CN108762454A - A kind of central processor core radiator for blade server - Google Patents
A kind of central processor core radiator for blade server Download PDFInfo
- Publication number
- CN108762454A CN108762454A CN201810884760.1A CN201810884760A CN108762454A CN 108762454 A CN108762454 A CN 108762454A CN 201810884760 A CN201810884760 A CN 201810884760A CN 108762454 A CN108762454 A CN 108762454A
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- Prior art keywords
- heat
- blade server
- heat dissipation
- condenser
- evaporator
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 41
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 238000009833 condensation Methods 0.000 claims abstract description 7
- 230000005494 condensation Effects 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000741 silica gel Substances 0.000 claims 1
- 229910002027 silica gel Inorganic materials 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000009834 vaporization Methods 0.000 abstract description 4
- 230000008016 vaporization Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 239000007791 liquid phase Substances 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 abstract 1
- 239000012530 fluid Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of central processor core radiators for blade server, belong to heat dissipation of integrated circuit chip technical field.The radiator of blade server of the present invention includes evaporator, heat pipe, condenser and heat dissipation wind channel.The present invention absorbs the heat that cpu chip generates by evaporator, and the heated rear rapid vaporization of liquid working substance of evaporator inside cavity is steam, and working substance steam is transferred to condenser and carries out condensation liquefaction heat release by heat pipe.Heat is transmitted since the vapour using working medium, liquid phase become, thermal resistance very little has the very high capacity of heat transmission.Heat dissipation wind channel is bypass structure, and wind-force is unidirectional, and no turbulent flow phenomenon can make condenser quickly fully radiate, the rapid heat for discharging cpu chip and generating.The circuit space of heat dissipation wind channel and blade server is physically isolated, and radiating airflow only flows in heat dissipation wind channel, does not enter the circuit space of blade server, solves existing radiator and there is the problems such as cascade heating effect, radiating efficiency is low and fan noise is big.
Description
Technical field
The present invention relates to a kind of central processor core radiators for blade server, belong to IC chip
Technical field of heat dissipation.
Background technology
Blade server refers to the server unit that multiple cassettes can be inserted in the rack cabinet of calibrated altitude, is one
Kind realizes High Availabitity, highdensity inexpensive server platform, is widely used mainly in large-scale data center and high-performance collection at present
The construction of group.Blade server is due to using high-performance and high integration design scheme, its advantage is that reducing to the maximum extent
To the occupancy of physical space, but the disadvantage is that power density is greatly improved, a large amount of heat, therefore blade are generated in operation
The heat dissipation performance of server just becomes the key factor of decision systems operation stability.
Blade server is limited by physical arrangement, and the cooling fin volume of cpu chip cannot be too big, can not on cooling fin
Fan is installed, heat dissipation problem is extremely prominent.Its structure of existing radiator as shown in Figure 1, can only use front panel air inlet, after
The design of backboard outlet air, is radiated with air convection.Since electronics member device is numerous in blade server, internal wind is caused
Road is complicated, and fluid resistance is very big, and there are cascade heating effects, cause heat dissipation effect poor.In taking away in time
The heat that portion electronic component generates, the air mass flow for passing in and out blade server case must be very big, it has to using it is high-power,
High rotating speed high-power fan makes the Main Noise Sources for the blade server that the aerodynamic noise of fan and rotational noise become.
Invention content
The purpose of the present invention is to propose to a kind of central processor core radiators for blade server, to existing
The structure of radiator for blade server is improved, and absorbs the heat that central processor core generates using evaporator
Amount, to solve the problems, such as existing blade server radiator, there are heating effect is cascaded existing for grade.
Central processor core radiator proposed by the present invention for blade server, including cooling fin and axis stream wind
Fan, it is characterised in that further include evaporator, heat pipe, condenser and heat dissipation wind channel, the bottom of the evaporator passes through thermal conductive silicon
On central processor core, the both ends of the heat pipe are connected to evaporator and condenser welding glue sticking respectively, evaporator,
Heat pipe and condenser composition hot systems inside vacuum state, evaporator, heat pipe and condenser composition hot systems inside
It is filled with liquid working substance, the condenser is mounted in heat dissipation wind channel, the circuit space physics of heat dissipation wind channel and blade server
Isolation；More aerofoil fans are connected with heat dissipation wind channel and blade server shell respectively.
Central processor core radiator proposed by the present invention for blade server, its advantage is that：
The central processor core radiator for blade server of the present invention, utilizes the liquid in containing vacuum system
Evacuator body transmits heat with condensation, can the heat that cpu chip generates be transmitted to rapidly the condenser in heat dissipation channel.Evaporation
Rapid vaporization is steam after the liquid working substance of device intracavitary is heated, and steam is sent to the condenser in heat dissipation wind channel through heat pipe, right
Working substance steam carries out condensation liquefaction heat release.Heat is transmitted since the vapour using working medium, liquid phase become, thermal resistance very little has very
The high capacity of heat transmission.Heat dissipation wind channel is bypass structure, and wind-force is unidirectional, and no turbulent flow phenomenon can make condenser fully radiate rapidly, soon
The heat that speed discharge cpu chip generates.Since the radiating fin area on condenser cavity is larger, and in unobstructed special
In heat dissipation wind channel, the smaller slow-speed of revolution of noise, low air quantity fan can be used, solve existing blade server radiator heat dissipation
The problems such as piece area is small, air channel structure is complicated, fan noise is big low with radiating efficiency.In addition, heat dissipation wind channel and blade server
Circuit space physical isolation, radiating airflow only flowed in Special heat dissipating air duct, do not enter blade server circuit space, solve
Existing radiator of having determined there are problems that cascading heating effect.
Description of the drawings
Fig. 1 is the structural schematic diagram of existing blade server radiator.
Fig. 2 is blade server central processor rediating device structure schematic diagram proposed by the present invention.
Fig. 3 is the A-A sectional views of condenser 7 in Fig. 2.
In Fig. 1 and Fig. 2,1 is central processor core, and 2 be cooling fin, and 3 be aerofoil fan, and 4 be blade server shell,
5 it is evaporator, 6 is heat pipe, 7 is condenser, and 8 be heat dissipation wind channel.
Specific implementation mode
Central processor core radiator proposed by the present invention for blade server, structure are as shown in Figure 2.Packet
Include cooling fin 2 and aerofoil fan 3, evaporator 5, heat pipe 6, condenser 7 and heat dissipation wind channel 8.The bottom of evaporator 5 passes through thermal conductive silicon
On central processor core 1, the both ends of heat pipe 6 are connected to evaporator 5 and the welding of condenser 7 glue sticking respectively, evaporator 5,
Vacuum state inside the hot systems that heat pipe 6 and condenser 7 form, the hot systems that evaporator 5, heat pipe 6 and condenser 7 form
Inside is filled with liquid working substance.Condenser 7 is mounted in heat dissipation wind channel 8, the circuit space physics of heat dissipation wind channel 8 and blade server
Isolation.More aerofoil fans 3 are connected with heat dissipation wind channel 3 and blade server shell 4 respectively, and aerofoil fan 3 can pass through spiral shell
Nail is fixed on blade server shell 4.
In central processor core radiator proposed by the present invention for blade server, evaporator 5 is used for absorbing
The heated rear rapid vaporization of liquid working substance of the heat that cpu chip 1 generates, 5 inside cavity of evaporator is steam, and working substance steam is micro-
Enter heat pipe 6 under the action of small pressure difference, and takes away amount of heat.Working substance steam is transferred to condenser by heat pipe 6 from evaporator 5
In 7 cavity, the straight rib radiating fin absorption working substance steam heat (as shown in Figure 3) on the cavity and cavity of condenser 7.Heat dissipation
The air quickly flowed in air duct 8 takes away rapidly the heat on 7 cavity of condenser and radiating fin.Lose the working medium condensation of heat
After liquefaction, under the action of 6 inner wall liquid-sucking core capillary of heat pipe, 5 intracavitary of evaporator is flowed back by heat pipe 6, completes working medium
Cycle.
Evaporator 5 in insert server heat sink is used for absorbing the heat of the generation of cpu chip 1, and rapidly will
The liquid working substance of 5 inside cavity of evaporator is vaporizated into steam, and working substance steam enters heat pipe 6 under the action of slight pressure difference, and
Take away amount of heat.
Heat pipe 6 in insert server heat sink is for the working substance steam of 5 inside cavity of evaporator to be transferred to
In the cavity of condenser 7, while the liquid working substance of 7 intracavitary of condenser is flowed back into evaporator 5.
Condenser 7 in insert server heat sink is used for the condensation liquefaction heat release of working substance steam.Working substance steam
Into the inside cavity of condenser 7, heat is conducted to the cavity of condenser 7 and straight rib radiating fin.It is fast in heat dissipation wind channel 8
Fast moving air takes away the heat on 7 cavity of condenser and radiating fin, after losing the working fluid condensate of heat, in heat pipe 6
Under the action of inner wall liquid-sucking core capillary, evaporator 5 is flowed back by heat pipe 6, completes the cycle of working medium.
Heat dissipation wind channel 8 in insert server heat sink is used to carry out forced air cooling to condenser 7, and will heat dissipation
Air-flow is physically isolated with blade server circuit space.
Aerofoil fan 3 in insert server heat sink in heat dissipation wind channel 8 for generating forced convertion.Axis stream
Fan 3 is mounted on the air outlet of heat dissipation wind channel 8, and cold air is drawn into air duct from the air inlet of heat dissipation wind channel 8, the sky quickly flowed
After heat on 7 cavity of aspiration condenser and radiating fin, from the rear portion air outlet discharge of heat dissipation wind channel 8.
In one embodiment of radiator proposed by the present invention for blade server, evaporator 5, heat pipe 6 and cold
Condenser 7 is all made of the good copper product of thermal conductivity and is made, and 6 inner wall liquid-sucking core of heat pipe is made of nickel fibre felt, and working medium uses water, steams
It is evacuated state inside the hot systems that hair device, heat pipe and condenser are constituted.
The operation principle of the radiator for blade server of the present invention is：
When the cpu chip 1 in blade server is started to work, the temperature of cpu chip 1 gradually rises, and cpu chip 1 will
Heat transfer is to evaporator 5；It is evacuated state inside the hot systems that evaporator 5, heat pipe 6 and condenser 7 are constituted, therefore
The liquid working substance boiling point of 5 inside cavity of evaporator is very low, and rapid vaporization is saturated vapor after liquid working substance is heated, and refrigerant vapor exists
Enter heat pipe 6 under the action of slight pressure difference, and takes away amount of heat.Working substance steam enters through heat pipe 6 in the cavity of condenser 7
Portion, and heat is conducted to the cavity and straight rib radiating fin thereon of condenser 7.The air quickly flowed in heat dissipation wind channel 8
The rapid heat taken away on 7 cavity of condenser and fin, after losing the working fluid condensate of heat, in 6 inner wall liquid-sucking core of heat pipe
Under the action of capillary, evaporator 5 is flowed back by heat pipe 6, completes the cycle of working medium.
Central processor core radiator proposed by the present invention for blade server, using in containing vacuum system
Liquid evaporation and condensation transmit heat, the heat that cpu chip generates can be transmitted to rapidly the condenser in heat dissipation channel.
Heat is transmitted since the vapour using working medium, liquid phase become, thermal resistance very little has the very high capacity of heat transmission.Heat dissipation wind channel is straight
Logical structure, wind-force is unidirectional, and no turbulent flow phenomenon can make condenser fully radiate rapidly, the heat that quick drain cpu chip generates.
Since the radiating fin area on condenser is larger, and in unobstructed Special heat dissipating air duct, it is smaller that noise can be used
The slow-speed of revolution, low air quantity fan.In addition, the circuit space of heat dissipation wind channel and blade server is physically isolated, radiating airflow is only special
With being flowed in heat dissipation wind channel, do not enter the circuit space of blade server, solves existing radiator and there is cascade heating effect
It answers, the problems such as radiating efficiency is low and fan noise is big.
Claims (1)
1. a kind of central processor core radiator for blade server, including cooling fin and aerofoil fan, feature
It is to further include evaporator, heat pipe, condenser and heat dissipation wind channel, during the bottom of the evaporator is bonded in by heat conductive silica gel
On central processor chip, the both ends of the heat pipe are connected to evaporator and condenser welding respectively, evaporator, heat pipe and condensation
Device composition hot systems inside vacuum state, evaporator, heat pipe and condenser composition hot systems inside be filled with liquid work
Matter, the condenser are mounted in heat dissipation wind channel, and the circuit space of heat dissipation wind channel and blade server is physically isolated；More axis
Flow fan is connected with heat dissipation wind channel and blade server shell respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810884760.1A CN108762454A (en) | 2018-08-06 | 2018-08-06 | A kind of central processor core radiator for blade server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810884760.1A CN108762454A (en) | 2018-08-06 | 2018-08-06 | A kind of central processor core radiator for blade server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108762454A true CN108762454A (en) | 2018-11-06 |
Family
ID=63969107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810884760.1A Withdrawn CN108762454A (en) | 2018-08-06 | 2018-08-06 | A kind of central processor core radiator for blade server |
Country Status (1)
| Country | Link |
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| CN (1) | CN108762454A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109491484A (en) * | 2019-01-07 | 2019-03-19 | 紫光股份有限公司 | A kind of central processor core air-cooled radiating device for blade server |
| CN109887895A (en) * | 2019-03-04 | 2019-06-14 | 四川长虹空调有限公司 | Semiconductor devices radiator |
| CN110366360A (en) * | 2019-08-06 | 2019-10-22 | 紫光股份有限公司 | A kind of water-cooling heat radiating device for blade server central processing element |
| CN112117510A (en) * | 2019-06-21 | 2020-12-22 | 百度（美国）有限责任公司 | Self-activating thermal management system for battery pack |
| CN113163683A (en) * | 2021-04-02 | 2021-07-23 | 西安易朴通讯技术有限公司 | Liquid cooling heat dissipation equipment, cabinet and system |
| CN113900502A (en) * | 2021-10-13 | 2022-01-07 | 紫光股份有限公司 | Thermoelectric refrigeration heat dissipation device for computer chip |
| CN115379729A (en) * | 2022-08-15 | 2022-11-22 | 湖南兴天电子科技股份有限公司 | Heat dissipation module, device, blade server and electronic equipment |
| CN115412649A (en) * | 2022-08-16 | 2022-11-29 | 常州大学 | Heat pipe type cooling system for fax machine |
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| US20100124012A1 (en) * | 2008-11-19 | 2010-05-20 | Hitachi, Ltd. | Blade server |
| CN203276154U (en) * | 2013-05-27 | 2013-11-06 | 汪凤兰 | Efficient heat dissipation device of computer CPU |
| CN104154787A (en) * | 2014-08-29 | 2014-11-19 | 电子科技大学 | Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device |
| CN106855741A (en) * | 2016-12-29 | 2017-06-16 | 中国航天空气动力技术研究院 | A kind of heat abstractor and system for blade server chip |
| CN208636787U (en) * | 2018-08-06 | 2019-03-22 | 紫光股份有限公司 | A kind of central processor core radiator for blade server |
-
2018
- 2018-08-06 CN CN201810884760.1A patent/CN108762454A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100124012A1 (en) * | 2008-11-19 | 2010-05-20 | Hitachi, Ltd. | Blade server |
| CN203276154U (en) * | 2013-05-27 | 2013-11-06 | 汪凤兰 | Efficient heat dissipation device of computer CPU |
| CN104154787A (en) * | 2014-08-29 | 2014-11-19 | 电子科技大学 | Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device |
| CN106855741A (en) * | 2016-12-29 | 2017-06-16 | 中国航天空气动力技术研究院 | A kind of heat abstractor and system for blade server chip |
| CN208636787U (en) * | 2018-08-06 | 2019-03-22 | 紫光股份有限公司 | A kind of central processor core radiator for blade server |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109491484A (en) * | 2019-01-07 | 2019-03-19 | 紫光股份有限公司 | A kind of central processor core air-cooled radiating device for blade server |
| CN109887895A (en) * | 2019-03-04 | 2019-06-14 | 四川长虹空调有限公司 | Semiconductor devices radiator |
| CN112117510A (en) * | 2019-06-21 | 2020-12-22 | 百度（美国）有限责任公司 | Self-activating thermal management system for battery pack |
| CN110366360A (en) * | 2019-08-06 | 2019-10-22 | 紫光股份有限公司 | A kind of water-cooling heat radiating device for blade server central processing element |
| CN113163683A (en) * | 2021-04-02 | 2021-07-23 | 西安易朴通讯技术有限公司 | Liquid cooling heat dissipation equipment, cabinet and system |
| CN113900502A (en) * | 2021-10-13 | 2022-01-07 | 紫光股份有限公司 | Thermoelectric refrigeration heat dissipation device for computer chip |
| CN115379729A (en) * | 2022-08-15 | 2022-11-22 | 湖南兴天电子科技股份有限公司 | Heat dissipation module, device, blade server and electronic equipment |
| CN115412649A (en) * | 2022-08-16 | 2022-11-29 | 常州大学 | Heat pipe type cooling system for fax machine |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181106 |
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| WW01 | Invention patent application withdrawn after publication |