CN103557506A - Radiating structure of LED (light-emitting diode) lamp - Google Patents
Radiating structure of LED (light-emitting diode) lamp Download PDFInfo
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- CN103557506A CN103557506A CN201310527381.4A CN201310527381A CN103557506A CN 103557506 A CN103557506 A CN 103557506A CN 201310527381 A CN201310527381 A CN 201310527381A CN 103557506 A CN103557506 A CN 103557506A
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Abstract
The invention relates to a radiating structure of an LED (light-emitting diode) lamp. The LED lamp comprises a substrate for bearing integrally packaged LED lamp beads, the radiating structure comprises a heat conducting part and a radiating layer exposed in the air, the heat conducting layer is fitted with the substrate, the outer side of at least part of the heat conducting part is coated with the radiating layer, the heat conducting part and the radiating layer are both made of heat conducting composite plastics, the heat conducting coefficient of the heat conducting part is greater than that of the radiating layer, and the radiating coefficient of the radiating layer is greater than that of the heat conducting part. The invention aims to provide the radiating structure of the LED lamp, which is good in heat radiating capability, convenient to process and easy for realizing automated mass production.
Description
Technical field
the present invention relates to a kind of radiator structure of LED light fixture.
Background technology
along with LED(Light Emitting Diode, Light-Emitting Diode) development of technology, LED obtains applying more and more widely at lighting field, therefore its heat dissipation problem has also obtained paying close attention to more and more widely, and particularly, in high-power LED lamp, great power LED has large specified operating current, its power output major part is converted into heat by conduction, if do not take cooling measure, the heat of accumulation will cause the excess Temperature of LED chip, thereby will affect luminous efficiency and the life-span of LED light fixture.
in prior art, in the scheme of the heat dissipation problem of solution LED light fixture, more effective and common mode is, under LED substrate, radiator is set, and in order to the heat that LED chip is produced, conducts and distributes.Radiator for LED light fixture mainly has following three kinds of structures: 1, aluminium alloy heat radiator, the aluminium alloy base substrate of forming can be used in LED light fixture via surface treatment rears such as surperficial anode processing or baking vanish or spraying heat radiation paints, the contour machining procedure of visible aluminium alloy heat radiator belongs to highly energy-consuming technique mostly, in addition for security consideration, must carry out protection against electric shock design; 2, the radiator of aluminium alloy outer cladding heat-conducting plastic, aluminium alloy still will be through the mode moulding such as high temperature die casting, and carries out after surface treatment injection-moulded plastic again, and it needs two kinds of processes, and process is complicated, cost is high and it is high to consume energy; 3, the radiator of being made by heat-conducting plastic completely, heat transfer is fast not, radiating effect is bad, can only be applicable to the LED light fixture below 0.1W.
Summary of the invention
for the problems referred to above, the object of this invention is to provide a kind of LED lamp cooling structure, its heat-sinking capability is good and easy to process, is easy to automation and produces in a large number.
for solving the problems of the technologies described above, the technical solution used in the present invention is:
a kind of radiator structure of LED light fixture, this LED light fixture comprises the substrate of the LED lamp pearl that carries integration packaging, described radiator structure comprises heat-conducting part and is exposed to airborne heat dissipating layer, described heat-conducting part and substrate fit, and the outside of heat-conducting part is coated with described heat dissipating layer at least partly, described heat-conducting part, heat dissipating layer are made by heat conduction composite plastic, and the thermal conductivity factor of described heat-conducting part is greater than the thermal conductivity factor of heat dissipating layer, and the coefficient of heat transfer of described heat dissipating layer is greater than the coefficient of heat transfer of heat-conducting part.
preferably, the thermal conductivity factor of described heat-conducting part is 10 ~ 100W/mK.
preferably, the thermal conductivity factor of described heat dissipating layer is 1 ~ 10W/mK.
preferably, described heat-conducting part and heat dissipating layer are integrated injection molded.
in some specific embodiment, described baseplate-laminating is on the upper surface of heat-conducting part, described heat dissipating layer is coated on the outer surface of described heat-conducting part sidewall, and the upper surface of described heat-conducting part is also established lampshade for cover, and the bottom of described heat dissipating layer is for being connected with lamp holder.
preferably, on the outer surface of described heat dissipating layer, along it, extend radially outwardly and be formed with a plurality of radiating fins.
in some specific embodiment, described heat-conducting part has a uncovered cavity and the wall that surrounds this cavity, and described substrate is arranged in described cavity, and the upper port of described cavity is established lampshade for cover, and described heat dissipating layer is coated on the outer surface of heat-conducting part.
in some more specific embodiment, described heat-conducting part extends radially outward and is formed with a ring-shaped platform at the upper port place of described cavity, and the surrounding of described ring-shaped platform is coated with described heat dissipating layer.
in some more specific embodiment, described heat dissipating layer extends radially outward and is formed with a ring-shaped platform at the upper port place of described cavity.
the present invention adopts above structure, tool has the following advantages compared to existing technology: adopt two kinds of heat-conducting plastics that thermal conductivity factor is different, on the plastics of good heat conductivity, fit LED chip so that the heat that LED chip produces can conduct as early as possible, at the plastics of the plastics outer cladding perfect heat-dissipating of good heat conductivity, so that the heat that conduction comes can be distributed in air with prestissimo, reach the object of quick heat radiating; In addition, two kinds of plastics can be integrally formed by double-material injection-molding technique, and processing technology is simple, is easy to full-automatic a large amount of production.
Accompanying drawing explanation
fig. 1 is the structural representation of the embodiment of the present invention one;
fig. 2 is the embodiment of the present invention one cutaway view vertically;
fig. 3 is the structural representation of the embodiment of the present invention two;
fig. 4 be in Fig. 3 B-B to cutaway view.
wherein: 11, heat-conducting part; 12, heat dissipating layer; 121, radiating fin;
21, heat-conducting part; 211, cavity; 22, heat dissipating layer; 23, ring-shaped platform.
The specific embodiment
below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be those skilled in the art will recognize that, protection scope of the present invention is made to more explicit defining.
embodiment mono-
shown in Fig. 1, Fig. 2, a kind of radiator structure of LED light fixture, this LED light fixture comprises the substrate of the LED lamp pearl that carries integration packaging, described radiator structure comprises heat-conducting part 11 and is exposed to airborne heat dissipating layer 12, described heat-conducting part 11 fits with substrate, and the outside of heat-conducting part 11 is coated with described heat dissipating layer 12 at least partly, described heat-conducting part 11, heat dissipating layer 12 are made by heat conduction composite plastic, the thermal conductivity factor of described heat-conducting part 11 is greater than the thermal conductivity factor of heat dissipating layer 12, and the coefficient of heat transfer of described heat dissipating layer 12 is greater than the coefficient of heat transfer of heat-conducting part 11.
particularly, this LED light fixture also comprises lampshade, lamp holder and the drive circuit for LED lamp pearl is covered, drive circuit is built in lamp holder or together with LED lamp pearl and is arranged on substrate, described baseplate-laminating is on the upper surface of heat-conducting part 11, described heat dissipating layer 12 is coated on the outer surface of described heat-conducting part 11 sidewalls, the upper surface of described heat-conducting part 11 is also established lampshade for cover, and the bottom of described heat dissipating layer 12 is for being connected with lamp holder.Heat dissipating layer 12 can partially or completely be coated the outer surface of heat-conducting part 11 sidewalls, and when completely coated, radiating effect is best.In addition, heat-conducting part 11 also can be coated heat dissipating layer 12 being provided with on the upper surface of substrate, but substrate must fit tightly with the upper surface of heat-conducting part 11.
the thermal conductivity factor of described heat-conducting part is 10 ~ 100W/mK.The thermal conductivity factor of described heat dissipating layer is 1 ~ 10W/mK.
described heat-conducting part 11 is integrated injection molded with heat dissipating layer 12.Except adopting the one-shot forming of double-material injection-molding technique, also injection moulding at twice.
on the outer surface of described heat dissipating layer 12, along it, extend radially outwardly and be formed with a plurality of radiating fins 121, with further increasing heat radiation area, improve radiating effect.
this LED light fixture is LED bulb lamp, and the radiator structure in the present embodiment is directly as the lamp socket of LED bulb lamp.
embodiment bis-
shown in Fig. 3, Fig. 4, a kind of radiator structure of LED light fixture, this LED light fixture comprises the substrate of the LED lamp pearl that carries integration packaging, described radiator structure comprises heat-conducting part 21 and is exposed to airborne heat dissipating layer 22, described heat-conducting part 21 fits with substrate, and the outside of heat-conducting part 21 is coated with described heat dissipating layer 22 at least partly, described heat-conducting part 21, heat dissipating layer 22 are made by heat conduction composite plastic, the thermal conductivity factor of described heat-conducting part 21 is greater than the thermal conductivity factor of heat dissipating layer 22, and the coefficient of heat transfer of described heat dissipating layer 22 is greater than the coefficient of heat transfer of heat-conducting part 21.
particularly, this LED light fixture also comprises the lampshade for LED lamp pearl is covered, described heat-conducting part 21 has a uncovered cavity 211 and the wall that surrounds this cavity, described substrate is arranged in described cavity 211, the upper port of described cavity 211 is established lampshade for cover, and described heat dissipating layer 22 is coated on the outer surface of heat-conducting part 21.Heat dissipating layer 22 can partially or completely be coated the outer surface of heat-conducting part 21, and when completely coated, radiating effect is best.In addition, on the inner surface of the cavity 211 of heat-conducting part 21, also can be coated heat dissipating layer 12, but substrate must fit tightly with the wall of heat-conducting part 21.
described heat-conducting part 21 extends radially outward and is formed with a ring-shaped platform 23 at the upper port place of described cavity 211, and the surrounding of described ring-shaped platform 23 is coated with described heat dissipating layer 22.
the thermal conductivity factor of described heat-conducting part is 10 ~ 100W/mK.The thermal conductivity factor of described heat dissipating layer is 1 ~ 10W/mK.
described heat-conducting part 21 is integrated injection molded with heat dissipating layer 22.Except adopting the one-shot forming of double-material injection-molding technique, also injection moulding at twice.
ring-shaped platform 22 also can directly be extended radially outward and form at the upper port place of cavity 211 by heat dissipating layer 22.In addition, ring-shaped platform 22 also can be directly injection molded by common plastics.
this LED light fixture is Down lamp.
tool of the present invention has the following advantages: adopt two kinds of heat-conducting plastics that thermal conductivity factor is different, on the plastics of good heat conductivity, fit LED chip so that the heat that LED chip produces can conduct as early as possible, at the plastics of the plastics outer cladding perfect heat-dissipating of good heat conductivity, so that the heat that conduction comes can be distributed in air with prestissimo, reach the object of quick heat radiating; In addition, two kinds of plastics can be integrally formed by double-material injection-molding technique, and processing technology is simple, is easy to automatically a large amount of production, owing to having saved the time of Al-alloy parts processing polishing, can effectively save manually, further cuts down finished cost.
radiator structure of the present invention can be applicable in the LED light fixtures such as LED bulb lamp, LED shot-light, LED Down lamp.
above-described embodiment, for explanation technical conceive of the present invention and feature, is only a kind of preferred embodiment, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.The equivalence that all Spirit Essences according to the present invention are done changes or modifies, within all should being encompassed in protection scope of the present invention.
Claims (9)
1. the radiator structure of a LED light fixture, this LED light fixture comprises the substrate of the LED lamp pearl that carries integration packaging, it is characterized in that: described radiator structure comprises heat-conducting part and is exposed to airborne heat dissipating layer, described heat-conducting part and substrate fit, and the outside of heat-conducting part is coated with described heat dissipating layer at least partly, described heat-conducting part, heat dissipating layer are made by heat conduction composite plastic, the thermal conductivity factor of described heat-conducting part is greater than the thermal conductivity factor of heat dissipating layer, and the coefficient of heat transfer of described heat dissipating layer is greater than the coefficient of heat transfer of heat-conducting part.
2. the radiator structure of LED light fixture according to claim 1, is characterized in that: the thermal conductivity factor of described heat-conducting part is 10 ~ 100W/mK.
3. the radiator structure of LED light fixture according to claim 1, is characterized in that: the thermal conductivity factor of described heat dissipating layer is 1 ~ 10W/mK.
4. the radiator structure of LED light fixture according to claim 1, is characterized in that: described heat-conducting part and heat dissipating layer are integrated injection molded.
5. the radiator structure of LED light fixture according to claim 1, it is characterized in that: described baseplate-laminating is on the upper surface of heat-conducting part, described heat dissipating layer is coated on the outer surface of described heat-conducting part sidewall, the upper surface of described heat-conducting part is also established lampshade for cover, and the bottom of described heat dissipating layer is for being connected with lamp holder.
6. the radiator structure of LED light fixture according to claim 5, is characterized in that: on the outer surface of described heat dissipating layer, along it, extend radially outwardly and be formed with a plurality of radiating fins.
7. the radiator structure of LED light fixture according to claim 1, it is characterized in that: described heat-conducting part has a uncovered cavity and the wall that surrounds this cavity, described substrate is arranged in described cavity, the upper port of described cavity is established lampshade for cover, and described heat dissipating layer is coated on the outer surface of heat-conducting part.
8. the radiator structure of LED light fixture according to claim 7, is characterized in that: described heat-conducting part extends radially outward and is formed with a ring-shaped platform at the upper port place of described cavity, and the surrounding of described ring-shaped platform is coated with described heat dissipating layer.
9. the radiator structure of LED light fixture according to claim 7, is characterized in that: described heat dissipating layer extends radially outward and is formed with a ring-shaped platform at the upper port place of described cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310527381.4A CN103557506A (en) | 2013-10-31 | 2013-10-31 | Radiating structure of LED (light-emitting diode) lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310527381.4A CN103557506A (en) | 2013-10-31 | 2013-10-31 | Radiating structure of LED (light-emitting diode) lamp |
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| CN103557506A true CN103557506A (en) | 2014-02-05 |
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| CN201310527381.4A Pending CN103557506A (en) | 2013-10-31 | 2013-10-31 | Radiating structure of LED (light-emitting diode) lamp |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106439757A (en) * | 2016-10-11 | 2017-02-22 | 夏孔能 | LED lamp cooling structure |
| CN109140385A (en) * | 2018-10-15 | 2019-01-04 | 华域视觉科技(上海)有限公司 | A kind of car light part and preparation method thereof with anti-focusing heat sinking function |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201795452U (en) * | 2010-07-23 | 2011-04-13 | 董金浩 | Heat radiator of light emitting diode (LED) lamp |
| CN202267043U (en) * | 2011-09-07 | 2012-06-06 | 隆达电子股份有限公司 | Solid-state light-emitting semiconductor lamp and heat dissipation device thereof |
| CN202511241U (en) * | 2012-03-13 | 2012-10-31 | 苏州东亚欣业节能照明有限公司 | Radiating device and LED (Light-Emitting Diode) lamp applying same |
| CN102939501A (en) * | 2010-04-02 | 2013-02-20 | Ge照明解决方案有限责任公司 | Lightweight heat sinks and led lamps employing same |
| CN202769597U (en) * | 2012-06-06 | 2013-03-06 | 广州市鸿利光电股份有限公司 | LED lamp radiating device |
| CN103047558A (en) * | 2012-11-23 | 2013-04-17 | 苏州东亚欣业节能照明有限公司 | Light emitting diode (LED) fluorescent lamp |
| US20130176731A1 (en) * | 2012-01-06 | 2013-07-11 | Wen-Lung Chin | LED Lamp |
| CN203099762U (en) * | 2013-02-06 | 2013-07-31 | 珠海市远康企业有限公司 | Heat dissipation machine of light emitting diode (LED) bulb lamp |
| CN203131533U (en) * | 2012-11-26 | 2013-08-14 | 苏州东亚欣业节能照明有限公司 | LED ball lamp |
| CN203586142U (en) * | 2013-10-31 | 2014-05-07 | 苏州东亚欣业节能照明有限公司 | Heat dissipation structure of LED lamp |
-
2013
- 2013-10-31 CN CN201310527381.4A patent/CN103557506A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102939501A (en) * | 2010-04-02 | 2013-02-20 | Ge照明解决方案有限责任公司 | Lightweight heat sinks and led lamps employing same |
| CN201795452U (en) * | 2010-07-23 | 2011-04-13 | 董金浩 | Heat radiator of light emitting diode (LED) lamp |
| CN202267043U (en) * | 2011-09-07 | 2012-06-06 | 隆达电子股份有限公司 | Solid-state light-emitting semiconductor lamp and heat dissipation device thereof |
| US20130176731A1 (en) * | 2012-01-06 | 2013-07-11 | Wen-Lung Chin | LED Lamp |
| CN202511241U (en) * | 2012-03-13 | 2012-10-31 | 苏州东亚欣业节能照明有限公司 | Radiating device and LED (Light-Emitting Diode) lamp applying same |
| CN202769597U (en) * | 2012-06-06 | 2013-03-06 | 广州市鸿利光电股份有限公司 | LED lamp radiating device |
| CN103047558A (en) * | 2012-11-23 | 2013-04-17 | 苏州东亚欣业节能照明有限公司 | Light emitting diode (LED) fluorescent lamp |
| CN203131533U (en) * | 2012-11-26 | 2013-08-14 | 苏州东亚欣业节能照明有限公司 | LED ball lamp |
| CN203099762U (en) * | 2013-02-06 | 2013-07-31 | 珠海市远康企业有限公司 | Heat dissipation machine of light emitting diode (LED) bulb lamp |
| CN203586142U (en) * | 2013-10-31 | 2014-05-07 | 苏州东亚欣业节能照明有限公司 | Heat dissipation structure of LED lamp |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106439757A (en) * | 2016-10-11 | 2017-02-22 | 夏孔能 | LED lamp cooling structure |
| CN109140385A (en) * | 2018-10-15 | 2019-01-04 | 华域视觉科技(上海)有限公司 | A kind of car light part and preparation method thereof with anti-focusing heat sinking function |
| CN109140385B (en) * | 2018-10-15 | 2023-09-01 | 华域视觉科技(上海)有限公司 | Car lamp part with anti-focusing and heat-dissipating functions and preparation method thereof |
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Application publication date: 20140205 |