CN106879231A - Radiator structure and electronic installation - Google Patents
Radiator structure and electronic installation Download PDFInfo
- Publication number
- CN106879231A CN106879231A CN201710200053.1A CN201710200053A CN106879231A CN 106879231 A CN106879231 A CN 106879231A CN 201710200053 A CN201710200053 A CN 201710200053A CN 106879231 A CN106879231 A CN 106879231A
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- China
- Prior art keywords
- master chip
- thermal conductive
- radiator structure
- conductive silicon
- radiating piece
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of radiator structure and electronic installation, the radiator structure includes mainboard, some master chips being connected on mainboard, the structure radiating piece of covering master chip and the thermal conductive silicon colloid being filled between master chip and structure radiating piece, the base material of the thermal conductive silicon colloid is silicon rubber, the heat conductive silica gel dignity is plane to the surface of the structure radiating piece, the heat conductive silica gel dignity is provided with some grooves and some projections to the surface of the master chip, and a master chip is raised with a groove or one corresponding.Radiator structure of the invention can to a certain extent solve the problems, such as that efficiency of assembling is low and heat dispersion is poor.
Description
Technical field
The present invention relates to technical field of electronic device, more particularly to a kind of radiator structure and the electronics using the radiator structure
Device.
Background technology
There would generally be air-filled clefts in electronic installation between heat generating component and metal structure radiator, cause radiating
Slowly, can typically use Heat Conduction Material, such as heat conductive silica gel to fill gap, heat is reached from heat generating component metal structure rapidly and dissipate
Hot body, so as to reach effectively radiating.As shown in figure 1, existing heat conductive silica gel 1 is generally single sheet material, correspondence different height
Heat generating component 2, it is necessary to using the different heat conductive silica gel 1 of thickness, material variety is more and cumbersome, and assembly cost is high.Meanwhile, heating
Gap between component 2 is not filled, and causes contact area small, and radiating effect is poor.
The content of the invention
It is a primary object of the present invention to provide a kind of radiator structure, it is intended to solve radiator structure assembling effect to a certain extent
The problems such as rate is low, radiating effect is poor.
In order to solve the above technical problems, the present invention provides a kind of radiator structure, the radiator structure includes mainboard, is connected to
Some master chips on mainboard, the structure radiating piece of covering master chip and it is filled in leading between master chip and structure radiating piece
Hot colloidal silica, the base material of the thermal conductive silicon colloid is silicon rubber, the honorable surface to the structure radiating piece of the heat conductive silica gel
It is plane, the heat conductive silica gel dignity is provided with some grooves and some projections, a master chip and to the surface of the master chip
Groove or a projection are corresponding.
Preferably, the thickness range of the thermal conductive silicon colloid is 0.2mm-1mm.
Preferably, when thermal conductive silicon colloid is filled between the structure radiating piece and master chip, the thermal conductive silicon colloid
The thickness reduction all same at any one place.
Preferably, the thickness reduction scope of the thermal conductive silicon colloid is 10%-50%.
Preferably, the master chip is provided with four, and the heat conductive silica gel body is formed with three grooves and a projection, wherein three
Three grooves of individual master chip correspondence, another master chip correspondence one is raised.
Preferably, the mainboard is also associated with some components, and the thermal conductive silicon colloid also fills up the structure radiating piece
With the gap of some components.
Preferably, the composition of the thermal conductive silicon colloid includes macromolecule silicone oil, heat conductive filler, flame retardant filler, crosslinking
Agent and coloring agent.
Preferably, the structure radiating piece is screening cover, and the thermal conductive silicon colloid is filled in the screening cover and master chip
Between.
Preferably, the structure radiating piece is center or drain pan, and the thermal conductive silicon colloid is filled in the master chip with
Between frame or drain pan.
The present invention also proposes a kind of electronic installation, and the electronic installation includes shell and radiator structure, the radiator structure
It is above-mentioned radiator structure, the shell is formed with accommodating chamber, and the radiator structure is contained in the accommodating chamber.
In radiator structure proposed by the present invention, the thermal conductive silicon colloid between some master chips and structure radiating piece is one
Overall structure, compared to scattered sole body, on the one hand reduces item number, reduces management cost, on the other hand can be by mould
It is integrally formed, is easy to processing, it is cost-effective, when being assembled, it is also possible to save manpower, improve efficiency of assembling.Additionally, this is led
Hot colloidal silica is a plane in face of the surface of structure radiating piece, good contact can be carried out with structure radiating piece, because of some main cores
The height of piece differs, thus heat conductive silica gel dignity to the surface of master chip set groove with it is raised, can respectively with different height
Master chip is relative to fit, and contact is good, and can couple together the gap between multiple master chips simultaneously, further increases and dissipates
Hot area, such that it is able to improve radiating effect.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is the partial sectional view of existing radiator structure；
Fig. 2 is the explosive view of the embodiment of radiator structure of the present invention；
Fig. 3 is the partial sectional view of cooling mechanism of the present invention；
Fig. 4 is the structural representation of the thermal conductive silicon colloid of radiator structure shown in Fig. 2.
Drawing reference numeral explanation：
| Label | Title | Label | Title |
| 100 | Radiator structure | 53 | It is raised |
| 10 | Mainboard | 70 | Structure radiating piece |
| 30 | Master chip | 90 | Component |
| 50 | Thermal conductive silicon colloid | 1 | Heat conductive silica gel |
| 51 | Groove | 2 | Heat generating component |
The realization of the object of the invention, functional characteristics and advantage will be described further referring to the drawings in conjunction with the embodiments.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In relative position relation, motion conditions under a certain particular pose (as shown in drawings) between each part etc. are explained, if should
When particular pose changes, then directionality indicates also correspondingly to change therewith.
In addition, it is related to the description of " first ", " second " etc. to be only used for describing purpose in the present invention, and it is not intended that referring to
Show or imply its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, " first ", " are defined
Two " at least one this feature can be expressed or be implicitly included to feature.In addition, the technical scheme between each embodiment can
To be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical scheme occurs
It is conflicting or when cannot realize it will be understood that the combination of this technical scheme does not exist, also not in the protection model of application claims
Within enclosing.
The present invention provides a kind of radiator structure 100, is applied to electronic installation (not shown).
Fig. 2 to Fig. 4 is refer to, radiator structure 100 includes mainboard 10, some master chips 30 being connected on mainboard 10, covers
The structure radiating piece 70 of lid master chip 30 and the thermal conductive silicon colloid 50 being filled between master chip 30 and structure radiating piece 70, lead
The base material of hot colloidal silica 50 is silicon rubber, and the surface of the structure-oriented radiating piece 70 of thermal conductive silicon colloid 50 is plane, thermal conductive silicon colloid
50 are provided with some grooves 51 and some raised 53, a master chip 30 and a groove 51 or a projection 53 towards the surface of master chip 30
It is corresponding.
In technical solution of the present invention, the master chip 30 on mainboard 10 is the important component of electronic chip, and its is worked
Cheng Zhonghui produces amount of heat, should just can guarantee that the stabilization of the electronic installation 100 in time by outside heat discharge structure radiating piece 70
Service behaviour.Master chip 30 on mainboard 10 generally comprises memory chip, CPU, power supply chip and charging management chip etc..Due to
The shape of each master chip 30 is different from height, therefore, it is necessary to each master chip 30 of correspondence and knot when using thermal conductive silicon colloid 50
The distance of structure radiating piece 70 is analyzed, and reserves certain decrement, so as on the datum level relative to thermal conductive silicon colloid 50
The groove 51 or raised 53 of different depth and shape is set, is matched with master chip 30, so as to reach the contact performance of stabilization,
Accelerate heat transfer rate, improve the heat dispersion of the radiator structure 100.
In radiator structure proposed by the present invention 100, the thermal conductive silicon between some master chips 30 and structure radiating piece 70
Colloid 50 is an overall structure, compared to scattered sole body, on the one hand reduces item number, reduces management cost, on the other hand may be used
It is integrally formed with by mould, is easy to processing, it is cost-effective, when being assembled, it is also possible to save manpower, improve assembling effect
Rate.Additionally, the thermal conductive silicon colloid 50 is a plane in face of the surface of structure radiating piece 70, can be carried out well with structure radiating piece 70
Contact, because the height of some master chips 30 differs, thus thermal conductive silicon colloid 50 towards master chip 30 surface set groove 51 with
Raised 53, relative with the master chip 30 of different height respectively can fit, contact is good, and simultaneously can be by multiple master chips 30
Between gap couple together, further increase area of dissipation, such that it is able to improve radiating effect.
Additionally, the thermal conductive silicon colloid 50 is an overall structure, setting of the groove 51 with raised 53 causes thermal conductive silicon colloid 50
Variable thickness, can cause that the position of thinner thickness is difficult to be torn with this, strengthen overall intensity, reduce bad loss.
Drawn according to actual test, the thickness range of thermal conductive silicon colloid 50 is 0.2mm-1mm.
In the present embodiment, thermal conductive silicon colloid 50 is different because of corresponding master chip 30, therefore its thickness also differs, specifically,
According to usually, considering that thermal conductive silicon colloid 50 has a decrement on thickness when in use, therefore by thermal conductive silicon colloid
50 thickness range is set between 0.2mm-1mm, can cause thermal conductive silicon colloid 50 and structure radiating piece 70 and master chip 30 it
Between contact it is good such that it is able to the heat conductivility of the electronic installation 100 is provided, extends its service life.
In preferred embodiment, when thermal conductive silicon colloid 50 is filled between structure radiating piece 70 and master chip 30, heat conduction
The thickness reduction all same at any one place of colloidal silica 50.
In the present embodiment, when thermal conductive silicon colloid 50 is made, consider first multiple master chips 30 and structure radiating piece 70 it
Between spacing, then will between multiple master chips 30 and structure radiating piece 70 reserve same ratio decrement, led so as to draw
, be integrally formed for the thermal conductive silicon colloid 50 using simple die finally by the thickness of the various pieces of hot colloidal silica 50.The method is caused
When thermal conductive silicon colloid 50 is filled between structure radiating piece 70 and master chip 30, the thickness at any one place of thermal conductive silicon colloid 50
Decrement is equal, such that it is able to further enhance thermal conductive silicon colloid 50 and contact performance between the two, and contacts stabilization
Property is good so that heat conductivility and heat dispersion get a promotion.
Specifically, the thickness reduction scope of thermal conductive silicon colloid 50 is 10%-50%.
The thickness reduction of thermal conductive silicon colloid 50 can be subject to the effect of distance between master chip 30 and structure radiating piece 70, together
When, it is also relevant with the constituent of thermal conductive silicon colloid 50 itself and the ratio of each composition.
In the present embodiment, the part of thermal conductive silicon colloid 50 include macromolecule silicone oil (i.e. silicon rubber), heat conductive filler,
Flame retardant filler, crosslinking agent and coloring agent etc., macromolecule silicone oil can improve the anti-aging and resistance to acids and bases of the thermal conductive silicon colloid 50
Can so that the thermal conductive silicon colloid 50 is lasted a long time, such that it is able to improving the service life of the electronic equipment.Heat conductive filler can
To improve the thermal conductivity of the thermal conductive silicon colloid 50, thermal conductivity factor is set to be up to 3~6w/mk, much larger than the thermal conductivity factor of air
0.026w/mk, such that it is able to increase substantially the heat conductivility of the electronic installation 100.Flame retardant filler ensures the heat conductive silica gel
Body 50 has preferable fire retardant performance, further improves the safe application performance of electronic installation 100.Crosslinking agent can be played
Preferable anastomosis so that thermal conductive silicon colloid 50 is contacted more preferably with component 90.Additionally, the thermal conductive silicon colloid 50 of the constituent
Pliability is good, and decrement can reach 10%~50% so that the thermal conductive silicon colloid 50 of integrative-structure can preferably with it is various
The component 90 in gap is coordinated, and increases versatility.
Fig. 2 and Fig. 4 is continued referring to, master chip 30 is provided with four, and thermal conductive silicon colloid 50 is formed with three grooves 51 and
Raised 53, wherein three three grooves 51 of correspondence of master chip 30, one projection 53 of correspondence of another master chip 30.
In the present embodiment, four chips on mainboard 10 are respectively memory chip, power supply chip, cpu chip and charging valve
Reason chip, general cpu chip is the maximum square chips of area on mainboard 10, and memory chip is slightly smaller oblong chips,
Power supply chip and charging management chip are corresponding smaller.In order to save material and easy to assembly, typically choose moderate height and make
It is the datum level of thermal conductive silicon colloid 50, so that the master chip 30 corresponding position higher with height is set to groove 51, with height
The corresponding position of master chip 30 told somebody what one's real intentions are is raised 53, so as to balance the thickness of the entirety of thermal conductive silicon colloid 50, is easy to cost-effective.
Referring once again to Fig. 2, mainboard 10 is also associated with some components 90, and thermal conductive silicon colloid 50 also fills up structure radiating piece
70 with the gap of some components 90.
The thermal conductive silicon colloid 50 of technical solution of the present invention is structure as a whole, because each master chip 30 is spaced shape
State, therefore thermal conductive silicon colloid 50 is corresponding to other components that can also be covered between the part of each master chip 30 on mainboard 10
90, and match with component 90 with the shape of the corresponding position of component 90.Because in addition to master chip 30 can produce heat,
These components 90 being connected on mainboard 10 can also produce a little heat, therefore the thermal conductive silicon colloid 50 of the structure can be further
Increase contact area, and each master chip 30 is also connected with the space between component 90, such that it is able to even heat is divided
Dissipate, structure radiating piece 70 is delivered to more rapidly and is distributed, further improve heat dispersion.
In an embodiment, structure radiating piece 70 is screening cover, and thermal conductive silicon colloid 50 is filled in screening cover and master chip 30
Between.
In the present embodiment, screening cover primarily serves the effect of protection master chip 30, and can shield electromagnetic interference so that
The performance of electronic installation 100 is more preferable, and smaller to the radiation of user.Setting screening cover can strengthen the electronic installation 100
Safe application performance, when structure radiating piece 70 is screening cover, screening cover is directly oppositely arranged with master chip 30, by thermal conductive silicon colloid
50 are located between screening cover and master chip 30, and the material of screening cover is metal, can increase heat dispersion.
In an other embodiment, structure radiating piece 70 is center or drain pan, and thermal conductive silicon colloid 50 is filled in master chip 30
Between center or drain pan.In the present embodiment, screening cover is not provided with, the heat of master chip 30 can be by thermal conductive silicon colloid 50
It is transferred on center or drain pan, is directly emitted to the external world, it is also possible to so that simple structure, heat-transfer path is few.
The present invention also proposes a kind of electronic installation, and the electronic installation includes shell (not shown) and radiator structure 100, radiating
Structure is above-mentioned radiator structure, and shell is formed with accommodating chamber (not shown), and radiator structure 100 is contained in the accommodating chamber.Cause
The radiator structure of electronic installation employs whole technical schemes of above-mentioned all embodiments, therefore, at least with above-described embodiment
All beneficial effects for being brought of technical scheme, this is no longer going to repeat them.
The electronic installation of technical solution of the present invention can be produced for mobile phone, panel computer, notebook computer and other electrical types
Product.Electronic installation also implements the necessary element of its function including other, such as：Circuit board, display screen, battery etc..
The preferred embodiments of the present invention are these are only, the scope of the claims of the invention is not thereby limited, it is every in the present invention
Inventive concept under, the equivalent structure transformation made using description of the invention and accompanying drawing content, or be directly or indirectly used in
Other related technical fields are included in scope of patent protection of the invention.
Claims (10)
1. a kind of radiator structure, is applied to electronic installation, it is characterised in that the radiator structure includes mainboard, is connected to mainboard
On some master chips, the structure radiating piece of covering master chip and the thermal conductive silicon that is filled between master chip and structure radiating piece
Colloid, the base material of the thermal conductive silicon colloid is silicon rubber, and the heat conductive silica gel dignity is flat to the surface of the structure radiating piece
Face, the heat conductive silica gel dignity is provided with some grooves and some projections, a master chip and a groove to the surface of the master chip
Or one is raised corresponding.
2. radiator structure as claimed in claim 1, it is characterised in that the thickness range of the thermal conductive silicon colloid is 0.2mm-
1mm。
3. radiator structure as claimed in claim 1, it is characterised in that when thermal conductive silicon colloid be filled in the structure radiating piece with
When between master chip, the thickness reduction all same at any one place of thermal conductive silicon colloid.
4. radiator structure as claimed in claim 2 or claim 3, it is characterised in that the thickness reduction scope of the thermal conductive silicon colloid
It is 10%-50%.
5. radiator structure as claimed in claim 1, it is characterised in that the master chip is provided with four, the thermal conductive silicon colloid
Three grooves and a projection are formed with, wherein three master chip three grooves of correspondence, another projection of master chip correspondence one.
6. radiator structure as claimed in claim 1, it is characterised in that the mainboard is also associated with some components, described to lead
Hot colloidal silica also fills up the gap of the structure radiating piece and some components.
7. radiator structure as claimed in claim 1, it is characterised in that the composition of the thermal conductive silicon colloid includes macromolecule silicon
Oil, heat conductive filler, flame retardant filler, crosslinking agent and coloring agent.
8. radiator structure as claimed in claim 1, it is characterised in that the structure radiating piece is screening cover, the thermal conductive silicon
Colloid is filled between the screening cover and master chip.
9. radiator structure as claimed in claim 1, it is characterised in that the structure radiating piece is center or drain pan, described to lead
Hot colloidal silica is filled between the master chip and center or drain pan.
10. a kind of electronic installation, it is characterised in that the electronic installation includes shell and radiator structure, the radiator structure is
Any described radiator structure of claim 1 to 9, the shell is formed with accommodating chamber, and the radiator structure is contained in the appearance
Receive in chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710200053.1A CN106879231A (en) | 2017-03-29 | 2017-03-29 | Radiator structure and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710200053.1A CN106879231A (en) | 2017-03-29 | 2017-03-29 | Radiator structure and electronic installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106879231A true CN106879231A (en) | 2017-06-20 |
Family
ID=59159480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710200053.1A Withdrawn CN106879231A (en) | 2017-03-29 | 2017-03-29 | Radiator structure and electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106879231A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111508536A (en) * | 2019-01-30 | 2020-08-07 | 株式会社东芝 | Disk device |
-
2017
- 2017-03-29 CN CN201710200053.1A patent/CN106879231A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111508536A (en) * | 2019-01-30 | 2020-08-07 | 株式会社东芝 | Disk device |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170620 |
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| WW01 | Invention patent application withdrawn after publication |