CN204291736U - Electrically-controlled component radiator structure - Google Patents
Electrically-controlled component radiator structure Download PDFInfo
- Publication number
- CN204291736U CN204291736U CN201420869227.5U CN201420869227U CN204291736U CN 204291736 U CN204291736 U CN 204291736U CN 201420869227 U CN201420869227 U CN 201420869227U CN 204291736 U CN204291736 U CN 204291736U
- Authority
- CN
- China
- Prior art keywords
- pcb
- electrically
- lower house
- radiator structure
- controlled component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims abstract description 14
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 4
- 238000004891 communication Methods 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000007796 conventional method Methods 0.000 abstract description 2
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000037361 pathway Effects 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000011469 building brick Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of electrically-controlled component radiator structure, comprise upper shell, lower house and PCB, PCB is arranged at upper shell and lower house coordinates in the cavity of formation, the edge of the upper and lower surface of PCB is provided with Heat Conduction Material, lower house edge is provided with the chuck for supporting PCB, and described chuck contacts with Heat Conduction Material.The utility model provides a kind of electrically-controlled component radiator structure, and efficiently radiates heat also overcomes the loaded down with trivial details poor efficiency of conventional method.
Description
Technical field
The utility model relates to a kind of automobile middle low power electronics field, is specifically related to a kind of electrically-controlled component radiator structure.
Background technology
Along with automobile electrically-controlled product is to the demand for development in lightweight, high performance, highly integrated direction, various electronic correlation device is as microprocessor (MCU), and integrated power supply, driving chip etc. are all towards multi-functional, high power, the research and development of small size direction.Therefore, automobile electrically-controlled product unit volume caloric value also constantly improves, and the heat dissipation problem of electronic building brick has become the key of electronic device stable performance, lifting.And the experience generally processing dissipation from electronic devices installs a small heat-dissipating device to device, by this to improve the area of dissipation of electronic device, strengthen heat radiation.But due to the coefficient of heat conduction of air lower, the heat that element is accumulated effectively cannot be scattered and disappeared rapidly, the usefulness of element be reduced, even reduces the life-span of element, this is intolerable for there being the automobile electrically-controlled product of high reliability request.
Utility model content
For above-mentioned technical problem, the utility model provides a kind of electrically-controlled component radiator structure, and efficiently radiates heat also overcomes the loaded down with trivial details poor efficiency of conventional method.
The utility model provides a kind of electrically-controlled component radiator structure, comprise upper shell, lower house and PCB, PCB is arranged at upper shell and lower house coordinates in the cavity of formation, the edge of the upper and lower surface of PCB is provided with Heat Conduction Material, lower house edge is provided with the chuck for supporting PCB, and described chuck contacts with Heat Conduction Material.
Described PCB end face is provided with the front pad of power device, described front pad is arranged in the edge of PCB, PCB bottom surface is provided with the bottom surface pad corresponding with front pad, and bottom surface pad is connected with front pad by multiple via hole.
Described lower house is provided with the boss that contact corresponding with bottom surface pad, and described boss inside is provided with the cavity be connected with the external world.
Described upper shell is provided with the gas port be in communication with the outside.
Described upper shell both sides are provided with mounting bracket, and the bottom surface of described mounting bracket is lower than the bottom surface of lower house.
Described boss surface is coated with heat-conducting silicone grease or conductive paste.
The edge of pcb board is all partial in power device distribution of the present utility model, to reduce thermally conductive pathways.Simultaneously for power device is provided with the upper and lower two-sided pad of pcb board, connect with several via hole between two-sided pad, so that when not increasing space, increasing heat radiation area.Lower house edge is provided with for the fixing chuck in pcb board edge, and the partial heat of pcb board assembly can directly conduct to metal shell by the Heat Conduction Material be in contact with it.And thickness is lower house shell thickness between the boss surfaces externally and internally of bottom surface contact pads, boss directly contacts with power device bottom surface pad and is led away by heat, both thermally conductive pathways was reduced, add area of dissipation, turn avoid the slow heat conduction of the injection of low heat conductivity material, and it is simple to operate, with low cost.Described upper shell both sides are respectively integrated with mounting bracket, support bottom require after upper-lower casing closes up, exceed lower house base plane, have certain space surplus after being convenient to controller entrucking, in order to controller outside air to the conductance amount of becoming popular.In addition, upper shell also has the air-vent for installing vent valve, can be beneficial to the intercommunication balance of controller outside air, in such a process, the partial heat of controller inside is also just led away.The utility model radiator structure is simple and direct, only need perform matched design to housing and pcb board, is shaped and just can implements, and need not do the guarantee of other technique and method enforcement again for the heat radiation of controller electronic building brick.Its method meets heat transfer principle, effectively can carry out the heat radiation of controller electronic building brick.
Accompanying drawing explanation
Fig. 1 is stereogram of the present utility model;
Fig. 2 is PCB assembly plan view of the present utility model;
Fig. 3 is PCB assembly upward view of the present utility model;
Fig. 4 is lower house cutaway view of the present utility model;
Fig. 5 is that radiator structure of the present utility model coordinates cutaway view.
Wherein, 1-upper shell, 11-mounting bracket, 12-gas port, 2-lower house; 21-chuck, 22-boss, 23-cavity, 3-PCB circuit board, 31-Heat Conduction Material; 32-bottom surface pad, 33-via hole, the driving integrated circuit of 4-load, 5-DC-DC integrated regulator, 6-over-current detection Protective IC.
Embodiment
Below in conjunction with Figure of description and specific embodiment, the utility model is described further:
As shown in Figure 1, the utility model provides a kind of electrically-controlled component radiator structure, comprises upper shell 1, lower house 2 and PCB 3, and PCB 3 is arranged at upper shell 1 and lower house 2 coordinates in the cavity of formation.The both sides of upper shell 1 are provided with mounting bracket 11.Described upper shell 1 is provided with the gas port 12 be in communication with the outside.When upper shell 1 and lower house are 2-in-1 hold together after, gas port 12 can make controller inner air and outer air molecule flow, thus partial heat is scattered in outside air through the flowing of air molecule again.
As shown in Figure 2; the front of pcb board 3 also namely above have multiple power device; integrated circuit 4 as driving in load; DC-DC integrated regulator 5; over-current detection Protective IC 6, they all have certain power consumption in the course of the work, produce certain heat; if do not carry out effectively, in time dispelling the heat, will be affected self and normally work with peripheral circuits.The edge of the upper and lower surface of described PCB 3 is provided with Heat Conduction Material 31, and Heat Conduction Material 31 is for covering the zinc-plated structure of copper and being only distributed in PCB three lateral edges.Conduction, the thermal conduction characteristic of metal are all higher than other nonmetallic materials.As shown in Figure 4, lower house 2 edge is provided with the chuck 21 for supporting PCB, and described chuck 21 contacts with Heat Conduction Material 31.The heat that pcb board 3 horizontal direction is conducted can utilize again the large area good contact covering the zinc-plated district 31 of copper at chuck 21 and pcb board 3 edge and lead away a part.
As shown in Figure 3, described PCB end face is provided with the front pad of power device, described front pad is arranged in the edge of PCB, and PCB 3 bottom surface is provided with the bottom surface pad 32 corresponding with front pad, and bottom surface pad 32 is connected with front pad by multiple via hole 33.As shown in Figure 4, described lower house 2 is provided with the boss 22 that contact corresponding with bottom surface pad 32, and described boss 22 inside is provided with the cavity 23 be connected with the external world.The heat of power device is passed to bottom surface pad 32 by front pad, then is passed to boss 22 via bottom surface pad 32.Boss 22 back is engraved structure, but not is formed closed with lower house outer surface, and heat directly can be distributed to outside air by the heat-dissipating space that cavity 23 is formed.Between boss 22 surfaces externally and internally, thickness is lower house 2 shell thickness, boss directly contacts with power device bottom surface pad and is led away by heat, both reduce thermally conductive pathways, added area of dissipation, turn avoid the slow heat conduction of the injection of low heat conductivity material (as air, silica gel cloth).
In this application example, lower house 2 directly connects vehicle body ground, and be not all earth terminal as the welding ends of power device, this just requires the insulating heat-conductive silica gel cloth that the interval last layer of between the bottom surface pad 32 that contacts with boss 22 and boss 22 is very thin, although substantially reduce thermally conductive pathways, its heat-conducting effect is very effective.In the application, for preventing boss 22 surface planarity bad or avoid the time to produce the not transcalent oxide layer of one deck for a long time, preferably do not having under requirement insulated from each other, at the heat-conducting silicone grease of boss 22 surface smear thin layer; If have ground connection heat conduction requirement just at the conductive paste of boss 22 surface smear thin layer, these all can make heat-conducting effect get twice the result with half the effort.
As shown in Figure 5, described upper shell 1 both sides are provided with mounting bracket 11, and the bottom surface of described mounting bracket is lower than the bottom surface of lower house.Its difference in height highly had with lower house 2 base plane of mounting bracket 11 that upper shell is integrated, just ensure that after controller entrucking, there is certain space air gap, the flowing of air can be utilized, scattering of acceleration controller heat, the heat that pcb board assembly produces fast, is effectively scattered, thus impels controller energy reliably working.
Obviously, those skilled in the art can carry out various change and modification to the utility model and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present utility model and modification belong within the scope of the utility model claim and equivalent technologies thereof, then the utility model is also intended to comprise these change and modification.
The content be not described in detail in this specification belongs to the known prior art of professional and technical personnel in the field.
Claims (6)
1. an electrically-controlled component radiator structure, comprise upper shell, lower house and PCB, PCB is arranged at upper shell and lower house coordinates in the cavity of formation, it is characterized in that the edge of the upper and lower surface of PCB is provided with Heat Conduction Material, lower house edge is provided with the chuck for supporting PCB, and described chuck contacts with Heat Conduction Material.
2. electrically-controlled component radiator structure according to claim 1, it is characterized in that PCB end face is provided with the front pad of power device, described front pad is arranged in the edge of PCB, PCB bottom surface is provided with the bottom surface pad corresponding with front pad, and bottom surface pad is connected with front pad by multiple via hole.
3. electrically-controlled component radiator structure according to claim 2, is characterized in that lower house is provided with the boss that contact corresponding with bottom surface pad, and described boss inside is provided with the cavity be connected with the external world.
4. electrically-controlled component radiator structure according to claim 3, is characterized in that upper shell is provided with the gas port be in communication with the outside.
5. electrically-controlled component radiator structure according to claim 4, is characterized in that upper shell both sides are provided with mounting bracket, and the bottom surface of described mounting bracket is lower than the bottom surface of lower house.
6. electrically-controlled component radiator structure according to claim 4, is characterized in that boss surface is coated with heat-conducting silicone grease or conductive paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420869227.5U CN204291736U (en) | 2014-12-31 | 2014-12-31 | Electrically-controlled component radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420869227.5U CN204291736U (en) | 2014-12-31 | 2014-12-31 | Electrically-controlled component radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204291736U true CN204291736U (en) | 2015-04-22 |
Family
ID=52874860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420869227.5U Expired - Fee Related CN204291736U (en) | 2014-12-31 | 2014-12-31 | Electrically-controlled component radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204291736U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105515342A (en) * | 2015-12-10 | 2016-04-20 | 广东志高空调有限公司 | Variable-frequency electric control module assembly structure |
| CN105916354A (en) * | 2016-05-24 | 2016-08-31 | 深圳威迈斯电源有限公司 | Power supply module with cofferdam |
-
2014
- 2014-12-31 CN CN201420869227.5U patent/CN204291736U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105515342A (en) * | 2015-12-10 | 2016-04-20 | 广东志高空调有限公司 | Variable-frequency electric control module assembly structure |
| CN105916354A (en) * | 2016-05-24 | 2016-08-31 | 深圳威迈斯电源有限公司 | Power supply module with cofferdam |
| CN105916354B (en) * | 2016-05-24 | 2018-09-25 | 深圳威迈斯电源有限公司 | A kind of power module with cofferdam |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 |