CN208547905U - A kind of thermoelectric radiating device for blade server central processing unit - Google Patents
A kind of thermoelectric radiating device for blade server central processing unit Download PDFInfo
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- CN208547905U CN208547905U CN201821279809.2U CN201821279809U CN208547905U CN 208547905 U CN208547905 U CN 208547905U CN 201821279809 U CN201821279809 U CN 201821279809U CN 208547905 U CN208547905 U CN 208547905U
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- cooling block
- radiator
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Abstract
The utility model relates to a kind of central processor core thermoelectric cooling radiators for blade server, belong to heat dissipation of integrated circuit chip technical field.Utility model device includes evaporator, heat pipe, cooling block, thermoelectric cooling device and radiator.The heat that cpu chip generates is absorbed by evaporator, rapid vaporization is steam after the liquid working substance of evaporator inside cavity is heated, steam enters the heat pipe other end under the action of slight pressure difference, and takes away amount of heat, and cooling block makes the rapid condensation liquefaction heat release of the working substance steam in heat pipe.Since the vapour using working medium, liquid phase become transmitting heat, there is the very high capacity of heat transmission.Freezed using thermoelectric cooling device to cooling block, cooling block can be made to absorb the heat in heat pipe rapidly, quickly sufficiently discharged the heat that cpu chip generates, improve radiating efficiency.Due to there is no rotating machinery in this radiator, solves the problems such as existing radiator deposits cascade heating effect and big noise.
Description
Technical field
The utility model relates to a kind of thermoelectric radiating devices of central processor core for blade server, belong to collection
At circuit chip technical field of heat dissipation.
Background technique
Blade server refers to the server unit that multiple cassettes can be inserted in the rack cabinet of calibrated altitude, is one
Kind realizes High Availabitity, highdensity inexpensive server platform, is now widely used in large-scale cloud computation data center and high-performance
The construction of computing cluster.Blade server is due to using high-performance and high integration design scheme, its advantage is that the maximum extent
It reduces the occupancy to physical space, but the disadvantage is that power density is greatly improved, a large amount of heat is generated in operation, because
The heat dissipation performance of this blade server just becomes the key factor of decision systems operation stability.
Blade server is limited by physical space, and the cooling fin volume of cpu chip cannot be too big, can not on cooling fin
The fan of forced air flowing is installed, heat dissipation problem is extremely prominent.Its structure of existing radiator is as shown in Figure 1, can only adopt
With front panel air inlet, the design of postnotum outlet air, cpu chip heat dissipation is carried out with air convection.Due in blade server
Electronics member device is numerous, causes internal air channel structure complicated, fluid resistance is very big, and there are cascade heating effects, leads to heat dissipation effect
It is poor.In order to take away the heat of internal electronic component generation in time, the air mass flow for passing in and out blade server case must
It must be very big, it has to high-power, high revolving speed strength aerofoil fan is used, since the motor in aerofoil fan occupies air duct center
Very large area, produce one piece of very big turbulent region, make high speed aerofoil fan aerodynamic noise and rotational noise become blade
The main source of server noise.
Summary of the invention
The purpose of this utility model is to propose a kind of thermoelectric radiating device for blade server central processor core,
The structure of the existing radiator for blade server is carried out using evaporator, heat pipe, cooling block, thermoelectric cooling device
It improves, outside the heat transmission to blade server case for being generated cpu chip using evaporator and heat pipe, using fan-free heat
Electric refrigeration device radiates to cooling block, and to solve, existing blade server heat-diffusing efficiency of heat abstractor is low, there is cascade adds
The problems such as fuel factor and big noise.
The utility model proposes the central processor core thermoelectric cooling radiator for blade server, including dissipate
Hot device, evaporator, heat pipe, cooling block and thermoelectric cooling device；During the bottom of the evaporator is bonded in by heat conductive silica gel
On central processor chip, one end of the heat pipe is sealed, and the other end is connected to evaporator welding, what evaporator and heat pipe formed
Vacuum state inside hot systems, and it is filled with liquid working substance, in the hole of the sealed end insertion cooling block of the heat pipe, and pass through
Heat conductive silica gel is bonded in sealed end in the hole of cooling block；The cooling block is fixed by screws in blade server case
Outside, the huyashi-chuuka (cold chinese-style noodles) of the thermoelectric cooling device is connect by heat conductive silica gel with the cooling block back side, the radiator underrun
The connection of the hot face of heat conductive silica gel and thermoelectric cooling device.
The utility model proposes the central processor core thermoelectric cooling radiator for blade server, advantage
It is:
The central processor core thermoelectric cooling radiator for blade server of the utility model, it is true using closing
Liquid evaporation in empty set system transmits heat with condensation, the heat that cpu chip generates can be transmitted to rapidly blade server
Cooling block outside cabinet.The heated rear rapid vaporization of liquid working substance in evaporator chamber is steam, and refrigerant vapor is poor in slight pressure
Effect be sent to the sealed end of heat pipe, cooling block absorbs heat pipe heat, carries out condensation liquefaction heat release to working substance steam.Due to
Become transmitting heat, therefore thermal resistance very little using the vapour of working medium, liquid phase, there is the very high capacity of heat transmission.Thermoelectric cooling device can make
Cooling block absorbs rapidly the heat of heat pipe sealed end, quickly sufficiently gives off the heat of cpu chip generation, has very high heat dissipation
Efficiency.Since radiator is radiated using thermoelectric cooling device, without rotating machinery, solves existing radiator and deposit grade
The problems such as joining heating effect and big noise.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of existing blade server radiator.
Fig. 2 be the utility model proposes blade server central processing unit thermoelectric cooling construction for heat radiating device schematic diagram.
In Fig. 1 and Fig. 2,1 is central processor core, and 2 be radiator, and 3 be aerofoil fan, and 4 be blade server case,
5 it is evaporator, 6 is heat pipe, 7 is cooling block, and 8 be thermoelectric cooling device.
Specific embodiment
The utility model proposes the central processor core thermoelectric cooling radiator for blade server, structure
As shown in Figure 2.Including radiator 2, evaporator 5, heat pipe 6, cooling block 7 and thermoelectric cooling device 8.The bottom of evaporator 5 passes through
Heat conductive silica gel is bonded on central processor core 1, and one end sealing of heat pipe 6, the other end is connected to the welding of evaporator 5, steams
Vacuum state inside the hot systems that device 5 and heat pipe 6 form is sent out, and is filled with liquid working substance.The sealed end of heat pipe 6 is inserted into cooling
In the hole of block 7, and it is bonded in the sealed end of heat pipe 6 in the hole of cooling block by heat conductive silica gel.Cooling block 7 is fixed by screw
Outside the cabinet 4 of blade server, the huyashi-chuuka (cold chinese-style noodles) of thermoelectric cooling device 8 is connect by heat conductive silica gel with the back side of cooling block 7, is radiated
The underrun heat conductive silica gel of device 2 is connect with the hot face of thermoelectric cooling device 8.
The utility model proposes the central processor core thermoelectric cooling radiator for blade server in, evaporation
Device 5 is used to absorb the heat of the generation of cpu chip 1, and rapid vaporization is steam after the liquid working substance of 5 inside cavity of evaporator is heated,
Working substance steam enters the other end (sealed end) of heat pipe 6 under the action of slight pressure difference, and takes away amount of heat.Cooling block 7
Heat-pipe working medium steam heat is directly absorbed, the heat that thermoelectric cooling device 8 rapidly absorbs huyashi-chuuka (cold chinese-style noodles) under voltage effect is to hot face
It shifts, the heat on the hot face of thermoelectric cooling device 8 is dispersed into surrounding air after being transmitted to the fin of radiator 2.Lose heat
The working medium of amount is condensed after liquefaction, under the action of 6 inner wall liquid-sucking core capillary of heat pipe, flows back into 5 chamber of evaporator by heat pipe 6
It is interior, complete the circulation of working medium.
Evaporator 5 in insert server heat sink is used to absorb the heat of the generation of cpu chip 1.5 chamber of evaporator
Rapid vaporization is steam after the liquid working substance in internal portion is heated, and working substance steam enters heat pipe 6 under the action of slight pressure difference
The other end, and take away amount of heat.
Heat pipe 6 in insert server heat sink is for the working substance steam of 5 inside cavity of evaporator to be transferred to
The other end of heat pipe 6, while the liquid working substance after condensation liquefaction is flowed back into evaporator 5.
Cooling block 7 in insert server heat sink is for the working substance steam condensation liquefaction heat release in opposite heat tube.
Steam heat is conducted to cooling block 7 by the heat pipe in insertion 7 hole of cooling block, and the huyashi-chuuka (cold chinese-style noodles) of thermoelectric cooling device 8 directly absorbs cooling
The heat of block 7 after losing the working fluid condensate of heat, under the action of 6 inner wall liquid-sucking core capillary of heat pipe, passes through heat pipe 6
Evaporator 5 is flowed back into, the circulation of working medium is completed.
Thermoelectric cooling device 8 in insert server heat sink is for freezing to cooling block 7.
Radiator 2 in insert server heat sink is for the heat that thermoelectric cooling device 8 generates to be dispersed into
In surrounding air.
The utility model proposes one embodiment for the thermoelectric radiating device of blade server in, evaporator 5, heat
Pipe 6 and cooling block 7 are all made of thermal conductivity good copper product are made, and 6 inner wall liquid-sucking core of heat pipe is made of nickel fibre felt, evaporator
State is evacuated inside the hot systems constituted with heat pipe, working medium uses water.Thermoelectric cooling device 8 uses model TEC1-
The semiconductor chilling plate (outer dimension 30mm × 30mm × 3mm) of 07115T125, radiator 2 use albronze.
The working principle of the thermoelectric radiating device for blade server of the utility model is:
When the cpu chip 1 in blade server is started to work, the temperature of cpu chip 1 is gradually risen, and cpu chip 1 will
Heat transfer is to evaporator 5；State, therefore evaporator 5 have been evacuated inside the hot systems that evaporator 5 and heat pipe 6 are constituted
The liquid working substance boiling point of inside cavity is very low, and rapid vaporization is saturated vapor after liquid working substance is heated, and refrigerant vapor is in small pressure
Enter the other end of heat pipe 6 under the action of power difference, and takes away amount of heat.The heat pipe in 7 hole of cooling block is inserted by steam heat
It is conducted to cooling block 7, the huyashi-chuuka (cold chinese-style noodles) of thermoelectric cooling device 8 directly absorbs the heat of cooling block 7.Thermoelectric cooling device 8 is made in voltage
The heat that huyashi-chuuka (cold chinese-style noodles) absorbs is shifted rapidly to hot face with lower, forms the phenomenon that huyashi-chuuka (cold chinese-style noodles) heat absorption is with hot face heat release, and heat is conducted
It to radiator 2, is distributed heat in surrounding air by the fin of radiator 2, keeps the hot pipe section being inserted into 7 hole of cooling block fast
Speed refrigeration.After losing the working fluid condensate of heat, under the action of 6 inner wall liquid-sucking core capillary of heat pipe, flowed back by heat pipe 6
To evaporator 5, the circulation of working medium is completed.
Claims (1)
1. a kind of central processor core thermoelectric cooling radiator for blade server, including radiator, feature exist
In including evaporator, heat pipe, cooling block and thermoelectric cooling device；During the bottom of the evaporator is bonded in by heat conductive silica gel
On central processor chip, one end of the heat pipe is sealed, and the other end is connected to evaporator welding, what evaporator and heat pipe formed
Vacuum state inside hot systems, and it is filled with liquid working substance, in the hole of the sealed end insertion cooling block of the heat pipe, and pass through
Heat conductive silica gel is bonded in sealed end in the hole of cooling block；The cooling block is fixed by screws in blade server case
Outside, the huyashi-chuuka (cold chinese-style noodles) of the thermoelectric cooling device is connect by heat conductive silica gel with the cooling block back side, the radiator underrun
The connection of the hot face of heat conductive silica gel and thermoelectric cooling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821279809.2U CN208547905U (en) | 2018-08-09 | 2018-08-09 | A kind of thermoelectric radiating device for blade server central processing unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821279809.2U CN208547905U (en) | 2018-08-09 | 2018-08-09 | A kind of thermoelectric radiating device for blade server central processing unit |
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| CN208547905U true CN208547905U (en) | 2019-02-26 |
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| CN201821279809.2U Active CN208547905U (en) | 2018-08-09 | 2018-08-09 | A kind of thermoelectric radiating device for blade server central processing unit |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108733185A (en) * | 2018-08-09 | 2018-11-02 | 紫光股份有限公司 | A kind of thermoelectric radiating device for blade server central processing unit |
| CN109887895A (en) * | 2019-03-04 | 2019-06-14 | 四川长虹空调有限公司 | Semiconductor devices radiator |
| WO2021168874A1 (en) * | 2020-02-25 | 2021-09-02 | 瑞声声学科技(深圳)有限公司 | Heat dissipation structure |
| WO2023071705A1 (en) * | 2021-11-01 | 2023-05-04 | 华为技术有限公司 | Heat dissipation assembly, vehicle module, and vehicle |
-
2018
- 2018-08-09 CN CN201821279809.2U patent/CN208547905U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108733185A (en) * | 2018-08-09 | 2018-11-02 | 紫光股份有限公司 | A kind of thermoelectric radiating device for blade server central processing unit |
| CN109887895A (en) * | 2019-03-04 | 2019-06-14 | 四川长虹空调有限公司 | Semiconductor devices radiator |
| WO2021168874A1 (en) * | 2020-02-25 | 2021-09-02 | 瑞声声学科技(深圳)有限公司 | Heat dissipation structure |
| WO2023071705A1 (en) * | 2021-11-01 | 2023-05-04 | 华为技术有限公司 | Heat dissipation assembly, vehicle module, and vehicle |
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