CN204289522U - A kind of far infrared cooling LED - Google Patents
A kind of far infrared cooling LED Download PDFInfo
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- CN204289522U CN204289522U CN201420222103.8U CN201420222103U CN204289522U CN 204289522 U CN204289522 U CN 204289522U CN 201420222103 U CN201420222103 U CN 201420222103U CN 204289522 U CN204289522 U CN 204289522U
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- far infrared
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- mineral particulate
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Abstract
The utility model provides a kind of far infrared cooling LED, comprising: substrate; Light-emitting diode chip for backlight unit, is arranged on this substrate surface; There is in this light-emitting diode chip for backlight unit periphery the fluorescent material of one deck nano-mineral particulate composite bed.Utilize the far infrared radiation of nano-mineral, the heat that light-emitting diode produces effectively is conducted, effectively reduce the operation heat of light-emitting diode, extend the life-span of light-emitting diode.
Description
Technical field
The utility model relates to a kind of semiconductor device, is specifically related to a kind of radiating mode of package structure for LED.
Background technology
Along with the development of semiconductor industry, electronic industry, various electronic component, semiconductor device comprise light-emitting component and are developed, but these products all can generate heat at work, in heat too high performance and the life-span that certainly will affect product, therefore need the heat dissipation problem considering components and parts.
Existing light-emitting diode (LED) produces a large amount of heat energy in the process of electrified light emitting, causes LED chip internal temperature to continue to rise, and causes LED chip life-span significantly rapid decay.
World's LED industry generally uses metal fin and heat-conducting glue to be close to LED chip heat exchange pattern to dispel the heat to reduce chip temperature now, or utilize heat-pipe apparatus to be attached to bottom LED chip, heat conduction is accelerated by fluid, but, because chip bottom area is very little, heat conduction velocity and heat conduction amount are restricted, and making effectively cannot derive the heat of great power LED light emitting module, have impact on its application.Therefore, the heat radiation of a large-power light-emitting diodes technical bottleneck having become high-power LED lamp to apply.
Utility model content
The utility model aims to provide a kind of radiating structure with the fluorescent material of far infrared radiator structure, to overcome the heat dissipation design shortcoming of conventional light emitting diodes.
After testing, nano-mineral particulate has Low Temperature Far Infrared line, and can radiate the Low Temperature Far Infrared line of 2-22 μm normal temperature 25 DEG C, release rate can reach more than 94%.
By nano-mineral particulate layer being arranged on material surface or wherein, because it has releasing far infrared function, directive property can be had the thermal radiation conductive-convective of material body is dispersed in air.The heat radiation of its excellence and cooling effect, can improve more than 20% by the radiating efficiency of material itself, therefore, if nano-mineral particulate to be applied to LED light source encapsulation, its life-span can be made to improve more than 20%.
Nano-mineral particulate can be selected from any mineral material, but preferred nanometer silicon, this is because nanometer silicon has the nonconducting feature of insulation, be applicable to metal, aluminum component, plastic stool associated materials, therefore the scope of application is wider.And there is good far infrared radiation ability, start to excite cooling-down effect when temperature reaches 25 DEG C.And this excitation temperature is by chance the proper temperature of protection light-emitting diodes tube coupling temperature, guarantee that chip joint temperature is no more than 25 DEG C.Like this, normal running at light-emitting diode remains on 25 DEG C, the life-span can not be impaired.
According to the aspect of for realizing the utility model target, providing a kind of far infrared cooling LED, comprising: substrate; Light-emitting diode chip for backlight unit, is arranged on this substrate surface; In this light-emitting diode chip for backlight unit periphery, there is the composite fluorescence bisque that one deck is mixed with nano-mineral particulate;
Wherein, described nano-mineral particulate composite bed comprises the phosphor powder layer of coated described light-emitting diode chip for backlight unit, and the nano-mineral particulate layer be arranged on above this phosphor powder layer or be mixed in the nano-mineral particulate of fluorescent material glue-line.
Described nano-mineral particulate composite bed comprises Multi-layer phosphor powder, and multi-layer nano mineral microparticle layer, and described phosphor powder layer and nano-mineral particulate layer are arranged alternately.
Described phosphor powder layer comprises resin and intersperses among the fluorescent material particulate in this resin; Described nano-mineral particulate layer comprises polymer and intersperses among nano-mineral particulate wherein.
Described phosphor powder layer resin used is identical with nano-mineral particulate layer polymeric material used.
Described nano-mineral particulate composite bed can also be the phosphor powder layer comprising coated described light-emitting diode chip for backlight unit, and described phosphor powder layer comprises multiple fluorescent material particulate, has a nano-mineral particulate layer in each at least one fluorescent material particulate group periphery.
Accompanying drawing explanation
Fig. 1 is the sectional view of the utility model one embodiment;
Fig. 2 is the sectional view of another embodiment of the utility model;
Fig. 3 is the sectional view of another embodiment of the utility model;
Fig. 4 is the sectional view of another embodiment of the utility model;
Fig. 5 is the utility model nano-mineral particulate lamination layer structure figure.
Embodiment
Now, describe the utility model more all sidedly with reference to the accompanying drawings, wherein, show preferred embodiment of the present utility model.But the utility model can realize in many different forms, and should not be construed and be confined to embodiment described here.On the contrary, to one skilled in the art, provide these embodiments, make the utility model fully open and cover scope of the present utility model completely.In the accompanying drawings, for the sake of clarity, can the size in amplification layer and region and relative size, and reference number identical in literary composition is for representing identical or similar parts.
Fig. 1 is the sectional view of the LED100 illustrated according to embodiment of the present utility model.Comprise with reference to Fig. 1, LED100 and have packaging body 101, packaging body can be made up of polymer or pottery.This packaging body 101 has recess 109.Electrode 103 and 104 is arranged on the basal surface of recess 109, and the sidewall surfaces of recess 109 is formed with reflecting surface 105.The basal surface of this recess is provided with LED chip 107, and LED chip 107 is connected to electrode 103 and 104.
As shown in Figure 1, in recess 109, be filled with the resin bed 110 including fluorescent material, this resin bed has the fluorescent material interspersed among wherein, thus conversion is from the wavelength of the light of LED chip 107 transmitting.Such as, resin bed 110 can be made up of the silicones of yellow fluorescent powder and epoxy resin being wherein scattered with such as YAG:Ce.Blue-light LED chip can be used from yellow fluorescent powder one and realize white light LEDs.
According to this embodiment, the resin bed that this includes fluorescent material is provided with one deck nano-mineral particulate layer 111.Wherein this nano-mineral particulate layer is formed in polymer by nano-mineral microparticulate.As nanometer silicon is scattered in polythene PE, high polymer acrylic acid PP or polyethylene terephtalate.This polymer also can adopt the material identical with the resin bed of fluorescent material.
Because nano-mineral particulate has far infrared radiation, the heat that LED chip produces can be scattered out very soon, serve cooling-down effect, have good protective effect to LED chip, extend the life-span of LED.
Fig. 2 shows the LED sectional view according to another embodiment of the utility model.With reference to Fig. 2, the LED200 of this embodiment includes lens 118 further, and lens 118 are formed at and include on the resin bed 110 of fluorescent material, are formed with one deck nano-mineral particulate layer 121 on the surface of these lens 118.Wherein this nano-mineral particulate layer is formed in polymer by nano-mineral microparticulate.As nanometer silicon is scattered in polythene PE, high polymer acrylic acid PP or polyethylene terephtalate.
Fig. 3 shows the LED sectional view according to another embodiment of the utility model.Include with reference in the lens 128 of Fig. 3, the LED300 of this embodiment the fluorescent material interspersed among wherein, when making light pass lens, carry out wavelength convert.The surface of these lens 128 is formed one deck nano-mineral particulate layer 131.Wherein this nano-mineral particulate layer is formed in polymer by nano-mineral microparticulate.As nanometer silicon is scattered in polythene PE, high polymer acrylic acid PP or polyethylene terephtalate.
In order to improve the radiating effect of nano-mineral particulate further, this nano-mineral particulate layer and the resin bed including fluorescent material can be arranged alternately, as shown in figure 4, fluorescent material resin bed 110 and nano-mineral particulate layer 111 in the recess 109 of the packaging body 101 of the LED 400 of this embodiment, are arranged alternately.Wherein this nano-mineral particulate layer is formed in polymer by nano-mineral microparticulate.As nanometer silicon is scattered in polythene PE, high polymer acrylic acid PP or polyethylene terephtalate.This polymer also can adopt the material identical with the resin bed of fluorescent material.
Further, can by this nano-mineral particle encapsulation around fluorescence powder ball, as shown in Figure 5, a coated nano-mineral particulate layer 511 around the micro-group of fluorescent material 510, in this embodiment, the micro-group 510 of fluorescent material is Ge little Wei groups, it is the resin particle comprising at least one fluorescent material particulate 5101, and nano-mineral particulate layer 511 at least one nano-mineral particulate 5111 is dispersed in polythene PE, high polymer acrylic acid PP, or in the polymer such as polyethylene terephtalate, the material that this polymer also can adopt the resin-phase of micro-group with fluorescent material same.Because nano-mineral particulate can closer to fluorescent material particulate, therefore, it is possible to dispel the heat better.
Although illustrate and describe the utility model in conjunction with the preferred embodiments, it will be understood by those skilled in the art that when not deviating from the spirit and scope of the present utility model limited by claims, can modify and change.
Claims (6)
1. a far infrared cooling LED, comprising:
Substrate;
Light-emitting diode chip for backlight unit, is arranged on this substrate surface;
It is characterized in that:
There is in this light-emitting diode chip for backlight unit periphery one deck nano-mineral particulate composite bed.
2. far infrared cooling LED according to claim 1, is characterized in that, described nano-mineral particulate composite bed comprises the phosphor powder layer of coated described light-emitting diode chip for backlight unit, and is arranged on above this phosphor powder layer or the nano-mineral particulate layer of the inside.
3. far infrared cooling LED according to claim 1, is characterized in that, described nano-mineral particulate composite bed comprises Multi-layer phosphor powder, and multi-layer nano mineral microparticle layer, and described phosphor powder layer and nano-mineral particulate layer are arranged alternately.
4. the far infrared cooling LED according to Claims 2 or 3, is characterized in that, described phosphor powder layer resin used is identical with nano-mineral particulate layer polymeric material used.
5. according to the far infrared cooling LED in claim 1-3 described in any one, it is characterized in that, nano-mineral particulate is nanometer silicon.
6. far infrared cooling LED according to claim 4, is characterized in that, nano-mineral particulate is nanometer silicon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420222103.8U CN204289522U (en) | 2014-05-04 | 2014-05-04 | A kind of far infrared cooling LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420222103.8U CN204289522U (en) | 2014-05-04 | 2014-05-04 | A kind of far infrared cooling LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204289522U true CN204289522U (en) | 2015-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420222103.8U Expired - Fee Related CN204289522U (en) | 2014-05-04 | 2014-05-04 | A kind of far infrared cooling LED |
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| Country | Link |
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| CN (1) | CN204289522U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108474547A (en) * | 2015-08-26 | 2018-08-31 | 思恩瑟莫伊克斯钦基有限公司 | Vacuum core circuit plate |
| CN110970541A (en) * | 2018-09-29 | 2020-04-07 | 有研稀土新材料股份有限公司 | Semiconductor light source and optical device prepared by same |
-
2014
- 2014-05-04 CN CN201420222103.8U patent/CN204289522U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108474547A (en) * | 2015-08-26 | 2018-08-31 | 思恩瑟莫伊克斯钦基有限公司 | Vacuum core circuit plate |
| CN110970541A (en) * | 2018-09-29 | 2020-04-07 | 有研稀土新材料股份有限公司 | Semiconductor light source and optical device prepared by same |
| CN110970541B (en) * | 2018-09-29 | 2023-04-21 | 有研稀土新材料股份有限公司 | Semiconductor light source and optical device prepared by same |
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| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Lu Hanxiong Document name: Notification of Termination of Patent Right |
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| DD01 | Delivery of document by public notice | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20190504 |
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| CF01 | Termination of patent right due to non-payment of annual fee |