CN207881844U - A kind of micro-bridge structure array and micro-metering bolometer - Google Patents
A kind of micro-bridge structure array and micro-metering bolometer Download PDFInfo
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- CN207881844U CN207881844U CN201721866262.1U CN201721866262U CN207881844U CN 207881844 U CN207881844 U CN 207881844U CN 201721866262 U CN201721866262 U CN 201721866262U CN 207881844 U CN207881844 U CN 207881844U
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Abstract
The utility model discloses a kind of micro-bridge structure array and micro-metering bolometers, the micro-bridge structure includes bridge leg layer, heat-sensitive layer, upper anchor post, mooring post, the bridge leg layer is supported in the top of substrate by mooring post, the heat-sensitive layer is supported in the top of the bridge leg layer by upper anchor post, the upper anchor post, mooring post is respectively positioned on the edge of bridge leg layer, to increase absorption area of the heat-sensitive layer to infra-red radiation, the arrangement space of bridge leg is maximized simultaneously, increase the length of bridge leg, reduce thermal conductivity, by the upper anchor post for the array that the micro-bridge structure of the structure forms, mooring post is evenly arranged in a row, the planarization of technique and the performance of detector can be improved.
Description
Technical field
The utility model belongs to infrared detector field, more particularly, to a kind of micro-bridge structure array and micrometering spoke
Penetrate hot meter.
Background technology
Micro-metering bolometer is to grow the pixel closely similar with bridge surface layer structure by MEMS technology on a silicon substrate.
Bridge floor layer is usually made of multilayer material, includes the absorbed layer for absorbing infrared energy, and temperature change is converted into
The heat-sensitive layer of voltage (or electric current) variation, anchor post and bridge leg layer play the role of supporting bridge floor layer, and realize electrical connection.Micrometering spoke
Penetrating the operation principle of heat meter is：Heat radiation from target is focused on by infrared optical system on detector focal plane arrays (FPA),
Temperature changes after the infrared absorption layer of each microbridge absorbs infrared energy, and different microbridges receive the hot spoke of different-energy
It penetrates, the temperature change of its own is just different, and corresponding change, this variation occurs so as to cause the heat-sensitive layer resistance value of each microbridge
It is converted into electric signal output via the reading circuit inside detector, by the signal acquisition and data processing electricity outside detector
Road finally obtains the visualization electronic image of reflection target temperature profiles situation.
Although the anchor post and bridge leg layer of the prior art can realize being electrically connected for heat-sensitive layer and reading circuit substrate, simultaneously can
Thermal conductivity is generated, the temperature change of infrared absorption energy production is inevitably passed into reading circuit substrate, influences benchmark letter
Number, it causes signal background noise to increase, the accuracy of detector output image is reduced, so semiconductor cooler is needed to reduce
Thermal conductivity, but so increase detector cost and package area.
Existing 106595876 A of patent CN reduce thermal conductivity by being extended the bridge leg layer of bending on heat-sensitive layer both sides,
But this scheme reduces the area of heat-sensitive layer, that is, reduces the absorption of infra-red radiation in the case of same chip package area
Rate, while the length of bridge leg is also unable to fully eliminate thermal conductivity.
Heat-sensitive layer, bridge leg are arranged as upper layer and lower layer by patent CN106564854A, make the area phase of heat-sensitive layer and bridge leg layer
When, it is intended to absorptivity of the heat-sensitive layer to infra-red radiation is improved, the thermal conductivity of bridge leg layer, but the bridge leg layer of the patent micro-bridge structure are eliminated
For incense coil shape, two mooring posts are located among bridge leg layer, cannot share mooring post with other micro-bridge structure, and due to anchor post technique
(releasing sacrificial layer) can make the upper table of anchor post be recessed downwards, thus the bridge leg layer of the structure can be uneven due to intermediate recess
It is whole, it influences the arrangement of anchor post and then influences the susceptibility of entire micro-metering bolometer, increase noise.
Utility model content
For the disadvantages described above or Improvement requirement of the prior art, the utility model provide a kind of micro-bridge structure array and
Micro-metering bolometer expands the effective absorbing area of infra-red radiation, simultaneously its object is to reduce the thermal conductivity of micro-metering bolometer
The planarization and uniformity of micro-bridge structure array are improved, the performance of micro-metering bolometer is thus improved.
To achieve the above object, it according to the one side of the utility model, provides micro- on a kind of reading circuit substrate
Bridge structure includes bridge leg layer, the heat-sensitive layer of rectangle from the bottom to top, which is characterized in that further includes two vertically disposed upper anchor posts
And two vertically disposed mooring posts, the mooring post are supported in the lower section of bridge leg layer, the upper anchor post is supported in the heat
Between photosensitive layer and the bridge leg layer, two mooring posts are arranged in the edge of bridge leg layer, two upper anchor posts be respectively arranged in
On two opposite side of bridge leg layer, the bridge leg layer, heat-sensitive layer, upper anchor post, mooring post are electrically connected.
Preferably, two mooring posts are distributed in two diagonal angles of bridge leg layer.
Preferably, described two upper anchor posts are distributed in the both sides of the bisector of two opposite side of the bridge leg layer.
Preferably, the bridge leg layer includes non-touching two bridge legs, and the bridge leg is multiple tortuous in the horizontal direction
The first end of structure, described two bridge legs is separately connected a mooring post, and second end is separately connected a upper anchor post；
First electricity input terminal of the first end of one of bridge leg as bridge leg layer, second end as bridge leg layer first
Electricity output end；Second electricity input terminal of the second end of another bridge leg as bridge leg layer, first end as bridge leg layer
Two electricity output ends.
Preferably, the multiple tortuous structure is " bow " font.
According to another aspect of the present invention, a kind of latticed array being made of multiple micro-bridge structures is provided
Micro-bridge structure array, in the micro-bridge structure array, each micro-bridge structure is micro- with the adjacent mooring post of diagonally forward or rear ramp
Bridge structure shares mooring post, and the upper anchor post of front and back two adjacent micro-bridge structures is mutually interspersed not to be contacted.
Preferably, the upper anchor post between micro-bridge structure described in adjacent rows, mooring post in the upright projection on substrate same
On straight line.
Preferably, between the upper anchor post between micro-bridge structure described in adjacent rows, the upright projection of mooring post on substrate etc.
Away from.
Other side according to the invention provides a kind of micro-metering bolometer, including the micro-bridge structure or microbridge
Array of structures.
In general, it can obtain down the above technical solutions conceived by the present invention are compared with the prior art,
Row advantageous effect.
1, bridge leg layer and heat-sensitive layer point upper layer and lower layer are arranged, increases the infrared absorption area of heat-sensitive layer, expands bridge
Upper anchor post, mooring post are arranged in the edge of bridge leg layer by the arrangement space of leg layer to eliminate thermal conductivity, improve microbridge knot
The planarization of structure reduces 1/f noise, improves the performance of bolometer.
2, two mooring posts are distributed in two diagonal angles of bridge leg layer, utmostly widened two mooring posts away from
From keeping the intermediate region of bridge leg layer opposed flattened, arrange upper anchor post on this basis, the planarization of heat-sensitive layer can be improved.
3, two upper anchor posts are distributed in the both sides of the bisector of two opposite side of bridge leg layer, can pull open two upper anchor posts away from
From the distance that is, dispersion heat-sensitive layer upper surface is recessed keeps temperature-sensitive layer surface more smooth.
The property that row gates when 4, being worked using micro-bridge structure array, i.e. adjacent rows do not work at the same time, mooring post are arranged
It can be shared by the micro-bridge structure of two adjacent rows at diagonal line, further save encapsulated space, and upper and lower anchor post is on substrate
Be projected on same straight line, can be improved the uniformity of micro-bridge structure array, and then improve the performance of micro-metering bolometer.
5, it realizes being electrically connected for bridge leg layer and heat-sensitive layer using upper anchor post, bridge leg layer and substrate is realized using mooring post
It is electrically connected so that anchor post can also play the role of conducting wire while as support construction, increase its electrical functions.
6, by the multiple tortuous arrangement of bridge leg, increase its length to reduce thermal conductivity, two tortuous structures of " bow " font make
Mooring post can also be distributed in the both sides of bridge leg layer, help to improve the stability of micro-bridge structure and the flatness of device.
7, using the abundant bridge leg structure alternative semiconductors refrigerator for eliminating thermal conductivity, reduce overall package area, reduce micro-
The cost of bolometer.
Description of the drawings
Fig. 1 is micro-bridge structure schematic diagram；
Fig. 2 is micro-bridge structure array vertical view；
Fig. 3 is the upper anchor post arrangement schematic diagram of micro-bridge structure array.
In all the appended drawings, identical reference numeral is used for indicating identical element or structure, wherein：
1- heat-sensitive layers, the first mooring posts of 2-1-, the second mooring posts of 2-2-, anchor post on 3-1- first, anchor post on 3-2- second,
4- bridge leg layers.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.In addition, institute in the various embodiments of the present invention described below
The technical characteristic being related to can be combined with each other as long as they do not conflict with each other.
Such as Fig. 1, according to one embodiment of the utility model, the micro-bridge structure battle array on a kind of reading circuit substrate is provided
Row, include the micro-bridge structure of multiple latticed arrays, the micro-bridge structure includes under heat-sensitive layer 1, the first mooring post 3-1, second
Anchor post 3-2, bridge leg layer 4, the first mooring post 2-1, the second mooring post 2-2, the heat-sensitive layer 1 pass through the first mooring post 3-1, second
Mooring post 3-2 is supported in the top of the bridge leg layer 4, and the bridge leg layer 4 passes through the first mooring post 2-1, the second mooring post 2-2 branch
It supports in the top of reading circuit substrate, the bridge leg layer 4, heat-sensitive layer 1 are rectangle, and the first mooring post 2-1, second are casted anchor
Column 2-2 is respectively arranged at two diagonal angles of bridge leg layer 4, and the first mooring post 3-1, the second mooring post 3-2 are respectively arranged at
The both sides of the bisector of two opposite side of the bridge leg layer 4, the bridge leg layer 4 include left bridge leg, right bridge leg side by side, the left side
Bridge leg, right bridge leg all have first end and second end, and first end " bow " font is tortuous to second end formation bridge leg, described
The initiating terminal and terminal of " bow " font are respectively the first end and second end of the bridge leg, the first end of left bridge leg connection the
One mooring post 2-1, second end connect the first mooring post 3-1, second end connection the second mooring post 3-2 of the right bridge leg, and first
The second mooring post 2-2 of end connection；
First electricity input terminal of the first end of the left bridge leg as bridge leg layer 4, second end as bridge leg layer 4 first
Electricity output end；Second electricity input terminal of the second end of right bridge leg as bridge leg layer 4, first end as bridge leg layer 4 second
Electricity output end.
As shown in Fig. 2, in micro-bridge structure array, the upper anchor post of front and back two adjacent micro-bridge structures, which is staggeredly arranged, not to be connect
It touches, heat transfer can be prevented.
As shown in figure 3, the mooring post due to the micro-bridge structure is located at the diagonal angle of bridge leg layer 4, so in micro-bridge structure
In array, each micro-bridge structure can share mooring post with the micro-bridge structure of the adjacent mooring post of diagonally forward or rear ramp；
The upper anchor post of micro-bridge structure homonymy described in any row, mooring post in the upright projection on substrate point-blank,
And spacing is equal, this structure is conducive to improve the uniformity of micro-bridge structure array.
As it will be easily appreciated by one skilled in the art that the above is only the preferred embodiment of the utility model only, not
To limit the utility model, any modification made within the spirit and principle of the present invention, equivalent replacement and change
Into etc., it should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of micro-bridge structure includes bridge leg layer, the heat-sensitive layer of rectangle from the bottom to top, which is characterized in that further include two vertical
The upper anchor post being arranged and two vertically disposed mooring posts, the mooring post are supported in the lower section of bridge leg layer, the upper anchor post
It is supported between the heat-sensitive layer and the bridge leg layer, two mooring posts are arranged in the edge of bridge leg layer, two upper anchors
Column is respectively arranged on two opposite side of bridge leg layer, and the bridge leg layer, heat-sensitive layer, upper anchor post, mooring post are electrically connected.
2. micro-bridge structure as described in claim 1, which is characterized in that two mooring posts be distributed in bridge leg layer two are right
At angle.
3. micro-bridge structure as claimed in claim 2, which is characterized in that described two upper anchor posts are distributed in the two of the bridge leg layer
The both sides of the bisector of opposite side.
4. micro-bridge structure as claimed in claim 3, which is characterized in that the bridge leg layer includes non-touching two bridge legs,
The bridge leg is multiple tortuous structure in the horizontal direction, and the first ends of described two bridge legs is separately connected a mooring post, second
End is separately connected a upper anchor post；
First electricity input terminal of the first end of one of bridge leg as bridge leg layer, first electricity of the second end as bridge leg layer
Output end；Second electricity input terminal of the second end of another bridge leg as bridge leg layer, second electricity of the first end as bridge leg layer
Learn output end.
5. micro-bridge structure as claimed in claim 4, which is characterized in that the multiple tortuous structure is " bow " font.
6. a kind of micro-bridge structure array includes the microbridge knot as described in any one of claim 1-5 of multiple latticed arrays
Structure.
7. micro-bridge structure array as claimed in claim 6, which is characterized in that each micro-bridge structure and diagonally forward or rear ramp
The micro-bridge structure of adjacent mooring post shares mooring post.
8. micro-bridge structure array as claimed in claim 7, which is characterized in that the upper anchor between micro-bridge structure described in adjacent rows
Column, mooring post are in being projected on same straight line on substrate.
9. a kind of micro-bridge structure array as claimed in claim 8, which is characterized in that between micro-bridge structure described in adjacent rows
The projection of upper anchor post, mooring post on substrate is equidistant.
10. a kind of micro-metering bolometer, which is characterized in that include the micro-bridge structure as described in any one of claim 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721866262.1U CN207881844U (en) | 2017-12-27 | 2017-12-27 | A kind of micro-bridge structure array and micro-metering bolometer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721866262.1U CN207881844U (en) | 2017-12-27 | 2017-12-27 | A kind of micro-bridge structure array and micro-metering bolometer |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110940419A (en) * | 2019-08-30 | 2020-03-31 | 上海集成电路研发中心有限公司 | Infrared detector and preparation method thereof |
| CN114112058A (en) * | 2021-11-19 | 2022-03-01 | 深圳迈塔兰斯科技有限公司 | Microbridge structure and preparation method thereof |
| CN114485951A (en) * | 2022-01-13 | 2022-05-13 | 北京安酷智芯科技有限公司 | Plane image sensor |
-
2017
- 2017-12-27 CN CN201721866262.1U patent/CN207881844U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110940419A (en) * | 2019-08-30 | 2020-03-31 | 上海集成电路研发中心有限公司 | Infrared detector and preparation method thereof |
| CN110940419B (en) * | 2019-08-30 | 2021-04-30 | 上海集成电路研发中心有限公司 | Infrared detector and preparation method thereof |
| CN114112058A (en) * | 2021-11-19 | 2022-03-01 | 深圳迈塔兰斯科技有限公司 | Microbridge structure and preparation method thereof |
| CN114112058B (en) * | 2021-11-19 | 2024-05-14 | 深圳迈塔兰斯科技有限公司 | Microbridge structure and preparation method thereof |
| CN114485951A (en) * | 2022-01-13 | 2022-05-13 | 北京安酷智芯科技有限公司 | Plane image sensor |
| CN114485951B (en) * | 2022-01-13 | 2024-01-30 | 北京安酷智芯科技有限公司 | Planar image sensor |
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