer interaction through a touch screen; and stores the information through the USB interface.
13. The direct cooler for controlling the temperature of the reaction chamber of the semiconductor device according to any one of claims 9 to 12, wherein: the monitoring system comprises a plurality of direct cooling machines, communication modules are arranged on the direct cooling machines respectively and connected with the server respectively, and the communication modules transmit working state information to the server; the server is connected with the terminal display.
Applications Claiming Priority (2)
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CN201910001462 | 2019-01-02 | ||
CN2019100014628 | 2019-01-02 |
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CN111457617A true CN111457617A (en) | 2020-07-28 |
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CN201920046172.0U Active CN210267799U (en) | 2019-01-02 | 2019-01-11 | Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment |
CN201910026792.2A Pending CN111457617A (en) | 2019-01-02 | 2019-01-11 | Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment |
CN201920046105.9U Active CN209375692U (en) | 2019-01-02 | 2019-01-11 | A kind of monitoring system of direct-cooled machine |
CN201920045643.6U Active CN210220285U (en) | 2019-01-02 | 2019-01-11 | Over-temperature protection device of heat exchanger |
CN201920045647.4U Active CN211503310U (en) | 2019-01-02 | 2019-01-11 | Liquid cooling passage structure of heat exchanger |
CN201920045648.9U Active CN210220286U (en) | 2019-01-02 | 2019-01-11 | Heat exchanger structure |
CN201920046134.5U Active CN210267798U (en) | 2019-01-02 | 2019-01-11 | Film coating structure of direct cooling machine chip |
CN201920093126.6U Active CN210220287U (en) | 2019-01-02 | 2019-01-21 | One-way valve structure of direct cooling machine |
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CN201920046172.0U Active CN210267799U (en) | 2019-01-02 | 2019-01-11 | Heat exchanger and direct cooling machine for controlling temperature of reaction cavity of semiconductor equipment |
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CN201920046105.9U Active CN209375692U (en) | 2019-01-02 | 2019-01-11 | A kind of monitoring system of direct-cooled machine |
CN201920045643.6U Active CN210220285U (en) | 2019-01-02 | 2019-01-11 | Over-temperature protection device of heat exchanger |
CN201920045647.4U Active CN211503310U (en) | 2019-01-02 | 2019-01-11 | Liquid cooling passage structure of heat exchanger |
CN201920045648.9U Active CN210220286U (en) | 2019-01-02 | 2019-01-11 | Heat exchanger structure |
CN201920046134.5U Active CN210267798U (en) | 2019-01-02 | 2019-01-11 | Film coating structure of direct cooling machine chip |
CN201920093126.6U Active CN210220287U (en) | 2019-01-02 | 2019-01-21 | One-way valve structure of direct cooling machine |
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CN115164490A (en) * | 2022-07-20 | 2022-10-11 | 安徽中科新源半导体科技有限公司 | High-power high-efficiency semiconductor direct cooling machine |
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- 2019-01-11 CN CN201920046105.9U patent/CN209375692U/en active Active
- 2019-01-11 CN CN201920045643.6U patent/CN210220285U/en active Active
- 2019-01-11 CN CN201920045647.4U patent/CN211503310U/en active Active
- 2019-01-11 CN CN201920045648.9U patent/CN210220286U/en active Active
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CN115164490A (en) * | 2022-07-20 | 2022-10-11 | 安徽中科新源半导体科技有限公司 | High-power high-efficiency semiconductor direct cooling machine |
CN115164490B (en) * | 2022-07-20 | 2023-03-10 | 安徽中科新源半导体科技有限公司 | High-power high-efficiency semiconductor direct cooling machine |
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CN210267798U (en) | 2020-04-07 |
CN210220286U (en) | 2020-03-31 |
CN210220285U (en) | 2020-03-31 |
CN211503310U (en) | 2020-09-15 |
CN210267799U (en) | 2020-04-07 |
CN210220287U (en) | 2020-03-31 |
CN209375692U (en) | 2019-09-10 |
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