CN207022345U - Radiator structure and electronic installation - Google Patents
Radiator structure and electronic installation Download PDFInfo
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- CN207022345U CN207022345U CN201720321345.6U CN201720321345U CN207022345U CN 207022345 U CN207022345 U CN 207022345U CN 201720321345 U CN201720321345 U CN 201720321345U CN 207022345 U CN207022345 U CN 207022345U
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- radiator structure
- master chip
- thermal conductive
- conductive silicon
- radiating piece
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Abstract
The utility model provides a kind of radiator structure and electronic installation, the radiator structure includes mainboard, some master chips being connected on mainboard, the structure radiating piece for covering master chip and the thermal conductive silicon colloid being filled between master chip and structure radiating piece, the heat conductive silica gel dignity to the surface of the structure radiating piece be plane, the heat conductive silica gel dignity is provided with some grooves and some projections to the surface of the master chip, and a master chip is raised corresponding with a groove or one.Radiator structure of the present utility model can solve the problems, such as that efficiency of assembling is low and heat dispersion is poor to a certain extent.
Description
Technical field
It the utility model is related to technical field of electronic device, more particularly to a kind of radiator structure and the application radiator structure
Electronic installation.
Background technology
There would generally be air-filled clefts in electronic installation between heat generating component and metal structure radiator, cause to radiate
Slowly, Heat Conduction Material can be typically used, gap is filled such as heat conductive silica gel, heat is reached metal structure rapidly from heat generating component and dissipates
Hot body, so as to reach effective radiating.As shown in figure 1, existing heat conductive silica gel 1 is generally single sheet material, corresponding different height
Heat generating component 2, it is necessary to using the different heat conductive silica gel 1 of thickness, material variety is more and cumbersome, and assembly cost is high.Meanwhile generate heat
Gap between component 2 is not filled, and causes contact area small, radiating effect is poor.
Utility model content
Main purpose of the present utility model is to provide a kind of radiator structure, it is intended to solves radiator structure dress to a certain extent
With the problems such as efficiency is low, radiating effect is poor.
In order to solve the above technical problems, the utility model provides a kind of radiator structure, the radiator structure includes mainboard, connected
Some master chips for being connected on mainboard, the structure radiating piece for covering master chip and it is filled between master chip and structure radiating piece
Thermal conductive silicon colloid, the heat conductive silica gel dignity to the surface of the structure radiating piece be plane, the heat conductive silica gel dignity to
The surface of the master chip is provided with some grooves and some projections, and a master chip is raised corresponding with a groove or one.
Preferably, the thickness range of the thermal conductive silicon colloid is 0.2mm-1mm.
Preferably, when thermal conductive silicon colloid is filled between the structure radiating piece and master chip, the thermal conductive silicon colloid
The thickness reduction all same at any one place.
Preferably, the thickness reduction scope of the thermal conductive silicon colloid is 10%-50%.
Preferably, the master chip is provided with four, and the heat conductive silica gel body is raised formed with three grooves and one, wherein three
Corresponding three grooves of individual master chip, another master chip corresponding one are raised.
Preferably, the mainboard is also associated with some components, and the thermal conductive silicon colloid also fills up the structure radiating piece
With the gap of some components.
Preferably, the composition of the thermal conductive silicon colloid includes macromolecule silicone oil, heat conductive filler, flame retardant filler, crosslinking
Agent and coloring agent.
Preferably, the structure radiating piece is screening cover, and the thermal conductive silicon colloid is filled in the screening cover and master chip
Between.
Preferably, the structure radiating piece is center or drain pan, and the thermal conductive silicon colloid is filled in the master chip with
Between frame or drain pan.
The utility model also proposes a kind of electronic installation, and the electronic installation includes shell and radiator structure, the radiating
Structure is above-mentioned radiator structure, and the shell is contained in the accommodating chamber formed with accommodating chamber, the radiator structure.
The utility model proposes radiator structure in, the thermal conductive silicon colloid between some master chips and structure radiating piece
Structure is integral, compared to scattered sole body, item number is on the one hand reduced, reduces management cost, on the other hand can pass through
Mould is integrally formed, and is easy to process, cost-effective, when being assembled, can also be saved manpower, be improved efficiency of assembling.In addition,
The heat conductive silica gel dignity is a plane to the surface of structure radiating piece, good contact can be carried out with structure radiating piece, because some
The height of master chip differs, therefore heat conductive silica gel dignity sets groove with raised to the surface of master chip, can respectively from different height
The master chip of degree is relative to be bonded, and contact is good, and simultaneously can connect the gap between multiple master chips, further increases
Add area of dissipation, so as to improve radiating effect.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to the structure shown in these accompanying drawings.
Fig. 1 is the partial sectional view of existing radiator structure；
Fig. 2 is the explosive view of the embodiment of the utility model radiator structure one；
Fig. 3 is the partial sectional view of the utility model cooling mechanism；
Fig. 4 is the structural representation of the thermal conductive silicon colloid of radiator structure shown in Fig. 2.
Drawing reference numeral explanation：
| Label | Title | Label | Title |
| 100 | Radiator structure | 53 | It is raised |
| 10 | Mainboard | 70 | Structure radiating piece |
| 30 | Master chip | 90 | Component |
| 50 | Thermal conductive silicon colloid | 1 | Heat conductive silica gel |
| 51 | Groove | 2 | Heat generating component |
Realization, functional characteristics and the advantage of the utility model purpose will be described further referring to the drawings in conjunction with the embodiments.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only part of the embodiment of the present utility model, rather than all
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making creative work premise
Lower obtained every other embodiment, belong to the scope of the utility model protection.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining relative position relation under a certain particular pose (as shown in drawings) between each part, motion conditions etc., such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes therewith.
In addition, the description for being related to " first ", " second " etc. in the utility model is only used for describing purpose, without being understood that
To indicate or implying its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ",
At least one this feature can be expressed or be implicitly included to the feature of " second ".In addition, the technical side between each embodiment
Case can be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical scheme
Occur conflicting or will be understood that the combination of this technical scheme is not present when can not realize, also not in the requires of the utility model
Protection domain within.
The utility model provides a kind of radiator structure 100, applied to electronic installation (not shown).
Fig. 2 to Fig. 4 is refer to, radiator structure 100 includes mainboard 10, some master chips 30 being connected on mainboard 10, covered
The structure radiating piece 70 of lid master chip 30 and the thermal conductive silicon colloid 50 being filled between master chip 30 and structure radiating piece 70, lead
The surface of the hot structure-oriented radiating piece 70 of colloidal silica 50 is plane, and thermal conductive silicon colloid 50 is provided with some towards the surface of master chip 30
Groove 51 and some raised 53, a master chip 30 are corresponding with a groove 51 or a projection 53.
In technical solutions of the utility model, the master chip 30 on mainboard 10 is the important component of electronic chip, its work
Amount of heat can be produced during work, should just can guarantee that the electronic installation 100 in time by outside heat discharge structure radiating piece 70
Steady operation performance.Master chip 30 on mainboard 10 generally comprises memory chip, CPU, power supply chip and charging management chip etc..
Because the shape of each master chip 30 is different from height, therefore, it is necessary to corresponding each master chip 30 when using thermal conductive silicon colloid 50
Analyzed with the distance of structure radiating piece 70, reserve certain decrement, so as to relative to the benchmark of thermal conductive silicon colloid 50
The groove 51 or projection 53 of different depth and shape are set on face, to match with master chip 30, so as to reach stable contact
Performance, accelerate heat transfer rate, improve the heat dispersion of the radiator structure 100.
The utility model proposes radiator structure 100 in, leading between some master chips 30 and structure radiating piece 70
Hot colloidal silica 50 is integral structure, compared to scattered sole body, on the one hand reduces item number, reduces management cost, the opposing party
Face can be integrally formed by mould, be easy to process, cost-effective, when being assembled, can also be saved manpower, be improved assembling
Efficiency.In addition, the thermal conductive silicon colloid 50 is a plane in face of the surface of structure radiating piece 70, can be carried out with structure radiating piece 70 good
Good contact, because the height of some master chips 30 differs, therefore thermal conductive silicon colloid 50 sets groove 51 towards the surface of master chip 30
With projection 53, relative with the master chip 30 of different height respectively can be bonded, contact is good, and simultaneously can be by multiple master chips
Gap between 30 connects, and further increases area of dissipation, so as to improve radiating effect.
In addition, the thermal conductive silicon colloid 50 is integral structure, groove 51 and the setting of projection 53 cause thermal conductive silicon colloid 50
Variable thickness, with this position of thinner thickness can be caused to be not easy to be torn, strengthen overall intensity, reduce bad loss.
Drawn according to actual test, the thickness range of thermal conductive silicon colloid 50 is 0.2mm-1mm.
In the present embodiment, thermal conductive silicon colloid 50 is because corresponding master chip 30 is different, therefore its thickness also differs, specifically,
According to usually, considering that thermal conductive silicon colloid 50 has a decrement on thickness when in use, therefore by thermal conductive silicon colloid
50 thickness range is set between 0.2mm-1mm, can cause thermal conductive silicon colloid 50 and structure radiating piece 70 and master chip 30 it
Between contact it is good, so as to provide the heat conductivility of the electronic installation 100, extend its service life.
In preferred embodiment, when thermal conductive silicon colloid 50 is filled between structure radiating piece 70 and master chip 30, heat conduction
The thickness reduction all same at 50 any one place of colloidal silica.
In the present embodiment, when making thermal conductive silicon colloid 50, consider first multiple master chips 30 and structure radiating piece 70 it
Between spacing, then will between multiple master chips 30 and structure radiating piece 70 reserve same ratio decrement, led so as to draw
The thickness of the hot various pieces of colloidal silica 50, finally the thermal conductive silicon colloid 50 is integrally formed using simple die.This method causes
When thermal conductive silicon colloid 50 is filled between structure radiating piece 70 and master chip 30, the thickness at 50 any one place of thermal conductive silicon colloid
Decrement is equal, so as to further enhance thermal conductive silicon colloid 50 and contact performance between the two, and contacts stabilization
Property is good so that heat conductivility and heat dispersion get a promotion.
Specifically, the thickness reduction scope of thermal conductive silicon colloid 50 is 10%-50%.
The thickness reduction of thermal conductive silicon colloid 50 can be by the effect of distance between master chip 30 and structure radiating piece 70, together
When, it is also relevant with the constituent of thermal conductive silicon colloid 50 itself and the ratio of each composition.
In the present embodiment, the part of thermal conductive silicon colloid 50 include macromolecule silicone oil (i.e. silicon rubber), heat conductive filler,
Flame retardant filler, crosslinking agent and coloring agent etc., macromolecule silicone oil can improve the anti-aging and resistance to acids and bases of the thermal conductive silicon colloid 50
Can so that the thermal conductive silicon colloid 50 lasts a long time, so as to improve the service life of the electronic equipment.Heat conductive filler can
To improve the thermal conductivity of the thermal conductive silicon colloid 50, thermal conductivity factor is set to be up to 3~6w/mk, much larger than the thermal conductivity factor of air
0.026w/mk, so as to increase substantially the heat conductivility of the electronic installation 100.Flame retardant filler ensures the heat conductive silica gel
Body 50 has preferable fire retardant performance, further improves the safe application performance of electronic installation 100.Crosslinking agent can play
Preferable anastomosis so that thermal conductive silicon colloid 50 contacts more preferably with component 90.In addition, the thermal conductive silicon colloid 50 of the constituent
Pliability is good, and decrement can reach 10%~50% so that the thermal conductive silicon colloid 50 of integrative-structure can preferably with it is various
The component 90 in gap is coordinated, and increases versatility.
Fig. 2 and Fig. 4 are continued referring to, master chip 30 is provided with four, and thermal conductive silicon colloid 50 is formed with three grooves 51 and one
Projection 53, wherein corresponding three grooves 51 of three master chips 30, the corresponding projection 53 of another master chip 30.
In the present embodiment, four chips on mainboard 10 are respectively memory chip, power supply chip, cpu chip and charging valve
Chip is managed, general cpu chip is the square chips that area is maximum on mainboard 10, and memory chip is slightly smaller oblong chips,
Power supply chip and charging management chip are corresponding smaller.In order to save material and easy to assembly, typically choose moderate height and make
For the reference plane of thermal conductive silicon colloid 50, so that groove 51 is set to highly higher 30 corresponding position of master chip, with height
Position corresponding to the master chip 30 told somebody what one's real intentions are is projection 53, so as to balance the overall thickness of thermal conductive silicon colloid 50, is easy to cost-effective.
Referring once again to Fig. 2, mainboard 10 is also associated with some components 90, and thermal conductive silicon colloid 50 also fills up structure radiating piece
70 with the gaps of some components 90.
The thermal conductive silicon colloid 50 of technical solutions of the utility model is structure as a whole, because each master chip 30 is spaced
State, therefore thermal conductive silicon colloid 50 is corresponding to other components that can also be covered between the part of each master chip 30 on mainboard 10
90, and match with the shape of 90 corresponding position of component with component 90.Because in addition to master chip 30 can produce heat,
These components 90 being connected on mainboard 10 can also produce a little heat, therefore the thermal conductive silicon colloid 50 of the structure can be further
Increase contact area, and the space between each master chip 30 and component 90 is also connected, so as to which even heat is divided
Dissipate, be delivered to structure radiating piece 70 more rapidly and distribute, further improve heat dispersion.
In an embodiment, structure radiating piece 70 is screening cover, and thermal conductive silicon colloid 50 is filled in screening cover and master chip 30
Between.
In the present embodiment, screening cover primarily serves the effect of protection master chip 30, and can shield electromagnetic interference so that
The performance of electronic installation 100 is more preferable, and the radiation to user is smaller.Screening cover is set to strengthen the electronic installation 100
Safe application performance, when structure radiating piece 70 is screening cover, screening cover is directly oppositely arranged with master chip 30, by thermal conductive silicon colloid
50 are located between screening cover and master chip 30, and the material of screening cover is metal, can increase heat dispersion.
In an other embodiment, structure radiating piece 70 is center or drain pan, and thermal conductive silicon colloid 50 is filled in master chip 30
Between center or drain pan.In the present embodiment, screening cover is not provided with, the heat of master chip 30 can pass through thermal conductive silicon colloid 50
It is transferred on center or drain pan, is directly emitted to the external world, it is also possible that simple in construction, heat-transfer path is few.
The utility model also proposes a kind of electronic installation, and the electronic installation includes shell (not shown) and radiator structure 100,
Radiator structure is above-mentioned radiator structure, and shell is contained in the receiving formed with accommodating chamber (not shown), radiator structure 100
Chamber.Because the radiator structure of electronic installation employs whole technical schemes of above-mentioned all embodiments, therefore, at least with above-mentioned reality
All beneficial effects caused by the technical scheme of example are applied, this is no longer going to repeat them.
The electronic installation of technical solutions of the utility model can be mobile phone, tablet personal computer, notebook computer and other electronics
Class product.Electronic installation also includes the necessary element of other its function of implementation, such as：Circuit board, display screen, battery etc..
Preferred embodiment of the present utility model is these are only, not thereby limits the scope of the claims of the present utility model, it is every
Under utility model of the present utility model design, the equivalent structure made using the utility model specification and accompanying drawing content is become
Change, or be directly or indirectly used in other related technical areas and be included in scope of patent protection of the present utility model.
Claims (9)
1. a kind of radiator structure, applied to electronic installation, it is characterised in that the radiator structure includes mainboard, is connected to mainboard
On some master chips, cover master chip structure radiating piece and the thermal conductive silicon that is filled between master chip and structure radiating piece
Colloid, the heat conductive silica gel dignity are plane to the surface of the structure radiating piece, and the heat conductive silica gel dignity is to the main core
The surface of piece is provided with some grooves and some projections, and a master chip is raised corresponding with a groove or one.
2. radiator structure as claimed in claim 1, it is characterised in that the thickness range of the thermal conductive silicon colloid is 0.2mm-
1mm。
3. radiator structure as claimed in claim 1, it is characterised in that when thermal conductive silicon colloid be filled in the structure radiating piece with
When between master chip, the thickness reduction all same at any one place of thermal conductive silicon colloid.
4. radiator structure as claimed in claim 2 or claim 3, it is characterised in that the thickness reduction scope of the thermal conductive silicon colloid
For 10%-50%.
5. radiator structure as claimed in claim 1, it is characterised in that the master chip is provided with four, the thermal conductive silicon colloid
Raised formed with three grooves and one, wherein corresponding three grooves of three master chips, another master chip corresponding one is raised.
6. radiator structure as claimed in claim 1, it is characterised in that the mainboard is also associated with some components, described to lead
Hot colloidal silica also fills up the gap of the structure radiating piece and some components.
7. radiator structure as claimed in claim 1, it is characterised in that the structure radiating piece is screening cover, the thermal conductive silicon
Colloid is filled between the screening cover and master chip.
8. radiator structure as claimed in claim 1, it is characterised in that the structure radiating piece is center or drain pan, described to lead
Hot colloidal silica is filled between the master chip and center or drain pan.
9. a kind of electronic installation, it is characterised in that the electronic installation includes shell and radiator structure, and the radiator structure is power
Profit requires 1 to 8 any described radiator structure, and the shell is contained in the receiving formed with accommodating chamber, the radiator structure
Intracavitary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720321345.6U CN207022345U (en) | 2017-03-29 | 2017-03-29 | Radiator structure and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720321345.6U CN207022345U (en) | 2017-03-29 | 2017-03-29 | Radiator structure and electronic installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207022345U true CN207022345U (en) | 2018-02-16 |
Family
ID=61460537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720321345.6U Active CN207022345U (en) | 2017-03-29 | 2017-03-29 | Radiator structure and electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207022345U (en) |
-
2017
- 2017-03-29 CN CN201720321345.6U patent/CN207022345U/en active Active
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