CN101645431A - Improved semiconductor water cooling system of computer central processing unit - Google Patents
Improved semiconductor water cooling system of computer central processing unit Download PDFInfo
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- CN101645431A CN101645431A CN200910027477A CN200910027477A CN101645431A CN 101645431 A CN101645431 A CN 101645431A CN 200910027477 A CN200910027477 A CN 200910027477A CN 200910027477 A CN200910027477 A CN 200910027477A CN 101645431 A CN101645431 A CN 101645431A
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- semiconductor
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- central processing
- radiator
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Abstract
The invention relates to an improved semiconductor water cooling system of a computer central processing unit, which can lower the temperature of a heating device to be lower than the environmental temperature, can be suitable for occasions of various environments and have good cooling effect and wide applicable scope. The semiconductor water cooling system comprises a water block, a water pump, acooling module, a fan and a pipeline, wherein the water block is in contact with the central processing unit. The improved semiconductor water cooling system is characterized in that the cooling module is concretely formed by combining a radiator, an exchanger and a semiconductor cooling plate; the section of the radiator is round, and the excircle surface of the radiator is provided with a mounting plane for mounting the semiconductor cooling plate; the hot surface of the semiconductor cooling plate is connected with the mounting plane, and the cold surface of the semiconductor cooling plateis connected with the exchanger; the exchanger forms a circulation loop with the water pump and the water block, and the fan is arranged at one side of the end surface of the round radiator.
Description
(1) technical field
The present invention relates to computer cooling technology field, be specially a kind of semiconductor water cooling system of central processing unit (CPU) of improvement.
(2) background technology
Present computer water-cooling cooling system, it is by the water-cooled head, water pump, water row radiator, fan, pipeline is formed.It can only be reduced to ambient temperature with temperature at most, and it is unsuitable in ambient temperature than higher applications (especially summer), so its scope of application is little, and its cooling effect is general.
(3) summary of the invention
At the problems referred to above, the invention provides a kind of semiconductor water cooling system of central processing unit (CPU) of improvement, it can drop to the temperature of heater members and be lower than ambient temperature, and good cooling results can be applicable to various environment occasions, and the scope of application is big.
A kind of semiconductor water cooling system of central processing unit (CPU) of improvement, its technical scheme is such: it comprises the water-cooled head, water pump, refrigerating module, fan, pipeline, described water-cooled head contact central processing unit, it is characterized in that: described refrigerating module is specially radiator, interchanger, semiconductor chilling plate combines, described radiator cross section is circular, have the mounting plane that described semiconductor chilling plate is installed on its periphery, the hot side of described semiconductor chilling plate connects described mounting plane, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate connects described interchanger, described interchanger and described water pump, described water-cooled head constitutes a circulation circuit, and described fan is installed on a side of the end face of described circular radiator.
It is further characterized in that: described circular radiator is specially the soldering of multi-disc aluminum annular-shaped fin and forms, and the core of described circular radiator connects; Described mounting plane is distributed on the periphery of described circular radiator, described semiconductor chilling plate is a plurality of, the number of described interchanger is identical with the number of described semiconductor cooling fin, described interchanger, semiconductor chilling plate, mounting plane by clip, screw is fastening is fitted and connected; Described a plurality of interchanger is communicated with by described pipeline, and one in described a plurality of interchangers is communicated with described water pump, and another in described a plurality of interchangers is communicated with described water-cooled head, and described water pump is communicated with described water-cooled head; Described interchanger inside is equipped with the multi-disc radiating fin; Screw is an end face of junctor tank wall, cabinet connecting plate, described fan, fan mounting panel, described circular radiator successively; The other end of described circular radiator is fastenedly connected with described water pump by screw.
Adopt water-cooling system of the present invention, described refrigerating module is specially radiator, interchanger, semiconductor chilling plate combines, described radiator cross section is circular, have the mounting plane that described semiconductor chilling plate is installed on its periphery, the hot side of described semiconductor chilling plate connects described mounting plane, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate connects described interchanger, described interchanger and described water pump, described water-cooled head constitutes a circulation circuit, described fan is installed on a side of the end face of described circular radiator, when described central processing unit is worked, the heat that distributes conducts to described water-cooled head, cooling fluid with heat transferred to described interchanger inside, the interchanger internal heat is the huyashi-chuuka (cold chinese-style noodles) of heat transferred to described semiconductor chilling plate, its heat is passed to the hot side of described semiconductor chilling plate from the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate, the heat of the hot side of described semiconductor chilling plate blows away heat by described fan at last by described round heat sink radiates.Because semiconductor chilling plate can quick heat radiating, its good cooling results, can guarantee that temperature with heater members drops to and be lower than ambient temperature that so native system can be applicable to various environment occasions, the scope of application is big.
(4) description of drawings
Fig. 1 is a three-dimensional icon intention of the present utility model;
Fig. 2 is the stereogram of the utility model radiator.
(5) embodiment
See Fig. 1, Fig. 2, it comprises water-cooled 13, water pump 11, refrigerating module, fan 3, pipeline 12, water-cooled 13 a contact central processing unit, refrigerating module is specially radiator 5, interchanger 8, semiconductor chilling plate 9 and combines, radiator 5 cross sections are circular, have the mounting plane 15 that semiconductor chilling plate is installed on its periphery, the hot side connection plane 15 of semiconductor chilling plate 9, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 9 connects interchanger 8, interchanger 8 and water pump 11, water-cooled 13 formations, one circulation circuit, fan 3 is installed on a side of the end face of circular radiator 5.Circular radiator 5 is specially 14 solderings of multi-disc aluminum annular-shaped fin and forms, and the core of circular radiator 5 connects; Three mounting planes 15 are distributed on the periphery of circular radiator 5, and semiconductor chilling plate 9 is three, and interchanger 8 is three, and interchanger 8, semiconductor chilling plate 9, mounting plane 15 are by clip 7, screw 6 fastening being fitted and connected; Three interchangers 8 are communicated with by pipeline 12, and another in 11, three interchangers 8 of a connection water pump in three interchangers 8 is communicated with water-cooled 13, and water pump 11 is communicated with water-cooleds 13; Interchanger 8 inside are equipped with the multi-disc radiating fin; Screw 1 junctor tank wall, cabinet connecting plate 2, fan 3, fan is successively installed an end face of 4 plates, circular radiator 5; The other end of circular radiator 5 is fastenedly connected with water pump 11 by screw 10.
Semiconductor chilling plate is a prior art, a kind of cooling device of forming by semiconductor, it is a kind of electronic refrigeration plant, its operation principle is: after the energising, the heat of closed-loop path huyashi-chuuka (cold chinese-style noodles) just is moved to the hot junction, thereby cause the reduction of semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) temperature, working properly in order to guarantee semiconductor chilling plate, must be in time the heat of hot side be loose.
Claims (6)
1, a kind of semiconductor water cooling system of central processing unit (CPU) of improvement, it comprises the water-cooled head, water pump, refrigerating module, fan, pipeline, described water-cooled head contact central processing unit, it is characterized in that: described refrigerating module is specially radiator, interchanger, semiconductor chilling plate combines, described radiator cross section is circular, have the mounting plane that described semiconductor chilling plate is installed on its periphery, the hot side of described semiconductor chilling plate connects described mounting plane, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate connects described interchanger, described interchanger and described water pump, described water-cooled head constitutes a circulation circuit, and described fan is installed on a side of the end face of described circular radiator.
2, according to the semiconductor water cooling system of the central processing unit (CPU) of the described a kind of improvement of claim 1, it is characterized in that: described circular radiator is specially the soldering of multi-disc aluminum annular-shaped fin and forms, and the core of described circular radiator connects.
3, according to the semiconductor water cooling system of the central processing unit (CPU) of the described a kind of improvement of claim 2, it is characterized in that: described mounting plane is distributed on the periphery of described circular radiator, described semiconductor chilling plate is a plurality of, the number of described interchanger is identical with the number of described semiconductor cooling fin, described interchanger, semiconductor chilling plate, mounting plane by clip, screw is fastening is fitted and connected.
4, according to the semiconductor water cooling system of the central processing unit (CPU) of the described a kind of improvement of claim 3, it is characterized in that: described a plurality of interchangers are communicated with by described pipeline, one in described a plurality of interchanger is communicated with described water pump, in described a plurality of interchanger another is communicated with described water-cooled head, and described water pump is communicated with described water-cooled head.
5, according to the semiconductor water cooling system of the central processing unit (CPU) of the described a kind of improvement of claim 4, it is characterized in that: described interchanger inside is equipped with the multi-disc radiating fin.
6, according to the semiconductor water cooling system of the central processing unit (CPU) of the described a kind of improvement of claim 5, it is characterized in that: screw is an end face of junctor tank wall, cabinet connecting plate, described fan, fan mounting panel, described circular radiator successively; The other end of described circular radiator is fastenedly connected with described water pump by screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910027477A CN101645431A (en) | 2009-05-07 | 2009-05-07 | Improved semiconductor water cooling system of computer central processing unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910027477A CN101645431A (en) | 2009-05-07 | 2009-05-07 | Improved semiconductor water cooling system of computer central processing unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101645431A true CN101645431A (en) | 2010-02-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910027477A Pending CN101645431A (en) | 2009-05-07 | 2009-05-07 | Improved semiconductor water cooling system of computer central processing unit |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105066507A (en) * | 2015-09-02 | 2015-11-18 | 北京三相典创科技有限公司 | Air-cooling semiconductor refrigeration device for circulating cooling system |
| CN108650347A (en) * | 2018-04-28 | 2018-10-12 | Oppo广东移动通信有限公司 | Production method, in-out box and the electronic device of in-out box |
-
2009
- 2009-05-07 CN CN200910027477A patent/CN101645431A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105066507A (en) * | 2015-09-02 | 2015-11-18 | 北京三相典创科技有限公司 | Air-cooling semiconductor refrigeration device for circulating cooling system |
| CN108650347A (en) * | 2018-04-28 | 2018-10-12 | Oppo广东移动通信有限公司 | Production method, in-out box and the electronic device of in-out box |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100210 |