CN205873891U - Microbridge structure and micro -bolometer - Google Patents
Microbridge structure and micro -bolometer Download PDFInfo
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- CN205873891U CN205873891U CN201620669579.5U CN201620669579U CN205873891U CN 205873891 U CN205873891 U CN 205873891U CN 201620669579 U CN201620669579 U CN 201620669579U CN 205873891 U CN205873891 U CN 205873891U
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Abstract
The utility model relates to a bolometer provides a microbridge structure, include the substrate and be located bridge leg layer on the substrate, bridge leg layer through two first anchor posts support in on the substrate, still including being located bridge floor heat -sink shell directly over the bridge leg layer, the bridge floor heat -sink shell through at least one second anchor post support in on the bridge leg layer, seted up on the bridge floor heat -sink shell and run through a plurality of diffraction windows of bridge floor heat -sink shell, each the size of diffraction window is less than the wavelength of light wave, still provide a micro -bolometer, including above -mentioned microbridge structure. The utility model discloses an in the microbridge structure, be provided with the bridge floor heat -sink shell on the bridge leg layer, can improve infrared absorptivity greatly, and still seted up a plurality of diffraction windows on the bridge floor heat -sink shell, infraredly produce the diffraction phenomena in each diffraction window department, and then can shorten the micro -bolometer's that the microbridge structure corresponds thermal response time.
Description
Technical field
This utility model relates to bolometer, particularly relates to a kind of micro-bridge structure and micro-metering bolometer.
Background technology
Micro-metering bolometer is typically the photosensitive unit of resistive, after infra-red radiation incides photosensitive unit, the temperature of light-sensitive material
Degree raise, cause light-sensitive material resistance to change so that outer treatment circuit can detect corresponding resistor change cause
Weak current change, thus reach the purpose of infrared acquisition.And use the infrared imaging system that uncooled IRFPA detector technology realizes
System then has less size, more low-power consumption and the longer persistent period.Its mainly by infra-red radiation make heat insulation and
The variations in temperature of suspension bridge sensitive sensing material increases, and owing to the temperature-coefficient of electrical resistance i.e. resistance of sensitive material itself is with temperature
Relative variation, and then cause the resistance of sensitive material to change.The detector sensitivity of this structure depends on micro-
Bridge construction effect, reading circuit be thermally isolated with the performance of thermo-sensitive material, and the microbridge of the micro-metering bolometer of moment detector
Structure uses single layer structure form, and its thermal response time is long, affects serviceability.
Utility model content
The purpose of this utility model is to provide a kind of micro-bridge structure, it is intended to is used for solving existing detector and uses monolayer
The problem that the thermal response time of structure is longer.
This utility model is achieved in that
This utility model embodiment provides a kind of micro-bridge structure, including substrate and the bridge lower limb layer that is positioned on described substrate,
Described bridge lower limb layer is supported on described substrate by two first anchor posts, also includes that being positioned at the bridge floor directly over described bridge lower limb layer inhales
Thermosphere, described bridge floor heat-sink shell is supported on described bridge lower limb layer by least second anchor post, described bridge floor heat-sink shell is opened
It is provided with the some diffraction windows running through described bridge floor heat-sink shell, the wavelength being smaller in size than light wave of each described diffraction window.
Further, each described second anchor post is hollow structure along its length, and each described second anchor post all passes through
Wear described bridge floor heat-sink shell.
Further, the surrounding of each described second anchor post is all equipped with some described diffraction windows.
Further, the bore of each described diffraction window is 1um-1.5um, and between adjacent two described diffraction windows
Distance be 0.5um-1um.
Further, described second anchor post is two, bridge floor heat-sink shell described in two described second anchor post diagonal struts;Or
Second anchor post described in person is four, and each described second anchor post encloses bridge floor heat-sink shell described in formation quadrate support.
Further, form resonator cavity between described substrate and described bridge lower limb layer, be provided with in described resonator cavity and be positioned at institute
State the reflecting layer on substrate, described reflecting layer just lower surface to described bridge lower limb layer.
Further, the height of described resonator cavity is between 1um-2.5um.
Further, described bridge lower limb layer includes first anchor post described with two is connected respectively two bridge lower limbs and is positioned at two
The heat-sensitive material layer being connected between individual described bridge lower limb and with both of which, two described bridge lower limbs are and repeatedly fold formation, described
Second anchor post is supported on described heat-sensitive material layer.
This utility model embodiment also provides for a kind of micro-metering bolometer, including control chip, also includes that above-mentioned microbridge is tied
Structure, described substrate attaching is on described control chip.
This utility model has the advantages that
In micro-bridge structure of the present utility model, bridge lower limb layer is additionally provided with bridge floor heat-sink shell, and uses the second anchor post to prop up
Support, this micro-bridge structure is formed bilayer version, bridge floor heat-sink shell can efficient absorption infra-red radiation, the heat warp of absorption
Second anchor post is transferred to bridge lower limb layer, then is transferred on substrate through bridge lower limb layer, and ir-absorbance is the highest, additionally at bridge floor heat-sink shell
On be further opened with some diffraction windows, the wavelength being smaller in size than light wave of diffraction window, bridge floor absorbed layer absorb infrared spoke
When penetrating, infra-red radiation can play diffracting effect at each diffraction window, not only with enhanced highpass filtering rate, and can be able to contract
The thermal response time of short micro-bridge structure correspondence detector.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, the accompanying drawing in describing below is only
It is embodiments more of the present utility model, for those of ordinary skill in the art, in the premise not paying creative work
Under, it is also possible to other accompanying drawing is obtained according to these accompanying drawings.
The structural representation of the micro-bridge structure that Fig. 1 provides for this utility model embodiment;
Fig. 2 is the front view of the micro-bridge structure of Fig. 1;
Fig. 3 is the top view of the micro-bridge structure of Fig. 1;
Fig. 4 is the structural representation of the bridge floor heat-sink shell of the micro-bridge structure of Fig. 1.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not under making creative work premise
The all other embodiments obtained, broadly fall into the scope of this utility model protection.
Seeing Fig. 1-Fig. 3, this utility model embodiment provides a kind of micro-bridge structure, is used for absorbing infra-red radiation, including lining
The end 1 and bridge lower limb layer 2, substrate 1 is fabric, and bridge lower limb layer 2 is supported on substrate 1 by two first anchor posts 3, substrate 1, bridge
Lower limb layer 2 and the first anchor post 3 are electrical equipment, and the first anchor post 3 not only can play the effect of support bridge lower limb layer 2, but also
Electrically conduct bridge lower limb layer 2 and substrate 1, and bridge lower limb layer 2 is equivalent to resistive element, two the most corresponding resistive elements of first anchor post 3
Two ends, micro-bridge structure also includes bridge floor heat-sink shell 4, and this bridge floor heat-sink shell 4 is positioned at the surface of bridge lower limb layer 2, and it leads to
Crossing at least second anchor post 5 to be supported on bridge lower limb layer 2, bridge floor heat-sink shell 4 is the absorption infra-red radiation unit that micro-bridge structure is main
Part, and the heat of absorption is transferred to bridge lower limb layer 2 by the second anchor post 5, bridge floor heat-sink shell 4 offers some diffraction windows
41, at each equal shop of diffraction window 41, bridge floor heat-sink shell 4 and its size are less than the wavelength of infrared light-wave.In the present embodiment,
Have additional bridge floor heat-sink shell 4 on the basis of traditional axle lower limb layer 2 so that micro-bridge structure is double-decker, can effectively increase microbridge
The endotherm area of structure, and then the ir-absorbance of micro-bridge structure can be improved, and on the other hand, bridge floor heat-sink shell 4 is opened
Being provided with some diffraction windows 41, and the wavelength being smaller in size than infrared waves of each diffraction window 41, it is so that each spread out
Penetrating and can produce diffraction at window 41, diffraction window 41 not only will not reduce the ir-absorbance of bridge floor heat-sink shell 4, and
The heat that infra-red radiation is produced transmits to the surrounding of this diffraction window 41 when through diffraction window 41, can be with accelerated heat
Collect transmission to the second anchor post 5, and then the thermal response time of micro-bridge structure correspondence detector can be greatly reduced.
Seeing Fig. 1 and Fig. 4, optimize above-described embodiment, each second anchor post 5 is hollow structure along its length, and
Each second anchor post 5 all runs through bridge floor heat-sink shell 4.In the present embodiment, it is respectively provided with at corresponding each second anchor post 5 of bridge floor heat-sink shell 4
Perforate 42, the second anchor post 5 stretches in the perforate 42 of correspondence, and the hollow structure of the second anchor post 5 connects with the upper surface of bridge floor heat-sink shell 4
Logical, can be directly through on the second anchor post 5 to bridge lower limb layer 2 to this infra-red radiation, it can strengthen the INFRARED ABSORPTION of micro-bridge structure
Rate, in still further aspect, owing to the second anchor post 5 uses hollow structure, the small volume of conduction of heat, and then can reduce corresponding biography
The thermal response time of sensor.Position relationship for the second anchor post 5 with diffraction window 41, it is common that right at each second anchor post 5
The surrounding of the perforate 42 answered is additionally provided with some diffraction windows 41, the most each second anchor post 5 should between multiple diffraction windows 41,
To this when each diffraction window 41 is when occurring diffraction, and infra-red radiation detours to the surrounding of this diffraction window 41, and then can make
The infra-red radiation obtaining multiple diffraction windows 41 all can converge to, at the second anchor post 5 of correspondence, accelerate heat transfer effect, can enter one
Step reduces the thermal response time of corresponding detector.
Seeing Fig. 3 and Fig. 4, further, the bore of each diffraction window 41 is 1um-1.5um, and adjacent two are spread out
Penetrating the distance between window 41 is 0.5um-1um.In the present embodiment, the Infrared wavelength of absorption is generally 8-14um, by diffraction
The bore of window 41 is designed as 1um-1.5um so that diffraction window 41 is the least relative to Infrared wavelength, and infrared ray is close
Then can produce diffraction effect during diffraction window 41, infra-red radiation will not pass through each diffraction window 41, thus it is existing both to have produced diffraction
As, shorten thermal response time, and can ensure that the ir-absorbance of bridge floor heat-sink shell 4.For adjacent two diffraction windows 41 it
Between distance, be set between 0.5um-1um so that each diffraction window 41 forms preferably distribution at bridge floor heat-sink shell 4,
Thermal response time narrows down to maximization, and otherwise spacing is too small so that each diffraction window 41 is difficult to be formed effective diffraction, and
Spacing is excessive, limits the distribution number of diffraction window 41, it is difficult to play effective effect.
See Fig. 3, further, when the second anchor post 5 is one, then the second anchor post 5 is arranged at bridge floor heat-sink shell 4
Centre position, to ensure the stability of supporting construction, and when the second anchor post 5 is two, then two second anchor posts 5 are inhaled along bridge floor
The diagonal angle of thermosphere 4 is arranged, and by diagonal strut bridge floor heat-sink shell 4, and in prioritization scheme, the second anchor post 5 should be four, and each the
Two anchor posts 5 enclose formation quadrate support bridge floor heat-sink shell 4, are not only able to ensure the stability of structure, can also make every simultaneously
One second anchor post 5 is corresponding with multiple diffraction windows 41, reduces the thermal response time of detector.
See Fig. 1, further, between substrate 1 and bridge lower limb layer 2, be formed with resonator cavity 6, be provided with anti-in this resonator cavity 6
Penetrating layer 61, reflecting layer 61 is positioned on substrate 1 and just lower surface to bridge lower limb layer 2.In this utility model, bridge floor heat-sink shell 4 passes through
Second anchor post 5 transfers heat on bridge lower limb layer 2, and bridge lower limb layer 2 is then transferred heat on substrate 1 by the first anchor post 3, and
Being provided with reflecting layer 61 in the present embodiment in resonator cavity 6, it can reflect the heat of bridge lower limb layer 2 lower surface, and then accelerates bridge
The heat of lower limb layer 2 lower surface transmits to the first anchor post 3, can play the thermal response time optimizing detector, usual resonator cavity 6
Height is between 1um-2.5um, and it can ensure that the absorbance of heat is reflected in reflecting layer 61 by bridge lower limb layer 2.And bridge lower limb layer 2 and bridge
Distance between face heat-sink shell 4, effectively can select according to the difference of micro-bridge structure application scenario, when required thermal response
Time in short-term, then can control this distance size less, otherwise can select bigger distance size.
Seeing Fig. 1 and Fig. 2, the structure of refinement bridge lower limb layer 2, bridge lower limb layer 2 includes two bridge lower limbs 21 and a temperature-sensitive
Sense material layer 22, two bridge lower limbs 21 and two first anchor post 3 one_to_one corresponding, all use the version of horizontal buckling, its one end
Connecting with the first corresponding anchor post 3, the other end is then connected to heat-sensitive material layer 22, the corresponding bridge lower limb layer of heat-sensitive material layer 22
The centre position of 2, and the most right with bridge floor heat-sink shell 4 and reflecting layer 61, the second anchor post 5 is all installed in heat-sensitive material layer 22
On, the heat that bridge floor heat-sink shell 4 absorbs is transferred on heat-sensitive material layer 22 through the second anchor post 5, heat-sensitive material layer 22 temperature
Raise, and then the resistance variations of bridge lower limb layer 2 can be caused, reach the purpose of infrared acquisition.Heat-sensitive material layer 22 uses oxidation
Vanadium, non-crystalline silicon, polycrystalline silicon germanium (poly-SiGe), prepared by yttrium barium copper oxide and metallic film etc..
Referring again to Fig. 1, this utility model embodiment also provides for a kind of micro-metering bolometer, including control chip (in figure
Not shown) and above-mentioned micro-bridge structure, the substrate 1 of micro-bridge structure is fitted on control chip.This utility model embodiment
In, above-mentioned micro-bridge structure is applied on micro-metering bolometer, also should electrically connect between substrate 1 and control chip, and then make
Obtain micro-metering bolometer and there is infrared acquisition function, additionally, due to the micro-bridge structure of this structure of employing, not only microbolometer heat
The ir-absorbance of meter is high, and thermal response time is the shortest, and the performance of micro-metering bolometer is effectively ensured.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all at this
Within the spirit of utility model and principle, any modification, equivalent substitution and improvement etc. made, should be included in this utility model
Protection domain within.
Claims (9)
1. a micro-bridge structure, including substrate and the bridge lower limb layer that is positioned on described substrate, described bridge lower limb layer passes through two first
Anchor post is supported on described substrate, it is characterised in that: also include being positioned at the bridge floor heat-sink shell directly over described bridge lower limb layer, described bridge
Face heat-sink shell is supported on described bridge lower limb layer by least second anchor post, described bridge floor heat-sink shell offers and runs through described
Some diffraction windows of bridge floor heat-sink shell, the wavelength being smaller in size than light wave of each described diffraction window.
2. micro-bridge structure as claimed in claim 1, it is characterised in that: each described second anchor post is hollow along its length
Structure, and each described second anchor post all runs through described bridge floor heat-sink shell.
3. micro-bridge structure as claimed in claim 2, it is characterised in that: the surrounding of each described second anchor post is all equipped with some
Described diffraction window.
4. micro-bridge structure as claimed in claim 1, it is characterised in that: the bore of each described diffraction window is 1um-1.5um,
And the distance between adjacent two described diffraction windows is 0.5um-1um.
5. micro-bridge structure as claimed in claim 1, it is characterised in that: described second anchor post is two, two described second anchors
Bridge floor heat-sink shell described in post diagonal strut;Or described second anchor post is four, each described second anchor post encloses square of formation
Support described bridge floor heat-sink shell.
6. micro-bridge structure as claimed in claim 1, it is characterised in that: form resonance between described substrate and described bridge lower limb layer
Chamber, is provided with the reflecting layer being positioned on described substrate in described resonator cavity, described reflecting layer just lower surface to described bridge lower limb layer.
7. micro-bridge structure as claimed in claim 6, it is characterised in that: the height of described resonator cavity is between 1um-2.5um.
8. micro-bridge structure as claimed in claim 1, it is characterised in that: described bridge lower limb layer includes first anchor described with two respectively
Two bridge lower limbs that post connects and the heat-sensitive material layer being connected between two described bridge lower limbs and with both of which, described in two
Bridge lower limb is and repeatedly folds formation, and described second anchor post is supported on described heat-sensitive material layer.
9. a micro-metering bolometer, including control chip, it is characterised in that: also include as described in any one of claim 1-8
Micro-bridge structure, described substrate attaching is on described control chip.
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Cited By (6)
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CN110108367A (en) * | 2019-05-22 | 2019-08-09 | 电子科技大学 | A kind of more bridge pier micro-bridge structures of bilayer and micro-metering bolometer |
CN113390513A (en) * | 2021-06-11 | 2021-09-14 | 哈尔滨工业大学 | Three-layer pixel structure of micro-bolometer |
CN113447149A (en) * | 2021-06-25 | 2021-09-28 | 北京北方高业科技有限公司 | Infrared microbridge structure and infrared detector |
CN114112058A (en) * | 2021-11-19 | 2022-03-01 | 深圳迈塔兰斯科技有限公司 | Microbridge structure and preparation method thereof |
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CN115403004A (en) * | 2022-09-28 | 2022-11-29 | 武汉高芯科技有限公司 | Infrared detector and preparation method thereof |
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2016
- 2016-06-29 CN CN201620669579.5U patent/CN205873891U/en active Active
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110108367A (en) * | 2019-05-22 | 2019-08-09 | 电子科技大学 | A kind of more bridge pier micro-bridge structures of bilayer and micro-metering bolometer |
CN113390513A (en) * | 2021-06-11 | 2021-09-14 | 哈尔滨工业大学 | Three-layer pixel structure of micro-bolometer |
CN113390513B (en) * | 2021-06-11 | 2022-10-25 | 哈尔滨工业大学 | Three-layer pixel structure of micro bolometer |
CN113447149A (en) * | 2021-06-25 | 2021-09-28 | 北京北方高业科技有限公司 | Infrared microbridge structure and infrared detector |
CN114112058A (en) * | 2021-11-19 | 2022-03-01 | 深圳迈塔兰斯科技有限公司 | Microbridge structure and preparation method thereof |
CN114112058B (en) * | 2021-11-19 | 2024-05-14 | 深圳迈塔兰斯科技有限公司 | Microbridge structure and preparation method thereof |
CN114485950A (en) * | 2021-12-07 | 2022-05-13 | 北京安酷智芯科技有限公司 | Plane image sensor |
CN115403004A (en) * | 2022-09-28 | 2022-11-29 | 武汉高芯科技有限公司 | Infrared detector and preparation method thereof |
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