CN209418493U - A kind of lead frame - Google Patents
A kind of lead frame Download PDFInfo
- Publication number
- CN209418493U CN209418493U CN201920029874.8U CN201920029874U CN209418493U CN 209418493 U CN209418493 U CN 209418493U CN 201920029874 U CN201920029874 U CN 201920029874U CN 209418493 U CN209418493 U CN 209418493U
- Authority
- CN
- China
- Prior art keywords
- lead frame
- ring
- hole
- chip seat
- pitman
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a kind of lead frame, the lead frame includes chip seat, for bearing wafer, the position of the chip seat is located at bottom surface, and the upper surface of described chip seat encloses the ring equipped with one, for beating ground connection bonding wire, the circuit that chip domestic demand is grounded is drawn, and described ground ring is connect with chip seat by pitman, the pitman and the ground angled setting of ring, described ground ring is equipped with a plastic packaging through-hole, and the chip seat is provided with the resin being set in plastic packaging through-hole with ground ring and is attached.The plastic packaging through-hole is resist delamination through-hole, and thermosetting resin can flow through resist delamination through-hole ring over the ground, and ring plays the role of rivet over the ground.Delamination problems caused by concentrating which solves ground ring and chip seat junction stress avoid the risk of delamination at ground ring, promote the reliability of lead frame class wrapper product effectively.
Description
Technical field
The utility model relates to a kind of lead frames, belong to technical field of semiconductor encapsulation.
Background technique
Chip carrier of the lead frame as integrated circuit is that one kind is drawn by means of bonding material realization chip internal circuits
The electrical connection of outlet and outer lead forms the key structure part of electric loop.Her gas has arrived the bridge connected with outer lead
It acts on, requires to be basic material important in electronics and information industry using lead frame in most semiconductor integrated blocks
Material.
Existing more high-end lead frame E-PAD LQFP(Exposed Pad Low Profile Quad Flat
Pack, exposed wafer seat low profile quad-flat package) product, because its solderable line number is more, the advantages that perfect heat-dissipating, is widely used
In consumer electronics product.Because of lead frame ring and ground ring and chip seat pitman are all silver-plated, and the combination of silver and resin
Power is poor, the design that ring sinks in addition and chip seat is exposed, concentrates ground ring and chip seat junction stress obvious, therefore the position
It sets and is easy to happen delamination with resin, in turn result in the increase of packaging body security risk.Therefore ground ring position can be prevented by studying one kind
The lead frame of delamination just becomes urgent problem to be solved.
Utility model content
The purpose of this utility model is exactly to propose a kind of lead frame to solve the above-mentioned problems in the prior art
Frame.
The purpose of this utility model will be realized through the following technical scheme: a kind of lead frame, including chip seat, use
In bearing wafer, the position of the chip seat is located at bottom surface, and the upper surface of described chip seat encloses the ring equipped with one, for playing ground connection weldering
Line, the circuit that chip domestic demand is grounded are drawn, and described ground ring is connect with chip seat by pitman, and the pitman has with ground ring
Angle setting, described ground ring are equipped with a plastic packaging through-hole, and the chip seat and ground ring are provided with and are set in plastic packaging through-hole
Resin be attached.
Preferably, the plastic packaging through-hole is resist delamination through-hole.
Preferably, the angle of the pitman and ground ring is 0 ~ 60 °.
Preferably, a lead foot is additionally provided on the lead frame, the lead foot is to beat bonding wire, is used for inner wafer circuit
It draws, the position of the lead foot is located at top surface.
Preferably, the lead frame further includes a support stick, is used to support ground ring and chip seat, the position of described ground ring
Higher than chip seat, it is located at middle part, the support stick is for connecting bottom surface and middle part.
Preferably, the support stick includes the first bending section and the second bending section, and the first bending section has with the second bending section
Angle setting, the angle is less than 90 degree.
Preferably, the surface of described ground ring and pitman is coated with electroplated layer, and the electroplated layer is silver.
Preferably, pitman, the position of the plastic packaging through-hole and the position phase of pitman have been uniformly arranged on described ground ring
Corresponding, the quantity in the plastic packaging hole and the quantity of pitman match.
The advantages of technical solutions of the utility model, is mainly reflected in: which solves ground ring and chip seat junction in response to
Delamination problems caused by power is concentrated.The lead frame enables resin can be by resist delamination through-hole, and then resin is enable to pass through ground
Ring coats the position of details E, generates a kind of confrontation of rivet effect and weakens the stress of the position and concentrates, thus reduce and
The risk for avoiding delamination at ground ring, promotes the reliability of lead frame class wrapper product effectively.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of lead frame of the utility model.
Fig. 2 is the lead frame chip seat of the utility model and the structural schematic diagram of ground loop section.
Fig. 3 is a kind of C-C of lead frame of the utility model'Structural schematic diagram.
Fig. 4 is the enlarged structure schematic diagram of the resist delamination throughhole portions details E of the utility model.
Fig. 5 is a kind of D-D of lead frame of the utility model'Structural schematic diagram.
Fig. 6 is the schematic diagram for preventing ground ring position delamination of the utility model.
Specific embodiment
The purpose of this utility model, advantage and feature will carry out figure by the non-limitative illustration of preferred embodiment below
Show and explains.These embodiments are only the prominent examples using technical solutions of the utility model, all to take equivalent replacement or wait
Effect transformation and formed technical solution, all fall within the requires of the utility model protection within the scope of.
The utility model discloses a kind of lead frame, and as depicted in figs. 1 and 2, which includes chip seat 1, uses
In bearing wafer, the position of the chip seat 1 is located at bottom surface, and the upper surface of described chip seat encloses ring 2 equipped with one, for beating ground connection
Bonding wire, the circuit that chip domestic demand is grounded are drawn.
As shown in Figure 3 and Figure 4, described ground ring 2 is connect with chip seat 1 by pitman 3, and the pitman 3 has with ground ring 2
Angle setting.Pitman 3 is uniformly arranged on described ground ring, the position of the plastic packaging through-hole 4 is opposite with the position of pitman 3
It answers, the quantity in the plastic packaging hole and the quantity of pitman match.Each pitman corresponds respectively to plastic packaging through-hole, connection
The position of stick is corresponding to be arranged plastic packaging through-hole on ground ring, it is therefore an objective to which allowing thermosetting resin by plastic packaging through-hole, ring plays rivet over the ground
Effect, resistance resin with ground interannular due to thermal expansion coefficient it is different caused by stress, thus reduce resin with interannular delamination
Risk.
The chip seat 1 is square structure or rectangle structure, at least provided with two on each side of square
A pitman is symmetrical arranged between two neighboring pitman.The shape of the chip seat and the number of pitman specifically see chip
The size of seat, but considering for the balance of power, pitman are generally uniformly distributed.
As shown in figure 4, described ground ring is equipped with a plastic packaging through-hole 4, the chip seat 1 is provided with setting with ground ring 2
Resin 7 in plastic packaging through-hole is attached, i.e., the resin for connecting ground loop Yu chip seat is provided in the described plastic packaging through-hole.
The plastic packaging through-hole 4 is resist delamination through-hole, and thermosetting resin can flow through resist delamination through-hole, and ring plays the role of rivet over the ground, resistance because
Stress caused by lead frame is different from resin thermal expansion coefficient makes to draw to reduce and avoid the risk of delamination at ground ring
The reliability of wire frame class wrapper product is effectively promoted.As shown in figure 5, thermosetting resin 7 can flow through resist delamination through-hole pair
Ground ring plays the role of rivet, resistance resin and ground interannular due to thermal expansion coefficient it is different caused by stress, thus reduce resin and
The delamination risk of ground interannular.The angle of the pitman 3 and ground ring 2 is 0 ~ 60 °, in the technical scheme, the pitman 3 with
The angle of ground ring 2 is preferably 30 ° or 45 °.
Thermosetting resin can be by resist delamination through-hole, and then resin is enable to carry out by position of the ground ring to details E
Cladding generates a kind of confrontation of rivet effect and weakens the stress of the position and concentrate, to reduce and avoid the wind of delamination at ground ring
Danger, the plastic packaging through-hole by thermosetting resin be filled in plastic eyelet, solidify behind gap between ring and chip seat, in turn
Rivet effect is generated after hardening.
As shown in Figure 1, being additionally provided with a lead foot 5 on the lead frame, the lead foot 5 is to beat bonding wire, and being used for will be in chip
Portion's circuit is drawn, and the position of the lead foot is located at top surface.The lead frame further includes a support stick 6, be used to support ground ring with
The position of chip seat, described ground ring is higher than chip seat, is located at middle part, the support stick is for connecting bottom surface and middle part.
As shown in fig. 6, the support stick 6 includes the first bending section 61 and the second bending section 62, the first bending section and second
The angled setting of bending section, the angle is less than 90 degree.The surface of described ground ring and pitman 3 is coated with electroplated layer, the plating
Layer is silver.
The lead frame is manufactured for semiconductor packages, and in mold process, thermosetting resin used can flow through resist delamination
Through-hole, ring does segmented cladding over the ground, and then generates rivet effect after hardening, to weaken and eliminate ground ring and chip seat chain
It takes over the baton and locates the problem of stress concentration and silver-plated level and resin-bonded power difference and the lead frame of generation are with resin delamination, make
The reliability of lead-frame packages body gets a promotion.
Still there are many embodiment, all technologies formed using equivalents or equivalent transformation for the utility model
Scheme is all fallen within the protection scope of the utility model.
Claims (8)
1. a kind of lead frame, it is characterised in that: including chip seat (1), be used for bearing wafer, the position of the chip seat (1)
Positioned at bottom surface, the upper surface of described chip seat encloses equipped with one ring (2), for beating ground connection bonding wire, the circuit that chip domestic demand is grounded
It draws,
Described ground ring is connect with chip seat by pitman (3), the pitman (3) and ground ring (2) angled setting, describedly
Ring is equipped with a plastic packaging through-hole (4), and the chip seat (1) and ground ring (2) are provided with the resin being set in plastic packaging through-hole
It is attached.
2. a kind of lead frame according to claim 1, it is characterised in that: the plastic packaging through-hole (4) is resist delamination through-hole.
3. a kind of lead frame according to claim 1, it is characterised in that: the angle of the pitman (3) and ground ring (2)
It is 0 ~ 60 °.
4. a kind of lead frame according to claim 1, it is characterised in that: be additionally provided with a lead foot on the lead frame
(5), the lead foot (5) is to beat bonding wire, and for drawing inner wafer circuit, the position of the lead foot is located at top surface.
5. a kind of lead frame according to claim 4, it is characterised in that: the lead frame further includes a support stick
(6), it is used to support ground ring and chip seat, the position of described ground ring is higher than chip seat, is located at middle part, the support stick is for connecting
Bottom surface and middle part.
6. a kind of lead frame according to claim 5, it is characterised in that: the support stick (6) includes the first bending section
(61) with the second bending section (62), the first bending section and the angled setting of the second bending section, the angle is less than 90 degree.
7. a kind of lead frame according to claim 1, it is characterised in that: described ground ring and the surface of pitman (3) are equal
It is coated with electroplated layer, the electroplated layer is silver.
8. a kind of lead frame according to claim 1, it is characterised in that: be uniformly arranged pitman on described ground ring
(3), the position of the plastic packaging through-hole (4) is corresponding with the position of pitman (3), the quantity of the plastic packaging through-hole and pitman
Quantity matches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920029874.8U CN209418493U (en) | 2019-01-08 | 2019-01-08 | A kind of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920029874.8U CN209418493U (en) | 2019-01-08 | 2019-01-08 | A kind of lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209418493U true CN209418493U (en) | 2019-09-20 |
Family
ID=67943096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920029874.8U Active CN209418493U (en) | 2019-01-08 | 2019-01-08 | A kind of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209418493U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114703507A (en) * | 2022-03-15 | 2022-07-05 | 洛阳双瑞精铸钛业有限公司 | Titanium aluminium titanium electrolysis zinc negative plate |
-
2019
- 2019-01-08 CN CN201920029874.8U patent/CN209418493U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114703507A (en) * | 2022-03-15 | 2022-07-05 | 洛阳双瑞精铸钛业有限公司 | Titanium aluminium titanium electrolysis zinc negative plate |
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