CN103956358A - Heat dissipation structure and heat dissipation method of LED module - Google Patents
Heat dissipation structure and heat dissipation method of LED module Download PDFInfo
- Publication number
- CN103956358A CN103956358A CN201410193836.8A CN201410193836A CN103956358A CN 103956358 A CN103956358 A CN 103956358A CN 201410193836 A CN201410193836 A CN 201410193836A CN 103956358 A CN103956358 A CN 103956358A
- Authority
- CN
- China
- Prior art keywords
- chip
- led
- heat
- heat dissipation
- led module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The invention provides a heat dissipation structure of an LED module. The heat dissipation structure comprises a heat dissipation substrate, an adhesion layer, a plurality of LED chips and lateral heat dissipation materials, wherein the adhesion layer is formed on the heat dissipation substrate, the LED chips evenly adhere to the adhesion layer, and spaces between the LED chips are filled with the lateral heat dissipation materials. The heat dissipation structure of the LED module has the advantages of being simple in structure, low in working temperature, small in thermal resistance and good in heat dissipation effect. The invention further provides a heat dissipation method of the heat dissipation structure of the LED module.
Description
Technical field
The present invention relates to a kind of heat dissipating method, relate in particular to a kind of radiator structure and heat dissipating method of LED module.
Background technology
Because LED light fixture has high brightness, the effect such as energy-conservation, use more and more in various occasions, but because caloric value is larger, often need heat radiation to ensure that it normally works, the maximum technology barriers that restricting at present LED light source development are exactly heat conduction and hot settlement issues, the i.e. heat dissipation problem of LED of LED encapsulation.LED is as light source, and work also can produce a large amount of thermal accumlations for a long time, and this just requires the radiating element operating efficiency of LED light source good, can remove to dredge heat energy by shorter pathway, reduces the infringement that excess Temperature brings to chip as far as possible.In (not filling heat sink material) prior art, do not fill encapsulating structure and the method for packing of heat sink material in side, chip sides heat dissipation channel disappearance, on horizontal plane, density of heat flow rate is high, and overall thermal resistance is high.
Summary of the invention
The object of the invention is to, a kind of radiator structure of LED module is provided, there is the advantages such as simple in structure, working temperature reduces, thermal resistance is little.
Another object of the present invention is to, a kind of heat dissipating method of LED module is provided, there is good heat dissipation effect.
The radiator structure that the invention provides a kind of LED module, comprising:
One heat-radiating substrate;
One tack coat, its be formed on heat-radiating substrate above;
Multiple LED chips, its be evenly bonded in tack coat above;
One side heat sink material, it is filled between each LED chip.
The present invention also provides a kind of heat dissipating method of LED module, and it is to adopt as foregoing radiator structure, comprises the steps:
Step S1: die bond, multiple LED chips are evenly bonded in to the appointed area of LED support, form heat passage or electric pathway;
Step S2: at the filling side, all sides of each LED chip heat sink material;
Step S3: routing, connects the electrode of each LED chip;
Step S4: encapsulating on each LED chip 3 and side heat sink material, completes the step of heat dissipating method.
The invention has the beneficial effects as follows, increase LED chip 3 side heat dissipation channels, impel heat to spread in the horizontal direction, improve module horizontal plane thermal uniformity, thereby reduce module overall thermal resistance.
Brief description of the drawings
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated, wherein:
Fig. 1 is that the present invention is the cross section structure schematic diagram of the radiator structure of LED module;
Fig. 2 is that the present invention is the Facad structure schematic diagram of the radiator structure of LED module;
Fig. 3 is flow chart of steps of the present invention.
Embodiment
Refer to shown in Fig. 1 and Fig. 2, the invention provides a kind of radiator structure of LED module, comprising:
One heat-radiating substrate 1, this baseplate material is copper, also can be aluminium, silicon, pottery, glass fiber reinforced polymer, tungsten copper, molybdenum copper, native graphite reinforced epoxy, serialization carbon fibre enhancing polymer, discontinuum carbon fibre enhancing copper, carborundum granule-reinforced copper, discontinuous carbon fibre strengthens carborundum, and foamy carbon strengthens copper etc.;
One tack coat 2, its be formed on heat-radiating substrate 1 above, this bonding layer material for silver slurry, also can be heat-conducting silicone grease, golden tin, gold, Jin Zhe, graphite etc.;
Multiple LED chips 3, its be evenly bonded in tack coat 2 above, described LED chip 3 is positive cartridge chip, flip-chip or vertical chip, chip base is sapphire, carborundum etc.;
One side heat sink material 4, it is filled between each LED chip 3, and described heat sink material 4 is silver-colored slurry, heat-conducting silicone grease, diamond, pottery, silicon chip or golden soldering sheet.Between each LED chip 3, fill side heat sink material 4, increase LED chip 3 side heat dissipation channels, impel heat to spread in the horizontal direction, improve module horizontal plane thermal uniformity, thereby reduce module overall thermal resistance, improve luminous power.
Refer to described in Fig. 3, simultaneously in conjunction with consulting Fig. 1 and Fig. 2, the heat dissipating method of a kind of LED module of the present invention, it is to adopt aforesaid radiator structure, comprises the steps:
Step S1: die bond, multiple LED chips 3 are evenly bonded in to the appointed area of LED support, form heat passage or electric pathway, described LED chip 3 is positive cartridge chip, flip-chip or vertical chip, when die bond, at normal temperatures, use silver slurry, by die bond machine or artificial die bond, also can pass through eutectic machine, use golden soldering sheet 400 degrees Celsius of lower die bonds;
Step S2: at the filling side, all sides of each LED chip 3 heat sink material 4, described side heat sink material 4 is silver-colored slurry, heat-conducting silicone grease, diamond, pottery, silicon chip or golden soldering sheet;
Step S3: routing, connect the electrode of each LED chip 3, can beat gold thread by automatic wire bonder, also can beat gold thread with ball attachment machine, flip-chip is without routing;
Step S4: encapsulating on each LED chip 3 and side heat sink material 4, the filling mode of the side heat sink material 4 that fill the side of described LED chip 3 comprises direct filling, heating filling, fills or the filling of pressing bonding by binding agent, completes the step of heat dissipating method.Silver slurry, heat-conducting silicone grease isocolloid or powder body material, can directly fill.The solid materials such as diamond, pottery, silicon chip, can fill or the filling of pressing bonding by binding agent, and the materials such as golden soldering sheet can be filled by heating.The filling thickness of side heat sink material 4 is not higher than chip thickness.
Above-described specific embodiment; object of the present invention, technical scheme and beneficial effect are further described; be understood that; the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. a radiator structure for LED module, comprising:
One heat-radiating substrate;
One tack coat, its be formed on heat-radiating substrate above;
Multiple LED chips, its be evenly bonded in tack coat above;
One side heat sink material, it is filled between each LED chip.
2. the radiator structure of LED module according to claim 1, wherein said LED chip is positive cartridge chip, flip-chip or vertical chip.
3. the radiator structure of LED module according to claim 1, wherein said heat sink material is silver-colored slurry, heat-conducting silicone grease, diamond, pottery, silicon chip or golden soldering sheet.
4. a heat dissipating method for LED module, it is to adopt radiator structure as claimed in claim 1, comprises the steps:
Step S1: die bond, multiple LED chips are evenly bonded in to the appointed area of LED support, form heat passage or electric pathway;
Step S2: at the filling side, all sides of each LED chip heat sink material;
Step S3: routing, connects the electrode of each LED chip;
Step S4: encapsulating on each LED chip 3 and side heat sink material, completes the step of heat dissipating method.
5. the heat dissipating method of LED module according to claim 4, wherein said LED chip is positive cartridge chip, flip-chip or vertical chip.
6. the heat dissipating method of LED module according to claim 4, wherein said side heat sink material is silver-colored slurry, heat-conducting silicone grease, diamond, pottery, silicon chip or golden soldering sheet.
7. the heat dissipating method of LED module according to claim 4, the filling mode that heat sink material is filled in the side of wherein said LED chip comprises direct filling, heating filling, fills or the filling of pressing bonding by binding agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410193836.8A CN103956358A (en) | 2014-05-08 | 2014-05-08 | Heat dissipation structure and heat dissipation method of LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410193836.8A CN103956358A (en) | 2014-05-08 | 2014-05-08 | Heat dissipation structure and heat dissipation method of LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103956358A true CN103956358A (en) | 2014-07-30 |
Family
ID=51333611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410193836.8A Pending CN103956358A (en) | 2014-05-08 | 2014-05-08 | Heat dissipation structure and heat dissipation method of LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103956358A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104534421A (en) * | 2014-12-24 | 2015-04-22 | 中国科学院半导体研究所 | LED light source module with highlight power density |
| CN106231780A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board and there is its mobile terminal |
| CN107654951A (en) * | 2017-10-31 | 2018-02-02 | 顾哲锴 | A kind of energy-saving desk lamp |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101876406A (en) * | 2009-12-14 | 2010-11-03 | 东莞市光宇新能源科技有限公司 | Technique for manufacturing high-power light emitting diode (LED) lamp |
| CN201715318U (en) * | 2010-06-26 | 2011-01-19 | 中山市世耀光电科技有限公司 | LED area light source |
| CN203589071U (en) * | 2013-04-18 | 2014-05-07 | 深圳市聚飞光电股份有限公司 | An LED support and an LED |
-
2014
- 2014-05-08 CN CN201410193836.8A patent/CN103956358A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101876406A (en) * | 2009-12-14 | 2010-11-03 | 东莞市光宇新能源科技有限公司 | Technique for manufacturing high-power light emitting diode (LED) lamp |
| CN201715318U (en) * | 2010-06-26 | 2011-01-19 | 中山市世耀光电科技有限公司 | LED area light source |
| CN203589071U (en) * | 2013-04-18 | 2014-05-07 | 深圳市聚飞光电股份有限公司 | An LED support and an LED |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104534421A (en) * | 2014-12-24 | 2015-04-22 | 中国科学院半导体研究所 | LED light source module with highlight power density |
| CN106231780A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb board and there is its mobile terminal |
| CN107654951A (en) * | 2017-10-31 | 2018-02-02 | 顾哲锴 | A kind of energy-saving desk lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5219445B2 (en) | Light emitting diode device | |
| Sim et al. | Characteristic enhancement of white LED lamp using low temperature co-fired ceramic-chip on board package | |
| Luo et al. | Chip packaging: Encapsulation of nitride LEDs | |
| CN104534421A (en) | LED light source module with highlight power density | |
| CN101369615B (en) | Packaging method for low-thermal resistance high-power light-emitting diode | |
| CN105932019A (en) | Large power LED structure adopting COB packaging | |
| CN103956358A (en) | Heat dissipation structure and heat dissipation method of LED module | |
| CN103928577A (en) | Plate type LED packaging method and LED packaged with method | |
| CN204118067U (en) | Directly be packaged in the LED chip encapsulation architecture of radiator | |
| CN203192859U (en) | Heat-dissipating lead frame structure | |
| CN201796962U (en) | LED (light-emitting diode) light source module with high heat conductivity and low junction temperature | |
| CN102194787A (en) | Electronic component | |
| CN208208753U (en) | A kind of superelevation optical power density LED light source | |
| CN108807643B (en) | A kind of semiconductor package and its manufacturing method | |
| CN201502995U (en) | LED heat dissipation device | |
| CN103579210B (en) | The connection of light emitting diode and heat-radiating substrate | |
| CN104022193B (en) | The method for packing and device of Rimless LED | |
| CN105609496A (en) | High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof | |
| CN201956389U (en) | High-heat-conduction LED light source module | |
| WO2015003402A1 (en) | Bearing heat-dissipating plate, led light source of remote fluorescent powder structure and production method therefor | |
| CN204289522U (en) | A kind of far infrared cooling LED | |
| CN105977227A (en) | Integrated circuit package with composite substrate | |
| CN102386311B (en) | Integrated light-emitting diode (LED) light source and manufacturing method thereof | |
| CN201478339U (en) | LED heat dissipation device | |
| CN202948978U (en) | White-light light-emitting diode (LED) apparatus with cubic boron nitride film for promoting cooling of chips |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140730 |