WO2023071705A1

WO2023071705A1 - Heat dissipation assembly, vehicle module, and vehicle

Info

Publication number: WO2023071705A1
Application number: PCT/CN2022/123034
Authority: WO
Inventors: 彭耀锋; 李泉明; 施健
Original assignee: 华为技术有限公司
Priority date: 2021-11-01
Filing date: 2022-09-30
Publication date: 2023-05-04
Also published as: CN116075106A

Abstract

The present application provides a heat dissipation assembly, a vehicle module, and a vehicle. The heat dissipation assembly comprises a circuit board, one or more chips, a heat dissipation device, and a first cooling working medium, and the one or more chips are provided on the circuit board; the heat dissipation device and the circuit board jointly define a closed space, and the one or more chips are located in the closed space; the first cooling working medium is provided in the closed space and immerses the one or more chips, the first cooling working medium is configured to transfer heat of the one or more chips to the heat dissipation device by means of gas-liquid conversion, and the first cooling working medium is a non-conductive liquid. The technical solution of the present application can achieve good heat dissipation for the chip while ensuring that the chip has good working reliability, so that the vehicle applying the chip has good heat dissipation benefits.

Description

散热组件、车辆模块及车辆Cooling components, vehicle modules and vehicles

本申请要求于2021年11月01日提交中国国家知识产权局、申请号为202111282540.X、申请名称为“散热组件、车辆模块及车辆”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application claims priority to a Chinese patent application with application number 202111282540.X and application title "radiation assembly, vehicle module, and vehicle" filed with the State Intellectual Property Office of China on November 01, 2021, the entire contents of which are incorporated by reference in this application.

技术领域technical field

本申请涉及散热技术领域，尤其涉及一种散热组件、车辆模块及车辆。The present application relates to the technical field of heat dissipation, and in particular to a heat dissipation assembly, a vehicle module and a vehicle.

背景技术Background technique

随着汽车自动化等级的不断提高，应用在汽车内部模块的芯片的功耗急剧升高，散热成为芯片算力提高的一个重要挑战，芯片能否进行良好的散热直接影响整车性能。然而现有的对芯片进行散热的散热装置的散热能力较差，易导致芯片的工作可靠性降低。With the continuous improvement of the automation level of automobiles, the power consumption of chips used in the internal modules of automobiles has risen sharply, and heat dissipation has become an important challenge for the improvement of chip computing power. Whether the chips can perform good heat dissipation directly affects the performance of the entire vehicle. However, the existing heat dissipation device for dissipating heat from the chip has a poor heat dissipation capability, which easily leads to a decrease in the working reliability of the chip.

发明内容Contents of the invention

本申请的实施例提供一种散热组件、车辆模块及车辆，能够在保证芯片具有良好的工作可靠性的基础上，为芯片实现良好散热，进而使应用芯片的整车具有良好的散热收益。Embodiments of the present application provide a heat dissipation component, a vehicle module, and a vehicle, which can realize good heat dissipation for the chip on the basis of ensuring good working reliability of the chip, and further enable the entire vehicle using the chip to have good heat dissipation benefits.

本申请第一方面，提供一种散热组件，所述散热组件包括：In the first aspect of the present application, a heat dissipation assembly is provided, and the heat dissipation assembly includes:

电路板；circuit board;

一个或多个芯片，所述芯片一个或多个设于所述电路板；one or more chips, one or more of which are arranged on the circuit board;

散热装置，所述散热装置和所述电路板共同包围形成封闭空间，所述一个或多个芯片位于所述封闭空间内；及a heat dissipation device, the heat dissipation device and the circuit board together form a closed space, and the one or more chips are located in the closed space; and

第一冷却工质，所述第一冷却工质设于所述封闭空间，且浸没所述一个或多个芯片，所述第一冷却工质用于通过气液转换而将所述一个或多个芯片的热量传递至所述散热装置，且所述第一冷却工质为不导电的液体。A first cooling medium, the first cooling medium is arranged in the closed space, and immerses the one or more chips, and the first cooling medium is used to transform the one or more chips through gas-liquid conversion. The heat of one chip is transferred to the heat dissipation device, and the first cooling working fluid is a non-conductive liquid.

其中，当芯片的数量为一个时，一个芯片位于封闭空间内且浸没在第一冷却工质中，散热装置可以为该一个芯片散热。当芯片的数量为多个时，多个芯片均位于封闭空间内且均被第一冷却工质浸没，散热装置可以为该多个芯片散热。Wherein, when there is one chip, one chip is located in the closed space and immersed in the first cooling working fluid, and the heat dissipation device can dissipate heat for the one chip. When there are multiple chips, the multiple chips are all located in the closed space and submerged by the first cooling working fluid, and the cooling device can dissipate heat for the multiple chips.

第一冷却工质可以是任何不导电且具有两相转换功能(即能够在受热时汽化并在遇冷后液化)的液体。示例性地，第一冷却工质可以包括惰性的氟化液、制冷剂R134a(1,1,1,2-四氟乙烷)、制冷剂R245fa(1,1,1,3,3-五氟丙烷)、制冷剂R1234ze(1,1,1,3-四氟丙烯)、制冷剂R1233zd(1-氯-3,3,3-三氟丙烯)等中一种或多种的组合。The first cooling medium can be any non-conductive liquid that has a two-phase transition function (that is, can be vaporized when heated and liquefied when cooled). Exemplarily, the first cooling medium may include inert fluorinated liquid, refrigerant R134a (1,1,1,2-tetrafluoroethane), refrigerant R245fa (1,1,1,3,3-five Fluoropropane), refrigerant R1234ze (1,1,1,3-tetrafluoropropene), refrigerant R1233zd (1-chloro-3,3,3-trifluoropropene), etc.

可以理解的是，在芯片的工作过程中，芯片作为发热器件会产生大量的热量，从而在散热组件的相应位置处形成热点。热点的温度较高，如不及时将热点产生的热量有效散发，会直接影响散热组件的工作性能。例如若局部过热会使散热组件失效。也即为，散热组件的热量平衡情况会直接影响散热组件的工作性能。It can be understood that, during the working process of the chip, the chip, as a heat-generating device, will generate a large amount of heat, thereby forming hot spots at corresponding positions of the heat-dissipating components. The temperature of the hot spot is high, if the heat generated by the hot spot is not dissipated effectively in time, it will directly affect the working performance of the heat dissipation component. For example, if localized overheating can cause the heat dissipation component to fail. That is, the heat balance of the heat dissipation component will directly affect the working performance of the heat dissipation component.

基于此，通过使电路板和散热装置共同围设出封闭空间，并将第一冷却工质置于封闭空间内，能够因封闭空间良好的密闭性能，而为第一冷却工质提供具有较佳密封性的容置区域，有利于减少第一冷却工质逸散到外部环境的可能性。另外，芯片被第一冷却工质浸没，使得芯片全方位被第一冷却工质包裹，能够有效将芯片与空气隔绝开来。Based on this, by enclosing the closed space together with the circuit board and the heat dissipation device, and placing the first cooling working medium in the closed space, it is possible to provide the first cooling working medium with better performance due to the good sealing performance of the closed space. The airtight accommodating area is beneficial to reduce the possibility of the first cooling working fluid escaping to the external environment. In addition, the chip is submerged by the first cooling fluid, so that the chip is wrapped by the first cooling fluid in all directions, which can effectively isolate the chip from the air.

此设置下，第一冷却工质能够与芯片具有较大的接触面积，从而在芯片工作发热时，第一冷却工质可以及时携带上芯片的热量，并因其自身所具有的两相转换性能而在受热后汽化，汽化后所形成的蒸汽在遇到散热装置后遇冷凝结，冷却变为液体而迅速回流，循环往复实现芯片与散热装置之间的热量的传递。Under this setting, the first cooling medium can have a larger contact area with the chip, so that when the chip heats up, the first cooling medium can carry the heat of the chip in time, and because of its own two-phase conversion performance It is vaporized after being heated, and the steam formed after the vaporization meets the cooling device and then condenses when it meets the cooling device, and turns into a liquid when it is cooled, and then flows back quickly, and the heat transfer between the chip and the cooling device is realized in a cycle.

由此，能够通过第一冷却工质“蒸发-冷凝-...-蒸发”的不断的气液转换而将芯片的热量迅速传递至散热装置，并通过散热装置向外散发。一方面，能够因第一冷却工质浸没芯片的设置而使芯片的表面温度更为一致，不仅能够充分保证芯片的均温性，显著提高芯片与散热装置之间的热传递效率，更有利于提升散热组件整体的散热性能。另一方面，第一冷却工质能够提供良好的缓冲作用，有效避免芯片与散热装置之间因直接接触而导致受碰撞损坏的问题发生，有利于延长散热组件的工作寿命，散热组件整体的工作可靠性佳。Thus, through the continuous gas-liquid conversion of the first cooling medium "evaporation-condensation-...-evaporation", the heat of the chip can be quickly transferred to the heat sink, and then dissipated outside through the heat sink. On the one hand, the surface temperature of the chip can be more consistent due to the setting of the first cooling working fluid to immerse the chip, which can not only fully ensure the temperature uniformity of the chip, but also significantly improve the heat transfer efficiency between the chip and the heat sink, and is more conducive to Improve the overall cooling performance of the cooling components. On the other hand, the first cooling medium can provide a good buffering effect, effectively avoiding the problem of collision damage caused by direct contact between the chip and the heat sink, which is beneficial to prolong the working life of the heat sink assembly, and the overall work of the heat sink assembly Good reliability.

一种可能的实施方式中，所述散热装置包括散热基板和围框，所述围框连接至所述散热基板，且位于所述散热基板和所述电路板之间，所述围框包围所述一个或多个芯片，所述第一冷却工质与所述散热基板之间的间隙区域形成所述第一冷却工质的蒸汽通道。In a possible implementation manner, the heat dissipation device includes a heat dissipation substrate and a surrounding frame, the surrounding frame is connected to the heat dissipation substrate and is located between the heat dissipation substrate and the circuit board, and the surrounding frame surrounds the heat dissipation substrate. The one or more chips, the gap region between the first cooling working fluid and the heat dissipation substrate forms a steam channel for the first cooling working fluid.

也即为，围框连接在散热基板和电路板之间，散热基板、围框和电路板配合形成封闭空间。That is, the surrounding frame is connected between the heat dissipation substrate and the circuit board, and the heat dissipation substrate, the surrounding frame and the circuit board cooperate to form a closed space.

可以理解的是，在第一冷却工质与散热基板之间预留出蒸汽通道，能够使第一冷却工质的液面与散热基板之间形成一定的高度差，高度差有利于实现第一冷却工质的两相变换，能够促使第一冷却工质在受热时蒸发而向上流动，并在遇冷后凝结而向下回流，循环往复实现第一冷却工质的气液转换，其中，向上流动即向散热基板的方向流动，向下回流即向电路板的方向流动。It can be understood that a steam channel is reserved between the first cooling working fluid and the heat dissipation substrate, so that a certain height difference can be formed between the liquid surface of the first cooling working fluid and the heat dissipation substrate, and the height difference is conducive to realizing the first The two-phase transformation of the cooling medium can promote the first cooling medium to evaporate and flow upward when it is heated, and condense and flow downward after being cooled. The flow is to flow in the direction of the heat dissipation substrate, and the downward flow is to flow in the direction of the circuit board.

一种可能的实施方式中，所述散热装置还包括挡墙和密封垫，所述挡墙环绕设置在所述电路板上，且包围所述一个或多个芯片，所述密封垫夹设于所述围框和所述挡墙之间。In a possible implementation manner, the heat dissipation device further includes a retaining wall and a sealing gasket, the retaining wall is arranged around the circuit board and surrounds the one or more chips, and the sealing gasket is sandwiched between Between the surrounding frame and the retaining wall.

也即为，散热基板、围框、密封垫、挡墙和电路板配合形成封闭空间。That is, the heat dissipation substrate, the frame, the gasket, the retaining wall and the circuit board cooperate to form a closed space.

其中，当芯片的数量为一个时，挡墙包围一个芯片所在的区域。当芯片的数量为多个时，挡墙包围多个芯片所在的区域。也即为，无论芯片的数量多寡，挡墙均位于芯片***并将芯片包饶设置。Wherein, when the number of chips is one, the barrier wall surrounds the area where one chip is located. When there are multiple chips, the barrier surrounds the area where the multiple chips are located. That is, regardless of the number of chips, the retaining wall is located on the periphery of the chips and covers the chips.

通过设置挡墙，可以令挡墙将芯片所在区域围设起来，能够有效将芯片所在区域和其他器件所在区域区别开来，从而使芯片所在区域和其他器件所在区域能够彼此独立而不会相互影响，有利于根据芯片的布局区域而有针对性的对芯片进行导热和散热布局，可靠性佳。By setting up a barrier, the barrier can surround the area where the chip is located, which can effectively distinguish the area where the chip is located from the area where other devices are located, so that the area where the chip is located and the area where other devices are located can be independent of each other without affecting each other , which is conducive to targeted heat conduction and heat dissipation layout of the chip according to the layout area of the chip, and has good reliability.

示例性地，挡墙的材质可以为金属材质，金属材质不仅强度较高，同时还具有一定的电磁屏蔽作用，能够有效避免信号干扰，有利于保证芯片信号传输的精度，提高芯片工作时的稳定性，从而将芯片工作时出现异常的可能性降低到最小。Exemplarily, the material of the retaining wall can be a metal material. The metal material not only has high strength, but also has a certain electromagnetic shielding effect, which can effectively avoid signal interference, help ensure the accuracy of chip signal transmission, and improve the stability of the chip when it is working. Sex, thereby reducing the possibility of abnormality when the chip is working to a minimum.

需说明的是，挡墙的高度可以根据实际情况进行选取，本申请的实施例对此不做严格限制。例如，挡墙的高度可以与芯片的高度相同，其中，高度为垂直于电路板方向上的尺寸。或者，挡墙的高度可以大于芯片的高度，其中，高度为垂直于电路板方向上的尺寸。It should be noted that the height of the retaining wall can be selected according to the actual situation, which is not strictly limited in the embodiments of the present application. For example, the height of the wall may be the same as the height of the chip, wherein the height is a dimension perpendicular to the direction of the circuit board. Alternatively, the height of the barrier may be greater than the height of the chip, where the height is a dimension perpendicular to the direction of the circuit board.

围框与挡墙对应设置，从而使围框与挡墙配合形成封闭空间。也即为，通过设置围框，可以在散热基板的板面上圈设出与围框占用电路板板面区域所相当的区域，进而当围框和挡墙相互连接时，能够因围框和挡墙均位于散热基板和电路板之间，而在散热基板和电路板之间配合围设出封闭空间。The surrounding frame and the retaining wall are arranged correspondingly, so that the surrounding frame and the retaining wall cooperate to form a closed space. That is to say, by setting the surrounding frame, an area equivalent to the area of the circuit board surface occupied by the surrounding frame can be set on the board surface of the heat dissipation substrate, and then when the surrounding frame and the retaining wall are connected to each other, the The retaining walls are all located between the heat dissipation substrate and the circuit board, and a closed space is cooperatively formed between the heat dissipation substrate and the circuit board.

应当理解，由于挡墙呈包围芯片的结构形态，故而与挡墙连接的围框也呈包围芯片的结构形态。其中，当芯片的数量为一个时，围框包围一个芯片所在的区域。当芯片的数量为多个时，围框包围多个芯片所在的区域。也即为，无论芯片的数量多寡，围框均位于芯片***并将芯片包饶设置。It should be understood that since the retaining wall is in a structural form surrounding the chip, the surrounding frame connected to the retaining wall is also in a structural form surrounding the chip. Wherein, when the number of chips is one, the enclosing frame surrounds the area where one chip is located. When there are multiple chips, the enclosing frame surrounds the area where the multiple chips are located. That is, regardless of the number of chips, the surrounding frame is located on the periphery of the chips and surrounds the chips.

需说明的是，围框的高度可以根据实际情况进行选取，仅需使围框和挡墙的高度总和能够小于或等于散热基板与电路板之间的距离即可，本申请的实施例对此不做严格限制。例如，当密封垫连接在围框远离散热基板的一端的端面和挡墙远离电路板的一端的端面之间时，围框、密封垫和挡墙的高度总和共同构成散热基板和电路板之间的距离。当在围框远离散热基板的一端的端面或挡墙远离电路板的一端的端面设置容置槽时，密封垫可位于容置槽内部，围框和挡墙的高度总和共同构成散热基板和电路板之间的距离。It should be noted that the height of the surrounding frame can be selected according to the actual situation. It is only necessary to make the sum of the heights of the surrounding frame and the retaining wall less than or equal to the distance between the heat dissipation substrate and the circuit board. Not strictly limited. For example, when the gasket is connected between the end face of the frame away from the heat dissipation substrate and the end face of the barrier wall away from the circuit board, the sum of the heights of the frame, the gasket and the barrier wall together constitutes the gap between the heat sink substrate and the circuit board. distance. When an accommodating groove is provided on the end face of the frame away from the heat dissipation substrate or the end face of the retaining wall away from the circuit board, the sealing gasket can be located inside the accommodating groove, and the sum of the heights of the surrounding frame and the retaining wall together constitutes the heat dissipation substrate and the circuit distance between boards.

可以理解的是，通过在围框和挡墙之间设置密封垫，一方面，能够因密封垫所具有的弹性，而可以提供良好的缓冲作用，使得密封垫在受力后可通过弹性变形而抵消其自身所受的冲击力，有效避免围框和挡墙之间因直接接触而导致的刚性碰撞，规避因受振动/冲击所产生的不良影响。另一方面，能够因密封垫所具有的形变能力，而起到吸收公差以及进一步对封闭空间进行密封的作用，可靠性佳。It can be understood that by arranging the gasket between the surrounding frame and the retaining wall, on the one hand, due to the elasticity of the gasket, a good cushioning effect can be provided, so that the gasket can be elastically deformed after being stressed. Offset its own impact, effectively avoid the rigid collision caused by direct contact between the enclosure and the retaining wall, and avoid the adverse effects caused by vibration/shock. On the other hand, due to the deformation ability of the gasket, it can absorb tolerances and further seal the closed space, and has good reliability.

一种可能的实施方式中，所述围框远离所述散热基板的一端和所述挡墙远离所述电路板的一端中一个设有凸起，所述围框远离所述散热基板的一端和所述挡墙远离所述电路板的一端中另一个设有凹槽，所述密封垫连接在所述凸起与所述凹槽之间。In a possible implementation manner, one of the end of the surrounding frame far away from the heat dissipation substrate and the end of the retaining wall far away from the circuit board is provided with a protrusion, and the end of the surrounding frame far away from the heat dissipation substrate and The other end of the retaining wall away from the circuit board is provided with a groove, and the sealing gasket is connected between the protrusion and the groove.

此设置下，在围框上加工凸起/凹槽，并在对应的挡墙上加工凹槽/凸起，能够因凹槽与凸起相互配合而使围框与挡墙的连接处呈现类似方波形状的连接路径，此方波形状的连接路径，相对于平面与平面之间的直线形状的连接路径，能够延长第一冷却工质在蒸汽形态下逸散出封闭空间的通道长度，有利于使蒸汽的逸散速度减慢，进一步保证封闭空间的密封性能。Under this setting, the protrusions/grooves are processed on the surrounding frame, and the grooves/protrusions are processed on the corresponding retaining wall. Due to the cooperation between the grooves and the protrusions, the connection between the surrounding frame and the retaining wall can be similar. The connection path in the shape of a square wave, the connection path in the shape of a square wave, compared with the connection path in the shape of a straight line between planes, can extend the length of the channel for the first cooling working medium to escape from the closed space in the form of steam, and has It is beneficial to slow down the escape speed of steam and further ensure the sealing performance of the closed space.

需说明的是，凸起的数量可以为一个或多个。当凸起的数量为一个时，其可以设置在围框/挡墙的四侧中的任意一侧，而凹槽与凸起相对应故而凹槽的数量也为一个，其可以设置在挡墙/围框中与一个凸起相对应的位置。当凸起的数量为多个时，其可以间隔设置在围框/挡墙的四侧中的任意一侧、任意两侧、任意三侧或每一侧。而凹槽与凸起可以为一对一的对应关系，故而凹槽的数量也为多个，其可以设置在与多个凸起分别相对应的挡墙/围框不同位置。It should be noted that the number of protrusions may be one or more. When the number of protrusions is one, it can be arranged on any side of the four sides of the enclosure/retaining wall, and the groove corresponds to the protrusion, so the number of grooves is also one, and it can be arranged on the retaining wall / The position in the bounding box corresponding to a bump. When there are multiple protrusions, they can be arranged at intervals on any one, any two sides, any three sides or each side of the four sides of the enclosure/retaining wall. And groove and protrusion can be one-to-one correspondence, so the quantity of groove is also a plurality of, and it can be arranged in different positions of the retaining wall/surrounding frame corresponding to a plurality of protrusions respectively.

一种可能的实施方式中，所述散热基板包括第一表面，所述围框设于所述第一表面，所述散热装置还包括第一翅片，所述第一翅片设于所述第一表面且位于所述封闭空间内。In a possible implementation manner, the heat dissipation substrate includes a first surface, and the surrounding frame is arranged on the first surface, and the heat dissipation device further includes first fins, and the first fins are arranged on the first surface. The first surface is located in the enclosed space.

示例性地，第一翅片可以包括间隔设置的多个第一齿部，相邻两个第一齿部的间隔区域能够形成用于供第一冷却工质流动的流道。Exemplarily, the first fin may include a plurality of first teeth arranged at intervals, and the space between two adjacent first teeth can form a flow channel for the first cooling medium to flow.

可以理解的是，在封闭空间内部设置第一翅片，并使相邻两个第一齿部的间隔区域形成流道，能够使第一冷却工质受热蒸发后的蒸汽流动至流道中，并在遇冷后凝结为液体而沿着第一齿部向下回流，有效增加第一冷却工质的蒸汽遇冷冷凝后的换热面积，能够强化第一冷却工质的换热性能，使散热装置具备优异的热传导能力。It can be understood that the first fins are arranged inside the closed space, and the space between two adjacent first teeth forms a flow channel, so that the steam evaporated by the first cooling working medium can flow into the flow channel, and After being cooled, it condenses into a liquid and flows back down along the first tooth, effectively increasing the heat transfer area of the first cooling medium after the steam is cooled and condensed, which can strengthen the heat transfer performance of the first cooling medium and make the heat dissipation The device has excellent thermal conductivity.

需说明的是，以上仅为示例性的描述强化第一冷却工质蒸汽的冷凝换热的实现可能性，而强化第一冷却工质蒸汽的冷凝换热的实现可能性也不局限于上述列举的第一翅片，其还可以在第一表面上设置凸起、或在第一表面上设置凹槽、或在围框位于封闭空间内的表面上设置凸起、或在围框位于封闭空间内的表面上设置凹槽等其他实现形式，仅需满足能够强化第一冷却工质蒸汽的冷凝换热的目的即可，本申请的实施例对此不做严格限制。It should be noted that the above is only an exemplary description of the realization possibility of strengthening the condensation heat exchange of the first cooling working fluid steam, and the realization possibility of strengthening the condensation heat exchange of the first cooling working fluid steam is not limited to the above list The first fin can also be provided with protrusions on the first surface, or grooves can be provided on the first surface, or protrusions can be provided on the surface of the surrounding frame located in the closed space, or the surrounding frame can be located in the closed space. Other implementation forms such as setting grooves on the inner surface only need to meet the purpose of strengthening the condensation heat exchange of the first cooling working fluid steam, which is not strictly limited in the embodiments of the present application.

一种可能的实施方式中，所述散热组件还包括补液通道和第一密封塞，所述补液通道位于所述围框的外侧且与所述封闭空间连通，所述补液通道用于向所述封闭空间内补充所述第一冷却工质，所述第一密封塞与所述补液通道可拆卸连接并密封所述补液通道。In a possible implementation manner, the heat dissipation assembly further includes a liquid replenishment channel and a first sealing plug, the liquid replenishment channel is located outside the enclosure and communicates with the enclosed space, and the liquid replenishment channel is used to The closed space is supplemented with the first cooling medium, and the first sealing plug is detachably connected with the liquid replenishment channel and seals the liquid replenishment channel.

示例性地，补液通道可以设置在围框上，或者，补液通道也可以设置在挡墙上。Exemplarily, the fluid replacement channel may be arranged on the surrounding frame, or the fluid replacement channel may also be arranged on the retaining wall.

需说明的是，补液通道的具体设置位置以及补液通道的形态可根据实际应用场景进行调整，仅需满足补液通道与封闭空间连通，且可供第一冷却工质在其内流动即可，本申请的实施例对此不做严格限制。It should be noted that the specific setting position of the liquid replenishment channel and the shape of the liquid replenishment channel can be adjusted according to the actual application scenario. It only needs to meet the requirement that the liquid replenishment channel is connected to the closed space and that the first cooling medium can flow in it. The embodiments of the application do not strictly limit this.

可以理解的是，由于第一冷却工质为具有气液转换功能的两相液体，其在循环往复的两相转换过程中，会随着时间的流逝而发生逸散，逸散会致使第一冷却工质的液体量减少，液面下降，进而导致第一冷却工质与芯片之间的接触不足，使得第一冷却工质的热传递效率降低，无法实现为芯片的良好导热。故而需要定期在封闭空间内补充第一冷却工质，以确保第一冷却工质能够始终浸没芯片，保证散热组件整体的使用性能不受严重影响。It can be understood that since the first cooling working medium is a two-phase liquid with a gas-liquid conversion function, it will dissipate as time goes by during the reciprocating two-phase conversion process, and the dissipation will cause the first cooling The liquid amount of the working medium decreases, and the liquid level drops, which leads to insufficient contact between the first cooling working medium and the chip, which reduces the heat transfer efficiency of the first cooling working medium, and cannot achieve good heat conduction for the chip. Therefore, it is necessary to regularly replenish the first cooling medium in the closed space to ensure that the first cooling medium can always immerse the chip and ensure that the overall performance of the heat dissipation component is not seriously affected.

由此，设置补液通道可以在散热组件的外部与封闭空间之间形成可供第一冷却工质流动的通道，从而在封闭空间内的第一冷却工质的液面下降时，可以及时向封闭空间内补充第一冷却工质，使第一冷却工质与芯片之间的换热性能不受影响，灵活性强。而设置第一密封塞并使其与补液通道远离封闭空间的一端可拆卸连接，能够在需向封闭空间内补充第一冷却工质时将之从补液通道中拆卸，而在补充完第一冷却工质后将之与补液通道密封连接，此设置下，无需借助复杂工具即可达成与补液通道的连接，操作方式简便快捷。Thus, the provision of the replenishment channel can form a channel between the outside of the cooling assembly and the closed space for the flow of the first cooling medium, so that when the liquid level of the first cooling medium in the closed space drops, it can be closed in time. The first cooling working fluid is supplemented in the space, so that the heat exchange performance between the first cooling working fluid and the chip is not affected, and the flexibility is strong. The first sealing plug is set and detachably connected to the end of the liquid replenishment channel away from the closed space, so that it can be removed from the liquid replenishment channel when the first cooling medium needs to be replenished in the closed space, and after the first cooling fluid is replenished The working fluid is then sealed and connected to the liquid replenishment channel. Under this setting, the connection with the liquid replenishment channel can be achieved without the use of complicated tools, and the operation method is simple and fast.

一种可能的实施方式中，所述散热组件还包括液位传感器，所述液位传感器位于所述补液通道内，所述液位传感器用于在所述第一冷却工质的液位小于预设液位时告警，保证第一冷却工质始终浸没芯片。其中，预设液位可以是第一冷却工质浸没芯片的临界液位。In a possible implementation manner, the heat dissipation assembly further includes a liquid level sensor, the liquid level sensor is located in the replenishment channel, and the liquid level sensor is used to An alarm is set when the liquid level is set to ensure that the first cooling fluid is always immersed in the chip. Wherein, the preset liquid level may be a critical liquid level at which the chip is submerged by the first cooling working fluid.

需说明的是，以上仅为示例性的描述液位传感器的位置可能性，其还可以位于封闭空间内部，而提醒用户需向封闭空间内补充第一冷却工质的实现可能性也不局限于上述列举的液位传感器，其还可以是液位标尺等其他实现形式，仅需满足能够达到提醒用户的目的即可，本申请的实施例对此不做严格限制。It should be noted that the above is only an exemplary description of the location possibility of the liquid level sensor, which can also be located inside the closed space, and the implementation possibility of reminding the user to replenish the first cooling medium in the closed space is not limited to The liquid level sensor listed above can also be implemented in other forms such as a liquid level gauge, as long as it can achieve the purpose of reminding the user, and the embodiments of the present application do not strictly limit it.

一种可能的实施方式中，所述散热组件还包括排气通道和第二密封塞，所述排气通道位于所述围框的外侧且与所述蒸汽通道连通，所述排气通道用于排出空气，所述第二密封塞与所述排气通道可拆卸连接并密封所述排气通道。In a possible implementation manner, the heat dissipation assembly further includes an exhaust channel and a second sealing plug, the exhaust channel is located outside the surrounding frame and communicates with the steam channel, and the exhaust channel is used for To discharge air, the second sealing plug is detachably connected with the exhaust channel and seals the exhaust channel.

示例性地，排气通道可以设置在围框上，或者，排气通道也可以设置在挡墙上。Exemplarily, the exhaust passage can be arranged on the surrounding frame, or the exhaust passage can also be arranged on the retaining wall.

在一具体的应用场景中，排气通道与补液通道异侧设置。也即为，排气通道与补液通道设置在围框的不同侧。由此，向封闭空间内补充第一冷却工质和排出封闭空间内的空气的两个操作可以因排气通道与补液通道异侧设置而具有较大的操作空间，有利于使两者彼此独立而不会相互干涉。In a specific application scenario, the exhaust channel and the liquid replenishment channel are arranged on opposite sides. That is, the exhaust channel and the liquid replenishment channel are arranged on different sides of the surrounding frame. Therefore, the two operations of replenishing the first cooling medium into the closed space and exhausting the air in the closed space can have a larger operating space because the exhaust channel and the replenishment channel are arranged on different sides, which is beneficial to make the two independent of each other without interfering with each other.

在另一具体的应用场景中，排气通道与补液通道同侧设置。也即为，排气通道与补液通道设置在围框的同一侧。In another specific application scenario, the exhaust channel is set on the same side as the liquid replenishment channel. That is, the exhaust channel and the liquid replenishment channel are arranged on the same side of the surrounding frame.

需说明的是，排气通道的具体设置位置以及排气通道的形态可根据实际应用场景进行调整，仅需满足排气通道与蒸汽通道连通，且可供空气流动即可，本申请的实施例对此不做严格限制。It should be noted that the specific setting position of the exhaust channel and the shape of the exhaust channel can be adjusted according to the actual application scenario. There are no strict restrictions on this.

可以理解的是，在散热装置未使用的状态下，封闭空间内部可能会具有一定量的空气，空气会对第一冷却工质的两相转换过程造成一定影响。由此，设置排气通道可以在散热装置未工作前预加热芯片，使封闭空间内部的残留空气通过排气通道排出，以使第一冷却工质能够在较为清洁的环境中工作，有效将因清洁度不够而受污染的问题发生的可能性降低到最小，使第一冷却工质可以通过相变进行热量传递，换热效率高，可靠性佳。而设置第二密封塞并使其与排气通道远离封闭空间的一端可拆卸连接，能够在需排出封闭空间内的空气时将之从排气通道中拆卸，而在排出完封闭空间内的空气后将之与排气通道密封连接，此设置下，无需借助复杂工具即可达成与排气通道的连接，操作方式简便快捷。It can be understood that, when the cooling device is not in use, there may be a certain amount of air inside the closed space, and the air will have a certain impact on the two-phase conversion process of the first cooling working medium. Therefore, setting the exhaust channel can preheat the chip before the cooling device is in operation, so that the residual air in the closed space can be discharged through the exhaust channel, so that the first cooling medium can work in a relatively clean environment, effectively reducing the heat dissipation due to The possibility of pollution due to insufficient cleanliness is minimized, so that the first cooling working fluid can transfer heat through phase change, with high heat exchange efficiency and good reliability. And the second sealing plug is set and made to be detachably connected with the exhaust passage away from one end of the closed space, it can be disassembled from the exhaust passage when the air in the closed space needs to be discharged, and after the air in the closed space has been discharged Finally, it is sealed and connected with the exhaust channel. Under this setting, the connection with the exhaust channel can be achieved without the use of complicated tools, and the operation method is simple and fast.

一种可能的实施方式中，所述散热装置还包括第二冷却工质，所述散热基板内设有腔体，所述第二冷却工质设于所述腔体并能够在所述腔体内流动而为所述散热基板散热。In a possible implementation manner, the heat dissipation device further includes a second cooling medium, a cavity is provided in the heat dissipation substrate, and the second cooling medium is provided in the cavity and can flow to dissipate heat for the heat dissipation substrate.

此设置下，第一冷却工质通过相变将芯片的热量传递至散热基板，散热基板能够通过第二冷却工质在其腔体内的流动而携带上热量，使散热基板可形成类似冷板的结构，进而通过液冷散热的方式使散热装置整体具有优异的散热性能。Under this setting, the first cooling fluid transfers the heat of the chip to the heat dissipation substrate through phase change, and the heat dissipation substrate can carry heat through the flow of the second cooling fluid in its cavity, so that the heat dissipation substrate can form a cold plate-like structure, and then the heat dissipation device has excellent heat dissipation performance through liquid cooling and heat dissipation.

示例性地，第二冷却工质可以包括水、惰性的氟化液、制冷剂R134a(1,1,1,2-四氟乙烷)、制冷剂R245fa(1,1,1,3,3-五氟丙烷)、制冷剂R1234ze(1,1,1,3-四氟丙烯)、制冷剂R1233zd(1-氯-3,3,3-三氟丙烯)等中一种或多种的组合。Exemplarily, the second cooling medium may include water, inert fluorinated liquid, refrigerant R134a (1,1,1,2-tetrafluoroethane), refrigerant R245fa (1,1,1,3,3 - Pentafluoropropane), refrigerant R1234ze (1,1,1,3-tetrafluoropropene), refrigerant R1233zd (1-chloro-3,3,3-trifluoropropene), etc. .

一种可能的实施方式中，所述散热基板包括与所述第一表面相背设置的第二表面，所述散热装置还包括第二翅片，所述第二翅片设于所述第二表面。In a possible implementation manner, the heat dissipation substrate includes a second surface opposite to the first surface, and the heat dissipation device further includes second fins disposed on the second surface. surface.

示例性地，第二翅片可以包括间隔设置的多个第二齿部，相邻两个第二齿部的间隔区域能够形成用于供空气流动的风道。Exemplarily, the second fin may include a plurality of second teeth arranged at intervals, and the space between two adjacent second teeth can form an air channel for air flow.

可以理解的是，相邻两个第二齿部的间隔区域形成风道。也即为，冷空气能够在流动的过程中，不断的通过风道流向散热装置的外部环境，从而使风道中被加热的空气不断流向散热装置的外部环境中，并使外部环境中的冷空气不断的进入到风道中，进而能够快速的将散热基板上的热量传递至外部环境中，使得自然散热的对流换热水平提高，从而通过风冷散热的方式使散热装置整体具有优异的散热性能。It can be understood that the space between two adjacent second teeth forms an air duct. That is, the cold air can continuously flow to the external environment of the heat sink through the air duct during the flow, so that the heated air in the air duct continuously flows to the external environment of the heat sink, and the cold air in the external environment Continuously enters the air duct, and then can quickly transfer the heat on the heat dissipation substrate to the external environment, so that the level of convective heat transfer of natural heat dissipation is improved, so that the heat dissipation device as a whole has excellent heat dissipation performance through air cooling and heat dissipation.

第二方面，本申请还提供一种车辆模块，所述车辆模块包括如上所述的散热组件。In a second aspect, the present application further provides a vehicle module, the vehicle module includes the heat dissipation assembly as described above.

需说明的是，散热组件不仅可以适用于如上所述的车辆模块，其还可以适用于任何对芯片的散热有需求的设备，如手机、平板电脑、笔记本电脑、智能手环、智能手表、等智能消费类电子设备，也可以为如城域路由器、中心路由器等电信机房类设备，也可以为如数据中心服务器、数据中心交换机等IT计算机房类设备，也可以为如MDC(Mobile Data Center，移动数据中心)等车载类设备，其还可应用至工业机器人、轨道交通(例如地铁、高铁)或特种电源(例如舰船、飞机、车辆)等，本申请的实施例对此不做严格限制。It should be noted that the heat dissipation component can not only be applied to the above-mentioned vehicle modules, but also can be applied to any device that requires chip heat dissipation, such as mobile phones, tablet computers, notebook computers, smart bracelets, smart watches, etc. Smart consumer electronic devices can also be telecom equipment such as metro routers and central routers, IT computer equipment such as data center servers and data center switches, or MDC (Mobile Data Center, Mobile data center) and other vehicle-mounted equipment, which can also be applied to industrial robots, rail transit (such as subways, high-speed rails) or special power supplies (such as ships, aircrafts, vehicles), etc., the embodiments of this application are not strictly limited .

第三方面，本申请还提供一种车辆，所述车辆包括如上所述的车辆模块。In a third aspect, the present application further provides a vehicle, the vehicle includes the above-mentioned vehicle module.

附图说明Description of drawings

图1是本申请实施例提供的车辆的结构示意图；Fig. 1 is a schematic structural diagram of a vehicle provided by an embodiment of the present application;

图2是本申请实施例提供的车辆模块的结构示意图；Fig. 2 is a schematic structural diagram of a vehicle module provided by an embodiment of the present application;

图3是图2所示的车辆模块的***示意图；Fig. 3 is an exploded schematic diagram of the vehicle module shown in Fig. 2;

图4是本申请实施例提供的散热组件的一种结构示意图；Fig. 4 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application;

图5是图4所示的散热组件的一种***示意图；Fig. 5 is an exploded schematic diagram of the heat dissipation assembly shown in Fig. 4;

图6是本申请实施例提供的散热组件的另一种结构示意图；Fig. 6 is another schematic structural view of the heat dissipation assembly provided by the embodiment of the present application;

图7是本申请实施例提供的散热组件的芯片的一种排布示意图；Fig. 7 is a schematic diagram of the arrangement of chips of the heat dissipation assembly provided by the embodiment of the present application;

图8是本申请实施例提供的散热组件的芯片的另一种排布示意图；Fig. 8 is another schematic diagram of the arrangement of the chips of the heat dissipation assembly provided by the embodiment of the present application;

图9是图4所示A区域的密封垫的一种连接示意图；Fig. 9 is a schematic diagram of the connection of the gasket in area A shown in Fig. 4;

图10是图4所示的A区域的密封垫的另一种连接示意图；Fig. 10 is another connection schematic diagram of the gasket in the A region shown in Fig. 4;

图11是图4所示的A区域的密封垫的又一种连接示意图；Fig. 11 is another connection schematic diagram of the gasket in the A region shown in Fig. 4;

图12是图4所示的A区域的密封垫的再一种连接示意图；Fig. 12 is another connection schematic diagram of the gasket in the A region shown in Fig. 4;

图13是图4所示的A区域的密封垫的第五种连接示意图；Fig. 13 is a schematic diagram of the fifth connection of the gasket in the A region shown in Fig. 4;

图14是图4所示的A区域的密封垫的第六种连接示意图；Fig. 14 is a schematic diagram of the sixth connection of the gasket in the A region shown in Fig. 4;

图15是图4所示的A区域的密封垫的第七种连接示意图；Fig. 15 is a schematic diagram of the seventh connection of the gasket in the A region shown in Fig. 4;

图16是本申请实施例提供的散热组件的又一种结构示意图；Fig. 16 is another structural schematic diagram of the heat dissipation assembly provided by the embodiment of the present application;

图17是本申请实施例提供的散热组件的再一种结构示意图；Fig. 17 is another structural schematic diagram of the heat dissipation assembly provided by the embodiment of the present application;

图18是本申请实施例提供的散热组件的第五种结构示意图；Fig. 18 is a schematic diagram of the fifth structure of the heat dissipation assembly provided by the embodiment of the present application;

图19是本申请实施例提供的散热组件的第六种结构示意图。FIG. 19 is a schematic diagram of a sixth structure of a heat dissipation assembly provided by an embodiment of the present application.

具体实施方式Detailed ways

为了方便理解，首先对本申请的实施例所涉及的术语进行解释。For ease of understanding, the terms involved in the embodiments of the present application are explained first.

多个：是指两个或多于两个。Plurality: Refers to two or more than two.

连接：应做广义理解，例如，A与B连接，可以是A与B直接相连，也可以是A与B通过中间媒介间接相连。Connection: It should be understood in a broad sense. For example, the connection between A and B can be directly connected between A and B, or indirectly connected through an intermediary.

下面将结合附图，对本申请的具体实施方式进行清楚地描述。The specific implementation manners of the present application will be clearly described below in conjunction with the accompanying drawings.

随着汽车自动化等级的不断提高，应用在汽车内部模块的芯片的功耗急剧升高，散热成为芯片算力提高的一个重要挑战，芯片能否进行良好的散热直接影响整车性能。目前，芯片常通过金属盖(Lid)封装的工艺封装，并通过金属盖与散热器连接。由于芯片与金属盖之间会通过热界面材料(TIM，Thermal Interface Material)连接，金属盖与散热器之间也会通过热界面材料连接，这两部分的热阻总和过大，易导致芯片在功耗升高的情况下，散热性能急剧下降。With the continuous improvement of the automation level of automobiles, the power consumption of chips used in the internal modules of automobiles has risen sharply, and heat dissipation has become an important challenge for the improvement of chip computing power. Whether the chips can perform good heat dissipation directly affects the performance of the entire vehicle. At present, chips are often packaged through a metal lid (Lid) packaging process, and connected to a heat sink through the metal lid. Since the chip and the metal cover are connected through a thermal interface material (TIM, Thermal Interface Material), and the metal cover and the heat sink are also connected through a thermal interface material, the sum of the thermal resistance of these two parts is too large, which may easily cause the chip As power consumption increases, thermal performance drops dramatically.

基于此，请结合参阅图1-图19，本申请的实施例提供一种散热组件100、车辆模块200和车辆300，能够在保证芯片具有良好的工作可靠性的基础上，为芯片实现良好散热，进而使应用芯片的整车具有良好的散热收益。Based on this, please refer to FIG. 1-FIG. 19. The embodiment of the present application provides a heat dissipation assembly 100, a vehicle module 200, and a vehicle 300, which can achieve good heat dissipation for the chip on the basis of ensuring good working reliability of the chip. , so that the whole vehicle using the chip has good heat dissipation benefits.

请结合参阅图1和图2，车辆300包括车辆模块200，通过在车辆模块200内设置具有良好散热收益的结构，不仅能够实现对于芯片的良好散热，还能够使车辆模块200自身具备良好的散热性能，进而使应用车辆模块200的车辆300具备良好的工作可靠性。Please refer to FIG. 1 and FIG. 2 together. The vehicle 300 includes the vehicle module 200. By setting a structure with good heat dissipation benefits in the vehicle module 200, not only good heat dissipation for the chip can be achieved, but also good heat dissipation for the vehicle module 200 itself can be achieved. performance, so that the vehicle 300 to which the vehicle module 200 is applied has good working reliability.

其中，车辆300可以为但不限于为纯电动车辆(Pure Electric Vehicle/Battery Electric Vehicle，PEV/BEV)、混合动力车辆(Hybrid Electric Vehicle，HEV)、增程式电动车辆(Range Extended Electric Vehicle，REEV)、插电式混合动力车辆(Plug-in Hybrid Electric Vehicle，PHEV)、新能源车辆(New Energy Vehicle)，燃油车辆等。车辆模块200可以为但不限于为自动驾驶模块、刹车***所属模块、转向制动***所属模块等模块。Wherein, the vehicle 300 may be, but not limited to, a pure electric vehicle (Pure Electric Vehicle/Battery Electric Vehicle, PEV/BEV), a hybrid electric vehicle (Hybrid Electric Vehicle, HEV), a range extended electric vehicle (Range Extended Electric Vehicle, REEV) , Plug-in Hybrid Electric Vehicle (PHEV), New Energy Vehicle (New Energy Vehicle), fuel vehicles, etc. The vehicle module 200 may be, but not limited to, an automatic driving module, a module belonging to the braking system, a module belonging to the steering braking system, and the like.

请结合参阅图2和图3，车辆模块200包括主板210和散热组件100，散热组件100连接至主板210，以具有良好的固位稳定性。示例性地，车辆模块还可以包括连接件220，散热组件100可通过连接件220固定至主板210，其中，连接件220可以为螺钉。Please refer to FIG. 2 and FIG. 3 together. The vehicle module 200 includes a main board 210 and a heat dissipation assembly 100 . The heat dissipation assembly 100 is connected to the main board 210 to have good retention stability. Exemplarily, the vehicle module may further include a connecting piece 220 through which the heat sink assembly 100 may be fixed to the main board 210 , wherein the connecting piece 220 may be a screw.

需说明的是，散热组件100不仅可以适用于如上所述的车辆模块200，其还可以适用于任何对芯片的散热有需求的设备，如手机、平板电脑、笔记本电脑、智能手环、智能手表、等智能消费类电子设备，也可以为如城域路由器、中心路由器等电信机房类设备，也可以为如数据中心服务器、数据中心交换机等IT计算机房类设备，也可以为如MDC(Mobile Data Center，移动数据中心)等车载类设备，其还可应用至工业机器人、轨道交通(例如地铁、高铁)或特种电源(例如舰船、飞机、车辆)等，本申请的实施例对此不做严格限制。It should be noted that the heat dissipation assembly 100 is not only applicable to the vehicle module 200 described above, but also applicable to any device that requires cooling of chips, such as mobile phones, tablet computers, notebook computers, smart bracelets, and smart watches. , and other smart consumer electronic devices, it can also be equipment in telecommunications equipment such as metropolitan area routers and central routers, it can also be equipment in IT computer rooms such as data center servers and data center switches, or it can be equipment such as MDC (Mobile Data Center, mobile data center) and other vehicle-mounted devices, which can also be applied to industrial robots, rail transit (such as subways, high-speed rails) or special power supplies (such as ships, aircrafts, vehicles), etc., the embodiments of the present application do not do this Strict restrictions.

如下将结合图2-图19对散热组件100的详细结构进行说明。The detailed structure of the heat dissipation assembly 100 will be described below with reference to FIGS. 2-19 .

请结合参阅图4和图5，散热组件100包括电路板10、芯片20、散热装置30和第一冷却工质40。Please refer to FIG. 4 and FIG. 5 together. The heat dissipation assembly 100 includes a circuit board 10 , a chip 20 , a heat dissipation device 30 and a first cooling medium 40 .

电路板10连接至主板210，以实现电路板10与主板210之间的物理连接和电连接。示例性地，电路板10可以为带BGA(Ball Grid Arra，球栅阵列封装)形式的封装基板，并通过设于电路板10的焊球230焊接至主板210。或者，电路板10也可以为ECP(Embedded Chip substrate，芯片20埋入式基板)形式的封装基板，并可通过如焊接等形式而连接至主板210，本申请的实施例对于电路板10的具体实现形式以及电路板10与主板210之间的连接方式不做严格限制。The circuit board 10 is connected to the main board 210 to realize physical connection and electrical connection between the circuit board 10 and the main board 210 . Exemplarily, the circuit board 10 may be a packaging substrate in the form of BGA (Ball Grid Arra, ball grid array package), and soldered to the main board 210 through the solder balls 230 provided on the circuit board 10 . Alternatively, the circuit board 10 can also be a packaging substrate in the form of an ECP (Embedded Chip substrate, chip 20 embedded substrate), and can be connected to the main board 210 through forms such as welding. The embodiment of the present application is specific to the circuit board 10 The implementation form and the connection mode between the circuit board 10 and the main board 210 are not strictly limited.

芯片20可以用于计算，信号处理等，在工作过程中产生热量，是散热组件100的热源，其设于电路板10。也即为，电路板10为芯片20的载体，可以为芯片20提供电连接、保护、支撑、散热、组装等功能。The chip 20 can be used for computing, signal processing, etc., and generates heat during operation, which is the heat source of the heat dissipation assembly 100 , which is arranged on the circuit board 10 . That is, the circuit board 10 is the carrier of the chip 20 and can provide functions such as electrical connection, protection, support, heat dissipation, and assembly for the chip 20 .

需说明的是，芯片20的数量可以根据实际应用场景进行选取，其可以为一个或多个。当芯片20的数量为一个时，一个芯片20设于电路板10。当芯片20的数量为多个时，多个芯片20间隔设于电路板10。It should be noted that the number of chips 20 may be selected according to actual application scenarios, and may be one or more. When the number of chips 20 is one, one chip 20 is provided on the circuit board 10 . When there are multiple chips 20 , the multiple chips 20 are arranged on the circuit board 10 at intervals.

散热装置30为能够对芯片20产生的热量进行传导、扩散或交换，以为芯片20进行散热的构件，其能够通过散热装置30的热辐射、自然对流或风扇的风冷散热中的多种而将热量散发至外部环境中。The heat sink 30 is a component capable of conducting, diffusing or exchanging the heat generated by the chip 20 to dissipate heat for the chip 20. The heat is dissipated to the external environment.

具体而言，散热装置30和电路板10共同包围形成封闭空间50，并使芯片20位于封闭空间50内。第一冷却工质40设于封闭空间50，且浸没芯片20，第一冷却工质40用于通过气液转换而将芯片20的热量传递至散热装置30。Specifically, the heat sink 30 and the circuit board 10 together form a closed space 50 , and the chip 20 is located in the closed space 50 . The first cooling medium 40 is disposed in the enclosed space 50 and submerged in the chip 20 . The first cooling medium 40 is used to transfer the heat of the chip 20 to the cooling device 30 through gas-liquid conversion.

其中，当芯片20的数量为一个时，一个芯片20位于封闭空间50内且浸没在第一冷却工质40中，散热装置30可以为该一个芯片20散热。当芯片20的数量为多个时，多个芯片20均位于封闭空间50内且均被第一冷却工质40浸没，散热装置30可以为该多个芯片20散热。Wherein, when there is one chip 20 , one chip 20 is located in the enclosed space 50 and immersed in the first cooling medium 40 , and the heat dissipation device 30 can dissipate heat for the one chip 20 . When there are multiple chips 20 , the multiple chips 20 are all located in the enclosed space 50 and submerged by the first cooling medium 40 , and the cooling device 30 can dissipate heat for the multiple chips 20 .

第一冷却工质40可以是任何不导电且具有两相转换功能(即能够在受热时汽化并在遇冷后液化)的液体。示例性地，第一冷却工质40可以为惰性的氟化液、制冷剂R134a(1,1,1,2-四氟乙烷)、制冷剂R245fa(1,1,1,3,3-五氟丙烷)、制冷剂R1234ze(1,1,1,3-四氟丙烯)、制冷剂R1233zd(1-氯-3,3,3-三氟丙烯)中一种或多种的组合。The first cooling medium 40 can be any liquid that is non-conductive and has a two-phase transition function (that is, can be vaporized when heated and liquefied when cooled). Exemplarily, the first cooling medium 40 may be inert fluorinated liquid, refrigerant R134a (1,1,1,2-tetrafluoroethane), refrigerant R245fa (1,1,1,3,3- Pentafluoropropane), refrigerant R1234ze (1,1,1,3-tetrafluoropropene), refrigerant R1233zd (1-chloro-3,3,3-trifluoropropene) or a combination of one or more.

可以理解的是，在芯片20的工作过程中，芯片20作为发热器件会产生大量的热量，从而在散热组件100的相应位置处形成热点。热点的温度较高，如不及时将热点产生的热量有效散发，会直接影响散热组件100的工作性能。例如若局部过热会使散热组件100失效。也即为，散热组件100的热量平衡情况会直接影响散热组件100的工作性能。It can be understood that, during the working process of the chip 20 , the chip 20 as a heat generating device will generate a large amount of heat, thus forming a hot spot at a corresponding position of the heat dissipation assembly 100 . The temperature of the hot spot is relatively high, if the heat generated by the hot spot is not dissipated effectively in time, the working performance of the heat dissipation assembly 100 will be directly affected. For example, if local overheating will cause the heat dissipation component 100 to fail. That is, the heat balance of the heat dissipation assembly 100 will directly affect the working performance of the heat dissipation assembly 100 .

基于此，通过使电路板10和散热装置30共同围设出封闭空间50，并将第一冷却工质40置于封闭空间50内，能够因封闭空间50良好的密闭性能，而为第一冷却工质40提供具有较佳密封性的容置区域，有利于减少第一冷却工质40逸散到外部环境的可能性。另外，芯片20被第一冷却工质40浸没，使得芯片20全方位被第一冷却工质40包裹，能够有效将芯片20与空气隔绝开来。Based on this, by making the circuit board 10 and the heat sink 30 jointly enclose the closed space 50, and placing the first cooling medium 40 in the closed space 50, the good airtightness of the closed space 50 can provide a cooling effect for the first cooling medium. The working medium 40 provides an accommodating area with better sealing, which is beneficial to reduce the possibility of the first cooling working medium 40 escaping to the external environment. In addition, the chip 20 is submerged by the first cooling medium 40 , so that the chip 20 is wrapped by the first cooling medium 40 in all directions, which can effectively isolate the chip 20 from the air.

此设置下，第一冷却工质40能够与芯片20具有较大的接触面积，从而在芯片20工作发热时，第一冷却工质40可以及时携带上芯片20的热量，并因其自身所具有的两相转换性能而在受热后汽化，汽化后所形成的蒸汽在遇到散热装置30后遇冷凝结，冷却变为液体而迅速回流，循环往复实现芯片20与散热装置30之间的热量的传递。Under this setting, the first cooling medium 40 can have a larger contact area with the chip 20, so that when the chip 20 heats up during operation, the first cooling medium 40 can carry the heat of the chip 20 in time, and because of its own The two-phase conversion performance is vaporized after being heated, and the vapor formed after the vaporization meets the cooling device 30 and then condenses when it meets the cooling device 30, and turns into a liquid when it cools down and then flows back quickly, and the heat between the chip 20 and the cooling device 30 is realized in a cycle transfer.

由此，能够通过第一冷却工质40“蒸发-冷凝-...-蒸发”的不断的气液转换而将芯片 20的热量迅速传递至散热装置30，并通过散热装置30向外散发。一方面，能够因第一冷却工质40浸没芯片20的设置而使芯片20的表面温度更为一致，不仅能够充分保证芯片20的均温性，显著提高芯片20与散热装置30之间的热传递效率，更有利于提升散热组件100整体的散热性能。另一方面，第一冷却工质40能够提供良好的缓冲作用，有效避免芯片20与散热装置30之间因直接接触而导致受碰撞损坏的问题发生，有利于延长散热组件100的工作寿命，散热组件100整体的工作可靠性佳。Thus, the heat of the chip 20 can be quickly transferred to the heat sink 30 through the continuous gas-liquid conversion of the first cooling medium 40 "evaporation-condensation-...-evaporation", and then dissipated outside through the heat sink 30 . On the one hand, the surface temperature of the chip 20 can be more consistent due to the arrangement of the first cooling medium 40 immersing the chip 20, which can not only fully ensure the temperature uniformity of the chip 20, but also significantly improve the heat dissipation between the chip 20 and the cooling device 30. The transfer efficiency is more conducive to improving the overall heat dissipation performance of the heat dissipation assembly 100 . On the other hand, the first cooling medium 40 can provide a good buffering effect, effectively avoid the problem of collision damage caused by direct contact between the chip 20 and the heat dissipation device 30, which is beneficial to prolong the working life of the heat dissipation assembly 100, and dissipate heat. The overall working reliability of the component 100 is good.

请结合参阅图4、图5和图6，散热装置30包括散热基板31和围框32。散热基板31包括相背设置的第一表面311和第二表面312，第一表面311为散热基板31朝向电路板10的表面，第二表面312为散热基板31背向电路板10的表面。围框32呈环状且环绕设置在散热基板31的第一表面311上。Please refer to FIG. 4 , FIG. 5 and FIG. 6 together, the heat dissipation device 30 includes a heat dissipation substrate 31 and a surrounding frame 32 . The heat dissipation substrate 31 includes a first surface 311 and a second surface 312 opposite to each other. The first surface 311 is the surface of the heat dissipation substrate 31 facing the circuit board 10 , and the second surface 312 is the surface of the heat dissipation substrate 31 facing away from the circuit board 10 . The surrounding frame 32 is annular and disposed on the first surface 311 of the heat dissipation substrate 31 .

本申请的实施例中，如图6所示，散热基板31可以仅通过围框32而连接至电路板10，即围框32连接在散热基板31和电路板10之间，散热基板31、围框32和电路板10配合形成封闭空间50。或者，如图4和图5所示，散热基板31可以通过围框32和中间结构件而连接至电路板10，即散热基板31、围框32、中间结构件和电路板11配合形成封闭空间50，如下将以散热基板31、围框32、中间结构件和电路板11配合形成封闭空间50为例进行说明，但应当理解，并不以此为限。In the embodiment of the present application, as shown in FIG. 6, the heat dissipation substrate 31 can be connected to the circuit board 10 only through the surrounding frame 32, that is, the surrounding frame 32 is connected between the heat dissipation substrate 31 and the circuit board 10, and the heat dissipation substrate 31, surrounding The frame 32 and the circuit board 10 cooperate to form an enclosed space 50 . Or, as shown in FIGS. 4 and 5 , the heat dissipation substrate 31 can be connected to the circuit board 10 through the surrounding frame 32 and the intermediate structural member, that is, the heat dissipation substrate 31, the surrounding frame 32, the intermediate structural member and the circuit board 11 cooperate to form a closed space 50, the following description will be made by taking the closed space 50 formed by the heat dissipation substrate 31, the surrounding frame 32, the intermediate structural member and the circuit board 11 as an example, but it should be understood that it is not limited thereto.

请结合参阅图4、图5、图7-图15，散热装置30还可以包括挡墙33和密封垫34，密封垫34连接在围框32和挡墙34之间，挡墙33和密封垫34即为前文所述的中间结构件。Please refer to Fig. 4, Fig. 5, Fig. 7-Fig. 15, the cooling device 30 can also include a retaining wall 33 and a gasket 34, the gasket 34 is connected between the surrounding frame 32 and the retaining wall 34, the retaining wall 33 and the gasket 34 is the intermediate structure mentioned above.

具体而言，挡墙33环绕设置在电路板10上并包围芯片20。也即为，挡墙33呈环状且设于芯片20的***。其中，如图5所述，当芯片20的数量为一个时，挡墙33包围一个芯片20所在的区域。如图6所示，当芯片20的数量为多个时，挡墙33包围多个芯片20所在的区域。也即为，无论芯片20的数量多寡，挡墙33均位于芯片20***并将芯片20包饶设置。Specifically, the retaining wall 33 is disposed around the circuit board 10 and encloses the chip 20 . That is, the retaining wall 33 is annular and disposed on the periphery of the chip 20 . Wherein, as shown in FIG. 5 , when the number of chips 20 is one, the barrier wall 33 surrounds the area where one chip 20 is located. As shown in FIG. 6 , when there are multiple chips 20 , the barrier wall 33 surrounds the area where the multiple chips 20 are located. That is, regardless of the number of chips 20 , the retaining wall 33 is located on the periphery of the chips 20 and covers the chips 20 .

通过设置挡墙33，可以令挡墙33将芯片20所在区域围设起来，能够有效将芯片20所在区域和其他器件所在区域区别开来，从而使芯片20所在区域和其他器件所在区域能够彼此独立而不会相互影响，有利于根据芯片20的布局区域而有针对性的对芯片20进行导热和散热布局，可靠性佳。By setting the barrier wall 33, the barrier wall 33 can surround the area where the chip 20 is located, and can effectively distinguish the area where the chip 20 is located from the area where other devices are located, so that the area where the chip 20 is located and the area where other devices are located can be independent of each other Without mutual influence, it is beneficial to carry out heat conduction and heat dissipation layout on the chip 20 according to the layout area of the chip 20 , and the reliability is good.

示例性地，挡墙33的材质可以为金属材质，金属材质不仅强度较高，同时还具有一定的电磁屏蔽作用，能够有效避免信号干扰，有利于保证芯片20信号传输的精度，提高芯片20工作时的稳定性，从而将芯片20工作时出现异常的可能性降低到最小。Exemplarily, the material of the retaining wall 33 can be a metal material. The metal material not only has high strength, but also has a certain electromagnetic shielding effect, which can effectively avoid signal interference, help ensure the accuracy of signal transmission of the chip 20, and improve the working efficiency of the chip 20. Time stability, thereby reducing the possibility of abnormality to the minimum when the chip 20 is working.

需说明的是，挡墙33的高度可以根据实际情况进行选取，本申请的实施例对此不做严格限制。例如，挡墙33的高度可以与芯片20的高度相同，其中，高度为垂直于电路板10方向上的尺寸。或者，挡墙33的高度可以大于芯片20的高度，其中，高度为垂直于电路板10方向上的尺寸。It should be noted that the height of the retaining wall 33 can be selected according to the actual situation, which is not strictly limited in the embodiments of the present application. For example, the height of the barrier wall 33 may be the same as that of the chip 20 , wherein the height is a dimension perpendicular to the direction of the circuit board 10 . Alternatively, the height of the blocking wall 33 may be greater than the height of the chip 20 , wherein the height is a dimension perpendicular to the direction of the circuit board 10 .

围框32与挡墙33对应设置，从而使散热基板31、围框32、挡墙33、密封垫34和电路板10配合形成封闭空间50。也即为，通过设置围框32，可以在散热基板31的板面上圈设出与围框32占用电路板10板面区域所相当的区域，进而当围框32和挡墙33相互连接时，能够因围框32和挡墙33均位于散热基板31和电路板10之间，而在散热基板31和电路板10之间配合围设出封闭空间50。The frame 32 is arranged corresponding to the retaining wall 33 , so that the heat dissipation substrate 31 , the frame 32 , the retaining wall 33 , the gasket 34 and the circuit board 10 cooperate to form a closed space 50 . That is to say, by arranging the surrounding frame 32, an area corresponding to the board surface area of the circuit board 10 occupied by the surrounding frame 32 can be set on the board surface of the heat dissipation substrate 31, and then when the surrounding frame 32 and the retaining wall 33 are connected to each other , because the surrounding frame 32 and the retaining wall 33 are located between the heat dissipation substrate 31 and the circuit board 10 , a closed space 50 can be cooperatively enclosed between the heat dissipation substrate 31 and the circuit board 10 .

应当理解，由于挡墙33呈包围芯片20的结构形态，故而与挡墙33连接的围框32也呈包围芯片20的结构形态。其中，当芯片20的数量为一个时，围框32包围一个芯片20所在的区域。当芯片20的数量为多个时，围框32包围多个芯片20所在的区域。也即为，无论芯片20的数量多寡，围框32均位于芯片20***并将芯片20包饶设置。It should be understood that, since the retaining wall 33 is in a structural form surrounding the chip 20 , the surrounding frame 32 connected to the retaining wall 33 is also in a structural form surrounding the chip 20 . Wherein, when the number of chips 20 is one, the surrounding frame 32 surrounds the area where one chip 20 is located. When there are multiple chips 20 , the surrounding frame 32 surrounds the area where the multiple chips 20 are located. That is, regardless of the number of chips 20 , the surrounding frame 32 is located on the periphery of the chips 20 and encloses the chips 20 .

需说明的是，围框32的高度可以根据实际情况进行选取，仅需使围框32和挡墙33的高度总和能够小于或等于散热基板31与电路板10之间的距离即可，本申请的实施例对此不做严格限制。例如，如图9所示，当密封垫34连接在围框32远离散热基板31的一端的端面和散热基板31挡墙33远离电路板10的一端的端面之间时，围框32、密封垫34和散热基板31挡墙33的高度总和共同构成散热基板31和电路板10之间的距离。如图10和图11所示，当在围框32远离散热基板31的一端的端面或散热基板31挡墙33远离电路板10的一端的端面设置容置槽38时，密封垫34可位于容置槽38内部，围框32和散热基板31挡墙33的高度总和共同构成散热基板31和电路板10之间的距离。It should be noted that the height of the surrounding frame 32 can be selected according to the actual situation. It is only necessary to make the sum of the heights of the surrounding frame 32 and the retaining wall 33 less than or equal to the distance between the heat dissipation substrate 31 and the circuit board 10. The embodiment does not strictly limit this. For example, as shown in Figure 9, when the sealing gasket 34 is connected between the end surface of the end surface of the surrounding frame 32 away from the heat dissipation substrate 31 and the end surface of the heat dissipation substrate 31 retaining wall 33 away from the end surface of the circuit board 10, the surrounding frame 32, the sealing gasket 34 and the height of the heat dissipation substrate 31 blocking wall 33 together form the distance between the heat dissipation substrate 31 and the circuit board 10 . As shown in FIGS. 10 and 11 , when an accommodating groove 38 is provided on the end surface of the frame 32 away from the end of the heat dissipation substrate 31 or the end surface of the heat dissipation substrate 31 retaining wall 33 away from the circuit board 10 , the sealing gasket 34 can be located in the accommodating groove 38 . Placed inside the groove 38 , the sum of the heights of the surrounding frame 32 and the retaining wall 33 of the heat dissipation substrate 31 constitutes the distance between the heat dissipation substrate 31 and the circuit board 10 .

请结合参阅图9-图15，密封垫34夹设于围框32和挡墙33之间，也即为，密封垫34连接在围框32和挡墙33之间。可以理解的是，通过在围框32和挡墙33之间设置密封垫34，一方面，能够因密封垫34所具有的弹性，而可以提供良好的缓冲作用，使得密封垫34在受力后可通过弹性变形而抵消其自身所受的冲击力，有效避免围框32和挡墙33之间因直接接触而导致的刚性碰撞，规避因受振动/冲击所产生的不良影响。另一方面，能够因密封垫34所具有的形变能力，而起到吸收公差以及进一步对封闭空间50进行密封的作用，可靠性佳。Please refer to FIGS. 9-15 in conjunction, the gasket 34 is sandwiched between the frame 32 and the retaining wall 33 , that is, the gasket 34 is connected between the frame 32 and the retaining wall 33 . It can be understood that by arranging the gasket 34 between the surrounding frame 32 and the retaining wall 33, on the one hand, due to the elasticity of the gasket 34, a good cushioning effect can be provided, so that the gasket 34 can It can offset its own impact force through elastic deformation, effectively avoid rigid collision caused by direct contact between the surrounding frame 32 and the retaining wall 33, and avoid adverse effects caused by vibration/shock. On the other hand, due to the deformability of the gasket 34 , it can absorb tolerances and further seal the closed space 50 , which has good reliability.

一种可能的实施方式中，如图12和图13所示，围框32远离散热基板31的一端设有凸起35，挡墙33远离电路板10的一端设有凹槽36，密封垫34连接在凸起35与凹槽36之间。In a possible implementation, as shown in FIG. 12 and FIG. 13 , the end of the surrounding frame 32 away from the heat dissipation substrate 31 is provided with a protrusion 35 , the end of the retaining wall 33 away from the circuit board 10 is provided with a groove 36 , and the gasket 34 It is connected between the protrusion 35 and the groove 36 .

示例性地，如图12所示，凸起35和凹槽36之间可形成间隙37，密封垫34位于间隙37内且连接在凸起35和凹槽36之间，以阻挡第一冷却工质40逸散出封闭空间50。或者，如图13所示，可在凹槽36的底部额外设置可供密封垫34容置于其内的容置槽38，以使凸起35和凹槽36之间无缝连接。Exemplarily, as shown in FIG. 12 , a gap 37 may be formed between the protrusion 35 and the groove 36, and the gasket 34 is located in the gap 37 and connected between the protrusion 35 and the groove 36 to block the first cooling process. The substance 40 escapes out of the enclosed space 50 . Alternatively, as shown in FIG. 13 , an accommodating groove 38 for accommodating the gasket 34 may be additionally provided at the bottom of the groove 36 , so that the protrusion 35 and the groove 36 are seamlessly connected.

此设置下，在围框32上加工凸起35，并在对应的挡墙33上加工凹槽36，能够因凹槽36与凸起35相互配合而使围框32与挡墙33的连接处呈现类似方波形状的连接路径，此方波形状的连接路径，相对于平面与平面之间的直线形状的连接路径，能够延长第一冷却工质40在蒸汽形态下逸散出封闭空间50的通道长度，有利于使蒸汽的逸散速度减慢，进一步保证封闭空间50的密封性能。Under this arrangement, the protrusion 35 is processed on the surrounding frame 32, and the groove 36 is processed on the corresponding retaining wall 33, so that the joint between the surrounding frame 32 and the retaining wall 33 can be formed due to the mutual cooperation of the groove 36 and the protrusion 35. It presents a connection path similar to a square wave shape. Compared with a straight line connection path between planes, this square wave shape connection path can prolong the time for the first cooling working medium 40 to escape from the closed space 50 in the form of steam. The length of the channel is beneficial to slow down the escape speed of the steam and further ensure the sealing performance of the closed space 50 .

需说明的是，凸起35的数量可以为一个或多个。当凸起35的数量为一个时，其可以设置在围框32的四侧中的任意一侧，而凹槽36与凸起35相对应故而凹槽36的数量也为一个，其可以设置在挡墙33中与一个凸起35相对应的位置。当凸起35的数量为多个时，其可以间隔设置在围框32的四侧中的任意一侧、任意两侧、任意三侧或每一侧。而凹槽36与凸起35可以为一对一的对应关系，故而凹槽36的数量也为多个，其可以设置在于多个凸起35分别相对应挡墙33的不同位置。It should be noted that the number of protrusions 35 can be one or more. When the quantity of projection 35 is one, it can be arranged on any one side in the four sides of surrounding frame 32, and groove 36 is corresponding to projection 35 so the quantity of groove 36 is also one, and it can be arranged on A position corresponding to a protrusion 35 in the retaining wall 33 . When the number of protrusions 35 is multiple, they may be arranged at intervals on any one side, any two sides, any three sides or every side of the four sides of the surrounding frame 32 . The groove 36 and the protrusion 35 can be in a one-to-one correspondence, so the number of the groove 36 is also multiple, and it can be arranged in a plurality of protrusions 35 corresponding to different positions of the retaining wall 33 respectively.

另一种可能的实施方式中，如图14和图15所示，围框32远离散热基板31的一端设有凹槽36，挡墙33远离电路板10的一端设有凸起35，密封垫34连接在凸起35与凹槽36之间。In another possible implementation, as shown in Figure 14 and Figure 15, a groove 36 is provided at the end of the surrounding frame 32 away from the heat dissipation substrate 31, a protrusion 35 is provided at the end of the retaining wall 33 away from the circuit board 10, and the gasket 34 is connected between the protrusion 35 and the groove 36 .

示例性地，如图14所示，凸起35和凹槽36之间可形成间隙37，密封垫34位于间隙37内且连接在凸起35和凹槽36之间，以阻挡第一冷却工质40逸散出封闭空间50。或者，如图15所示，可在凹槽36的底部额外设置可供密封垫34容置于其内的容置槽38，以使凸起35和凹槽36之间无缝连接。Exemplarily, as shown in FIG. 14 , a gap 37 may be formed between the protrusion 35 and the groove 36, and the gasket 34 is located in the gap 37 and connected between the protrusion 35 and the groove 36 to block the first cooling process. The mass 40 escapes out of the enclosed space 50 . Alternatively, as shown in FIG. 15 , an accommodating groove 38 for accommodating the gasket 34 may be additionally provided at the bottom of the groove 36 , so that the protrusion 35 and the groove 36 are seamlessly connected.

此设置下，在围框32上加工凹槽36，并在对应的挡墙33上加工凸起35，能够因凹槽36与凸起35相互配合而使围框32与挡墙33的连接处呈现类似方波形状的连接路径，此方波形状的连接路径，相对于平面与平面之间的直线形状的连接路径，能够延长第一冷却工质40在蒸汽形态下逸散出封闭空间50的通道长度，有利于使蒸汽的逸散速度减慢，进一步保证封闭空间50的密封性能。Under this setting, the groove 36 is processed on the surrounding frame 32, and the protrusion 35 is processed on the corresponding retaining wall 33, so that the joint between the surrounding frame 32 and the retaining wall 33 can be formed due to the mutual cooperation of the groove 36 and the protrusion 35. It presents a connection path similar to a square wave shape. Compared with a straight line connection path between planes, this square wave shape connection path can prolong the time for the first cooling working medium 40 to escape from the closed space 50 in the form of steam. The length of the channel is beneficial to slow down the escape speed of the steam and further ensure the sealing performance of the closed space 50 .

需说明的是，凹槽36的数量可以为一个或多个。当凹槽36的数量为一个时，其可以设置在围框32的四侧中的任意一侧，而凸起35与凹槽36相对应故而凹槽36的数量也为一个，其可以设置在挡墙33中与一个凹槽36相对应的位置。当凹槽36的数量为多个时，其可以间隔设置在围框32的四侧中的任意一侧、任意两侧、任意三侧或每一侧。而凸起35与凹槽36可以为一对一的对应关系，故而凸起35的数量也为多个，其可以设置在于多个凹槽36分别相对应的挡墙33的不同位置。It should be noted that the number of grooves 36 may be one or more. When the quantity of the groove 36 is one, it can be arranged on any one side in the four sides of the surrounding frame 32, and the protrusion 35 corresponds to the groove 36 so the quantity of the groove 36 is also one, and it can be arranged on A position corresponding to a groove 36 in the retaining wall 33 . When there are multiple grooves 36 , they can be arranged at intervals on any one side, any two sides, any three sides or every side of the four sides of the surrounding frame 32 . The protrusions 35 and the grooves 36 may have a one-to-one correspondence, so the number of the protrusions 35 may also be multiple, and they may be disposed at different positions of the retaining wall 33 corresponding to the plurality of grooves 36 .

应当理解，以上仅为示例性的列举延长蒸汽逸散出封闭空间50的通道长度的连接形式，围框32与挡墙33实际的连接形式并不局限于图8-图11所示的方式，能够使围框32与挡墙33配合形成的蒸汽逸散通道延长的实现形式均在本申请实施例所请求保护的范围内，对此不做严格限制。It should be understood that the above is only an exemplary connection form for prolonging the passage length of the steam escaping from the closed space 50, and the actual connection form between the surrounding frame 32 and the retaining wall 33 is not limited to the manner shown in FIGS. 8-11 . Implementation forms that can extend the steam escape channel formed by the cooperation of the surrounding frame 32 and the retaining wall 33 are all within the scope of protection claimed in the embodiment of the present application, and are not strictly limited thereto.

请再次参阅图4，本申请的实施例中，芯片20位于封闭空间50内部，封闭空间50还可以供第一冷却工质40容置于其内，并为第一冷却工质40提供良好的密闭性能，使得第一冷却工质40不至于泄露至外部环境而影响与芯片20的接触导热性能。Please refer to FIG. 4 again. In the embodiment of the present application, the chip 20 is located inside the closed space 50, and the closed space 50 can also accommodate the first cooling working medium 40 therein, and provide good cooling for the first cooling working medium 40. The airtight performance prevents the first cooling working medium 40 from leaking to the external environment and affecting the contact heat conduction performance with the chip 20 .

需说明的是，第一冷却工质40并不会完全充满封闭空间50，其液体量可以为刚刚浸没芯片20的程度，或者，其液体量也可以为浸没芯片20并高出芯片20一定高度的程度。第一冷却工质40只需满足能够浸没芯片20，使第一冷却工质40与芯片20的外表面充分接触即可，对于第一冷却工质40浸没芯片20的程度，本申请的实施例对此不做严格限制。It should be noted that the first cooling working medium 40 will not completely fill the enclosed space 50, and its liquid volume can be just enough to submerge the chip 20, or its liquid volume can also be submerged in the chip 20 and higher than the chip 20 by a certain height. Degree. The first cooling medium 40 only needs to be able to immerse the chip 20, so that the first cooling medium 40 can fully contact the outer surface of the chip 20. For the degree to which the first cooling medium 40 immerses the chip 20, the embodiment of the present application There are no strict restrictions on this.

而第一冷却工质40与散热基板31之间的间隙区域形成第一冷却工质40的蒸汽通道51。可以理解的是，在第一冷却工质40与散热基板31之间预留出蒸汽通道51，能够使第一冷却工质40的液面与散热基板31之间形成一定的高度差，高度差有利于实现第一冷却工质40的两相变换，能够促使第一冷却工质40在受热时蒸发而向上流动，并在遇冷后凝结而向下回流，循环往复实现第一冷却工质40的气液转换，其中，向上流动即向散热基板31的方向流动，向下回流即向电路板10的方向流动。The gap region between the first cooling medium 40 and the heat dissipation substrate 31 forms a vapor channel 51 of the first cooling medium 40 . It can be understood that the steam channel 51 is reserved between the first cooling medium 40 and the heat dissipation substrate 31, so that a certain height difference can be formed between the liquid surface of the first cooling medium 40 and the heat dissipation substrate 31. It is beneficial to realize the two-phase transformation of the first cooling working medium 40, which can promote the first cooling working medium 40 to evaporate and flow upward when heated, and condense and flow downward after being cooled. The gas-liquid conversion, wherein, the upward flow is to flow toward the direction of the heat dissipation substrate 31 , and the downward flow is to flow toward the direction of the circuit board 10 .

请参阅图16，本申请的实施例中，散热组件100还可以包括补液通道61、排气通道 62、液位传感器63、第一密封塞64和第二密封塞65。Referring to FIG. 16 , in the embodiment of the present application, the heat dissipation assembly 100 may further include a liquid replenishment channel 61 , an exhaust channel 62 , a liquid level sensor 63 , a first sealing plug 64 and a second sealing plug 65 .

具体而言，补液通道61位于围框32的外侧且与封闭空间50连通，补液通道61用于向封闭空间50内补充第一冷却工质40，第一密封塞64与补液通道61可拆卸连接并密封补液通道61。示例性地，补液通道61可以设置在围框32上，或者，补液通道61也可以设置在挡墙33上。Specifically, the liquid replenishment channel 61 is located outside the surrounding frame 32 and communicates with the enclosed space 50 , the liquid replenishment channel 61 is used to replenish the first cooling medium 40 into the enclosed space 50 , and the first sealing plug 64 is detachably connected to the liquid replenishment channel 61 And seal the liquid replenishment channel 61 . Exemplarily, the fluid replacement channel 61 may be arranged on the surrounding frame 32 , or the fluid replacement channel 61 may also be arranged on the retaining wall 33 .

需说明的是，补液通道61的具体设置位置以及补液通道61的形态可根据实际应用场景进行调整，仅需满足补液通道61与封闭空间50连通，且可供第一冷却工质40在其内流动即可，本申请的实施例对此不做严格限制。It should be noted that the specific setting position of the liquid replenishment channel 61 and the shape of the liquid replenishment channel 61 can be adjusted according to the actual application scenario, and it only needs to be satisfied that the liquid replenishment channel 61 communicates with the closed space 50 and can accommodate the first cooling working medium 40 in it. It only needs to flow, which is not strictly limited in the embodiments of the present application.

可以理解的是，由于第一冷却工质40为具有气液转换功能的两相液体，其在循环往复的两相转换过程中，会随着时间的流逝而发生逸散，逸散会致使第一冷却工质40的液体量减少，液面下降，进而导致第一冷却工质40与芯片20之间的接触不足，使得第一冷却工质40的热传递效率降低，无法实现为芯片20的良好导热。故而需要定期在封闭空间50内补充第一冷却工质40，以确保第一冷却工质40能够始终浸没芯片20，保证散热组件100整体的使用性能不受严重影响。It can be understood that since the first cooling working medium 40 is a two-phase liquid with a gas-liquid conversion function, it will dissipate as time goes by during the reciprocating two-phase conversion process, and the dissipation will cause the first The amount of liquid in the cooling working medium 40 decreases, and the liquid level drops, which in turn leads to insufficient contact between the first cooling working medium 40 and the chip 20, which reduces the heat transfer efficiency of the first cooling working medium 40, and cannot achieve good performance for the chip 20. conduct heat. Therefore, it is necessary to regularly replenish the first cooling medium 40 in the enclosed space 50 to ensure that the first cooling medium 40 can always immerse the chip 20 and ensure that the overall performance of the heat dissipation assembly 100 is not seriously affected.

由此，设置补液通道61可以在散热组件100的外部与封闭空间50之间形成可供第一冷却工质40流动的通道，从而在封闭空间50内的第一冷却工质40的液面下降时，可以及时向封闭空间50内补充第一冷却工质40，使第一冷却工质40与芯片20之间的换热性能不受影响，灵活性强。而设置第一密封塞64并使其与补液通道61远离封闭空间50的一端可拆卸连接，能够在需向封闭空间50内补充第一冷却工质40时将之从补液通道61中拆卸，而在补充完第一冷却工质40后将之与补液通道61密封连接，此设置下，无需借助复杂工具即可达成与补液通道61的连接，操作方式简便快捷。Thus, the provision of the replenishment channel 61 can form a channel between the outside of the heat dissipation assembly 100 and the closed space 50 through which the first cooling medium 40 can flow, so that the liquid level of the first cooling medium 40 in the closed space 50 drops. During this time, the first cooling medium 40 can be replenished into the closed space 50 in time, so that the heat exchange performance between the first cooling medium 40 and the chip 20 is not affected, and the flexibility is strong. The first sealing plug 64 is set and detachably connected to the end of the replenishment channel 61 away from the closed space 50, so that it can be detached from the replenishment channel 61 when the first cooling medium 40 needs to be replenished in the closed space 50, and After the first cooling medium 40 is replenished, it is sealed and connected to the liquid replenishment channel 61 . Under this setting, the connection with the liquid replenishment channel 61 can be achieved without the use of complicated tools, and the operation method is simple and fast.

示例性地，液位传感器63可位于补液通道61内，液位传感器63用于在第一冷却工质40的液位小于预设液位时告警，提醒用户需向封闭空间50内补充第一冷却工质40，保证第一冷却工质40始终浸没芯片20。其中，预设液位可以是第一冷却工质40浸没芯片20的临界液位。Exemplarily, the liquid level sensor 63 can be located in the liquid replenishment channel 61, and the liquid level sensor 63 is used to give an alarm when the liquid level of the first cooling medium 40 is lower than a preset liquid level, reminding the user to replenish the first coolant to the closed space 50. The cooling working medium 40 ensures that the first cooling working medium 40 is always immersed in the chip 20 . Wherein, the preset liquid level may be a critical liquid level at which the first cooling working fluid 40 immerses the chip 20 .

需说明的是，以上仅为示例性的描述液位传感器63的位置可能性，其还可以位于封闭空间50内部，而提醒用户需向封闭空间50内补充第一冷却工质40的实现可能性也不局限于上述列举的液位传感器63，其还可以是液位标尺等其他实现形式，仅需满足能够达到提醒用户的目的即可，本申请的实施例对此不做严格限制。It should be noted that the above is only an exemplary description of the location possibility of the liquid level sensor 63 , which can also be located inside the closed space 50 to remind the user of the possibility of replenishing the first cooling medium 40 into the closed space 50 It is not limited to the liquid level sensor 63 listed above, and it can also be implemented in other forms such as a liquid level gauge, as long as it can achieve the purpose of reminding the user, which is not strictly limited in the embodiments of the present application.

请继续参阅图16，排气通道62位于围框32的外侧且与蒸汽通道51连通，排气通道62用于排出封闭空间50内的空气，第二密封塞65与排气通道62可拆卸连接并密封排气通道62。示例性地，排气通道62可以设置在围框32上，或者，排气通道62也可以设置在挡墙33上。Please continue to refer to FIG. 16 , the exhaust channel 62 is located on the outside of the surrounding frame 32 and communicates with the steam channel 51 , the exhaust channel 62 is used to discharge the air in the enclosed space 50 , and the second sealing plug 65 is detachably connected to the exhaust channel 62 And seal the exhaust passage 62. Exemplarily, the exhaust passage 62 may be disposed on the surrounding frame 32 , or the exhaust passage 62 may also be disposed on the retaining wall 33 .

一种可能的实施方式中，排气通道62与补液通道61异侧设置。也即为，排气通道62与补液通道61设置在围框32的不同侧。由此，向封闭空间50内补充第一冷却工质40和排出封闭空间50内的空气的两个操作可以因排气通道62与补液通道61异侧设置而具有较大的操作空间，有利于使两者彼此独立而不会相互干涉。In a possible implementation manner, the exhaust channel 62 and the liquid replenishment channel 61 are arranged on different sides. That is, the exhaust channel 62 and the liquid replenishment channel 61 are disposed on different sides of the surrounding frame 32 . Thus, the two operations of replenishing the first cooling medium 40 into the closed space 50 and discharging the air in the closed space 50 can have a larger operating space because the exhaust passage 62 and the replenishment passage 61 are arranged on different sides, which is beneficial Make both independent of each other without interfering with each other.

另一种可能的实施方式中，排气通道62与补液通道61同侧设置。也即为，排气通道62与补液通道61设置在围框32的同一侧。In another possible implementation manner, the exhaust channel 62 is arranged on the same side as the liquid replenishment channel 61 . That is, the exhaust passage 62 and the liquid replacement passage 61 are arranged on the same side of the surrounding frame 32.

需说明的是，排气通道62的具体设置位置以及排气通道62的形态可根据实际应用场景进行调整，仅需满足排气通道62与蒸汽通道51连通，且可供空气流动即可，本申请的实施例对此不做严格限制。It should be noted that the specific setting position of the exhaust passage 62 and the shape of the exhaust passage 62 can be adjusted according to the actual application scene. It only needs to satisfy that the exhaust passage 62 is connected to the steam passage 51 and can be used for air flow. The embodiments of the application do not strictly limit this.

可以理解的是，在散热装置30未使用的状态下，封闭空间50内部可能会具有一定量的空气，空气会对第一冷却工质40的两相转换过程造成一定影响。由此，设置排气通道62可以在散热装置30未工作前预加热芯片20，使封闭空间50内部的残留空气通过排气通道62排出，以使第一冷却工质40能够在较为清洁的环境中工作，有效将因清洁度不够而受污染的问题发生的可能性降低到最小，使第一冷却工质40可以通过相变进行热量传递，换热效率高，可靠性佳。而设置第二密封塞65并使其与排气通道62远离封闭空间50的一端可拆卸连接，能够在需排出封闭空间50内的空气时将之从排气通道62中拆卸，而在排出完封闭空间50内的空气后将之与排气通道62密封连接，此设置下，无需借助复杂工具即可达成与排气通道62的连接，操作方式简便快捷。It can be understood that, when the cooling device 30 is not in use, there may be a certain amount of air inside the enclosed space 50 , and the air will affect the two-phase conversion process of the first cooling working medium 40 to a certain extent. Therefore, setting the exhaust channel 62 can preheat the chip 20 before the heat sink 30 is in operation, so that the residual air in the closed space 50 can be discharged through the exhaust channel 62, so that the first cooling medium 40 can be cooled in a relatively clean environment. Working in the middle, the possibility of pollution caused by insufficient cleanliness is effectively reduced to the minimum, so that the first cooling working medium 40 can conduct heat transfer through phase change, with high heat exchange efficiency and good reliability. And the second sealing plug 65 is set and made to be detachably connected with an end of the exhaust passage 62 away from the closed space 50, it can be disassembled from the exhaust passage 62 when the air in the closed space 50 needs to be discharged, and after the discharge is completed The air in the enclosed space 50 is then sealed and connected to the exhaust passage 62 . Under this setting, the connection with the exhaust passage 62 can be achieved without the use of complicated tools, and the operation method is simple and fast.

一种可能的实施方式中，请参阅图17，散热装置30还包括第一翅片66，第一翅片66设于第一表面311且位于封闭空间50内。示例性地，第一翅片66可以包括间隔设置的多个第一齿部661，相邻两个第一齿部661的间隔区域能够形成用于供第一冷却工质40流动的流道。In a possible implementation manner, please refer to FIG. 17 , the heat dissipation device 30 further includes a first fin 66 , and the first fin 66 is disposed on the first surface 311 and located in the enclosed space 50 . Exemplarily, the first fin 66 may include a plurality of first teeth 661 arranged at intervals, and the space between two adjacent first teeth 661 can form a flow channel for the first cooling medium 40 to flow.

可以理解的是，在封闭空间50内部设置第一翅片66，并使相邻两个第一齿部661的间隔区域形成流道，能够使第一冷却工质40受热蒸发后的蒸汽流动至流道中，并在遇冷后凝结为液体而沿着第一齿部661向下回流，有效增加第一冷却工质40的蒸汽遇冷冷凝后的换热面积，能够强化第一冷却工质40的换热性能，使散热装置30具备优异的热传导能力。It can be understood that the first fins 66 are arranged inside the closed space 50, and the space between two adjacent first tooth parts 661 forms a flow channel, so that the steam evaporated by the first cooling medium 40 can flow to the In the flow channel, it condenses into a liquid after being cooled and flows back down along the first tooth portion 661, effectively increasing the heat exchange area of the steam of the first cooling medium 40 after being cooled and condensed, and can strengthen the first cooling medium 40 Excellent heat transfer performance, so that the heat sink 30 has excellent heat conduction capability.

需说明的是，以上仅为示例性的描述强化第一冷却工质40蒸汽的冷凝换热的实现可能性，而强化第一冷却工质40蒸汽的冷凝换热的实现可能性也不局限于上述列举的第一翅片66，其还可以在封闭空间50内液面以上部分设置凸起或者凹槽，例如在第一表面311上设置凸起、或在第一表面311上设置凹槽、或在围框32位于封闭空间50内的表面上设置凸起、或在围框32位于封闭空间50内的表面上设置凹槽等其他实现形式，仅需满足能够强化第一冷却工质40蒸汽的冷凝换热的目的即可，本申请的实施例对此不做严格限制。It should be noted that the above is only an exemplary description of the realization possibility of strengthening the condensation heat exchange of the steam of the first cooling working medium 40, and the realization possibility of strengthening the condensation heat exchange of the steam of the first cooling working medium 40 is not limited to The above-mentioned first fin 66 can also be provided with protrusions or grooves on the part above the liquid level in the closed space 50, for example, a protrusion is provided on the first surface 311, or a groove is provided on the first surface 311, Or other implementations such as setting protrusions on the surface of the surrounding frame 32 located in the closed space 50, or setting grooves on the surface of the surrounding frame 32 located in the closed space 50, etc., only need to meet the requirements that can strengthen the steam of the first cooling medium 40 The purpose of condensation and heat exchange is sufficient, and the embodiments of the present application do not strictly limit this.

本申请的实施例中，散热装置30实现散热的方式既可以为液冷散热，也可以为风冷散热，还可以为液冷散热和风冷散热的双重散热形式，如下将结合图17、图18和图19对散热装置30实现散热的方式进行详细说明。In the embodiment of the present application, the cooling device 30 can realize heat dissipation by either liquid cooling or air cooling, or a dual cooling form of liquid cooling and air cooling. 18 and FIG. 19 describe in detail how the heat dissipation device 30 realizes heat dissipation.

一种可能的实施方式中，如图17所示，散热装置30还包括第二冷却工质67，散热基板31内设有腔体313，第二冷却工质67设于腔体313并能够在腔体313内流动而为散热基板31散热。In a possible implementation, as shown in FIG. 17 , the heat dissipation device 30 further includes a second cooling medium 67, a cavity 313 is provided in the heat dissipation substrate 31, and the second cooling medium 67 is provided in the cavity 313 and can be The flow in the cavity 313 dissipates heat for the heat dissipation substrate 31 .

此设置下，第一冷却工质40通过相变将芯片20的热量传递至散热基板31，散热基板31能够通过第二冷却工质67在其腔体313内的流动而携带上热量，使散热基板31可形成类似冷板的结构，进而通过液冷散热的方式使散热装置30整体具有优异的散热性能。Under this setting, the first cooling medium 40 transfers the heat of the chip 20 to the heat dissipation substrate 31 through phase change, and the heat dissipation substrate 31 can carry heat through the flow of the second cooling medium 67 in its cavity 313, so that the heat dissipation The substrate 31 can form a structure similar to a cold plate, and then the heat dissipation device 30 as a whole has excellent heat dissipation performance through liquid cooling and heat dissipation.

示例性地，第二冷却工质67可以包括水、惰性的氟化液、制冷剂R134a(1,1,1,2-四氟乙烷)、制冷剂R245fa(1,1,1,3,3-五氟丙烷)、制冷剂R1234ze(1,1,1,3-四氟丙烯)、制冷剂R1233zd(1-氯-3,3,3-三氟丙烯)等中一种或多种的组合。Exemplarily, the second cooling medium 67 may include water, inert fluorinated liquid, refrigerant R134a (1,1,1,2-tetrafluoroethane), refrigerant R245fa (1,1,1,3, One or more of 3-pentafluoropropane), refrigerant R1234ze (1,1,1,3-tetrafluoropropene), refrigerant R1233zd (1-chloro-3,3,3-trifluoropropene), etc. combination.

另一种可能的实施方式中，散热基板31可以为实心封闭结构，或者，散热基板31可以为具有空腔的结构，如图18所示，散热装置30还包括第二翅片68，第二翅片68设于第二表面312。示例性地，第二翅片68可以包括间隔设置的多个第二齿部681，相邻两个第二齿部681的间隔区域能够形成用于供空气流动的风道。In another possible implementation manner, the heat dissipation substrate 31 may be a solid closed structure, or the heat dissipation substrate 31 may be a structure with a cavity, as shown in FIG. The fins 68 are disposed on the second surface 312 . Exemplarily, the second fin 68 may include a plurality of second tooth portions 681 arranged at intervals, and the space between two adjacent second tooth portions 681 can form an air duct for air flow.

可以理解的是，相邻两个第二齿部681的间隔区域形成风道。也即为，冷空气能够在流动的过程中，不断的通过风道流向散热装置30的外部环境，从而使风道中被加热的空气不断流向散热装置30的外部环境中，并使外部环境中的冷空气不断的进入到风道中，进而能够快速的将散热基板31上的热量传递至外部环境中，使得自然散热的对流换热水平提高，从而通过风冷散热的方式使散热装置30整体具有优异的散热性能。It can be understood that the space between two adjacent second tooth portions 681 forms an air duct. That is, the cold air can continuously flow to the external environment of the heat sink 30 through the air duct during the flow, so that the heated air in the air duct continuously flows to the external environment of the heat sink 30, and the air in the external environment The cold air continuously enters the air duct, which can quickly transfer the heat on the heat dissipation substrate 31 to the external environment, so that the convective heat transfer level of natural heat dissipation is improved, so that the heat dissipation device 30 has an excellent overall performance through air cooling and heat dissipation. cooling performance.

又一种可能的实施方式中，如图19所示，散热装置30还包括第二冷却工质67和第二翅片68。散热基板31内设有腔体313，第二冷却工质67设于腔体313并能够在腔体313内流动而为散热基板31散热。第二翅片68设于第二表面312。示例性地，第二翅片68可以包括间隔设置的多个第二齿部681，相邻两个第二齿部681的间隔区域能够形成用于供空气流动的风道。In yet another possible implementation manner, as shown in FIG. 19 , the heat dissipation device 30 further includes a second cooling medium 67 and second fins 68 . A cavity 313 is disposed in the heat dissipation substrate 31 , and the second cooling medium 67 is disposed in the cavity 313 and can flow in the cavity 313 to dissipate heat for the heat dissipation substrate 31 . The second fins 68 are disposed on the second surface 312 . Exemplarily, the second fin 68 may include a plurality of second tooth portions 681 arranged at intervals, and the space between two adjacent second tooth portions 681 can form an air duct for air flow.

由此，能够使散热装置30具备风冷散热和液冷散热的双层散热结构，性能多元，应用范围广泛，还能够进一步提高散热基板31的热传导能力。Thus, the heat dissipation device 30 can be equipped with a double-layer heat dissipation structure of air-cooled heat dissipation and liquid-cooled heat dissipation, with multiple performances and a wide range of applications, and can further improve the heat conduction capability of the heat dissipation substrate 31 .

以上对本申请实施例进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。The embodiments of the present application have been introduced in detail above, and specific examples have been used in this paper to illustrate the principles and implementation methods of the present application. The descriptions of the above embodiments are only used to help understand the methods and core ideas of the present application; meanwhile, for Those skilled in the art will have changes in specific implementation methods and application scopes based on the ideas of the present application. In summary, the contents of this specification should not be construed as limiting the present application.

Claims

一种散热组件，其特征在于，所述散热组件包括：A cooling assembly, characterized in that the cooling assembly includes:

电路板；circuit board;

一个或多个芯片，所述一个或多个芯片设于所述电路板；one or more chips, the one or more chips are arranged on the circuit board;

散热装置，所述散热装置和所述电路板共同包围形成封闭空间，所述一个或多个芯片位于所述封闭空间内；及a heat dissipation device, the heat dissipation device and the circuit board together form a closed space, and the one or more chips are located in the closed space; and

第一冷却工质，所述第一冷却工质设于所述封闭空间，且浸没所述一个或多个芯片，所述第一冷却工质用于通过气液转换而将所述一个或多个芯片的热量传递至所述散热装置，且所述第一冷却工质为不导电的液体。A first cooling medium, the first cooling medium is arranged in the closed space, and immerses the one or more chips, and the first cooling medium is used to transform the one or more chips through gas-liquid conversion. The heat of one chip is transferred to the heat dissipation device, and the first cooling working fluid is a non-conductive liquid.
如权利要求1所述的散热组件，其特征在于，所述散热装置包括散热基板和围框，所述围框连接至所述散热基板，且位于所述散热基板和所述电路板之间，所述围框包围所述一个或多个芯片，所述第一冷却工质与所述散热基板之间的间隙区域形成所述第一冷却工质的蒸汽通道。The heat dissipation assembly according to claim 1, wherein the heat dissipation device comprises a heat dissipation substrate and a surrounding frame, and the surrounding frame is connected to the heat dissipation substrate and is located between the heat dissipation substrate and the circuit board, The surrounding frame surrounds the one or more chips, and a gap area between the first cooling working fluid and the heat dissipation substrate forms a vapor channel of the first cooling working fluid.
如权利要求2所述的散热组件，其特征在于，所述散热装置还包括挡墙和密封垫，所述挡墙环绕设置在所述电路板上，且包围所述一个或多个芯片，所述密封垫夹设于所述围框和所述挡墙之间。The heat dissipation assembly according to claim 2, wherein the heat dissipation device further comprises a retaining wall and a sealing pad, and the retaining wall is arranged around the circuit board and surrounds the one or more chips, so The gasket is interposed between the surrounding frame and the retaining wall.
如权利要求3所述的散热组件，其特征在于，所述围框远离所述散热基板的一端和所述挡墙远离所述电路板的一端中一个设有凸起，所述围框远离所述散热基板的一端和所述挡墙远离所述电路板的一端中另一个设有凹槽，所述密封垫连接在所述凸起与所述凹槽之间。The heat dissipation assembly according to claim 3, wherein one of the end of the surrounding frame away from the heat dissipation substrate and the end of the retaining wall away from the circuit board is provided with a protrusion, and the surrounding frame is far away from the circuit board. The other of the one end of the heat dissipation substrate and the end of the retaining wall away from the circuit board is provided with a groove, and the sealing gasket is connected between the protrusion and the groove.
如权利要求2所述的散热组件，其特征在于，所述散热基板包括第一表面，所述围框设于所述第一表面，所述散热装置还包括第一翅片，所述第一翅片设于所述第一表面且位于所述封闭空间内。The heat dissipation assembly according to claim 2, wherein the heat dissipation substrate comprises a first surface, the surrounding frame is provided on the first surface, the heat dissipation device further comprises a first fin, and the first The fins are disposed on the first surface and located in the closed space.
如权利要求2或5任一项所述的散热组件，其特征在于，所述散热组件还包括补液通道和第一密封塞，所述补液通道位于所述围框的外侧且与所述封闭空间连通，所述补液通道用于向所述封闭空间内补充所述第一冷却工质，所述第一密封塞与所述补液通道可拆卸连接并密封所述补液通道。The heat dissipation assembly according to any one of claims 2 or 5, characterized in that, the heat dissipation assembly further comprises a liquid replenishment channel and a first sealing plug, the liquid replenishment channel is located on the outside of the surrounding frame and is connected to the enclosed space The liquid replenishment channel is used to replenish the first cooling medium into the closed space, and the first sealing plug is detachably connected to the liquid replenishment channel and seals the liquid replenishment channel.
如权利要求6所述的散热组件，其特征在于，所述散热组件还包括液位传感器，所述液位传感器位于所述补液通道内，所述液位传感器用于在所述第一冷却工质的液位小于预设液位时告警。The heat dissipation assembly according to claim 6, wherein the heat dissipation assembly further comprises a liquid level sensor, the liquid level sensor is located in the liquid replenishment channel, and the liquid level sensor is used for Alarm when the liquid level of the substance is lower than the preset liquid level.
如权利要求2、5-7任一项所述的散热组件，其特征在于，所述散热组件还包括排气通道和第二密封塞，所述排气通道位于所述围框的外侧且与所述蒸汽通道连通，所述排气通道用于排出空气，所述第二密封塞与所述排气通道可拆卸连接并密封所述排气通道。The heat dissipation assembly according to any one of claims 2, 5-7, wherein the heat dissipation assembly further comprises an exhaust channel and a second sealing plug, the exhaust channel is located on the outside of the surrounding frame and is in contact with The steam channel communicates, the exhaust channel is used to discharge air, and the second sealing plug is detachably connected to the exhaust channel and seals the exhaust channel.
如权利要求2-8任一项所述的散热组件，其特征在于，所述散热装置还包括第二冷却工质，所述散热基板内设有腔体，所述第二冷却工质设于所述腔体并能够在所述腔体内流动而为所述散热基板散热。The heat dissipation assembly according to any one of claims 2-8, wherein the heat dissipation device further includes a second cooling medium, a cavity is provided in the heat dissipation substrate, and the second cooling medium is disposed on The cavity can also flow in the cavity to dissipate heat for the heat dissipation substrate.
如权利要求2-9任一项所述的散热组件，其特征在于，所述散热基板包括与所述第一表面相背设置的第二表面，所述散热装置还包括第二翅片，所述第二翅片设于所述第二表面。The heat dissipation assembly according to any one of claims 2-9, wherein the heat dissipation substrate comprises a second surface opposite to the first surface, and the heat dissipation device further comprises a second fin, so The second fins are disposed on the second surface.
如权利要求1-10任一项所述的散热组件，其特征在于，所述第一冷却工质包括氟化液、1,1,1,2-四氟乙烷、1,1,1,3,3-五氟丙烷、1,1,1,3-四氟丙烯、1-氯-3,3,3-三氟丙烯中一种或多种的组合。The heat dissipation assembly according to any one of claims 1-10, characterized in that, the first cooling medium includes fluorinated liquid, 1,1,1,2-tetrafluoroethane, 1,1,1, A combination of one or more of 3,3-pentafluoropropane, 1,1,1,3-tetrafluoropropene, and 1-chloro-3,3,3-trifluoropropene.
一种车辆模块，其特征在于，所述车辆模块包括如权利要求1-11任一项所述的散热组件。A vehicle module, characterized in that the vehicle module comprises the heat dissipation assembly according to any one of claims 1-11.
一种车辆，其特征在于，所述车辆包括如权利要求12所述的车辆模块。A vehicle, characterized in that the vehicle comprises the vehicle module as claimed in claim 12.