CN203650165U - 一种磨削碳化硅晶体端面的装置 - Google Patents
一种磨削碳化硅晶体端面的装置 Download PDFInfo
- Publication number
- CN203650165U CN203650165U CN201420046844.5U CN201420046844U CN203650165U CN 203650165 U CN203650165 U CN 203650165U CN 201420046844 U CN201420046844 U CN 201420046844U CN 203650165 U CN203650165 U CN 203650165U
- Authority
- CN
- China
- Prior art keywords
- crystal
- grinding
- positional cylinder
- silicon carbide
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000013078 crystal Substances 0.000 title claims abstract description 90
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 17
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title abstract description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 23
- 239000003921 oil Substances 0.000 abstract description 22
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- 238000005498 polishing Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 3
- 229910001651 emery Inorganic materials 0.000 description 16
- 238000000034 method Methods 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000001788 irregular Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420046844.5U CN203650165U (zh) | 2014-01-24 | 2014-01-24 | 一种磨削碳化硅晶体端面的装置 |
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CN201420046844.5U CN203650165U (zh) | 2014-01-24 | 2014-01-24 | 一种磨削碳化硅晶体端面的装置 |
Publications (1)
Publication Number | Publication Date |
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CN203650165U true CN203650165U (zh) | 2014-06-18 |
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CN201420046844.5U Expired - Lifetime CN203650165U (zh) | 2014-01-24 | 2014-01-24 | 一种磨削碳化硅晶体端面的装置 |
Country Status (1)
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CN (1) | CN203650165U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103722460A (zh) * | 2014-01-24 | 2014-04-16 | 山东天岳先进材料科技有限公司 | 一种磨削碳化硅晶体端面的方法及装置 |
CN108838870A (zh) * | 2018-06-05 | 2018-11-20 | 王青 | 一种半导体晶圆研磨设备 |
-
2014
- 2014-01-24 CN CN201420046844.5U patent/CN203650165U/zh not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103722460A (zh) * | 2014-01-24 | 2014-04-16 | 山东天岳先进材料科技有限公司 | 一种磨削碳化硅晶体端面的方法及装置 |
CN108838870A (zh) * | 2018-06-05 | 2018-11-20 | 王青 | 一种半导体晶圆研磨设备 |
CN108838870B (zh) * | 2018-06-05 | 2020-02-14 | 南通瑞森光学股份有限公司 | 一种半导体晶圆研磨设备 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Device for grinding silicon carbide crystal head face Effective date of registration: 20170912 Granted publication date: 20140618 Pledgee: Prudential Bank Ji'nan branch of Limited by Share Ltd. Pledgor: SICC Co.,Ltd. Registration number: 2017370000138 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20180208 Granted publication date: 20140618 Pledgee: Prudential Bank Ji'nan branch of Limited by Share Ltd. Pledgor: SICC Co.,Ltd. Registration number: 2017370000138 |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: No.99, Tianyue South Road, Huaiyin District, Jinan City, Shandong Province Patentee after: Shandong Tianyue advanced technology Co.,Ltd. Address before: 3-409, Yinhe building, 2008 Xinluo street, Lixia District, Jinan City, Shandong Province Patentee before: SICC Co.,Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20140618 |