CN110366360A - A kind of water-cooling heat radiating device for blade server central processing element - Google Patents
A kind of water-cooling heat radiating device for blade server central processing element Download PDFInfo
- Publication number
- CN110366360A CN110366360A CN201910720861.XA CN201910720861A CN110366360A CN 110366360 A CN110366360 A CN 110366360A CN 201910720861 A CN201910720861 A CN 201910720861A CN 110366360 A CN110366360 A CN 110366360A
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- Prior art keywords
- water
- heat
- blade server
- pipe
- central processing
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- 238000001816 cooling Methods 0.000 title claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 114
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000009834 vaporization Methods 0.000 description 3
- 230000008016 vaporization Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of central processing element water-cooling heat radiating devices for blade server, belong to heat dissipation of integrated circuit chip technical field.The water-cooling heat radiating device of blade server of the present invention includes evaporator, heat pipe, water cooler, water pump, heat exchanger and water pipe.Blade server central processing element water-cooling heat radiating device proposed by the present invention, the heat transmission for generating the heat sources such as central processing element first with heat pipe goes out to the water cooler outside blade server case, then by recirculated water to heat is taken rapidly to the heat exchanger far from blade server and radiated.Since the connector of water pipe and water cooler is located at the outside of blade server, even if liquid leakage occurs, liquid also can only drop onto the bottom of cabinet, without causing short circuit failure into blade server, the security risk for having prevented water-cooling heat radiating device ensure that the functional reliability of blade server.
Description
Technical field
The present invention relates to a kind of water-cooling heat radiating devices for blade server central processing element, belong to ic core
Piece technical field of heat dissipation.
Background technique
Blade server is a kind of unit that multiple cassette servers are inserted in the rack cabinet of calibrated altitude, is one
Kind realizes the server platform of High Availabitity, high density, low cost, is now widely used in large-scale cloud computation data center and high-performance
The construction of computing cluster.Blade server is due to using high-performance and high integration design scheme, its advantage is that the maximum extent
It reduces the occupancy to physical space, but the disadvantage is that power density is greatly improved, a large amount of heat is generated in operation, because
The heat dissipation performance of this blade server just becomes the key factor of decision systems operation stability.
For the blade server of ultrahigh heat density, wind-cooling heat dissipating mode has been unable to meet the heat dissipation effect of blade server
Rate, energy consumption and mute requirement.Existing ultrahigh heat density blade server generally uses water cooling method, utilizes circulation
The liquid of flowing takes away cpu chip heat, and the heat in liquid is discharged into ring by the heat exchanger far from blade server
In border.
For the existing water-cooling heat radiating device for blade server central processing element as shown in Figure 1, in Fig. 1,1 is center
Chip is handled, 2 be water-cooled plate, and 3 be blade server case, and 4 be water pump, and 5 be heat exchanger, and 6 be water pipe, absorbs central processing core
The water-cooled plate 2 of piece heat is connect with water pipe 6 by connector.The disadvantage is that since water pipe head sealing performance exists centainly not
Certainty has the risk of liquid leakage, once liquid leakage, can bring the damage burnt by short circuit to blade server
It loses.
Summary of the invention
The purpose of the present invention is to propose to a kind of water-cooling heat radiating devices for blade server central processing element, to existing
The structure of water-cooling heat radiating device of blade server central processing element improve, to guarantee that the work of blade server can
By property.
Water-cooling heat radiating device proposed by the present invention for blade server central processing element, including water pump, heat exchanger,
Water pipe further includes evaporator, heat pipe and water cooler；The bottom of the evaporator is bonded in central processing core by heat conductive silica gel
On piece；One end of the heat pipe seals, and the other end is connected to evaporator welding, and evaporator and heat pipe form a heat transfer system
It unites, internal after being evacuated inside heat transfer system to be filled with liquid working substance, the sealed end of heat pipe is inserted into water from the mounting hole of water cooler
In the cavity of cooler, and keep the sealed end of heat pipe and water cooler shell relatively fixed by welding, water cooler is fixed by screw
On the case back plate of blade server, the water inlet of water cooler and the water outlet of water pump are connected by water pipe, and water cooler goes out
The water inlet of the mouth of a river and heat exchanger is connected by water pipe, and the water outlet of heat exchanger and the water inlet of water pump are connected by water pipe.
Water-cooling heat radiating device proposed by the present invention for blade server central processing element, its advantage is that:
Blade server central processing element water-cooling heat radiating device of the invention, by heat pipe by heat such as central processing elements
The heat transmission that source generates goes out to the water cooler outside blade server case, is then taken heat to rapidly using recirculated water remote
Heat exchanger from blade server radiates.Since the connector of water pipe and water cooler is located at the outside of blade server, even if
Liquid leakage occurs, liquid also can only drop onto the bottom of cabinet, without causing short circuit failure into blade server,
The security risk for completely avoiding water-cooling heat radiating device guarantees the safe and reliable of blade server.
Detailed description of the invention
Fig. 1 is existing blade server central processing element water-cooling heat radiating device structural schematic diagram.
Fig. 2 is blade server central processing element water-cooling heat radiating device structural schematic diagram proposed by the present invention.
In Fig. 1 and Fig. 2,1 is central processing element, and 2 be water-cooled plate, and 3 be blade server case, and 4 be water pump, and 5 be to change
Hot device, 6 be water pipe, and 7 be water cooler, and 8 be heat pipe, and 9 be evaporator.
Specific embodiment
Water-cooling heat radiating device proposed by the present invention for blade server central processing element, structure as shown in Fig. 2,
Including water pump 4, heat exchanger 5, water pipe 6, evaporator 9, heat pipe 8 and water cooler 7.The bottom of evaporator 9 is bonded by heat conductive silica gel
On central processing element 1.One end of heat pipe 8 seals, and the other end is connected to the welding of evaporator 9, and evaporator 9 and heat pipe 8 form
One heat transfer system, internal after being evacuated inside heat transfer system to be filled with liquid working substance, the sealed end of heat pipe 8 is from water cooler 7
Mounting hole is inserted into the cavity of water cooler 7, and keeps the sealed end of heat pipe and water cooler shell relatively fixed by welding, water cooler
7 are fixed by screws on the backboard of blade server case 3, and the water inlet of water cooler 7 and the water outlet of water pump 4 pass through water pipe
Connection, the water outlet of water cooler 7 connect with the water inlet of heat exchanger 5 by water pipe, the water outlet of heat exchanger 5 and water pump 4 into
The mouth of a river is connected by water pipe.
In central processing element water-cooling heat radiating device proposed by the present invention for blade server, evaporator 9 is used to inhale
The heat that cpu chip 1 generates is received, rapid vaporization is steam after the liquid working substance of 9 inside cavity of evaporator is heated, and working substance steam exists
Enter the other end (sealed end) of heat pipe 8 under the action of slight pressure difference, and takes away amount of heat.Heat pipe 8 transfers heat to
Water cooler 7, the recirculated water in water cooler 7, which takes heat in the heat exchanger 5 far from blade server to through water pipe 6, to radiate,
Recirculated water after cooling is pushed to water cooler 7 by water pipe 6 by water pump 4 again.The working medium that heat is lost in heat pipe 8 is condensed liquefaction
Afterwards, under the action of 8 inner wall liquid-sucking core capillary of heat pipe, the intracavitary of evaporator 9 is flowed back by heat pipe 8, completes following for working medium
Ring.
Water pump 4 in insert server water-cooling heat radiating device is used to that recirculated water is pushed to flow in water cooling plant, helps
Recirculated water is set to carry out cold and hot exchange.
Heat exchanger 5 in insert server water-cooling heat radiating device is used to that the heat in recirculated water is made to be discharged rapidly to week
In collarette border, the recirculated water for losing heat flows back into water cooler 9 by water pipe 6.
Water pipe 6 in insert server water-cooling heat radiating device makes for connecting water pump 4, heat exchanger 5 and water cooler 7
Recirculated water is circulated in a closed channel without leaking outside.
Water cooler 7 in insert server water-cooling heat radiating device is cooled down for 6 sealed end of opposite heat tube, is absorbed
The circulation fluid of central processing element heat is flowed out from water cooler 7 under the action of water pump 4, and new low-temperature circulating liquid continues
Flow into and continue to absorb the heat of central processing element.Evaporator 9 in insert server water-cooling heat radiating device is used to inhale
Receive the heat that central processing element 1 generates.Rapid vaporization is steam, working medium after the liquid working substance of 9 inside cavity of evaporator is heated
Steam enters the other end of heat pipe 6 under the action of slight pressure difference, and takes away amount of heat.
Heat pipe 8 in insert server water-cooling heat radiating device is used to pass the working substance steam of 9 inside cavity of evaporator
The defeated other end to heat pipe 8, while the liquid working substance after condensation liquefaction is flowed back into evaporator 9.
In one embodiment of water-cooling heat radiating device proposed by the present invention for blade server, evaporator 9 and heat pipe 8
Being all made of thermal conductivity, good copper product is made, and 8 inner wall liquid-sucking core of heat pipe is constituted using nickel fibre felt production, evaporator and heat pipe
State is evacuated inside hot systems, working medium uses water.Water cooler 7 is welded using reflow soldering process, by copper product
Manufactured cabinet；Water pump 4 expels heart pump using Miniature brushless dc magnetic；Heat exchanger 5 uses plate heat exchanger；Water pipe 6 uses work
Industry grade rubber hose, interior glue material are ethylene propylene diene rubber；Recirculated water is deionized water.
The working principle of central processing element water-cooling heat radiating device for blade server of the invention is:
When the central processing element 1 in blade server is started to work, the temperature of central processing element 1 is gradually risen,
Central processing element 1 transfers heat to evaporator 9；It has been evacuated inside the heat transfer system that evaporator 9 and heat pipe 8 are constituted
State, therefore the liquid working substance boiling point of 9 inside cavity of evaporator is very low, rapid vaporization is saturated vapor after liquid working substance is heated,
Refrigerant vapor enters the other end of heat pipe 8 under the action of slight pressure difference, and takes away amount of heat.It is inserted into 7 cavity of water cooler
Steam heat is conducted to recirculated water by interior heat pipe, and recirculated water is taken heat far from blade server to by the driving of water pump 4
Heat exchanger radiates.The recirculated water of heat is lost under the action of water pump 4, water cooler 7 is flowed back by water pipe 6.In heat pipe 8
Working substance steam be water cooled 7 condensation liquefaction of device after, under the action of 8 inner wall liquid-sucking core capillary of heat pipe, flowed back by heat pipe 8
In the cavity of evaporator 9, the circulation of working medium is completed.
Claims (1)
1. a kind of water-cooling heat radiating device for blade server central processing element, including water pump, heat exchanger, water pipe, special
Sign is to further include evaporator, heat pipe and water cooler；The bottom of the evaporator is bonded in central processing by heat conductive silica gel
On chip；One end of the heat pipe seals, and the other end is connected to evaporator welding, and evaporator and heat pipe form a heat transfer system
It unites, internal after being evacuated inside heat transfer system to be filled with liquid working substance, the sealed end of heat pipe is inserted into water from the mounting hole of water cooler
In the cavity of cooler, and keep the sealed end of heat pipe and water cooler shell relatively fixed by welding, water cooler is fixed by screw
On the case back plate of blade server, the water inlet of water cooler and the water outlet of water pump are connected by water pipe, and water cooler goes out
The water inlet of the mouth of a river and heat exchanger is connected by water pipe, and the water outlet of heat exchanger and the water inlet of water pump are connected by water pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910720861.XA CN110366360A (en) | 2019-08-06 | 2019-08-06 | A kind of water-cooling heat radiating device for blade server central processing element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910720861.XA CN110366360A (en) | 2019-08-06 | 2019-08-06 | A kind of water-cooling heat radiating device for blade server central processing element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110366360A true CN110366360A (en) | 2019-10-22 |
Family
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|---|---|---|---|
| CN201910720861.XA Pending CN110366360A (en) | 2019-08-06 | 2019-08-06 | A kind of water-cooling heat radiating device for blade server central processing element |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885798A (en) * | 2020-12-25 | 2021-06-01 | 佛山市液冷时代科技有限公司 | Integrated phase change heat transfer element liquid cooling heat radiation module for server |
| CN113808628A (en) * | 2021-08-27 | 2021-12-17 | 西安理工大学 | RRAM array water-cooling heat dissipation device based on packaging part deionized water |
| CN113900502A (en) * | 2021-10-13 | 2022-01-07 | 紫光股份有限公司 | Thermoelectric refrigeration heat dissipation device for computer chip |
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| CN2640041Y (en) * | 2003-08-19 | 2004-09-08 | 林项武 | Heat pipe water-cooling heat-sink system |
| US20100124012A1 (en) * | 2008-11-19 | 2010-05-20 | Hitachi, Ltd. | Blade server |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885798A (en) * | 2020-12-25 | 2021-06-01 | 佛山市液冷时代科技有限公司 | Integrated phase change heat transfer element liquid cooling heat radiation module for server |
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| CN113808628A (en) * | 2021-08-27 | 2021-12-17 | 西安理工大学 | RRAM array water-cooling heat dissipation device based on packaging part deionized water |
| CN113900502A (en) * | 2021-10-13 | 2022-01-07 | 紫光股份有限公司 | Thermoelectric refrigeration heat dissipation device for computer chip |
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