CN110394711A - 一种研磨装置、倒角加工装置及加工方法 - Google Patents
一种研磨装置、倒角加工装置及加工方法 Download PDFInfo
- Publication number
- CN110394711A CN110394711A CN201910646108.0A CN201910646108A CN110394711A CN 110394711 A CN110394711 A CN 110394711A CN 201910646108 A CN201910646108 A CN 201910646108A CN 110394711 A CN110394711 A CN 110394711A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- emery wheel
- processing method
- grinding
- wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910646108.0A CN110394711A (zh) | 2019-07-17 | 2019-07-17 | 一种研磨装置、倒角加工装置及加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910646108.0A CN110394711A (zh) | 2019-07-17 | 2019-07-17 | 一种研磨装置、倒角加工装置及加工方法 |
Publications (1)
Publication Number | Publication Date |
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CN110394711A true CN110394711A (zh) | 2019-11-01 |
Family
ID=68325741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910646108.0A Pending CN110394711A (zh) | 2019-07-17 | 2019-07-17 | 一种研磨装置、倒角加工装置及加工方法 |
Country Status (1)
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CN (1) | CN110394711A (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110802502A (zh) * | 2019-11-12 | 2020-02-18 | 西安奕斯伟硅片技术有限公司 | 一种边缘研磨设备 |
CN112123110A (zh) * | 2020-09-15 | 2020-12-25 | 慈溪市豪格机械有限公司 | 一种轴承内圈沟道超精研机 |
CN112589573A (zh) * | 2020-12-12 | 2021-04-02 | 卢志强 | 一种自动双面倒角装置 |
CN113043108A (zh) * | 2021-03-19 | 2021-06-29 | 上海北玻自动化技术有限公司 | 一种立式玻璃磨边机 |
CN114589574A (zh) * | 2022-03-17 | 2022-06-07 | 蓝思科技(长沙)有限公司 | 一种大斜边2.5d盖板加工装置及加工方法 |
CN114986317A (zh) * | 2022-06-30 | 2022-09-02 | 西安奕斯伟材料科技有限公司 | 半导体边缘研磨设备和半导体的边缘研磨方法 |
CN115023316A (zh) * | 2020-01-20 | 2022-09-06 | 发那科株式会社 | 研磨量估计装置 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000198057A (ja) * | 1998-10-26 | 2000-07-18 | Komatsu Electronic Metals Co Ltd | 半導体ウェハの面取り加工面の鏡面研磨装置 |
CN1424953A (zh) * | 2000-02-02 | 2003-06-18 | 尤诺瓦英国有限公司 | 包括粗粒度和细粒度树脂粘结部的磨床磨杆 |
CN102189460A (zh) * | 2010-02-26 | 2011-09-21 | 中村留精密工业株式会社 | 圆盘状工件的倒角装置 |
JP2011235408A (ja) * | 2010-05-11 | 2011-11-24 | Noritake Co Ltd | シリコンインゴット面取り装置 |
CN203566475U (zh) * | 2013-09-29 | 2014-04-30 | 常州南车汽车零部件有限公司 | 固定式组合珩磨杆 |
CN107263219A (zh) * | 2017-06-23 | 2017-10-20 | 四川旭虹光电科技有限公司 | 玻璃面板的加工方法及光伏/光热器件 |
CN208629204U (zh) * | 2018-07-24 | 2019-03-22 | 山东优派特造纸机械有限公司 | 一种用于烘缸表面研磨装置 |
CN109773674A (zh) * | 2019-02-26 | 2019-05-21 | 江苏芯工半导体科技有限公司 | 半导体晶片用组合结构砂轮 |
-
2019
- 2019-07-17 CN CN201910646108.0A patent/CN110394711A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000198057A (ja) * | 1998-10-26 | 2000-07-18 | Komatsu Electronic Metals Co Ltd | 半導体ウェハの面取り加工面の鏡面研磨装置 |
CN1424953A (zh) * | 2000-02-02 | 2003-06-18 | 尤诺瓦英国有限公司 | 包括粗粒度和细粒度树脂粘结部的磨床磨杆 |
CN102189460A (zh) * | 2010-02-26 | 2011-09-21 | 中村留精密工业株式会社 | 圆盘状工件的倒角装置 |
JP2011235408A (ja) * | 2010-05-11 | 2011-11-24 | Noritake Co Ltd | シリコンインゴット面取り装置 |
CN203566475U (zh) * | 2013-09-29 | 2014-04-30 | 常州南车汽车零部件有限公司 | 固定式组合珩磨杆 |
CN107263219A (zh) * | 2017-06-23 | 2017-10-20 | 四川旭虹光电科技有限公司 | 玻璃面板的加工方法及光伏/光热器件 |
CN208629204U (zh) * | 2018-07-24 | 2019-03-22 | 山东优派特造纸机械有限公司 | 一种用于烘缸表面研磨装置 |
CN109773674A (zh) * | 2019-02-26 | 2019-05-21 | 江苏芯工半导体科技有限公司 | 半导体晶片用组合结构砂轮 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110802502A (zh) * | 2019-11-12 | 2020-02-18 | 西安奕斯伟硅片技术有限公司 | 一种边缘研磨设备 |
CN115023316A (zh) * | 2020-01-20 | 2022-09-06 | 发那科株式会社 | 研磨量估计装置 |
CN112123110A (zh) * | 2020-09-15 | 2020-12-25 | 慈溪市豪格机械有限公司 | 一种轴承内圈沟道超精研机 |
CN112123110B (zh) * | 2020-09-15 | 2022-05-31 | 慈溪市豪格机械有限公司 | 一种轴承内圈沟道超精研机 |
CN112589573A (zh) * | 2020-12-12 | 2021-04-02 | 卢志强 | 一种自动双面倒角装置 |
CN113043108A (zh) * | 2021-03-19 | 2021-06-29 | 上海北玻自动化技术有限公司 | 一种立式玻璃磨边机 |
CN114589574A (zh) * | 2022-03-17 | 2022-06-07 | 蓝思科技(长沙)有限公司 | 一种大斜边2.5d盖板加工装置及加工方法 |
CN114986317A (zh) * | 2022-06-30 | 2022-09-02 | 西安奕斯伟材料科技有限公司 | 半导体边缘研磨设备和半导体的边缘研磨方法 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20211018 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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Application publication date: 20191101 |