CN207052570U - 一种引线框架 - Google Patents
一种引线框架 Download PDFInfo
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- CN207052570U CN207052570U CN201720745187.7U CN201720745187U CN207052570U CN 207052570 U CN207052570 U CN 207052570U CN 201720745187 U CN201720745187 U CN 201720745187U CN 207052570 U CN207052570 U CN 207052570U
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CN201720745187.7U CN207052570U (zh) | 2017-06-20 | 2017-06-20 | 一种引线框架 |
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CN107369624A (zh) * | 2017-06-20 | 2017-11-21 | 南京矽邦半导体有限公司 | 一种引线框架改善封装的方法及引线框架 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN107369624A (zh) * | 2017-06-20 | 2017-11-21 | 南京矽邦半导体有限公司 | 一种引线框架改善封装的方法及引线框架 |
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Denomination of utility model: Two-stage time effect process for copper alloy materials of lead frame Effective date of registration: 20190314 Granted publication date: 20180227 Pledgee: Bank of Nanjing Jiangbei District branch of Limited by Share Ltd Pledgor: NANJING MIRCOBONDING TECHNOLOGY CO., LTD. Registration number: 2019320000130 |
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Date of cancellation: 20220518 Granted publication date: 20180227 Pledgee: Bank of Nanjing Jiangbei District branch of Limited by Share Ltd. Pledgor: NANJING MICROBONDING SEMICONDUCTOR CO.,LTD. Registration number: 2019320000130 |