CN203277495U - 一种全光束角发光的led光源模组 - Google Patents

一种全光束角发光的led光源模组 Download PDF

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Publication number
CN203277495U
CN203277495U CN2013202975030U CN201320297503U CN203277495U CN 203277495 U CN203277495 U CN 203277495U CN 2013202975030 U CN2013202975030 U CN 2013202975030U CN 201320297503 U CN201320297503 U CN 201320297503U CN 203277495 U CN203277495 U CN 203277495U
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China
Prior art keywords
light source
source module
beam angle
metal electrode
led chips
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Expired - Lifetime
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CN2013202975030U
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Inventor
严钱军
高基伟
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Hangzhou Hangke Optoelectronics Group Co ltd
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HANGZHOU HANGKE PHOTOELECTRIC CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

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  • Led Devices (AREA)

Abstract

本实用新型公开了一种全光束角发光的LED光源模组，它包括透明基板、金属电极、LED芯片和荧光粉包裹层；其中，所述金属电极通过丝网印刷固定在透明基板上，LED芯片固定在透明基板上，金属电极与LED芯片之间以及LED芯片之间均以金属线连接，形成串、并联结构，荧光粉包裹层包裹在LED芯片上。本实用新型提供的光源模组可以实现全周空间发光，可提高发光效率50%以上。

Description

一种全光束角发光的LED光源模组
技术领域
本实用新型涉及一种LED光源模组，尤其涉及一种全光束角发光的LED光源模组。
背景技术
半导体发光二极管（LED）照明被认为是21世纪最具发展前景的领域之一，它在引发照明革命的同时，也将为推动节能减排、建立节约型社会做出重大贡献。
传统的多芯片LED光源模组，一般采用铝基板、铜基板或陶瓷基板，基本本身不透明，所以光源模组上面焊接LED光源颗粒后，只能向上出光，对于灯具的设计、配光限制较大。
以球泡灯为例，不透明基板模组直接用于灯中时，只能达到半配光型(光束角小于180度)球泡灯的效果；要想实现国内外标准中的准全配光(光束角大于180度)和全配光型(光束角大于180度，且在135~180度区域内的光通量不低于总光通量的5%)要求，就必须在灯具中增加二次光学透镜，增加了灯具的成本。
发明内容
本实用新型的目的在于克服现有技术的不足，提供一种全光束角发光的LED光源模组。
本实用新型的目的是通过以下技术方案来实现的：一种全光束角发光的LED光源模组，它包括透明基板、金属电极、LED芯片和荧光粉包裹层；其中，所述金属电极通过丝网印刷固定在透明基板上，LED芯片固定在透明基板上，金属电极与LED芯片之间以及LED芯片之间均以金属线连接，形成串、并联结构；荧光粉包裹层包裹在LED芯片上。
本实用新型的有益效果是，本实用新型采用透明基板，并以COB(chip on board)工艺将发光芯片直接固定在透明基板上，这样的LED光源模组在通电时可以同时向全空间角度发光，不仅大幅增加发光角度，还可提高出光效率50%以上，用于灯具中可以实现灵活的配光设计，并节约散热器的成本。
附图说明
图1为本实用新型全光束角发光的LED光源模组示意图；
图2为侧剖图；
图中，透明基板1、金属电极2、LED芯片3、金属线4、荧光粉包裹层5。
具体实施方式
以下结合附图和具体实施方式对本实用新型做进一步详细说明。
如图1-2所示，本实用新型的全光束角发光的LED光源模组，包括透明基板1、金属电极2、LED芯片3和荧光粉包裹层5，金属电极2通过丝网印刷制备在透明基板1上，LED芯片3固定在透明基板1上，金属电极2与LED芯片3之间以及LED芯片3之间均以金属线4连接，形成串、并联结构，荧光粉包裹层5包裹在LED芯片3上。
本实用新型全光束角发光的LED光源模组，采用透明基板，可以实现双面或者多面发光，达到全空间角度发光的效果，可提高发光效率50%以上。

Claims (1)

1.一种全光束角发光的LED光源模组，其特征在于，它包括透明基板（1）、金属电极（2）、LED芯片（3）和荧光粉包裹层（5）；其中，所述金属电极（2）通过丝网印刷固定在透明基板（1）上，LED芯片（3）固定在透明基板（1）上，金属电极（2）与LED芯片（3）之间以及LED芯片（3）之间均以金属线（4）连接，形成串、并联结构；荧光粉包裹层（5）包裹在LED芯片（3）上。
CN2013202975030U 2013-05-28 2013-05-28 一种全光束角发光的led光源模组 Expired - Lifetime CN203277495U (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112066274A (zh) * 2019-06-10 2020-12-11 宁波天炬光电科技有限公司 Led光源模组及照明装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112066274A (zh) * 2019-06-10 2020-12-11 宁波天炬光电科技有限公司 Led光源模组及照明装置

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Address after: Hangzhou City, Zhejiang province 310011 Dengyun Road No. 425 Lilda Building 5 floor

Patentee after: HANGZHOU HANGKE OPTOELECTRONICS GROUP Co.,Ltd.

Address before: Hangzhou City, Zhejiang province 310011 Dengyun Road No. 425 Lilda Building 5 floor

Patentee before: HANGZHOU HANGKE OPTOELECTRONICS STOCK Ltd.,Corp.

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Granted publication date: 20131106