CN206640865U - Heat radiation type PCB heat board - Google Patents
Heat radiation type PCB heat board Download PDFInfo
- Publication number
- CN206640865U CN206640865U CN201720292672.3U CN201720292672U CN206640865U CN 206640865 U CN206640865 U CN 206640865U CN 201720292672 U CN201720292672 U CN 201720292672U CN 206640865 U CN206640865 U CN 206640865U
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- China
- Prior art keywords
- groove
- heat
- chip
- hole
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of heat radiation type PCB heat board, including PCB bodies, position corresponding with IC chip to be connected is provided with groove on the PCB bodies, the bottom land of the groove is provided with least one through hole, the surface of the groove depression and through-hole inner surface are respectively equipped with metal level, and the groove is used to contact with the heat sink of IC chip to be connected.IC chip and the contact area of air are increased by groove and through hole, so as to add area of dissipation, heat caused by IC chip is dispersed into air in time by heat sink and groove and through hole, so that IC chip the temperature remains within the normal range state, therefore IC chip can be operated under temperature constant state, so as to reach purpose that is stable, continuing, effectively work, ensure overall performance.And without additionally increasing heat dissipating layer in whole pcb board, there is the advantages of simple technique, low manufacture cost.
Description
Technical field
It the utility model is related to electronic information member arts, more particularly to a kind of heat radiation type PCB heat board.
Background technology
Conventional pcb board, the radiating of IC chip are radiated by common heat sink, but for high power, heating
Big IC chip is measured, radiating mode originally will be unable to normally give out the heat that IC chip operation is sent out in time, such a
In the case of, due to constantly generating heat, heat gathers and not distributed not go out IC chip, IC chip can be caused to exist over time
Cisco unity malfunction under the condition of high temperature, or even meeting high temperature burn out IC chip, so that complete machine fails.
The A of Publication No. CN 104302096 Chinese patent proposes a kind of pcb board, including electrical layer, non-electrical gas-bearing formation,
Heat-sink shell and adhesive layer, four layers are fixed successively from top to bottom, and heat absorption is laminated by the adhesive layer being made up of heat conductive adhesive；
Heat absorption layer surface has heat radiation film, and the film has infra-red radiation effect.
But such scheme needs additionally to set one layer of heat-sink shell, complex process, cost of manufacture height.
Utility model content
Technical problem to be solved in the utility model is：There is provided that a kind of technique is simple, the heat radiating type PCB of low manufacture cost
Plate, IC chip can effectively be radiated.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is：
A kind of heat radiation type PCB heat board, including PCB bodies, position corresponding with IC chip to be connected is set on the PCB bodies
Fluted, the bottom land of the groove is provided with least one through hole, the surface of the groove depression and the inner surface point of through hole
Not She You metal level, the groove be used for contacted with the heat sink of IC chip to be connected.
Further, the quantity of the through hole is two or more.
Further, more than two through holes are evenly distributed on groove.
Further, the quantity of the through hole is one, and the through hole is located at the center of groove.
Further, the size of the groove is identical with the size of the heat sink of IC chip to be connected.
Further, the through hole is manhole.
The beneficial effects of the utility model are：Groove and through hole be set in position corresponding to IC chip, and by groove and
The heat sink of via metal, groove and IC chip is joined directly together, and connecing for IC chip and air is increased by groove and through hole
Contacting surface is accumulated, and so as to add area of dissipation, heat is dispersed into time by heat sink and groove and through hole caused by IC chip
In air so that therefore IC chip the temperature remains within the normal range state, IC chip can be operated under temperature constant state, so as to reach stable, hold
Purpose that is continuous, effectively working, ensures overall performance.And without additionally increasing heat dissipating layer in whole pcb board, there is technique letter
The advantages of list, low manufacture cost.
Brief description of the drawings
Fig. 1 is the structural representation of the heat radiation type PCB heat board of the utility model embodiment；
Fig. 2 is the structural representation after the heat radiation type PCB heat board of the utility model embodiment one is connected with IC chip to be connected
Figure.
Label declaration：
1st, PCB bodies；2nd, groove；3rd, through hole；4th, first area；5th, IC chip.
Embodiment
For detailed description technology contents of the present utility model, the objects and the effects, below in conjunction with embodiment and match somebody with somebody
Accompanying drawing is closed to be explained in detail.
The design of the utility model most critical is：Position corresponding with IC chip to be connected is provided with recessed on PCB bodies
Groove, the bottom land of groove are provided with least one through hole, and the surface of groove depression and the inner surface of through hole are respectively equipped with metal level.
Referring to Fig. 1, the utility model provides a kind of heat radiation type PCB heat board, including PCB bodies 1, on the PCB bodies 1 with
Position corresponding to IC chip to be connected is provided with groove 2, and the bottom land of the groove 2 is provided with least one through hole 3, described recessed
The surface and the inner surface of through hole 3 that groove 2 is recessed are respectively equipped with metal level, and the groove 2 is used for scattered with IC chip to be connected
Hot plate contacts.
It was found from foregoing description, the beneficial effects of the utility model are：By setting groove and through hole, radiating is increased
Face is passed through so that IC chip can be operated under temperature constant state, it is ensured that the stability of IC chip, and with simple in construction, system
Make the advantages of cost is low.
Further, the quantity of the through hole 3 is two or more.
It was found from foregoing description, by setting multiple through holes, the heat sink and air of IC chip are further increased
Contact area, improve radiating effect.
Further, more than two through holes 3 are evenly distributed on groove 2.
It was found from foregoing description, multiple through holes are uniformly distributed so that radiating is uniform, improves radiating effect, above-mentioned multiple
Size, the shape of through hole be able to can also be differed with identical.
Further, the quantity of the through hole 3 is one, and the through hole 3 is located at the center of groove 2.
It was found from foregoing description, when through hole 3 only has one, radiating effect is optimal when being arranged on the center of groove 2, is
Preferred scheme of the present utility model.Naturally it can also arranged in the other positions of groove 2.
Further, the size of the groove 2 is identical with the size of the heat sink of IC chip to be connected.
It was found from foregoing description, the heat sink of IC chip can realize radiating, and can maximum just with matching grooves
The aperture area of groove and the area of metal level are reduced to degree, so as to farthest save cost, and causes pcb board
It is overall compacter, neat.
Further, the through hole 3 is manhole.
It was found from foregoing description, existing through hole is typically based on manhole, and certainly, manhole is that this practicality is new
One kind of type is specific to be set, and through hole can also be the shape that square, rhombus etc. can arbitrarily realize same effect.
Fig. 2 is refer to, embodiment one of the present utility model is：
A kind of heat radiation type PCB heat board, including PCB bodies 1, PCB bodies 1 are provided with corresponding with the pin of IC chip to be connected
First area 4, position corresponding with IC chip to be connected is provided with groove 2, the size of the groove 2 on the PCB bodies 1
Identical with the size of the heat sink of IC chip to be connected, the bottom land of the groove 2 is provided with more than two circular through holes
3, wherein a through hole 3 is arranged at the center of the bottom land of groove 2, other through holes 3 are uniformly arranged on groove 2 around a through hole 3
Bottom land on, surface and the inner surface of through hole 3 that the groove 2 is recessed are respectively equipped with metal level, and the groove 2 is used for and the company for the treatment of
The heat sink contact of the IC chip connect.
Above-mentioned heat radiation type PCB heat board be connected with IC chip to be connected after structural representation as shown in Fig. 2 IC chip 5
Pin is connected with first area 4, and the heat sink of IC chip 5 is embedded in the groove 2, and heat sink and the groove 2 of IC chip 5 connect
Touch.
In summary, heat radiation type PCB heat board provided by the utility model, the area of dissipation of IC chip is effectively increased, can had
Effect dissipates heat caused by IC chip, ensure that the constant operating temperatures of IC, ensures the normal work of IC elements, ensures
Overall performance after follow-up assembling.With rapid heat dissipation, make the advantages of simple, cost is low.
Embodiment of the present utility model is the foregoing is only, not thereby limits the scope of the claims of the present utility model, it is every
The equivalents made using the utility model specification and accompanying drawing content, or directly or indirectly it is used in the technology neck of correlation
Domain, similarly it is included in scope of patent protection of the present utility model.
Claims (6)
1. a kind of heat radiation type PCB heat board, including PCB bodies, it is characterised in that on the PCB bodies with IC chip pair to be connected
The position answered is provided with groove, and the bottom land of the groove is provided with least one through hole, the surface of the groove depression and through hole
Inner surface be respectively equipped with metal level, the groove is used to contact with the heat sink of IC chip to be connected.
2. heat radiation type PCB heat board according to claim 1, it is characterised in that the quantity of the through hole is two or more.
3. heat radiation type PCB heat board according to claim 2, it is characterised in that more than two through holes are evenly distributed on
On groove.
4. heat radiation type PCB heat board according to claim 1, it is characterised in that the quantity of the through hole is one, the through hole
Located at the center of groove.
5. heat radiation type PCB heat board according to claim 1, it is characterised in that the size of the groove and IC cores to be connected
The size of the heat sink of piece is identical.
6. heat radiation type PCB heat board according to claim 1, it is characterised in that the through hole is manhole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720292672.3U CN206640865U (en) | 2017-03-23 | 2017-03-23 | Heat radiation type PCB heat board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720292672.3U CN206640865U (en) | 2017-03-23 | 2017-03-23 | Heat radiation type PCB heat board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206640865U true CN206640865U (en) | 2017-11-14 |
Family
ID=60258700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720292672.3U Expired - Fee Related CN206640865U (en) | 2017-03-23 | 2017-03-23 | Heat radiation type PCB heat board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206640865U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107957760A (en) * | 2017-11-20 | 2018-04-24 | 安徽省未来博学信息技术有限公司 | Electronic equipment high temperature resistant mainboard |
-
2017
- 2017-03-23 CN CN201720292672.3U patent/CN206640865U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107957760A (en) * | 2017-11-20 | 2018-04-24 | 安徽省未来博学信息技术有限公司 | Electronic equipment high temperature resistant mainboard |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171114 Termination date: 20210323 |