CN207502917U - 显影液的浓度管理装置以及基板的显影处理*** - Google Patents

显影液的浓度管理装置以及基板的显影处理*** Download PDF

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Publication number
CN207502917U
CN207502917U CN201721635816.7U CN201721635816U CN207502917U CN 207502917 U CN207502917 U CN 207502917U CN 201721635816 U CN201721635816 U CN 201721635816U CN 207502917 U CN207502917 U CN 207502917U
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CN
China
Prior art keywords
developer solution
concentration
substrate
liquid
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721635816.7U
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English (en)
Chinese (zh)
Inventor
中川俊元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hirama Rika Kenkyusho Ltd
Hirama Laboratories Co Ltd
Original Assignee
Hirama Rika Kenkyusho Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirama Rika Kenkyusho Ltd filed Critical Hirama Rika Kenkyusho Ltd
Application granted granted Critical
Publication of CN207502917U publication Critical patent/CN207502917U/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/002—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using materials containing microcapsules; Preparing or processing such materials, e.g. by pressure; Devices or apparatus specially designed therefor
    • G03F7/0022—Devices or apparatus
    • G03F7/0025—Devices or apparatus characterised by means for coating the developer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3071—Process control means, e.g. for replenishing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
CN201721635816.7U 2017-05-26 2017-11-29 显影液的浓度管理装置以及基板的显影处理*** Expired - Fee Related CN207502917U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-104624 2017-05-26
JP2017104624A JP2018200943A (ja) 2017-05-26 2017-05-26 現像液の濃度管理装置、及び、基板の現像処理システム

Publications (1)

Publication Number Publication Date
CN207502917U true CN207502917U (zh) 2018-06-15

Family

ID=62507006

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201721635816.7U Expired - Fee Related CN207502917U (zh) 2017-05-26 2017-11-29 显影液的浓度管理装置以及基板的显影处理***
CN201711234540.6A Pending CN108957967A (zh) 2017-05-26 2017-11-29 显影液的浓度管理装置以及基板的显影处理***

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201711234540.6A Pending CN108957967A (zh) 2017-05-26 2017-11-29 显影液的浓度管理装置以及基板的显影处理***

Country Status (4)

Country Link
JP (1) JP2018200943A (ja)
KR (1) KR20180129601A (ja)
CN (2) CN207502917U (ja)
TW (2) TW201901310A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102541033B1 (ko) * 2022-11-28 2023-06-13 프로티앤에스(주) 사용자 직책 및 업무 기반 pc 권한 제어 장치 및 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3975333B2 (ja) * 2002-03-29 2007-09-12 セイコーエプソン株式会社 処理装置および半導体装置の製造方法
JP3972015B2 (ja) * 2003-04-11 2007-09-05 シャープ株式会社 薬液装置
JP5165185B2 (ja) * 2005-02-15 2013-03-21 大日本スクリーン製造株式会社 基板処理システムおよび基板処理装置
JP6505534B2 (ja) * 2015-07-22 2019-04-24 株式会社平間理化研究所 現像液の管理方法及び装置
JP6713658B2 (ja) * 2015-07-22 2020-06-24 株式会社平間理化研究所 現像液の成分濃度測定装置、成分濃度測定方法、現像液管理装置、及び現像液管理方法
JP6721157B2 (ja) * 2015-07-22 2020-07-08 株式会社平間理化研究所 現像液の成分濃度測定方法及び装置、並びに、現像液管理方法及び装置

Also Published As

Publication number Publication date
KR20180129601A (ko) 2018-12-05
JP2018200943A (ja) 2018-12-20
TW201901310A (zh) 2019-01-01
CN108957967A (zh) 2018-12-07
TWM560040U (zh) 2018-05-11

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180615

Termination date: 20201129