CN109887895A - Semiconductor devices radiator - Google Patents
Semiconductor devices radiator Download PDFInfo
- Publication number
- CN109887895A CN109887895A CN201910160134.2A CN201910160134A CN109887895A CN 109887895 A CN109887895 A CN 109887895A CN 201910160134 A CN201910160134 A CN 201910160134A CN 109887895 A CN109887895 A CN 109887895A
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- Prior art keywords
- heat
- evaporator
- semiconductor devices
- condenser
- semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 88
- 239000007788 liquid Substances 0.000 claims abstract description 44
- 239000000126 substance Substances 0.000 claims abstract description 19
- 230000017525 heat dissipation Effects 0.000 claims description 14
- 239000007858 starting material Substances 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 1
- 238000010025 steaming Methods 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 238000002207 thermal evaporation Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 238000002309 gasification Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of semiconductor devices radiators, including at least one set of semiconductor heat-dissipating unit loop, semiconductor heat-dissipating unit loop includes condenser and the evaporator that connect with semiconductor device surface, the outlet end of evaporator is connected to the arrival end of condenser, and the arrival end of evaporator is connected to the outlet end of condenser.The heat absorption that the present invention is distributed semiconductor devices using the liquid working substance in evaporator, liquid working substance is by heat release at condenser is transferred to after thermal evaporation and is re-converted into liquid working substance, it flows back in evaporator again, and constantly provides the liquid working substance of absorbable heat by capillary structure for evaporator.The present invention can conveniently and efficiently be shifted the heat that semiconductor devices is distributed at a distance, and heat concentration, the unsmooth performance to semiconductor devices of divulging information is avoided to impact；And the present invention is without external mechanical devices offer power, production cost is low, heat transfer efficiency is high.
Description
Technical field
The present invention relates to semiconductor heat-dissipating systems technology field, especially a kind of semiconductor devices radiator.
Background technique
Semiconductor devices is electric conductivity between good conductor of electricity and insulator, utilizes the specific electrical properties of semiconductor material
The electronic device of specific function is completed, can be used to generate, control, receive, converting, amplified signal and carrying out energy conversion.Half
Conductor device is widely used in the every field of engineering technology, especially the most universal with the application of semiconductor chip.Currently, half
The application of conductor chip is using computer CPU, air-conditioning IPM and pfc circuit power component as representative, and there are also in laser-projector
Laser and display chip etc..These semiconductor devices generate very big fever with the work of its high performance in the application
Amount needs to improve in order to prevent due to the functional fault that these semiconductor device temperatures rise and electronic equipment may be made to generate
The thermal diffusivity of the semiconductor devices, the heat for enabling it to generate are discharged to outside well.
Currently, the heat dissipation of semiconductor devices mainly uses following methods: 1, aluminum profile heat radiator and fan integral type,
Heat-conducting silicone grease is tightened together with semiconductor heating object, is transferred out aluminum profile heat radiator come hot discharge by fan running
Engine body exterior realizes cooling function；2, gravity assisted heat pipe one end and semiconductor heating device are fastenedly connected, and have conducted heat to wind
On the aluminum profile heat radiator of fan, the air by flowing through aluminum profile rejects heat to engine body exterior, realizes cooling；3, system is utilized
SAPMAC method generally utilizes refrigeration cycle by be fastenedly connected cooling down cold end with generating semiconductors using compressor
Transfer heat to engine body exterior.
The Chinese patent of Patent No. CN201180020727.0 discloses a kind of radiator and semiconductor device, heat dissipation
Device can satisfy the insulation function and refrigerating function to cooling object, and can cut down number of components, radiator tool
The standby matrix being made of ceramics and the refrigerant flow path flowed in the inside of matrix for refrigerant, by the multiple potteries of stacking
Laminated body made of tile material is sintered and forms matrix；Multiple ceramic sheet material includes: to be formed with composition refrigerant flow path
Multiple slits ceramic sheet material；And it is formed with refrigerant flow path and external interconnected access ceramic sheet material.It is logical
It crosses and constitutes semiconductor device for engaging for the metal plate of semiconductor element mounting with radiator.
The Chinese patent of Patent No. CN200410103832.2 discloses a kind of semiconductor device, and semiconductor device is by half
Conductor element, a pair of cooling fin up and down and radiating block are constituted.Radiating block has the flat shape less than semiconductor element.Semiconductor
Element has the heating part towards radiating block.Heating part has outer peripheral edge, the outer peripheral edge of the outer peripheral edge and radiating block of heating part
Distance is in 1.0mm or less.
The Chinese patent of Patent No. CN201110398635.8 discloses a kind of heat-pipe radiating apparatus, in the shell of compressor
Body surface surface cover is equipped with primary heat sink, and secondary radiator is arranged on the middle partition of air conditioner external, and primary heat sink and pair dissipate
The heat pipe that heat pipe and stream oriented device are respectively provided in thermal is connection, and secondary radiator is additionally provided with the heat pipe made in secondary radiator
Exchange heat the refrigerator condensed.
Near technical solution disclosed in above-mentioned patent is often only exported to the heat of heating device by conductive structure
Air in, and for the semiconductor devices big for calorific value, heat is still concentrated in around heating device, long and long
It, still can generate failure since heat is excessively high.
Summary of the invention
It is dissipated the technical problems to be solved by the present invention are: providing a kind of pair of good semiconductor devices of semiconductor devices heat dissipation
Thermal.
To solve above-mentioned technical problem the technical scheme adopted by the invention is that: semiconductor devices radiator, including extremely
Few one group of semiconductor heat-dissipating unit loop, the semiconductor heat-dissipating unit loop includes condenser and and semiconductor device surface
The evaporator of connection, the outlet end of the evaporator are connected to the arrival end of condenser, the arrival end of evaporator and condenser
Outlet end connection.
Further, the quantity of the semiconductor heat-dissipating unit loop is at least two groups, each group semiconductor heat-dissipating unit
The condenser of loop is disposed side by side in heat dissipation wind channel.
Further, being equipped with liquid storage device and capillary structure in the evaporator, the liquid storage device is provided with liquid working substance,
The arrival end of evaporator is arranged in liquid storage device；The capillary structure communicates with the liquid storage device and extends towards the outlet end of evaporator.
Further, the capillary structure is tubular structure of the surface throughout multiple pores.
Further, the condenser is finned heat exchanger, micro-channel heat exchanger, tube-sheet heat exchanger, plate-type heat-exchange
Device, threaded pipe type heat exchanger or rotation fin heat exchanger.
Further, the evaporator is connected to by steam pipework with the arrival end of condenser, the outlet end of condenser
It is connected to by liquid line with evaporator；The semiconductor heat-dissipating unit loop further includes the starting that evaporator inlet end is arranged in
Device, the starter are connected in steam pipework.
Further, the condenser and evaporator are tubular structure, and the caliber size of condenser is less than evaporation
The caliber size of device.
Further, the face that the evaporator is connected with semiconductor device surface is flat surface.
Further, being filled with heat-conducting medium between the evaporator and semiconductor device surface.
Further, the heat-conducting medium is heat conductive silica gel, heat-conducting silicone grease or Graphite pad.
The beneficial effects of the present invention are: the present invention carries out the circulation loop of hot transmitting, benefit by being arranged with semiconductor devices
The heat absorption for being distributed semiconductor devices with the liquid working substance in evaporator, liquid working substance are transferred to condenser by after thermal evaporation
Place's heat release is simultaneously re-converted into liquid working substance, then flows back in evaporator, and constantly provides and can inhale for evaporator by capillary structure
The liquid working substance for receiving heat, realizes recycling for liquid working substance.The present invention by liquid working substance endothermic gasification, heat release liquefaction with
And liquid capillary condensation principle, conveniently and efficiently the heat that semiconductor devices is distributed can be shifted at a distance, avoid heat
In quantity set, the unsmooth performance to semiconductor devices of ventilation impacts；And the present invention provides power, life without external mechanical devices
Produce that at low cost, heat transfer efficiency is high.
Detailed description of the invention
Fig. 1 is schematic diagram of the invention；
Fig. 2 is the distribution schematic diagram of condenser pipe；
In the figure, it is marked as 1- semiconductor devices, 2- evaporator, 3- condenser, 4- liquid storage device, 5- capillary structure, 6- steam
Pipeline, 7- liquid line.
Specific embodiment
To facilitate the understanding of the present invention, the present invention is further detailed with reference to the accompanying drawing.
As shown in Figure 1, semiconductor devices radiator of the present invention is by semiconductor heat-dissipating unit loop come with half
Conductor device 1 carries out heat exchange, and the condenser of the heat transmission of absorption to distant location 3 is released.Semiconductor heat-dissipating unit
The specific structure of loop includes evaporator 2, condenser 3 and corresponding connecting line, the surface of evaporator 2 and semiconductor devices 1
It contacts and connects；Condenser 3 uses tubular structure, and tubular structure or rectangular parallelepiped structure can be used in evaporator 2, if evaporator 2 is adopted
With tubular structure, the caliber size of condenser 3 is less than the caliber size of evaporator 2, in order to improve the area of heat transmitting, evaporator
2 faces being connected with 1 surface of semiconductor devices are preferred with flat surface, i.e., evaporator 2 uses half-round tubular structure；In addition, by
Utopian flat surface can not be processed in machining, evaporator 2 can exist carefully on the contact surface of semiconductor devices 1
Small gully is filled with air in gully, and the thermal resistance value of air is higher, in order to reduce thermal resistance value to improve heat dissipation performance,
Heat-conducting medium is filled between evaporator 2 and semiconductor devices 1, heat conductive silica gel, heat-conducting silicone grease or graphite pads can be selected in heat-conducting medium
Piece.The outlet end of evaporator 2 is connected to by steam pipework 6 with the arrival end of condenser 3, and the outlet end of condenser 3 passes through liquid
Pipeline 7 is connected to the arrival end of evaporator 2.
The semiconductor devices quantity that the quantity of semiconductor heat-dissipating unit loop can radiate as needed is selected, such as
Shown in Fig. 1, two groups of semiconductor heat-dissipating unit loops are used, according to multiple groups semiconductor heat-dissipating unit loop, each group semiconductor
Condenser 3 in heat-sink unit loop is disposed side by side in heat dissipation wind channel.In addition, being condensed in each group semiconductor heat-dissipating unit loop
The specification size of device 3 can be depending on corresponding heat dissipation capacity demand.
Semiconductor devices radiator of the present invention can be applied in most of equipment with semiconductor devices, such as
The equipment such as air-conditioner outdoor unit.If being applied in air-conditioner outdoor unit, condenser 3 be may be provided in the air duct of outdoor unit, and installation is fixed
In the blower side of air-conditioner outdoor unit partition.The heat exchanger of existing air-conditioning, refrigerator or car air-conditioner can be selected in condenser 3, such as
Finned heat exchanger, micro-channel heat exchanger, tube-sheet heat exchanger, plate heat exchanger, threaded pipe type heat exchanger or rotation fin heat exchanger.
According to finned heat exchanger as condenser 3, need when because having multiple semiconductor devices in equipment using more
When group semiconductor heat-dissipating loop, the pipeline of condenser 3 can be allocated.As shown in Fig. 2, if needed for multiple semiconductor devices
Heat dissipation capacity is identical, and the identical condenser 3 of 7 quantity of liquid line can be disposed in parallel in same heat dissipation wind channel；If multiple partly lead
Heat dissipation capacity needed for body device is different, then can distribute one for liquid line 7 corresponding to the lesser condenser 3 of heat dissipation capacity demand
The biggish condenser 3 of heat dissipation capacity demand is given, to meet the needs of different heat dissipation capacities, while being also convenient for carrying out condenser 3
Concentrated setting.
It, can also be near the arrival end of evaporator 2 in order to make semiconductor devices radiator that there is preferably starting effect
Starter is set, and starter is connected in steam pipework 6, provides heat power by starter for semiconductor heat-dissipating unit loop.
Semiconductor heat-dissipating unit loop realizes the heat exchange with semiconductor devices 1 by evaporator 2 in the present invention
Liquid storage device 4 and capillary structure 5 realize, as shown in Figure 1, liquid storage device 4 is arranged in the arrival end of evaporator 2, capillary structure 5 with
The connection of liquid storage device 4 simultaneously extends towards the outlet end of evaporator 2；Wherein, liquid storage device 4 is provided with liquid working substance, and liquid working substance is general
Common cooling water is selected, capillary structure 5 is tubular structure of the surface throughout multiple pores.The present invention at work, due to
The surface of evaporator 2 is fitted closely with semiconductor devices 1, and 1 operational heat of semiconductor devices simultaneously passes to evaporator 2, liquid storage device 4
Interior liquid working substance absorbs heat and gasifies, and the steam condition working medium after gasification is transmitted in condenser 3 by steam pipework 6,
Condenser 3 is re-converted to liquid working substance, then pass through liquid by condenser 3 by air duct radiation after steam condition working medium heat release
Pipeline 7 is back in liquid storage device 4, realizes recycling for liquid working substance.It is existing using capillary by capillary structure 5 in the present invention
As the endotherm section that the liquid working substance in liquid storage device 4 is sent to evaporator 2 is constantly carried out heat absorption, the steam condition of endothermic gasification
Working medium is discharged from the pore of capillary structure 5, and is discharged under the pressure difference effect between steam pipework 6 and liquid line 7 cold
In condenser 3.
The present invention is constantly passed the heat of semiconductor devices by liquid working substance recycling in heat-sink unit loop
It is delivered to the external world, more heat transfers can be arrived compared with existing radiator and fan by providing power without external mechanical devices
Farther distance, avoids heat from concentrating；Compared with existing gravity assisted heat pipe radiator structure, efficiency of transmission is higher, cost is lower；With
The mode to cool down using refrigeration system is compared, and low energy consumption, highly reliable.
Claims (10)
1. semiconductor devices radiator, it is characterised in that: including at least one set of semiconductor heat-dissipating unit loop, the semiconductor
Heat-sink unit loop includes condenser (3) and the evaporator (2) that connect with semiconductor devices (1) surface, the evaporator (2)
Outlet end be connected to the arrival end of condenser (3), the arrival end of evaporator (2) is connected to the outlet end of condenser (3).
2. semiconductor devices radiator as described in claim 1, it is characterised in that: the semiconductor heat-dissipating unit loop
Quantity is at least two groups, and the condenser (3) in each group semiconductor heat-dissipating unit loop is disposed side by side in heat dissipation wind channel.
3. semiconductor devices radiator as claimed in claim 1 or 2, it is characterised in that: be equipped with storage in the evaporator (2)
Liquid device (4) and capillary structure (5), the liquid storage device (4) are provided with liquid working substance, and entering in evaporator (2) is arranged in liquid storage device (4)
Mouth end；The capillary structure (5) is connected to liquid storage device (4) and extends towards the outlet end of evaporator (2).
4. semiconductor devices radiator as claimed in claim 3, it is characterised in that: the capillary structure (5) is surface time
The tubular structure of the multiple pores of cloth.
5. semiconductor devices radiator as described in claim 1, it is characterised in that: the condenser (3) is fin heat exchange
Device, micro-channel heat exchanger or pipe type heat exchanger.
6. semiconductor devices radiator as described in claim 1, it is characterised in that: the evaporator (2) passes through steam pipe
Road (6) is connected to the arrival end of condenser (3), and the outlet end of condenser (3) is connected to by liquid line (7) with evaporator (2)；
The semiconductor heat-dissipating unit loop further includes starter of the setting in evaporator (2) arrival end, and the starter is connected on steaming
In vapor pipeline (6).
7. semiconductor devices radiator as described in claim 1, it is characterised in that: the condenser (3) and evaporator (2)
It is tubular structure, and the caliber size of condenser (3) is less than the caliber size of evaporator (2).
8. semiconductor devices radiator as described in claim 1, it is characterised in that: the evaporator (2) and semiconductor device
The face that part (1) surface is connected is flat surface.
9. semiconductor devices radiator as claimed in claim 8, it is characterised in that: the evaporator (2) and semiconductor device
Heat-conducting medium is filled between part (1) surface.
10. semiconductor devices radiator as claimed in claim 9, it is characterised in that: the heat-conducting medium be heat conductive silica gel,
Heat-conducting silicone grease or Graphite pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910160134.2A CN109887895A (en) | 2019-03-04 | 2019-03-04 | Semiconductor devices radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910160134.2A CN109887895A (en) | 2019-03-04 | 2019-03-04 | Semiconductor devices radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109887895A true CN109887895A (en) | 2019-06-14 |
Family
ID=66930412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910160134.2A Pending CN109887895A (en) | 2019-03-04 | 2019-03-04 | Semiconductor devices radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109887895A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006012875A (en) * | 2004-06-22 | 2006-01-12 | Matsushita Electric Ind Co Ltd | Cooling device of semiconductor element |
| CN203163564U (en) * | 2012-12-13 | 2013-08-28 | 中国科学院大学 | Loop gravity assisted heat pipe heat transfer device provided with flat plate type evaporator |
| CN104154787A (en) * | 2014-08-29 | 2014-11-19 | 电子科技大学 | Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device |
| CN108762454A (en) * | 2018-08-06 | 2018-11-06 | 紫光股份有限公司 | A kind of central processor core radiator for blade server |
| CN208547905U (en) * | 2018-08-09 | 2019-02-26 | 紫光股份有限公司 | A kind of thermoelectric radiating device for blade server central processing unit |
| CN209312749U (en) * | 2019-03-04 | 2019-08-27 | 四川长虹空调有限公司 | Semiconductor devices radiator |
-
2019
- 2019-03-04 CN CN201910160134.2A patent/CN109887895A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006012875A (en) * | 2004-06-22 | 2006-01-12 | Matsushita Electric Ind Co Ltd | Cooling device of semiconductor element |
| CN203163564U (en) * | 2012-12-13 | 2013-08-28 | 中国科学院大学 | Loop gravity assisted heat pipe heat transfer device provided with flat plate type evaporator |
| CN104154787A (en) * | 2014-08-29 | 2014-11-19 | 电子科技大学 | Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device |
| CN108762454A (en) * | 2018-08-06 | 2018-11-06 | 紫光股份有限公司 | A kind of central processor core radiator for blade server |
| CN208547905U (en) * | 2018-08-09 | 2019-02-26 | 紫光股份有限公司 | A kind of thermoelectric radiating device for blade server central processing unit |
| CN209312749U (en) * | 2019-03-04 | 2019-08-27 | 四川长虹空调有限公司 | Semiconductor devices radiator |
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